Technology Development for InGaAs/InP-channel MOSFETs [email protected] 805-893-3244,...
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Transcript of Technology Development for InGaAs/InP-channel MOSFETs [email protected] 805-893-3244,...
![Page 1: Technology Development for InGaAs/InP-channel MOSFETs rodwell@ece.ucsb.edu 805-893-3244, 805-893-5705 fax MRS Spring Symposium, Tutorial: Advanced CMOS—Substrates,](https://reader036.fdocuments.net/reader036/viewer/2022062314/56649f535503460f94c7802e/html5/thumbnails/1.jpg)
Technology Development for InGaAs/InP-channel MOSFETs
[email protected] 805-893-3244, 805-893-5705 fax
MRS Spring Symposium, Tutorial: Advanced CMOS—Substrates, Devices, Reliability, and Characterization, April 13, 2009, San Francisco
Mark Rodwell University of California, Santa Barbara
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Scope of Presentation
Topic of discussion is channel materials for CMOS...the potential use of III-V materials...and their advantages and limitations
To understand this, we must examine in some detailMOSFET scaling limits
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Zeroth-Order MOSFET Operation
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Bipolar Transistor ~ MOSFET Below Threshold
cI
beV ceV
voltagecollector with little varies
it through pass base reaching electrons allAlmost
)/exp(
al)(exponenti thermalison distributienergy emitter Because
c
bec
I
kTqVI
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Field-Effect Transistor Operation
source draingate
Positive Gate Voltage
→ reduced energy barrier
→ increased drain current
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FETs: Computing Their Characteristics
chdC
/ where/ electrongd vLQI
/~ DACgs
/ and / where chdgdgsmdsdsgsmd CGCgVGVgI
dschdgsgs VCVCQ
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FET Characteristics
chdC /~ DACgs
dsdsgsmd VGVgI
ID
VDS
increasingVGS
electrongchdgdgsm vLCGCg / / /
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FET Subthreshold Characteristics
gs
gs
s
s
ox
schanneloxgate
V
V
q
kT
qn
qn
C
qnVVV
lly withexponentia variescharge channel :drive gateWeak
ithlinearly w variescharge channel :drive gate Strong
)()(
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Classical Long-Channel MOSFET Theory
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)()( usiondrift/diffby modeledTransport )2
.channel in field lateral Moderate1)
:sAssumption
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x
xnqDExnqJ
E
thermalexit
nn
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Classic Long-Channel MOSFET Theory
gthgsgoxD LVVWcI 2/)(
current limitedmobility2
,
)(
current limitedvelocity
, thgsexitgoxvD VVvWcI
1
Expression dGeneralize
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Id
VgsVth
mobility-limited
velocity-limited
:saturation nlarger tha voltagesdrainFor
ID
VDS
increasingVGS
Ohm
icconstant-current
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Classic Long-Channel FET : Far Above Threshold
/ where
1/)(for )(
gexit
thgsthgsexitgoxD
LvV
VVVVVVvWcI
Id
VgsVth
V
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Exponential, Square-Law, Linear FET Characteristics
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Relevance of DC Parameters
Digital circuit speed largely controlled by on-state current
Standby power consumption controlled by off-state current
Dynamic power consumption controlled by supply Voltage
→ Examine VLSI Power & Delay Relationships
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Zeroth-OrderVLSI Performance
Analysis
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CMOS Power Dissipation & Gate Delay
y)probabilit switching(frequency2
: ndissipatiodower Dynamic
dominatesusually ecapacitanc g wirin
2/)(2/
delay Gate
2
ddtotaldynamic
onddPFETNFETwireonddtotalgate
VCP
IVCCCIVCVdd
Cwire
ddoffstatic
thonoff
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on DissipatiStatic
)/exp(/
current state Off offIVdd
kTqVonddstaticddwiredynamic
theIVPpfVCP /2 ~ ~ :ndissipatio dynamic and static between Tradeoff
NFETC
PFETC
onI
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Why Large Current Density is Needed
S D S D S D S
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gg nWW
n
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. large wireslong FETsLarge
needed. are FETslarge small, is If
wire
gd
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/WI
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Device Requirements
High on-state current per unit gate width
Low off-state current→ subthreshold slope
Low device capacitance; but only to point where wires dominate
Low supply voltage: probably 0.5 to 0.7 V
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What Are Our Goals ?
Low off-state current (10 nA/m) for low static dissipation→ good subthreshold slope → minimum Lg / Tox
low gate tunneling, low band-band tunneling
Low delay CFET V/I d in gates where transistor capacitances dominate.
~1 fF/m parasitic capacitances→ low Cgs is desirable, but high Id is imperative
Low delay Cwire V/Id in gates where wiring capacitances dominate.
large FET footprint → long wires between gates→ need high Id / Wg ; target ~5 mA/m @ V= 0.7V
target ~ 3 mA/m @ V= 0.5V
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Improving FETs
by Scaling
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Simple FET ScalingGoal double transistor bandwidth when used in any circuit → reduce 2:1 all capacitances and all transport delays
→ keep constant all resistances, voltages, currents
All lengths, widths, thicknesses reduced 2:1
S/D contact resistivity reduced 4:1
oxgm TvWg /~/
oxgggs TLWC /~/
~/, gfgs WC
subcgsb TLWC /~/
If Tox cannot scale with gate length,
Cparasitic / Cgs increases,
gm / Wg does not increase
hence Cparasitic /gm does not scale
~/ ggd WC
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FET scaling: Output Conductance & DIBL effects) D.O.S.neglects expression ( gsC
gchd WC ~
dschdgsgsd VCVCQQI where/
/~ oxgggs TLWC
transconductance
→ Keep Lg / Tox constant as we scale Lg
output conductance
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parameter change
gate length decrease 2:1
gate dielectric capacitance density increase 2:1
gate dielectric equivalent thickness decrease 2:1
channel electron density increase 2:1
source & drain contact resistance decrease 4:1
current density (mA/m) increase 2:1
Changes required to double transistor bandwidth:
FET Scaling Laws
GW widthgate
GL
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nm Transistors: it's all about the interfaces
Metal-semiconductor interfaces (Ohmic contacts): very low resistivity
Dielectric-semiconductor interfaces (Gate dielectrics): very high capacitance density
Transistor & IC thermal resistivity.
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parameter change
gate length decrease 2:1
gate dielectric capacitance density increase 2:1
gate dielectric equivalent thickness decrease 2:1
channel electron density increase 2:1
source & drain contact resistance decrease 4:1
current density (mA/m) increase 2:1
Changes required to double transistor bandwidth:
What do we do if gate dielectric cannot be further scaled ?
FET Scaling Laws
GW widthgate
GL
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Why Consider MOSFETs with III-V Channels ?
If FETs cannot be further scaled, instead increase electron velocity:
III-V materials → lower m*→ higher velocityId / Wg = qnsv Id / Qtransit = v / Lg
Difficulties:High-K dielectricsIII-V growth on Sibuilding MOSFETs
low m* constrains vertical scaling, reduces drive current
( need > 1000 cm2 /V-s mobility)
Candidate materials (?) InxGa1-xAs, InP, InAs ( InSb, GaAs)
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III-V CMOS: The Benefit Is Low Mass, Not High Mobility
Id
VgsVth
: thresholdabovefar ate,nondegener theory,diffusion -drift Simple
low effective mass → high currents
/ginjectionLvV
)/(~ where 1/2*mkTvv thermalinjection )( VVVvWcI thgsinjectiongoxD
mobilities above ~ 1000 cm2/V-s of little benefit at 22 nm Lg
mV 700
that Ensure
~
)( thgs VVV
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III-V MOSFETs for VLSI
What is it ?MOSFET with an InGaAs channel
What are the problems ?low electron effective mass→ constraints on scaling !must grow high-K on InGaAs, must grow InGaAs on Si
Device characteristics must be considered in more detail
Why do it ?low electron effective mass→ higher electron velocitymore current, less charge at a given insulator thickness & gate lengthvery low access resistance
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III-V MOSFET
Characteristics
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Low Effective Mass Impairs Vertical Scaling
Shallow electron distribution needed for high gm / Gds ratio, low drain-induced barrier lowering.
./ 2*2wellTmL
Only one vertical state in well. Minimum ~ 5 nm well thickness.→ Hard to scale below 22 nm Lg.
For thin wells, only 1st state can be populated.For very thin wells, 1st state approaches L-valley.
Energy of Lth well state
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Semiconductor (Wavefunction Depth) Capacitance
./
energy state Bound2*2
wellwell TmLE
-4
-3
-2
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0
1
2
3
0 50 100 150 200 250
En
erg
y(e
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Y (Ang.)
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Density-Of-States Capacitance
Two implications:
- With Ns >1013/cm2, electrons populate satellite valleys - Transconductance dominated by finite state density
and n is the # of band minima
)//( 2* nmnEE swellf
2*2 / where nmqcdos
dosswellf cVV /
Fischetti et al, IEDM2007
Solomon & Laux , IEDM2001
motion) nalbidirectio(
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Current Including Density of States, Wavefunction Depth
Id
VgsVth
: thresholdabovefar ate,nondegener theory,diffusion -drift Simple
DOSoxeq /c /c /c/c 111 1 where torsemiconduc
)( VVVvWcI thgsthermalgeqD
...but with III-V materials, we must also consider degenerate carrier concentrations.
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Current of Degenerate & Ballistic FET
eV 1m
mA84
/)(
3
2
:densityCurrent
.)3/4( : velocityelectron ean M
,/)(2 : velocity ermi F
),)(2/( :density electron
:degenerateHighly
motion) ional(unidirect 2//:states ofDensity
2/32/1
0
*
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cf
cfs
f
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EE
m
mn
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vv
mEEv
EEmnn
mndEdN
...) Asbeck, , FischettiSolomon,
Laux,Natori, , Lundstrom(
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2D vs. 1D Field-Effect Transistors in Ballistic Limit
tor.semiconduc inshift level FermieV 0.3for
m
mA8.2
eV 1m
mA17
eV 1m
mA84
)04.0/( channel InGaAs FET;-2D2/32/32/1
0
*
0*
cfcf EEEE
m
mJ
mm
Lg
Wg
Id
Source
Drain
gate
gateE
Lg
Wg
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Sources
Drains
gate
gateE
torsemiconduc inshift level FermieV 0.3for
m
mA9.3
eV 1m
mA13
eV 1nm 6
A 78
S78/2 eV, 37.0*2
pitch nm 6 @ wellsInGaAs nm 5 FETs;-1D ofArray
2,2
22
cfcf
wellmwell
well
EEEEJ
hqgTm
E
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2D FET vs. Carbon Nanotube FET
tor.semiconduc inshift level FermieV 0.3for
, m
mA8.2
eV 1m
mA17
)04.0/*( channel InGaAs FET;-2D2/3
0
cf EEJ
mm
Lg
Wg
Id
Source
Drain
gate
gateE
torsemiconduc inshift level FermieV 0.3for
m
mA7.4
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A 78
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pitch nm 5 nanotubes, carbon ofArray 2
,
cfcf
tubem
EEEEJ
hqg
Lg
Wg
Sources
gate
Drains
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Ballistic/Degenerate Drive Current vs. Gate Voltage
More careful analyses by Taur & Asbeck Groups, UCSD; Fischetti Group: U-Mass: IEDM2007
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Drive Current in the Ballistic & Degenerate Limits
2/3*
,
2/1*2/3
)/()/(1 where,
V 1m
mA84
ooxodos
othgs
mmncc
mmnK
VVKJ
0
0.05
0.1
0.15
0.2
0.25
0.01 0.1 1
K
m*/mo
1.0 nm, n=1
0.8 nm, n=1
0.7 nm, n=6 0.4 nm, n=6
EOT includes wavefunction depth (0.5 nm for 3.5 nm InGaAs well)
n = # band minimacdos,o = density of states capacitance for m*=mo & n=1
Error bars on Si data points correct for (Ef-Ec)>> kT approximation
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High Drive Current Requires Low Access Resistance
m 2015
V 5.0)( @ mmA/ 3~/Target
V 3.0)( @ mmA/ 5.1~/Target
1.0)/(
current, drive onimpact 10% For
gs
thDDgD
thDDgD
thDDSD
WR
VVWI
VVWI
VVRI
substrate
barrier
sidewall
metal gate
quantum well / channel
gate dielectric
N+ source N+ drain
source contact drain contact
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Materials Selection;
What channel material should we use ?
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Common III-V Semiconductors
InAs
360
GaSb
770
AlSb
1550
GaAs
1420InGaAs
760
InAlAs
1460InP
1350
200
1350 200
500
450
250
450
550
200
170
InGaP
1900
200
InSb
220
150
AlAs
2170
6.48 A lattice constant
6.48 A lattice constant 5.65 A lattice constant;grown on GaAs
5.87 A lattice constant;grown on InP
B. Brar
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Semiconductor & Metal Band AlignmentsM. Wistey
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Materials of Interest
material Si Ge GaAs InP In0.53Ga0.47As InAs
n 6 6 1 1 1 1
m*/m0 0.98 ml 1.6 ml 0.063 0.08 0.04 0.0230.19 mt 0.08 mt
-(L/X) separation, eV -- -- 0.29 ~0.5 0.5 0.73
bandgap, eV 1.12 0.66 1.42 1.34 0.74 0.35
mobility, cm2/V-s 1000 2000 5000 3000 10,000 25,000
high-field velocity 1E7 1E7 1-2E7 3.5E7 3.5E7 ???
Source: Ioffe Institutehttp://www.ioffe.rssi.ru/SVA/NSM/Semicondrough #s only
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Drive Current in the Ballistic & Degenerate Limits
2/3*
,
2/1*2/3
)/()/(1 where,
V 1m
mA84
ooxodos
othgs
mmncc
mmnK
VVKJ
0
0.05
0.1
0.15
0.2
0.25
0.01 0.1 1
K
m*/mo
1.0 nm, n=1
0.8 nm, n=1
0.7 nm, n=6 0.4 nm, n=6
EOT includes wavefunction depth (0.5 nm for 3.5 nm InGaAs well)
n = # band minimacdos,o = density of states capacitance for m*=mo & n=1
Error bars on Si data points correct for (Ef-Ec)>> kT approximation
Si
InPInGaAs
Ge
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Intervalley Separation Source: Ioffe Institutehttp://www.ioffe.rssi.ru/SVA/NSM/Semicond
Intervalley separation sets:
-high-field velocity throughintervalley scattering
-maximum electron density in channel without increased carrier effective mass
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Choosing Channel Material: Other Considerations
Ge: low bandgap
GaAs: low intervalley separation
InP: good intervalley separationGood contacts only via InGaAs→ band offsetsmoderate mass→ better vertical scaling
InGaAs good intervalley separationbandgap too low ? → quantizationlow mass→ high well energy→ poor vertical scaling
InAs: good intervalley separationbandgap too lowvery low mass→ high well energy→ poor vertical scaling
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Non-Parabolic Bands
c.pessimistigenerally are
sexpression FETband-Parabolic
tors.semiconducmost inSimilar
velocity.group Asyptotic
.hyperbolicnearly become
bands energies, highAt
zero.near for only
parabolic~ are Bands
k
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Non-Parabolic Bands
T. Ishibashi, IEEE Transactions on Electron Devices, 48,11 , Nov. 2001,
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MOSFET DesignAssuming
In0.5Ga0.5As Channel
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Device Design / Fabrication Goals
substrate
barrier
sidewall
metal gate
quantum well / channel
gate dielectric
N+ source N+ drain
source contact drain contact
Device gate overdrive 700 500 300 mV drive current 5 3 1.4 mA/m Ns 6*1012 4*1012 2.5*1012 1/cm2
Dielectric: EOT 0.6 nm target, ~1.5 nm short term
Channel : 5 nm thick > 1000 cm2/V-s @ 5 nm, 6*1012 /cm2
S/D access resistance: 20 -m resistivity→ 0.5 -m2 contacts , ~2*1013 /cm2 , ~4*1019 /cm3 , 5 nm depth
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substrate
barrier
sidewall
metal gate
quantum well / channel
gate dielectric
N+ source N+ drain
source contact drain contact
Target Device Parameters
m 10contact widenm 25 )m 250 2 )/(.(
thicknm 5 ,cm/105~ :well 212sn
213319 cm1052 thicknm 5 , cm105 /./ sn
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Device Structure&
Process Flow
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Device Fabrication: Goals & Challenges
III-V HEMTs are built like this→ Source Drain
Gate
....and most III-V MOSFETs are built like this→
K Shinohara
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Device Fabrication: Goals & Challenges
r
InGaAs well
barrier
InP well
r
TiWN+ drainregrowth
N+ sourceregrowth
Yet, we are developing,at great effort,a structure like this →
Why ?
Source DrainGate
K Shinohara
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Why not just build HEMTs ? Gate Barrier is Low !
Tunneling through barrier→ sets minimum thickness
Source DrainGate
Ec
Ewell-
EF
Ec
Ewell-
EF
Gate barrier is low: ~0.6 eV
Emission over barrier→ limits 2D carrier density
K Shinohara
eV 6.0~)( ,cm/10At 213cfs EEN
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Ec
Ewell-
EF
N+ caplayer
Why not just build HEMTs ?
low leakage: need high barrier under gate
Source DrainGate
Ec
Ewell-
EF
Gate barrier also lies under source / drain contacts
low resistance: need low barrier under contacts
widegap barrier layer
N+ layer
K Shinohara
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substrate
barrier
sidewall
metal gate
quantum well / channel
gate dielectric
N+ source N+ drain
source contact drain contact
The Structure We Need
no gate barrier under S/D contacts
high-K gatebarrier
Overlap between gateand N+ source/drain
-- is Much Like a Si MOSFET
How do we make this device ?
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S/D Regrowth Process Flow
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Regrown S/D FETs: Versions
planar regrowthregrowth under sidewalls
need thin sidewalls(now ~20-30 nm)
..or doping under sidewalls
Wistey et al 2008 MBE conference
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60
S/D Regrowth by Migration-Enhanced Epitaxy
MBE growth is line-of-sight → gaps in regrowth near gate edges
MEE provides surface migration during regrowth→ eliminates gaps
Original Interface
InGaAs Regrowth
SiO2 dummy gate
SEM: Greg Burek
No gapsSmooth surfaces.
SEM: Uttam Singisetti
InGaAs Regrowth
SEM Cross Section
SiO2 dummy gate
SEM Side View (Oblique)Top of gate
High Si activation (4x1019 cm-3). Quasi-selective: no growth on sidewalls
Wistey et al 2008 MBE conference
Side of gate
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Self-Aligned Planar III-V MOSFETs by Regrowth
Wistey Singisetti Burek Lee
N+ InGaAs regrowth, Mo contact metal
gate
Mo contact metal
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Self-Aligned Planar III-V MOSFETs by Regrowth
Wistey Singisetti Burek Lee
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Regrown S/D FETs: Images
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Regrown S/D FETs: Images
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III-V MOS
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0
0.05
0.1
0.15
0.2
0.25
0.01 0.1 1
K
m*/mo
1.0 nm, n=1
0.8 nm, n=1
0.7 nm, n=6 0.4 nm, n=6
EOT includes wavefunction depth (0.5 nm for 3.5 nm InGaAs well)
InGaAs / InP MOSFETs: Why and Why Not
low m*/m0 → high vcarrier → more currentlow m*/m0 → low density of states → less current
2/3
*,
2/1*
2/3
1
where
, V 1m
mA84
oox
odos
o
thgs
mm
nc
c
mmnK
VVKJ
Low m* impairs vertical (hence Lg ) scaling ;InGaAs no good below 22-nm.
n = # band minimacdos,o = density of states capacitance for m*=mo & n=1
Error bars on Si data points correct for (Ef-Ec)>> kT approximation
Si wins if high-K scales below 0.6 nm EOT; otherwise, III-V has a chance
ballistic / degenerate calculation
InGaAs allows very low access resistance
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InGaAs/InP Channel MOSFETs for VLSI
Low-m* materials are beneficial only if EOT cannot scale below ~1/2 nm
Devices cannot scale much below 22 nm Lg→ limits IC density
Little CV/I benefit in gate lengths below 22 nm Lg
Gate dielectrics, III-V growth on Si: also under intensive development
Need device structure with very low access resistance radical re-work of device structure & process flow