The Burn-In test will expose the DUT (divice under test ...

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The Burn-In test will expose the DUT (divice under test) to harsh conditions: 150°C; relative humidity (RH): 85 rh; current rating: 1A continuous for 1000 hrs. In order to withstand conditions like that, C.C.P. modifies the plating material and core material. C.C.P. splits the socket into two parts: The standard part and the machining part. The standard part by insert molding and holds the machining part, that is customized according to the customers IC design and made by CNC. The Pins for the burn-in solution use a special material (WJ3) that shoes and exceptional hardness and is able to deal with the demanding conditions posed by the Burn-In test.

Transcript of The Burn-In test will expose the DUT (divice under test ...

Page 1: The Burn-In test will expose the DUT (divice under test ...

The Burn-In test will expose the DUT (divice under test) to harsh conditions: 150°C; relative humidity (RH): 85 rh; current rating: 1A continuous for 1000 hrs. In order to withstand conditions like that, C.C.P. modifies the plating material and core material. C.C.P. splits the socket into two parts: The standard part and the machining part. The standard part by insert molding and holds the machining part, that is customized according to the customers IC design and made by CNC. The Pins for the burn-in solution use a special material (WJ3) that shoes and exceptional hardness and is able to deal with the demanding conditions posed by the Burn-In test.

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Page 3: The Burn-In test will expose the DUT (divice under test ...

IUT de Valenciennes - UPHF · DUT GEA LPGPRH. LPPMOE. Management & Administration Human Resources Management. Organizations & Entrepreneurship. DUT GIM DUT MP DUT QLIO. LPDDGIE LP

IUT de Valenciennes - UPHF · DUT GEA LPGPRH. LPPMOE. Management & Administration Human Resources Management. Organizations & Entrepreneurship. DUT GIM DUT MP DUT QLIO. LPDDGIE LP

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Hazem Refai, Ph.D. The University of Oklahoma Williams ... · 1. Test info. 2. Interferer. 3. Medical Device Under Test (DUT). ! Test Info: Contains indicative information about each

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QSFP28 Test Adapter · QSFP28 TPA, always attach the QSFP28‐TPA100G to the device under test (DUT) or cable under test before attaching any SMA connectors. Carefully align the QSFP28

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Ethernet base divice control

Ethernet base divice control

IHS 3: Test of Digital Systems - Startseite TU IlmenauIHS 3: Test of Digital Systems R.Ubar, A. Jutman, H-D. Wuttke ... Basic concept usual JTAG DUT interface TDI TDO * 1 1 1 0 DUT

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IQxel-M8WTM Multi-DUT Connectivity Test System · Multi-DUT Connectivity Test System 2 General Technical Specifications RF Analyzer Parameter Ports (A/B) Value Input frequency range

IXIDM1401 TEST BOARD - IXYS Corporationixapps.ixys.com/DataSheet/IXIDM1401_Test_Board_Manual.pdf · DUT Pin #J1/1, pin #J1/11 continuity test, short circuit test Apply pin #J1/1 =

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DUT ATE Test Fixture S-Parameters Estimation using 1x-Reflect Methodology · ATE Test Fixture Challenges DUT ATE Test Fixture S -Parameters Estimation using 1x -Reflect Methodology

IQxel-M8TM Multi-DUT Connectivity Test System...Multi-DUT/Multicom Connectivity Test System 2 Overview of IQxel-M8 The IQxel-M8 is a manufacturing oriented, Multi-DUTtest system, designed

IQxel-M8TM Multi-DUT Connectivity Test System...Multi-DUT/Multicom Connectivity Test System 2 Overview of IQxel-M8 The IQxel-M8 is a manufacturing oriented, Multi-DUTtest system, designed

RFP Test Bench Development for mixed signal CMOS Imager · any new photonic devices such as Optical image sensor array (Device under test, DUT). Dedicated test bench is developed

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XGD Series - Littelfuse/media/electronics/datasheets/polymer_esd... · TEST FIXTURE QUADTECH 1865 RESISTANCE METER COMPUTER FARADAY CAGE ESD PULSE GENERATOR TEST BOARD W/ DUT ESD

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Conducted and Radiated Emissions Testing · a radiated test is performed to ensure emissions emanating from the Device Under Test (DUT) or the Equipment Under Test (EUT) comply with

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Device Under Test (DUT) Table Under Test (DUT) Table Device Vendor Speed DUT Number Package Markings Pentium III Intel 550 MHz 550_2 550/256/100/1.65V S1 90050493-0099 MALAY

Device Under Test (DUT) Table Under Test (DUT) Table Device Vendor Speed DUT Number Package Markings Pentium III Intel 550 MHz 550_2 550/256/100/1.65V S1 90050493-0099 MALAY

RM Italy HLA-305V HF Amplifier Test Report · PDF fileRM Italy HLA-305V HF Amplifier Test Report ... Test Procedure: On 8935, connect DUPLEX OUT via 6 dB pad to DUT TRX and DUT

RM Italy HLA-305V HF Amplifier Test Report · PDF fileRM Italy HLA-305V HF Amplifier Test Report ... Test Procedure: On 8935, connect DUPLEX OUT via 6 dB pad to DUT TRX and DUT

Keysight Technologies N6141A & W6141A EMI X-Series ...€¦ · the antenna is placed 3 to 10 meters from the device under test (DUT) and the DUT should be rotated in order to find

Keysight Technologies N6141A & W6141A EMI X-Series ...€¦ · the antenna is placed 3 to 10 meters from the device under test (DUT) and the DUT should be rotated in order to find

Simulating OpenPiton RTL - Princeton University · Anatomy of a Simulation •Simulation model –Design under test (DUT) RTL –Top-level test bench –Simulator compiler arguments

Simulating OpenPiton RTL - Princeton University · Anatomy of a Simulation •Simulation model –Design under test (DUT) RTL –Top-level test bench –Simulator compiler arguments

DUT - Packaging Avignon...DUT DIPLÔME UNIVERSITAIRE DE TECHNOLOGIE IUT.UNIV-AVIGNON.FR Plus d’informations DUT-PACKAGING.UNIV-AVIGNON.FR Packaging, Emballage et Conditionnement

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Test Strategies for High- Walt Schulte Applications ... · Link- CCDF demo video 10/16/2012 . IMD products from DUT Low IMD reduces test uncertainty Tone correction Minimize test