tbp’s early involvement

Gerard Elema & Marcel SwinnenDfM expert DfT expert

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• EMS, production of electronics for third parties

(B2B)

• development, test engineering, assembly,

testing and box building

• responsible for complete supply chain

• high-end, high mix

the business of perfection

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• turnover € 30 million

• locations 2

• employees 130

• customers 50+

• floor space 8.000 m2

• ISO-9001:2008, AQAP-2120:2009

• ISO-13485 (roadmap 2014)

• JTAG AAP (Approved Application Provider)

the business of perfection

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our mission

the tbp Way of Life is a process of cooperation

with our customers to maximize the

manufacturability and testability of a design

resulting in higher quality and lower “hidden

costs” for you as our customer

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10 ± 3 DPMO

86,5

77,5

58,5

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IPC7912

why DfX – Design for eXcellence

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customer• design idea (in block diagram)

• batch size and year volume of product

• traceability

tbp• DfM rules• data-exchange guidelines• ABC component list

customer• full BOM • CAD data, preferably in ODB++ (component and outer copper layers)

tbp• DfM report containing:

• component placement check• footprint check

customer• full BOM• CAD data, preferably in ODB++ (complete design )

tbp• DfM report containing:

• analysis of makeability• footprint check• component placement check• netlist analysis

design

Design for Manufacturing (DfM)

phase 0

phase 1

phase 2

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customer• design idea (in block diagram)• batch size and year volume of product

• traceability

tbp• DfT rules• data exchange guidelines

customer• schematics in EDIF 2.0 or Cadence Allegro format

• schematics in searchable PDF• full BOM• if possible, BSDL files

tbp• DfT report containing:

• preliminary test coverage• preliminary test strategy• preliminary slip-through• do-file

customer• CAD data, preferably in ODB++• possibly new schematics• possibly adjusted BOM

tbp• DfT report containing:

• final test coverage• final test strategy• percentage slip-through

designDesign for Test (DfT)

phase 0 phase 1 phase 2

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• production faults are unavoidable during assembly process (DPMO)

• a test coverage of 100% is unrealistic (technical)

• slip-through is the amount of boards which are passing the test strategy and still may contain production faults at customer side

• slip-through will be calculated in advance

slip-through explained

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test methods

X-ray

AOI

FPT

ICT

BST

combinationtest

FT

IEEE 1149.1 & IEEE 1149.6

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DfT – way of working

test strategy “as is”: AOI + FPT + BST

test strategy “as advised”: AOI + FPT + EBS test

quality x 4,7

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NIKHEF - HAM base promise 2

• via structural tests the slip-through can

be reduced to 0,08 %

• less functional test or no functional test at all

at board level

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production

customer

MES

logistics

qualitydata

reports

BOM

materials (jit)visual aids

SPC

Manufacturing Execution System

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questions

©tbp electronics bv

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dank u voor uw aandacht

thank you for your attention