The engineer’s resource guide to...ttough cost targets set by the incumbent technology. For full...

17
The engineer’s resource guide to new products, technology and design www.electronicspecifier.com 2014 Media Kit

Transcript of The engineer’s resource guide to...ttough cost targets set by the incumbent technology. For full...

Page 1: The engineer’s resource guide to...ttough cost targets set by the incumbent technology. For full editorial OLEDs To Outshine LEDs In Lighting Applications Driving a critical phase

The engineer’s resource guide to new products, technology and design

www.electronicspecifier.com

2014

Media Kit

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www.electronicspecifier.com

ABOUT...

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Contents

ES Product Magazine .................. 3

ES Design Magazine .................... 4

ES French Magazine .................... 5

Test & Measurement .................. 6

Power............................................ 7

Circulation .................................. 8

Rates ............................................ 9

T&M and Power - Rates ............ 10

Website ........................................ 11

Microsites .................................... 13

Packages........................................ 14

Newsletter .............................. 15

List Rental .................................... 16

Contacts ...................................... 17

2

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www.electronicspecifier.com10 | october 2012 | electronicspecifierproduct

NEWSLINE

With OLED lighting still in its in-fancy, IDTechEx says pricepoints are several orders ofmagnitude above those pro-jected by industry roadmapsand even more off cost targetsrequired for widespread mar-ket uptake. There is still no setof standards or consensus inthe industry on optimal devicearchitecture including stack ordouble layer, manufacturingtechnique including evapora-tion, solution processing or hy-brid, or manufacturing toolkit.It is not even clear how OLEDlighting can borrow from tech-niques developed and scaledfor the OLED display industry.With cost drivers today such

as integrated substrates, en-compassing the substrate, thetransparent conductor and ex-ternal light extraction layer,which constitute 45~50% ofthe overall cost and encapsula-tion issues, it is not yet clear

how and when costs are goingto come down to competitivelevels when compared to LEDs. LED technology on the other

hand is many years ahead ofOLED. It was already a $10bil-lion market in 2011. In 2001,there were only 38 manufac-turing sites globally; this rose to169 in 2012. Today, manufac-turing takes place mostly in farAsia. Indeed, China, Japanand Taiwan offer 52.2% of theglobal manufacturing capacity. Not all, however, is well with

the LED industry. Similar to thephotovoltaic industry, the mar-ket today is currently experi-encing a supply glut – Chinahas heavily subsidised manu-facturing capacity. The industryitself has created excess capac-ity in anticipation of marketpull from the LED-LCD industryand in addition to this, the de-mand is also expected to slow. Going forward, the most dif-

ficult challenge lies in meetingttough cost targets set by theincumbent technology. �� For full editorial

OLEDs To OutshineLEDs In LightingApplications

Driving a critical phase of ve-hicle to vehicle, V2V, and ve-hicle to infrastructure, V2I,communications develop-ment, General Motors isproviding eight speciallyequipped vehicles for a yearof real world testing. V2Vequipped Buick and Cadillaccars will be part of a largerfleet of passenger cars, com-mercial trucks and transit ve-hicles participating in the USDepartment of Transporta-tion’s Connected VehicleSafety Pilot Model Deploy-ment Program.The University of Michigan

Transportation Research Insti-tute will conduct the pro-gramme, which is designedto determine the effective-ness of V2V and V2I safetytechnologies at reducingcrashes. In late 2013, theNational Highway Trans-portation Safety Administra-tion will use data collected bythese vehicles to measure

overall system benefits.Analysis of the data could re-sult in a wide-scale deploy-ment V2V technology beforethe end of the decade.“Safety is our number one

priority, and this researchcould save lives and preventinjuries across America,” saysUS Transportation SecretaryRay LaHood. “With morethan 30,000 people a yearkilled on our nation's roads,we need to keep looking fornew ways to improve safetyand reduce fatalities.” V2V communication allows

vehicles to send and receivefrom each other basic infor-mation such as location,speed and direction of travel.V2I communication sharesinformation about traffic sig-nal phase, road attributesand surface conditions. Eachtechnology has the potentialto mitigate traffic collisionsand congestion.�� For full editorial

Connected Vehicle Connections...

Dr Wolfgang Schäuble, Ger-many’s Federal Finance Minis-ter, opened TDK-Lambda’snew 2300m2 European Logis-tics and Supply Centre inAchern. The new facility rampsup the available space bysome 900m2 and will holdaround €5m worth of stock.The move to the new build-

ing follows strong growth bythe company in recent years:last year the European Ware-house supplied more than8000 customers with morethan a million products. Thenew logistics centre will enableTDK-Lambda to stock morepower supply products from itsproduction facilities in the UK,

USA, Israel and Asia to supplythe European market.“Our common Enterprise

Resource Planning systemprovides instant visibility ofour stock levels across Eu-rope,” says TDK-Lambda Lo-gistics Director Jürgen Spen-gler, “and random stockaccess will optimise our han-dling processes.”With this increased invest-

ment in additional stock,TDK-Lambda says it willmaintain high availability ofits products anywhere in Eu-rope, whether through directsales or distribution, thus op-timising delivery times.�� For full editorial

European Logistics& Supply Centre Opens

Michael Rayfield is the newVP for Wireless Solutions atMicron Technology. He takeson the responsibility for man-aging all aspects of Micron'sWireless Solutions Group thatprovides DRAM, NAND Flash,NOR Flash and PCM memorysolutions, including multi-chippackages, to the global mobiledevice market.With 15 years executive

management experience and

nearly 30 in the industry, Ray-field worked for tseven yearsas VP & General Manager ofNVIDIA's Mobile Business Unit.His team created advancedcomputer on a chip technologyand won key mobile industryreference designs.“Micron has the industry's

broadest set of innovativememory products,” says Mi-cron President Mark Adams.“Mike has the direct industryexperience, relationships andleadership skill set that willhelp us leverage this portfolio.”�� For full editorial

Rayfield Takes VPRole At MicronTechnology

2014 EDiTORiAL CALENDAR

Month Trending Spotlight Focus Trade Shows & ConferencesEditorialDeadline

AdvertisingCopy Deadline

Publication

JanuaryAutomotive connectors /

interconnection / connectivityEDA & Design

Power, Comms computing &

control, Actives20 December 6 January 13 January

February Smart GridsEmbedded World

Supplement

Packaging & Panelware, T&M,

Cable & Connecting

Integrated Systems Europe, Amsterdam

Moems-Mems, San Francisco27 January 4 February 11 February

March NFC T&MProduction, Optoelectronics,

Passives

Emv, Düsseldorf

Amper 2014, Czech Republic

Smart System Integration, Vienna

Esc Silicon Valley, San Jose

Printed Electronics, Berlin

25 February 4 March 11 March

April Energy Harvesting Microwave & RF Power, T&M, Sensing Smt, Nuremberg 25 March 2 April 8 April

May Automotive sensingPower

Management

Packaging & Panelware, Comms

computing & control, Actives

Electronics Sourcing Live

Pcim, Nuremberg

Ecartec, Paris

Lope-C + Printed Electronics, Munich

Dac, San Francisco

Sid/Display Week 2014, San Diego

Sensor And Test, Nuremberg

Inter Solar Europe, Munich

29 April 7 May 13 May

JuneRFID/Wireless

CommunicationsDefence & Marine

Production, Cable & Connecting,

Wireless27 May 4 June 10 June

July MCU’s Alternative EnergyT&M, Optoelectronics, Passives,

Automotive

Semicon West, San Francisco

Techno-Frontier, Tokyo24 June 1 July 8 July

August End of Life Components InterconnectsProduction, Power, Comms

computing & control29 July 6 August 12 August

September LEDs & Laser Technology Data SecurityPackaging & Panelware, Cable &

Connecting, Actives, Sensing

Semicon West, San Francisco

Techno-Frontier, Tokyo26 August 2 September 9 September

October M2M communicationsComputing /

Printed Electronics

T&M, Energy Harvesting,

Automotive

Pcim, Sao Paulo, Brazil

Electronics Design Show, Coventry 30 September 7 October 14 October

November Robotics Power ComponentsPower, T&M, Comms computing &

control

Electronica 2014, Munich

Auto Electronics Show, Birmingham

Sps/Ipc/Drives, Nuremberg

28 October 4 November 11 November

December Memory & Data StorageData Acquisition/

T&M toolsWireless, Automotive, sensing Cartes Conference, Paris 25 November 2 December 9 December

product

In This Issue

Power

LEDs

PLUS:

In This Issue

vicesor IoT defer Cortww poa-loUltr

In This Issue

x M0+ MCUs eer Cort

rewPo

erdriv

LEDs

US:PL

ES Product Magazine

ESP magazine delivers the latest new products, technology and newsdigitally to over 66,000 design engineers monthly across Europe.

NEWSLINE

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 11

The market for integrated circuits isforecast to post stronger average an-nual growth through to 2021 com-pared to the average market growthover the past 15 years, accord-ing to an analysis recently com-pleted by IC Insights. Though ICunit growth is expected to slow,the IC average selling price is ex-pected to jump into the positiverange, and help boost averageannual IC market growth to8.0% per year from 2011-2021,an increase of 54% compared tothe 5.2% annual growth the ICmarket averaged in the periodbetween 1996 and 2011.Clearly, says IC Insights, there

are significant obstacles facingthe industry including troubled globaleconomies and numerous technologyhurdles to improve the manufacturingprocess, yet IC Insights believes that ICmarket growth will improve despitethese and other challenges.IC unit shipments have been the foun-

dation for growth in the IC industry overthe past 15 years, averaging 9.5%pagrowth. Over the next ten years, the av-erage annual growth rate for IC units isforecast to slow to 7%pa as lacklustreglobal GDP cools demand for electronicsystems and integration results in morefunctions on a single chip.

Offsetting slower unit growth is anupward swing in the IC average sellingprice, which is forecast to be the driverfor IC market growth through 2021. ICaverage selling prices declined an av-erage of 4% annually from 1996 to2011. However, through 2021, IC

ASPs are forecast to increase by an av-erage of 1%pa, resulting in an 8.0%average IC market growth rate from2011 to 2021.Improving IC ASPs can be attributed

to several factors. With no new entrypoint opportunities, the IC industry isnow closed to new major manufactur-

ing start ups and this willhelp moderate over-invest-ment in new fabs. Moreover,the Fab-lite foundry move-ment should lead to lessoverspending for IC fabrica-tion capacity and Capex as apercentage of sales, afterreaching 21% in 2011, theratio is forecast to decline to19% in 2012 and to 15% bythe end of the decade.Delays in moving produc-

tion to 450mm will delay thenext cost reduction phase for

IC manufacturing, for example, 14nm,EUV, 3D transistor structure and so on.As a result of these and other industrytrends, longterm IC ASPs are forecast tostabilise and lead to IC market growthof 8.0% annually through to 2021.�� For full editorial

Longterm IC MarketForecast On The Up

3

Supplements

• Embedded World, February

• Electronica , November

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2014EDiTORiAL CALENDAR

Supplements

• Embedded World,February

• Electronica, November

MonthSection 1:Industrysector

Section 2:Technology

Section 3:System Design

Trade Shows & ConferencesEditorialDeadline

AdvertisingCopyDeadline

Publication

January MedicalProcessors &

FPGAsWireless Ces International, Las Vegas 19 December 26 December 3 January

February EnergyMixed Signal &

AnalogLEDs

Integrated Systems Europe,

Amsterdam

Moems-Mems, San Francisco15 January 22 January 29 January

MarchAdvanced

Processes

Power

Semiconductors

Development

Tools

Embedded World, Nuremberg

Mobile World, Barcelona

Emv, Düsseldorf

Amper 2014, Czech Republic

12 February 19 February 26 February

April Industrial T&M Displays & GUIsSmart System Integration, Vienna

Esc Silicon Valley, San Jose

Printed Electronics, Berlin 12 March 19 March 26 March

May Sensors Data Transfer Wireless

Smt, Nuremberg

Electronics Sourcing Live

Pcim, Nuremberg

Ecartec, Paris

Lope-C+ Printed Electronics, Munich

9 April 16 April 23 April

June Automotive Memory Communications

Dac, San Francisco

Sid/Display Week 2014, San Diego

Sensor And Test, Nuremberg

Inter Solar Europe, Munich

14 May 21 May 28 May

July Medical Power Circuit Protection Semicon West, San Francisco 11 June 18 June 25 June

August ConsumerMixed Signal &

Analog

Frequency

ControlTechno-Frontier, Tokyo 9 July 16 July 23 July

September SensorsProcessors &

FPGAs

Development

ToolsSensors & Instrumentation Show 13 August 20 August 27 August

October Energy Data Transfer Wireless

European Microwave Week, Rome

Semicon Europa, Grenoble

Pcim, Sao Paulo, Brazil

Plastic Design, Dresden

Electronics Design Show, Coventry

10 September 17 September 24 September

November Industrial T&M Displays & GUIsElectronica 2014, Munich

Auto Electronics Show, Birmingham

Sps/Ipc/Drives, Nuremberg22 October 27 October 10 November

December Automotive Memory Communications Cartes Conference, Paris 12 November 19 November 26 November

ES Design Magazine

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ESD magazine provides in-depth technical articles, analysis andreviews on all aspects of electronics design to over 66,000 designengineers monthly across Europe.

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2014EDiTORiAL CALENDAR

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ES French MagazineESF magazine delivers new products, technology, news andtechnical articles bi-monthly in French to over 10,000 designengineers in France.

Month Feature 1 Feature 2 Trade Shows & ConferencesEditorialDeadline

AdvertisingCopy Deadline

Publication

January/

FebruaryEmbedded Automotive Embedded World, Nuremberg 21 January 28 January 4 February

March/April Power Passives PCIM Nuremberg 18 March 25 March 01 April

May/June Optoelectronics Sensing 20 May 27 May 03 June

July/Aug Alternative EnergyCables &

Connecr22 July 29 July 05 Aug

Sept/Oct Wireless T&M European Microwave Week, Nuremberg 23 September 30 September 07 October

Nov/DecDefence &

AvionicsIC’s and Semis 18 November 25 November 02 December

Purchase and Procurement - 793

Design & Development GeneralManagement - 2,136

Design & DevelopmentCorporate Management - 2,346

Design & Development R&D - 1,719

Design & DevelopmentEngineering - 3,274

Contract Manufacturers - 978Industrial Controls - 2,245

Others - 167

Automotive - 1,356

Consumer Electronics - 1,295

Communications - 834Computers & IT - 737

Medical Electronics - 555

Defence, Aerospace & Avionics - 1,335

Test and Measurement - 549

Distribution - 247

BREAkDOWN By JOB FUNCTiON

BREAkDOWN ByiNDUSTRy

5

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2013 / 2014EDiTORiAL CALENDAR

Test & Measurement

T&M magazine delivers new products, technology, news andtechnical articles quarterly to over 13,500 design engineersacross Europe.

Spain / Portugal - 880

Germany - 3,321

France - 2,270

United Kingdom - 1,783

Italy - 1,515

Eastern Europe - 1,036

Benelux - 939

Other - 894

Scandinavia - 883

BREAkDOWN By REGiON

Issue Date September 24th.

Advertising copy deadline Sept 17. Editorial deadline Sept 10

RF/Wireless. The remorseless pace of technology advances in the RF/Wireless communications ismaking new demands on test and measurement suppliers. They are rising to the challenge and thissupplement will tell you what innovations and products to expect.

Issue Date November 12th.

Advertising copy deadline Nov 5. Editorial deadline Oct 29

Oscilloscopes. The oscilloscope market is probably the most competitive in the test and measurementsector right from the humble bench-top instrument to the 50/60 (any advance on 60) GHzoscilloscopes. This issues will see suppliers helping engineers find the right path for their oscilloscopeneeds.

Issue Date February 11th.

Advertising copy deadline Feb 4. Editorial deadline Jan 20

Rules and Regulations. Compliance with industry standards is a sine qua non, but it’s not always thatsimple. This issue will get experts to guide you through the global requirements for EMC test, radiotest, product safety and many more

Issue Date May 13th.

Advertising copy deadline May 6. Editorial deadline April 29

Embedded instrumentation. The ability to debug and test during the design process can ease time to

market pressures for hard-pressed engineers. This issue will take a look at the options on the market.

6

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2013 / 2014EDiTORiAL CALENDAR

POWER

Power magazine delivers new products, technology, newsand technical articles bi-monthly to over 36,700 designengineers across Europe.

Month Feature 1Other topicscovered in thisissue

Editorial DeadlineAdvertising CopyDeadline

Publication

September 2013 Lighting power LED and drivers Sept 3 Sept 10 Sept 17

November 2013 Battery power hybrid and electric,

industrial batteryNov 5 Nov 12 Nov 19

January 2014 Mobile Powermobile phones and

devicesJan 7 Jan 14 Jan 21

March 2014 Industrial power DC/DC converters for

servers, enterpriseMarch 4 March 11 March 18

May 2014 Power management automotive,

computingApril 29 May 6 May 13

July 2014 Renewable/alternative

power- July 1 July 8 July 15

September 2014 Power semiconductors DC/DC converters,

PMICsSept 2 Sept 9 Sept 16

November 2014 Power supplies Benchtop, UPS Oct 21 Oct 28 Nov 4

Spain / Portugal - 2,198

Germany - 8,701

France - 6,823

United Kingdom - 4,945

Italy - 3,677

Eastern Europe - 2,802

Benelux - 2,604

Other - 2,774

Scandinavia - 2,274

BREAkDOWN By REGiON

7

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Purchase and Procurement - 5593

Design & Development GeneralManagement - 14,650

Design & DevelopmentCorporate Management - 14,846

Design & Development R&D - 11,119Design & DevelopmentEngineering - 20,584

Contract Manufacturers - 4,718

Industrial Controls - 16,645

Others - 167

Automotive - 12,261

Consumer Electronics - 8,395

Communications - 6,483

Computers & IT - 5,037

Medical Electronics - 3,105

Defence, Aerospace & Avionics - 5,935

Test and Measurement - 2,099

Distribution - 1,947

BREAkDOWN By JOB FUNCTiON

BREAkDOWN ByiNDUSTRy

Circulation Breakdown

Country Count

Austria 775Belgium 2294Bulgaria 567Croatia 333Czech 1482Denmark 1187Finland 883France 10298Germany 15576

Greece 554Hungary 1023Ireland 425Israel 654Italy 5523Netherlands 2314Norway 763Poland 1065Portugal 687Romania 384Russia 1653

Serbia 143Slovakia 374Slovenia 341Spain 2848Sweden 1753Switzerland 1514Turkey 689UK 10432Other 258

Totals 66,792

BREAkDOWN By COUNTRy

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product

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ADvERTiSiNG OPTiONS, RATES & DATA

COPY REQUIREMENTS:Our preferred digital file formatis Press Optimized PDF,created using Acrobat Distiller4.05 and holding specific PPA(Pass for Press) standardsettings. PDFs must besupplied as composite CMYKand not contain True Type orMultiple Master fonts, JPEGimages or Copy Dot scanelements.

Original image files should behigh-resolution (300dpi TIFF orEPS) and in CMYK format withall fonts embedded. We acceptZip discs, CDs and ISDN filetransfer. Please submit a colourproof.

Advertising Option

Dimension (wide x high)

Design &Product Editions

Rate US $

FrenchIssue

Rate US $Insertions

DoublePageSpread

Trim 420mm x297mm (16.535" x 11.692")Type 400mm x277mm (15.748" x 10.905")

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Bleed 216mm x303mmTrim 210mm x297mm (8.268" x 11.693")

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Half PageHorizontal

190mm x 130mm (7.48" x 5.118"")

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$1,950$1,755$1,560

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93mm x 277mm (8.268" x10.098")

$2,600$2,340$2,080

$1,950$1,755$1,560

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1/3 PageHorizontal

190mm x 82mm (7.48" x 3.228")

$1,800$1,620$1,440

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60mm x 277mm (2.362" x10.905")

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QuarterPage Box

93mm x 130mm (3.661" x 5.118")

$1,400$1,260$1,120

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Page 10: The engineer’s resource guide to...ttough cost targets set by the incumbent technology. For full editorial OLEDs To Outshine LEDs In Lighting Applications Driving a critical phase

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T&M and Power Rates & Data

ADvERTiSiNG OPTiONS, RATES & DATA

COPY REQUIREMENTS:Our preferred digital file format is Press Optimized PDF,created using Acrobat Distiller 4.05 and holding specificPPA (Pass for Press) standard settings. PDFs must besupplied as composite CMYK and not contain TrueType or Multiple Master fonts, JPEG images or CopyDot scan elements.

Original image files should be high-resolution (300dpiTIFF or EPS) and in CMYK format with all fontsembedded. We accept Zip discs, CDs and ISDN filetransfer. Please submit a colour proof.

Advertising Option

Dimension (wide x high)

Rate US $

DoublePageSpread

Trim 420mm x297mm (16.535" x 11.692")Type 400mm x277mm (15.748" x 10.905")

$5,000

Full Page

Bleed 216mm x303mmTrim 210mm x297mm (8.268" x 11.693")

$3,000

Half PageHorizontal

190mm x 130mm (7.48" x 5.118"")

$1,950

Half PageVertical

93mm x 277mm (8.268" x10.098")

$1,950

1/3 PageHorizontal

190mm x 82mm (7.48" x 3.228")

$1,350

1/3 PageVertical

60mm x 277mm (2.362" x10.905")

$1,350

QuarterPage Box

93mm x 130mm (3.661" x 5.118")

$1,050

QuarterPageHorizontal

190mm x 66mm (7.480" x 2.362")

$1,050

Dynamic advertising options available on request

ADvERTiSiNG CONTACT

For more informations, or to book your space callBen Price on +44 (0) 1622 871 944

or email [email protected]

EDiTORiAL CONTACT

T&M Mick Elliottemail [email protected]

Power Caroline Hayesemail [email protected]

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GEOGRAPHiCALSPLiT

Americas 24%

Asia 17%

Europe 56%

MONTHLy TRAFFiC FiGURES:

Average Jan-October 2013

● Page views ....................306,022

● Visitor sessions ................70,350

● Unique visitors ..................44,940

● Page Views per visit ............4.35

Referring Sites 15%

Search Engines 60%

Bookmarked 25 %

viSiTS By SOURCE

Website

Others 3%

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Website - Ad Options

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Tile

Banner

Boombox

Leaderboard

Welcome Ad

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Top Leaderboard $150 720 x 90 20k 72 dpi Gif, Jpeg, HTML

Boombox $150 300 x 250 20k 72 dpi Gif, Jpeg, HTML

Leaderboard $130 575 x 70 20k 72 dpi Gif, Jpeg, HTML

Tile Banner $50 125 x 125 15k 72 dpi Gif, Jpeg, HTML

Welcome Ad $6,000 / week 640 x 480 30k 72 dpi Gif, Jpeg, HTML

Note: image is not to scale

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Optoelectronics

Automotive

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Microsites

Alternative Energy

Wireless

As part of our on-going commitment to providedesign engineers with the technical information theyneed, ElectronicSpecifier has launched a seriesof design focused, vertically targeted micro sites.

The micro sites deliver the how-to information that engineersrequire to quickly move from concept development toproduction line; including case studies, video tutorials,whitepapers and technical datasheets.

Each micro site will be supported by a monthly e-newsletter,highlighting the key topics and resources featured on the site.

Automotive 13,125 circ

Wireless 12,350 circ

Optoelectronics 10,700 circ

Alternative Energy 8,000 circ

13

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Packages

SUBSCRiPTiON TO THE DATASHEETDOWNLOAD SERviCE

Bronze

Company Profile Enhancement

£495 / $795 per annum

Silver

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£955 / $1,525 per annum

(15% discount from rate card)

Gold

All the benefits of the Silver sponsorship,

plus 2 x sponsored stories on the ElectronicSpecifier Daily

e-newsletter

£1,950 / $3,120(25% discount from rate card)

● An enhancement to

your company profile

including...

● Add your logo plus up

to 80 words description

of your company

● Plus direct links to key

landing pages within

your website

COMPANy PROFiLEENHANCEMENT

Datasheets are a second to none necessity to engineers;

Over 5,000 datasheets are downloaded every month!

ELECTRONiC SPECiFiER DAiLyENEWSLETTER REACHiNG

OUT TO 62,000 ENGiNEERS

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Page 15: The engineer’s resource guide to...ttough cost targets set by the incumbent technology. For full editorial OLEDs To Outshine LEDs In Lighting Applications Driving a critical phase

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E-Newsletters

The Electronics Specifier daily newsletter, is sent to over 62,000 design engineers Globally and features the latestelectronics products and technology. The Power Newsletter, is sent weekly to over 35,000 power industry specifiers.

The newsletters achieve combined average open rates of 21% and a 27% click through rate of opens.

We'll be issuing frequent broadbased and single subject newsletters to sections of our database that have requestedinformation on specific application and/or technology areas. Our newsletters offer you the most highly targeted marketingopportunity available.

NEWSLETTER SPONSORSHiP:

Top Sponsorship Story $1,500 per issue Headline: Maximum of 12 words. Body copy: Maximum of 60 words. Image 150 x 150. Plus One link

Leader board banner $1,000 per issue Leader board banner 575 x 70 pixels; 20k file size; 72 dpi; GIF, Jpeg, HTML formats

MPU $1,200 per issue MPU 336 x 280 pixels; 20k file size; 72 dpi; GIF, Jpeg, HTML formats

Tile $500 per issue Tile 125 x 125 pixels; 20k file size; 72 dpi; GIF, Jpeg, HTML formats

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With our email marketing expertise and technicalcapabilities, we can manage an entire campaignof direct marketing on your behalf - targeting tensof thousands of decision-makers in your specificlocations and industry-sectors of choice.

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E-mail List Rental

BREAkDOWN By COUNTRy

Country Count

Japan 10,804Germany 11,274France 8,611United Kingdom 7,154Italy 4,200Benelux 3,655United States 3,468Scandinavia 3,214Spain and Portugal 2,574Switzerland 937China 910Turkey 673India 654Russia 591Poland 564Central and South America 605Israel 477Canada 413Austria 389

Czech Republic 340Greece 389Bulgaria 285Romania 276Hungary 257Ireland 246Taiwan 190Slovenia 188South Korea 177Serbia And Montenegro 138Australia and New Zealand 181Ukraine 133Africa 123Slovakia 115Middle East 93Baltic States 93Other 255

Totals 64,500

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ABOUT...

Call +44 (0) 1622 871 [email protected]

Contacts

Electronic Specifier LimitedComice Place, Woodfalls FarmGravelly Ways, Laddingford, Kent, ME18 6DA

Tel: +44 (0) 1622 871 944

email: [email protected]

Publishing Director Steve [email protected]

Publisher Tim [email protected]

Advertising Sales Manager Ben [email protected]

Web Editor Ellie [email protected]

Editor – ES Design Phil [email protected]

Editor – Test And Measurement Mick Elliott [email protected]

Editor – Power Caroline [email protected]

Newsletters & Social Nat BowersNetworking [email protected]

Features Editor Sally Ward [email protected]

Vanessa [email protected]

Disti Blog Editor Mick Elliott [email protected]

Editor – France, Automotive Jacqueline RegnierOptoelectronics [email protected]

Circulation Manager Raj [email protected]

17