The Constituents of Semiconductor Components · The Constituents of Semiconductor Components...

Vishay Semiconductors

02-02 1www.vishay.comDocument Number 80103

The Constituents of Semiconductor ComponentsResponsible electronic component and equipmentmanufacturers are already preparing for the time whenthe lifespan of their products comes to an end by scru-tinizing the materials incorporated and their futurerecylcability. Recycling laws have already come intoforce in Germany (“Kreislauf-Wirtschaftsgesetz”) andguidelines for electronic scrap are in preparation.

The aim is a suitable waste disposal program and �as a preventative measure � a reduction in the con-tent of hazardous damaging materials in suchcomponents. In order to conform to this procedure, de-tailed information about the materials and theirquantities is needed.

This overview answers questions put forward bycustomers as to the constituents and their function inthe most important of Vishay Semiconductors’ssemiconductor products. Special significance is givento so-called “Hazardous Substances”. It demonstratesthat Vishay Semiconductors products under normaloperating conditions do not expose the applier orenvironment to any hazard. However, most productsnevertheless contain small but necessary quantities of“Hazardous Substances” which can � if not treatedcorrectly or through accidents � be released on asmall scale into the environment.

The present information was produced with thegreatest possible care. Any suggestions forimprovement of this brochure are welcome.

DefinitionsVishay Semiconductors offers a wide range of semi-conductor components including transistors, diodesand opto-electronic components. These have beenmanufactured in various standard packages.

On the following pages, these packages are listedtogether with their materials shown in weightpercentages. In order to limit the number of tables, allcomponents whose structure and composition are thesame have been compiled in families. In many cases,different lead frames together with chips of differentsizes may be used for the one package. This usuallymeans that there may be slight differences in thequantities of the declared material. The weight percentis, however, valid for a representative sample of therelevant family. In order to sensibly reduce the numberand quantities of materials contained in the respectivecomponents, quantities smaller than 0.1% by weighthave been stated in the following list as traces . Thisis the case unless lower limits are forced by law, e.g.,cadmium < 75 ppm and PCDD as well as PCDF(known as dioxin) < 2 ppb. In the lists themselves,

details of content and composition are separated intothe individual parts of the semiconductor component.The most important of these are:

Active element: The active element is either a siliconchip or for optoelectronic components a chipcontaining combinations of Ga (Al) (As, P). These aredoped with very small amounts of boron, arsenic,phosphorus, zinc and germanium etc. Themetallisation consists of thin layers of aluminium, goldor titanium. The chips are generally bonded to the leadframe with a silver epoxy and have gold or aluminiumwires bonded to the lead frame.Lead frame: For electrical connection, a metal leadframe made from alloys such as FeNi (42) or CuFe (2)and partly or totally plated with silver is commonlyused. The metal alloys contain traces of silver, zincand phosphorus. Part of the lead frame is also coatedwith tin/ lead.Case: The semiconductor chip is protected from theenvironment by a case of glass, plastic or metal.The glass is composed of oxides of silicon and leadtogether with boron and aluminium.Plastic cases are composed of an epoxy resin filledwith up to 70% by weight of quartz particles. Antimonytrioxide and brominated epoxy resin (no TBA) areadded as flame retardents. Antimony and bromineamount to about 1.6 and 1.0% respectively.In use: In use, it is the content of hazardoussubstances which is of importance. In Germany, thereare a series of lists which give the materials which arepotentially hazardous to people and the environment,for example:Appendix II and IV of the “Hazardous MaterialsRegulations”, the TRGS 900 (“MAK-Wert-Liste”) andthe “Catalog of Materials Hazardous to the WaterSupply”. These lists, however, are only partiallyconsistent.The names used are often different for materials withthe same chemical composition. Furthermore, the useof trivial and trade names often adds to the confusion.Vishay Semiconductors therefore for theirdescriptions use that proposed by the ZentralverbandElektrotechnik und Elektronikindustrie e.V. (ZVEI;Central Association of Electrical Engineering andElectronic Industry) for the harmonization of thenomenclature of hazardous substances.Statements are made on the safety precautions to beused during storage and disposal by mechanical,chemical and thermal means of the more importantchemicals (so-called “Leitchemikalien”). These arelisted in the tables in the order of their potential risk.



Their effect upon people and the environment are alsolisted and any special precautions emphasized.Notes: The following information has been prepared

to be as exact and reliable as possible.The manufacture of semiconductorcomponents is, however, subject to regularchange without special notification.The publication of this brochure excludes anyresponsibility resulting from its use.

Explanation of Abbreviations 1While the information on weight percent is believedcorrect, discrepancies depending upon componenttype may be possible.1) Material information etc. Material listed as

“Material Hazardous in Production”2) S: Trace material < 0.1% by weight;

Cd < 75 ppm; concerning Cd see ***)

PCDD and PCDF < 2 ppb*) Dioxin content – lies below agreed limits**) No. 85 “Rules for Hazardous Materials”, to be

replaced as soon as a technically suitablealternative material is available

***) Traces of cadmium can only be found in leadframes made of copper

CMT: Material containing carcinogens, mutagens orterratogens

Tox: Material is toxic or very toxicS Material with allergy producing characteristicsHAL Halogen containing materialWKG Material hazardous to the water supplyL Storage, suitable for disposalD DisposableM Mechanical disposalN Chemical disposalT Thermal disposalH Handling

Ozone Depleting Substances 2The use of Ozone Depleting Substances has been to-tally eliminated by Vishay Semiconductors and bydoing so meets the legal requirements as defined inthe following documents.

1. The “Montreal Protocol” together with the “LondonAmendments” Appendix A, B, and the “List ofTransitional Substances”

2. “Clean Air Act”, Amendments 1990, “Environmen-tal Protection Agency” (EPA), USA, Class I and II– Ozone Depleting Substances

3. “European Council Resolution” number88/540/EEC and 91/690/eec Appendix A, B and C(Transitional Substances)

Vishay Semiconductors guarantees that its compo-nents do not contain and are manufactured without theuse of Ozone Depleting Substances.



The Constituents of Package FormsPackage form 1:

Total weight 30 mg

Epoxy resin (10.0%)50% resin50% hardener

Reflector (47.8%)66.7%amodel33.3%glass fibre

Lead frame (42.0%)95% copper2% iron2% Silver1% SnPbTraces of Ni, Zn, P, Cd***)

Silver epoxy (< 0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K

LED chip (< 0.1%)50% gallium50% arsenic and

phosphorusTraces of Al, Au, Zn, Ge, In, Ti

IR chip (0.17%)50% gallium50% arsenic Traces of Al, Au, Zn, Ge, Ti

Detector chip (0.2%)99% siliconTraces of Ag, Al, Au, Sb, Ti,SiO2

Bond wire (< 0.1%)99.99% goldTraces of Be, Mg

Significant Materials for Disposal

No. Material and/or Group 1)CMT

TOX S

HAL

WGK

Available in the CompoundUsed for

Part in 2)

WeightPercent L D M N T H

1 Lead and lead compounds � � Lead plating 0.1 � � �

Package form 2:

Total weight 84 mg

Mold (38%)50% resin50% hardenerTraces of Fe, C, Cl

Lead frame (55%)94% copper2% iron2% tin2% silverTraces of Ni, Zn, P, Cd***)


Detector chip (7%)99% siliconTraces of Ag, Al, Ni, Ti, V




TOX S

HAL

WGK


Part in 2)


1 Halide compounds � � � Mold 0.6 � � �

2 Antimony and -compounds � � Mold 1.0 � � �

Note: *), **), ***), 1), 2), CMT, T etc.: see ‘Explanation of Abbreviations’, page 2



Package form 3:

Total weight 200 mg

Epoxy resin (58%)50% resin50% hardenerTraces of Fe, C, Cl

Lead frame (39%)96% copper2% iron2% silverTraces of Ni, Zn, P, Cd***)


Detector chip(2.9%)99% siliconTraces ofAg, Al, Ni, Ti, V

Silver epoxy (<0.1%)80% silver10% resin10% hardenerTraces of Cl, Na, K



TOX S

HAL

WGK


Part in 2)



Package form 4:

Total weight 219 mg








TOX S

HAL

WGK


Part in 2)






Package form 5:

Total weight 193 mg








TOX S

HAL

WGK


Part in 2)



Package form 6:

Total weight 159 mg


Lead frame (60%)92% copper2% iron2% silver4% SnPbTraces of Ni, Zn, P, Cd***)


Detector chip (< 0.1%)99% siliconTraces of Ag, Al, Au, Sb, Ti, SiO2

Capacitor (< 0.1%)98% alumnium trioxideTraces of Ag, Pd, Ni




TOX S

HAL

WGK


Part in 2)






Package form 7:

Total weight 130 mg


Lead frame (44.7%)96% copper2% iron2% silverTraces of Ni, Ag, Zn, P, Cd ***)


IR chip (< 0.1%)50.0%gallium50.0%arsenicTraces of Al, Au, Zn, Ge, Ti

Detector chip (< 0.1%)99.9%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2

Bond wire (< 0.1%)99.99% goldTraces of BE, Mg



TOX S

HAL

WGK


Part in 2)



Package form 8:

Total weight (5 mm) 310 mg

Epoxy resin (58%)50% resin50% hardener

Lead frame (42 %)93% iron2% copper2% silver3% SnPbTraces ofNi, Zn, P, Cd ***)

Silver epoxy (< 0.1%)80% silver10% resin10% hardener







TOX S

HAL

WGK


Part in 2)






Package form 9:

Total weight (5mm) 310 mg




Detector chip (<0.1%)99% siliconTraces ofAg, Al, Ni, Ti, V




TOX S

HAL

WGK


Part in 2)



Package form 10:

Total weight (3mm)132 mg



Detector chip (< 0.1%)99% siliconTraces ofAg, Al, Au, Sb, Ti, SiO2





TOX S

HAL

WGK


Part in 2)






Package form 11:

Total weight (3mm) 130 mg


Lead frame (70%)90% iron4% copper2% silver4% SnPbTraces ofNi, Zn, P, Cd***)









TOX S

HAL

WGK


Part in 2)



Package form 12:

Total weight 345 mg

Header & cap(99.9%)37.5%iron20.5%nickel12.5%cobalt29.0%glas0.5% goldTraces of K, P

Silver epoxy (< 0.1%)80.0%silver10.0%resin10.0%hardenerTraces of Cl, Na, K


IR chip (<0.1%)50% gallium50% arsenic Traces of Al, Au, Zn, Ge, Ti

Photo trans. chip (<0.1%)99.0%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2

Photo diode chip (<0.1%)99.0%siliconTraces of Ag, Al, Ni, Ti, V



TOX S

HAL

WGK


Part in 2)






Package form 13:

Total weight 850 mg

Header & cap(99.9%)37.5%iron20.5%nickel12.5%cobalt29.0%glas0.5% goldTraces of K, P



Photo diode chip (<0.1%)99.0%siliconTraces of Ag, Al, Ni, Ti, V



TOX S

HAL

WGK


Part in 2)



Package form 14:

Case Weight/ mg

7 mm 70010 mm 115013 mm 2090

Epoxy resin (42.9%)44.0%resin48.0%hardener8.0% diffuser

Reflector (39.8%)73.0%Pocan27.0%TiO2

Lead frame (17.3%)98.8%copper1.2% ironTraces ofNi, Ag, Zn, Cd ***)

LED chip (< 0.1%)50.0%gallium50.0%arsenic and






TOX S

HAL

WGK


Part in 2)


1 Arsenic � � � Chip Traces � � �

2 Epoxy resin Mold 43.0 �




Package form 15:

Total weight 1060 mg

Epoxy resin (55.0%)55.5%resin44.5%hardener

Lead frame (43.7%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)

Capacitor (< 0.1%)98.0%aluminium

trioxideTraces of Ag, Pd, Ni

Resistor (< 0.1%)99.0%aluminium

trioxideTraces of Ag, Pd, Ni

Photo diode (< 0.1%)99.0%siliconTraces of As, Al, Ni. Ti,V

IC chip (< 0.1%)99.0%siliconTraces of SiO2, Al,Al3N4





TOX S

HAL

WGK


Part in 2)



Package form 16:

Total weight 485 mg


Lead frame (36.3%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P,SN, PB, Cd ***)


Photo diode (< 0.1%)99.0%siliconTraces ofAS, Al, Ni, Ti, V

IC chip (< 0.1%)99.0%siliconTraces of SiO2, Al,Al3N4




TOX S

HAL

WGK


Part in 2)






Package form 17:

Total weight 503 mg

Mold (62.0%)71.4%SiO226.0%epoxy resin1.6% Sb (as antimony

trioxide) **)

1.0% bromine(no TBA) *)

Traces of N, Fe, C, Cl


Solder plating (0.4%)85.0%tin15.0%lead

Reflector (7.6%)100.0% pocan


Emitter chip (0.1%)50.0%gallium50.0%arsenicTraces ofAl, Au, Zn, Ge, In, Ti

Detector chip (< 0.1%)99.0%siliconTraces ofAg, Al, Au, Sb, Ti, SiO2





TOX S

HAL

WGK


Part in 2)







Package form 18:

Type Weight/ mg

DIP4 250DIP8 550DIP16 1100

13946

Mold (64.5%)27.0%SiO236.0%epoxy resin30.0%TiO23.0% Al (OH)32.5% antimony **)

1.5% Br (no TBA) *)

Traces of N, Fe, C, Cl


Emitter chip (< 0.1%)50.0%gallium50.0%arsenicTraces ofAl, Au, Ge, Si3N4

Detector chip (< 0.1%)99.0%siliconTraces of Al, SiO2,Al3N4

Solder plating (0.4%)80.0%tin20.0%lead

Silicon (6.1%)90.9%resin9.1% hardener





TOX S

HAL

WGK


Part in 2)




Package form 19:

Type Weight/ mg

CNY64 730CNY65 1400CNY66 1700

9510536

Epoxy resin (56.0%)50.0%resin49.5%hardener0.5% Br (no TBA) *)

Case (25.0%)70.0%Crastin30.0%SiO2

Bushing (7.0%)73.0%Lexan30.0%TiO2

Lead frame (12.0%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P,Cd ***)

Detector chip (< 0.1%)99.0%siliconTraces of SiO2, Al,Al3N4

Emitter chip (< 0.1%)50.0%gallium50.0%arsenicTraces of Al, Au, Si3N4




TOX S

HAL

WGK


Part in 2)







Package form 20:

Type Weight/ m g

TCSS1100/TCST1000/TCST1x0x 800TCSS2100/TCST2000/TCST2x0x 900TCST1030 250TCST1230 280TCST5123TCST1210

� IR emitting diode



Emitter chip (< 0.1%)50.0%gallium50.0%arsenic and

phosphorusTraces of Al, Au, Zn, Ge, Si3N4


Bond wire (< 0.1%)99.99% gold

� IR photodetector



Detector chip (< 0.1%)50.0%siliconTraces of SiO2, Al,Al3N4



� Housing 100% Polycarbonate



TOX S

HAL

WGK


Part in 2)






Package form 21:

Total weight 150 mg

94 9318

Epoxy resin (31.1%)47.0%resin50.0%hardener3.0% filter color

Mold (20.1%)70.0%PBTP30.0%glas fiber



Emitter chip (< 0.1%)50.0%gallium50.0%arsenic and


Detector chip (< 0.1%)99.0%siliconTraces of Al, SiO2,Si3N4




TOX S

HAL

WGK


Part in 2)






Package form 22:

Total weight 230 mg

94 9442

� Housing 100% Polycarbonate� IR emitting diodeEpoxy resin (34.5%)50.0% resin50.0% hardenerTraces of N, Fe, C, ClLead frame (65.2%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)

IR emitting diode(0.2%)50.0%gallium50.0%arsenic and



� IR photodetectorEpoxy resin (29%)50.0%resin50.0%hardenerTraces of Fe, C, ClLead frame (70.7%)89.0%iron4.1% copper2.4% silver4.5% SnPbTraces of Ni, Zn, PBond wire (< 0.1%)99.99% goldTraces of Be, MgIR Photodetector (<0.1%)99.0%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2




TOX S

HAL

WGK


Part in 2)



2 Lead and -compounds � � Lead frame 0.4 � � �




Package form 23:

12776


Lead frame (39%)79% copper17% Ni4% AuTraces of Ag, Fe, Co, Zu, Su, Al


Detector chip (17%)99% siliconTraces ofAg, Al, Ni, Ti, V


Fibreglas (21%)63% oxygen19% silicon8% calcium6% aluminum4% carbon



TOX S

HAL

WGK


Part in 2)






Package form 24:

TCYS6201Total weight 2700 mg

TCYS5201Total weight 1100 mg

95 10755

95 10756

� Housing 100% Polycarbonate

� Connector (10%)40% polyamid59% copper1% SnPb (60/40)� IR emitting diodeEpoxy resin (34.5%)50.0% resin50.0% hardenerTraces of N, Fe, C, ClLead frame (65.2%)98.8% copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)




PWB (20%)53.9% glass41% Epoxy resin

(50% hardener50% resin)

5.1% copper>0.1% PVC (Solder Resist)_� IR photodetectorEpoxy resin (29%)50.0% resin50.0% hardenerTraces of Fe, C, ClLead frame (70.7%)89.0%iron4.1% copper2.4% silver4.5% SnPbTraces of Ni, Zn, PBond wire (< 0.1%)99.99% goldTraces of Be, MgIR Photodetector (<0.1%)99.0%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2




TOX S

HAL

WGK


Part in 2)







Package form 25:

CNY70Total weight 700 mg

94 9320

� Housing 100% Polycarbonate� IR emitting diodeEpoxy resin (34.5%)50.0% resin50.0% hardenerTraces of N, Fe, C, ClLead frame (65.2%)98.8%copper1.2% ironTraces of Ni, Ag, Zn, P, Cd ***)




� IR photodetectorEpoxy resin (29%)50.0%resin50.0%hardenerTraces of Fe, C, ClLead frame (70.7%)89.0%iron4.1% copper2.4% silver4.5% SnPbTraces of Ni, Zn, PBond wire (< 0.1%)99.99% goldTraces of Be, MgIR Photodetector (<0.1%)99.0%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2




TOX S

HAL

WGK


Part in 2)







Package form 26:

TCUT1200Total weight 150 mg

TCPT1200Total weight 150 mg

1484814849

Molding Compound(77.6%)71.4% SiO226% Epoxy resin1.6% Sb (as antimony trixide)Traces of N,Fe,C,CI ***)

Lead frame (65.2%)58% copper42% nickelTraces of Ag, Zn, P, Cd ***)

Emitter – Chip(<0.1%)50.0%gallium50.0%arsenic and


Bond wire (< 0.1%)99.99% goldDetector–Chip (< 0.1%)99.0%siliconTraces of Al, Al3, N4, SiO2

Silver epoxy (< 0.1%)78.0%silver11.0%resin11.0%hardener



TOX S

HAL

WGK


Part in 2)




Package form 27:

Total weight 100 mg

94 8639








TOX S

HAL

WGK


Part in 2)






Package form 28:

Total weight 350 mg

94 8390


Lead frame (70%)90% iron4% copper2% silver4% SnPbTraces ofNi, Zn, P, Cd***)









TOX S

HAL

WGK


Part in 2)



Package form 29:

Total weight 16.5 mg

15 969

15 970


Lead frame (44.7%)96% copper2% iron2% silverTraces of Ni, Ag, Zn, P, Cd ***)


IR chip (< 0.1%)50.0%gallium50.0%arsenicTraces of Al, Au, Zn, Ge, Ti

Detector chip (< 0.1%)99.9%siliconTraces of Ag, Al, Au, Sb, Ti, SiO2




TOX S

HAL

WGK


Part in 2)






Package form 30:

Total weight 400 mg

12785




Detector chip (<0.1%)99% siliconTraces ofAg, Al, Ni, Ti, V




TOX S

HAL

WGK


Part in 2)



Package form 31:

Total weight 120 mg

94 8673



Photo diode chip (< 0.1%)99.0%siliconTraces of As, Al, Ni, Ti, V

IR chip (< 0.1%)50% galium50% arsenicTraces of Al, Au,Zn,Ge,Ti





TOX S

HAL

WGK


Part in 2)






Package form 32:

Total weight 102 mg

Epoxy molding compound (74%)

Lead frame (26%)98.8%copper1.2% FeTraces ofNi, Ag, Zn, P, Cd***)

Emitter ( 0.001%)50.0% Ga50.0% Al + AsTraces of Au


Conductive Epoxy (< 0.1%)78.0% silver22.0% epoxy

IC chip (0.02%)99.0% siliconTraces of Al, Si3N4, SiO2

Detector chip ( 0.01%)99% siliconTraces ofAl, Si3N4, SiO2



TOX S

HAL

WGK


Part in 2)



Package form 33: TFDU4xxx, TFDU5xxx, TFDU6xxx Baby Face (Universal)

Total weight 203 mg

Epoxy molding compound (73.5%)

Lead frame (26.4%)98.8%copper1.2% FeTraces ofNi, Ag, Zn, P, Cd***)

Emitter chip ( 0.001%)54.0% As43.0% Ga3.0% AlTraces of Au







TOX S

HAL

WGK


Part in 2)






Package form 34: TFDT4xxx, TFDT5xxx, TFDT6xxx

Top View

Total weight 390 mg

Epoxy moldingcompound (73.5%)









TOX S

HAL

WGK


Part in 2)



Package form 35: TFDS4xxx, TFDS5xxx, TFDS6xxx Side View

Total weight 390 mg

Epoxy molding compound (73.5%)









TOX S

HAL

WGK


Part in 2)






Package form 36:

Total weight 224 mg

TFDS–Dracula Side View

Epoxy moldingcompound (73.5%)









TOX S

HAL

WGK


Part in 2)



Package form 37:

Total weight 150 mg

TOIM3000, TOIM3232 SO16 Package

Epoxy moldingcompound (55.0%)72.0% SiO225.5% epoxy resin1.5% Sb (as anti-mony trioxide) **)

1.0% Br (no TBA) *)

Lead frame (40.1%)98.8%copper2.0% ironTraces ofPb, Sn, Cd***)

Tin plating (0.2%)20.0% lead80.0% tin

Silver epoxy (1.4%)70.0% silver30.0% epoxy resin

Silicon chip ( 3.2%)99% silicon0.7% SiO2, Si3N40.3% aluminiumTraces ofAs, B, P, Ti

Bond wire (<0.1%)99.99% gold


No. Material and/or Group 1)CMT T S

HAL

WGK


Part in 2)


1 Antimony and –compounds � � Mold 0.8 � � �

2 Orgo–bromide compounds � � � Mold 0.55 � � �


The Constituents of Semiconductor Components · The Constituents of Semiconductor Components...

Documents

Transcript of The Constituents of Semiconductor Components · The Constituents of Semiconductor Components...