Taiwan Semiconductor Manufacturing Company: Competitor Analysis Artificial Intelligence Lab,...

Taiwan Semiconductor Manufacturing Company: Competitor Analysis

Taiwan Semiconductor Manufacturing Company: Competitor Analysis

Artificial Intelligence Lab, University of Arizona

Dr. Hsinchun Chen

OutlineOutline

• Bibliometric Analysis

• Citation Network Analysis– Assignee-level Analysis

– Inventor-level Analysis

• Technology Topic Analysis– Topics of TSMC

– Topics in the technology field of 257 of the US Patent Classification

– Topic comparisons between TSMC and Competitors

• Conclusions2

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BIBLIOMETRIC ANALYSISBIBLIOMETRIC ANALYSIS

The bibliometric analysis reveals the following facts:

• TSMC has issued 5,193 patents to the USPTO during 2000 and 2012.

• TSMC has issued a significantly large portion of patents (3,397) in the technology field of 257, which is Active solid-state devices (e.g., transistors, solid-state diodes).

• Under this technology field, TSMC has issued the sixth most patents since 2007 among 2,993 assignees.

Taiwan Semiconductor Manufacturing Company (TSMC)Taiwan Semiconductor Manufacturing Company (TSMC)

•Top 10 technology fields of TSMC (US Patent Classification First-Level Categories)

•Data collection for patents in US Patent Classification of 257

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Rank Technology Field Number of Patents*1 257:Active solid-state devices (e.g., transistors, solid-state diodes) 3,3972 438:Semiconductor device manufacturing: process 2,6723 430:Radiation imagery chemistry: process, composition, or product thereof 3254 365:Static information storage and retrieval 2625 700:Data processing: generic control systems or specific applications 2096 216:Etching a substrate: processes 1287 716:Data processing: design and analysis of circuit or semiconductor mask 1228 134:Cleaning and liquid contact with solids 1109 361:Electricity: electrical systems and devices 106

10 327:Miscellaneous active electrical nonlinear devices, circuits, and systems 105

Assignee Period # of Patents # of InventorsTSMC 2000-2012 5,193 6,660

* A patent can belong to more than one classification category.** Name variations of assignees were resolved by NLP-based fuzzy string matching. The total number of assignees has been reduced from 4,517 to 2,993. (See Appendix 1).

Technology Field Period # of Patents # of Inventors # of Assignees** # of Countries257 2007-2012 59,471 51,972 2,993 52

Numbers of patents between 2000 and 2012Numbers of patents between 2000 and 2012

5

• TSMC issued the largest patents of 512 in 2001. Since then, the company issues around 450 patents every year.

• The trend analysis shows the slight decreases in patenting activities between 2008 and 2011. In particular, there was a big drop in 2009.

Top 20 assignees in the technology field of 257Top 20 assignees in the technology field of 257

• There are 2,993 assignees between 2007 and 2012.– During the past five years, TSMC has issued the sixth largest patents

(1,203) to the field of 257.

– 1,365 inventors of TSMC are involved in these patents.Rank Assignee Country # of Patents

1 Samsung Electronics Co., Ltd. KR 3,1622 International Business Machines Corporation US 2,7453 Micron Technology, Inc. US 2,2264 Kabushiki Kaisha Toshiba JP 1,7445 Semiconductor Energy Laboratory Co., Ltd. JP 1,3746 Taiwan Semiconductor Manufacturing Company, Ltd. TW 1,2037 Infineon Technologies AG DE 1,2008 Intel Corporation US 1,1079 Hynix Semiconductor, Inc. KR 944

10 Panasonic Corporation JP 77211 Texas Instruments Incoporated US 71812 NEC Electronics Corporation JP 66413 Seiko Epson Corporation JP 65614 Renesas Technology, Corp. JP 65415 Fujitsu Microelectronics Limited JP 60616 Sony Corporation JP 59217 Freescale Semiconductor, Inc. US 58518 Renesas Electronics Corportion JP 49819 Dongbu Electronics Co., Ltd KR 48220 Dongbu HiTek, Co., Ltd. KR 443

Rank Assignee Country # of Inventors1 Samsung Electronics Co., Ltd. KR 3,4832 International Business Machines Corporation US 2,4503 Kabushiki Kaisha Toshiba JP 1,4104 Taiwan Semiconductor Manufacturing Company, Ltd. TW 1,3655 Infineon Technologies AG DE 1,2586 Intel Corporation US 1,0547 Renesas Technology, Corp. JP 1,0188 Panasonic Corporation JP 8849 Micron Technology, Inc. US 839

10 Texas Instruments Incoporated US 81911 Renesas Electronics Corporation JP 81412 Applied Materials, Inc. US 75713 Sony Corporation JP 72014 Fujitsu Microelectronics Limited JP 71315 Hynix Semiconductor, Inc. KR 69916 NEC Electronics Corporation JP 66717 Matsushita Electric Industrial Co., Ltd. JP 63318 Hitachi, Ltd. JP 62419 Freescale Semiconductor, Inc. US 62320 Sharp Kabushiki Kaisha JP 525

The numbers of patents between 2007 and 2012The numbers of patents between 2007 and 2012

• The numbers of patents of the top 10 assignees are shown. – TSMC (6th), Samsung Electronics Co., Ltd. (1st), and IBM (2nd) are

highlighted.

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In early 2007, the numbers of patents between TSMC, IBM, and Samsung were similar. However, after the second quarter of 2008, Samsung and IBM issued a lot more patents (around 3 times more) than TSMC did.

8

CITATION NETWORK ANALYSISCITATION NETWORK ANALYSIS

Assignee-level and inventor-level analyses were conducted.

We observe from citation network analysis that TSMC has been one of key players in the technology field of 257. The company seems to be heavily related with IBM and Intel Corporation.

• TSMC ranked 3rd by PageRank, which is a measure to identify important nodes in a network. (Google has used PageRank to identify important web pages on the Web.)

• TSMC also ranked 3rd by Betweenness Centrality, which identifies influential nodes in terms of spreading information between other nodes.

Assignee networks by PageRankAssignee networks by PageRank

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* The citation network was drawn by PageRank under the US Classification of 257.

** The top 3 assignees are highlighted, which are IBM(1st), Samsung Electronics (2nd), and TSMC (3rd).

*** The thinker and darker in red the color, the stronger relationship between assignees.

Cluster 1 in red represents the relationships between the top 10 assignees. They have stronger relationships each other than other assignees. In particular, TSMC (3rd), Intel Corporation (6th), and IBM (1st) have strong relationships in patenting activities.

Cluster 2 in green represents another group of assignees that have strong relationships.

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Assignee networks by PageRank cont’dAssignee networks by PageRank cont’d

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TSMC is the third most important assignee under US Classification of 257.

IBM and Samsung Electronics are the top 2 assignees in terms of PageRank score.

Although Samsung Electronics has the most patents under this classification, its impact is next to that of IBM.

On the contrary, the analysis reveals that TSMC is ranked 3rd by importance, though it is at 6th by the total number of patents.

Rank Assignee PageRank

1 International Business Machines Corporation 33.319367

2 Samsung Electronics Co., Ltd. 28.264505

3 Taiwan Semiconductor Manufacturing Company, Ltd. 22.982529

4 Micron Technology, Inc. 20.826821

5 Kabushiki Kaisha Toshiba 20.243724

6 Intel Corporation 18.505991

7 Infineon Technologies AG 16.626531

8 Semiconductor Energy Laboratory Co., Ltd. 14.069179

9 Panasonic Corporation 12.509489

10 Freescale Semiconductor, Inc. 11.840193

11 NEC Electronics Corporation 11.751204

12 Sony Corporation 11.494882

13 STATS ChipPAC, Ltd. 11.10989

14 Renesas Technology, Corp. 10.622072

15 Cree, Inc. 10.164305

Assignee networks by Betweenness CentralityAssignee networks by Betweenness Centrality

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* The citation network was drawn by betweenness centrality under the US Classification of 257.

** The top 3 assignees are highlighted, which are IBM(1st), Samsung Electronics (2nd), and TSMC (3rd).

*** The thicker and darker in red the color, the stronger relationship between assignees.

The cluster in red shows the relationships between the top 10 assignees. They have stronger relationships each other than other assignees. Likewise, TSMC (3rd), IBM (1st), and Intel Corporation (5th) have strong relationships in patenting activities.

Cree, Inc.(9th) and Sony Corporation (10th) circled in green were named on the top 10 list. (They were 12th and 15th in terms of PageRank.)

Assignee networks by Betweenness Centrality cont’dAssignee networks by Betweenness Centrality cont’d

Rank Assignee Betweenness

1 International Business Machines Corporation 395939.64

2 Samsung Electronics Co., Ltd. 295207.83

3 Taiwan Semiconductor Manufacturing Company, Ltd. 211841.53

4 Kabushiki Kaisha Toshiba 177330.19

5 Intel Corporation 150580.73

6 Micron Technology, Inc. 146722.34

7 Semiconductor Energy Laboratory Co., Ltd. 111323.64

8 Infineon Technologies AG 110178.81

9 Cree, Inc.* 87210.531

10 Sony Corporation* 84321.651

11 NEC Electronics Corporation 78925.762

12 Panasonic Corporation 73943.286

13 Hewlett-Packard Development Company, L.P. 63522.442

14 Samsung Electro-Mechanics Co., Ltd. 62896.937

15 Matsushita Electric Industrial Co., Ltd. 60581.932

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TSMC is the third most influential assignee in the technology field of 257.

IBM and Samsung Electronics are the top 2 assignees in terms of betweenness centrality score.

Although Samsung Electronics has the most patents under this classification, its influence on other inventors is somewhat limited.

On the contrary, the analysis indicates that TSMC is one of the top 3 leading assignees in this category.

Inventor networks of the US Classification of 257Inventor networks of the US Classification of 257* The citation network was drawn based on the top 100 most important inventors by PageRank.

** Inventors of the top 5 assignees are highlighted, which are TSMC, Samsung Electronics, IBM, Toshiba, and Semiconductor Energy Laboratory.

The most important person is Shunpei, Yamazaki of Semiconductor Energy Laboratory in Japan.

There are 7 inventors of TSMC on the top 100 inventor list (See Appendix 1 for the top 60 inventors):•12th: Chen-Hua, Yu (11.645)•27th: Fu-Liang, Yang (8.920)•50th: Chenming, Hu (7.451)•66th: Andreas, Hase, Thomas, Murphy, and Matthias, Heschel (6.662)•77th: Yee-Chia, Yeo (6.112)

It seems to look that there are active relationships (Cluster 1) between TSMC and IBM. There is an inventor network (Cluster 2) of Semiconductor Energy Laboratory.

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Inventor networks of US Classification of 257 cont’dInventor networks of US Classification of 257 cont’d

Rank Assignee # of Inventors

1 Micron Technology, Inc. 15

2 International Business Machines Corporation 14

3 Intel Corporation 8

4 Advanced Semiconductor Engineering, Inc. 7

5 Taiwan Semiconductor Manufacturing Company, Ltd. 7

6 Semiconductor Energy Laboratory Co., Ltd. 5

7 MEGIC Corporation 4

8 Illumitex, Inc. 4

9 Macronix International Co. Ltd 4

10 STATS ChipPAC, Ltd. 3

11 Kabushiki Kaisha Toshiba 3

12 Infineon Technologies AG 3

13 General Electric Company 2

14 Cree, Inc. 2

15 Tela Innovations, Inc. 2

14

TSMC has 7 inventors listed on the top 100 inventors by PageRank.

Micron Technology, Inc. and IBM are the top 2 assignees that have the largest number of inventors on the top 100 list.

Even though Samsung Electronics has the most largest number of patents in this category, it has only 1 inventor that is on the top 100 inventor list.

Inventor networks of the technology fiedl of 257Inventor networks of the technology fiedl of 257* The citation network was drawn by Betweenness Centrality. The top 30 inventors are shown.

** Inventors of the top 5 assignees are highlighted, which are TSMC, Samsung Electronics, IBM, Toshiba, and Semiconductor Energy Lab.

The most important person is Shunpei, Yamazaki of Semiconductor Energy Laboratory In Japan.

There are 6 inventors of TSMC on the top 100 inventor list (See Appendix 2 for the top 60 inventors):•4th: Chen-Hua, Yu (7412117.24)•44th: Fu-Liang, Yang (1157142.58)•57th: Wen-Chih, Chiou (1059065.04)•76th: Andreas, Hase, Thomas, Murphy, and Matthias, Heschel (841019)

Cluster 2 mostly consists of inventors of TSMC. This cluster seems to connect Cluster 1 (mainly consisting of IBM’s inventors) and Cluster 3, which is a bridge to Cluster 4. (See the next slide for Cluster 2 in detail)

1

2

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Inventor networks of the technology field of 257 cont’dInventor networks of the technology field of 257 cont’d

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Inventors of Cluster 4 are mostly from Semiconductor Energy Lab.

Cluster 2 consisting mostly of TSMC is bridging Cluster 1 and Cluster 4 through Cluster 3 which is a mixed network of inventors.

TSMC has weakly connected citation networks. In contrary, IBM and Semiconductor Energy Lab have highly condensed (well formed) inventor networks.

1. IBM network

4: Semiconductor Energy Lab.

2. TSMC network

3. Mixed network

An enlarged part

Inventor network of the technology field of 257 cont’dInventor network of the technology field of 257 cont’d

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TSMC has 6 inventors listed on the top 100 inventors by Betweenness Centrality.

IBM and Micron Technology, Inc. are the top 2 assignees that have the largest number of inventors on the top 100 list.

Even though Samsung Electronics has the most largest number of patents in this category, it has only 2 inventors that are on the top 100 inventor list.

Rank Assignee # of Inventors

1 International Business Machines Corporation 17

2 Micron Technology, Inc. 13

3 Taiwan Semiconductor Manufacturing Company, Ltd. 6

4 Intel Corporation 6

5 STATS ChipPAC, Ltd. 4

6 Illumitex, Inc. 4

7 LG Electronics, Inc. 3

8 LG Innotek Co., Ltd. 3

9 Macronix International Co. Ltd 2

10 Infineon Technologies AG 2

11 Freescale Semiconductor, Inc, 2

12 Cree, Inc. 2

13 Semiconductor Energy Laboratory Co., Ltd. 2

14 Siliconware Precision Industries, Co. Ltd. 2

15 Samsung Electronics Co., Ltd. 2

Findings from citation network analysisFindings from citation network analysis

• In terms of a simple measure - the number of patents, TSMC was ranked 6th. However, when measuring quality of patents by network metrics of PageRank and Betweenness Centrality, we observe that TSMC has issued higher quality (important and influential) patents than other competitors such as Micron Technology, Kabushiki Kaisha Toshiba, and Semiconductor Energy Laboratory.

• In particular, Chen-Hua, Yu is a key inventor of TSMC. – Chen-Hua, Yu was ranked 4th and 12th in terms of betweenness centrality

and PageRank respectively.

• We also observe that IBM and Semiconductor Energy Lab. have significantly well formed inventors networks.

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TECHNOLOGY TOPIC ANALYSISTECHNOLOGY TOPIC ANALYSIS

Topic analyses reveal that TSMC has mostly invested in the following three topics: •semiconductor substrate/gate electrode (2000~2001), •semiconductor manufacturing/semiconductor wafer (2006-2007), and •semiconductor device/drain region (around 2011-2012)

TSMC has similar technology topics with Samsung Electronics, IBM, and Micron Technology.

• Japanese companies such as Toshiba and Semiconductor Energy Lab. Have their unique technology topics.

Topic Analysis on patents of TSMCTopic Analysis on patents of TSMC

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* The horizontal axis represents the time period, and the vertical axis shows the number of patents.

** The bigger circle, the more patents.

*** The top 2 most popular terms are shown per cluster. **** Clusters are represented as follows:the most popular term/the second most popular term (# of patent in popular year/total # of patents)

**** For example, a topic of ‘semiconductor device/drain region (57/536)’ marked by a red star is related with 536 patents in total, and this topic was peaked around 2011 with 57 patents. Likewise, ‘semiconductor manufacturing/semiconductor wafer (103/903)’ marked by a blue star means that there are 903 patents associated with this topic and it was popular around 2005~2006 with 103 of patents.

22 major topics were identified. 5 topics were popular in 2011. (See Slide 20)

• We observe from the topic analysis that before 2007 TSMC invested a wider range of technology topics (15 topics), since then, the company has narrowed down (7~8 topics) its technology fields.

Year

No

. o

f P

aten

ts

Topic Analysis on patents of TSMC cont’dTopic Analysis on patents of TSMC cont’d

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• There has been the big three technology topics: semiconductor substrate/gate electrode (2000~2001), semiconductor manufacturing/semiconductor wafer (2006-2007), and semiconductor device/drain region (around 2011-2012).

• Patents relating to semiconductor device/drain region has increased in 2011.

Year



*** The top 2 most popular terms are shown per cluster.

**** Clusters are represented as follows:the most popular term/the second most popular term (# of patent in popular year/total # of patents)

**** For example, a topic of ‘semiconductor device/drain region (57/536)’ marked by a red star is related with 536 patents in total, and this topic was peaked around 2011 with 57 patents. Likewise, ‘semiconductor manufacturing/semiconductor wafer (103/903)’ marked by a blue star means that there are 903 patents associated with this topic and it was popular around 2005~2006 with 103 of patents.

No

. o

f P

aten

ts

• Descriptive statistics on clusters

Topic Analysis* on patents of TSMC cont’dTopic Analysis* on patents of TSMC cont’d

22* The EM algorithm with an entropy–based feature selection technique was used.** Terms were extracted by Markov chain-based NLP technique.

Among 22 major topics, 5 were popular in 2011.

- semiconductor device/drain region

- semiconductor device/ semiconductor substrate

- semiconductor substrate/solder bump

- integrated circuit/semiconductor device

- active region/Shallow Trench Isolation

Cluster No. Topic (Cluster) # of

PatentsMost Popular

Year# of Patents

in most popular Year1 semiconductor manufacturing/semiconductor wafer (103/903) 903 2006 1032 semiconductor device/drain region (57/536) 536 2011 573 semiconductor substrate/gate electrode (75/452) 452 2001 754 semiconductor wafer/dual damascene structure (60/407) 407 2002 605 semiconductor substrate/floating gate (40/272) 272 2001 406 chemical mechanical polishing/semiconductor substrate (33/231) 231 2002 337 drain region/semiconductor substrate (31/230) 230 2007 318 semiconductor device/semiconductor substrate (50/229) 229 2011 509 integrated circuit/memory cell (35/209) 209 2010 35

10 semiconductor substrate/solder bump (31/194) 194 2011 3111 semiconductor substrate/image sensor (43/188) 188 2010 4312 memory cell/capacitor structure (24/184) 184 2002 2413 semiconductor wafer/microelectronic fabrication (31/172) 172 2004 3114 floating gate/control gate (26/162) 162 2000 2615 integrated circuit/semiconductor device (25/157) 157 2011 2516 silicon nitride/semiconductor device (14/115) 115 2001 1417 integrated circuit/CMOS image sensor (13/109) 109 2004 1318 integrated circuit/integrated circuit device (12/104) 104 2007 1219 process chamber/semiconductor processing (20/97) 97 2001 2020 storage device/manufacturing process (13/90) 90 2004 1321 contact hole/drain region (10/69) 69 2004 1022 active region/shallow trench isolation (9/52) 52 2011 9

Topic Analysis* on patents in the technology field of 257Topic Analysis* on patents in the technology field of 257

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Topic analysis finds 45 technology topics between 2007 and 2012. The 5 most popular topics are as follows:

1. drain region/gate electrode (1417/6189)

2. semiconductor material/semiconductor structure (1090/4582)

3. semiconductor package/integrated circuit (1105/4530)

4. thin film/integrated circuit (974/4402)

5. light emitting device/light emitting diode (1162/4220)

• Most of the topics are on the timeline of 2010 to 2012, meaning that these topics are growing and heavily invested.

No

. o

f P

aten

ts

* Top 15 topics are labeled.

Year

* See Appendix 4 for all topics.

Topic Areas of TSMCTopic Areas of TSMC

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*** The top 2 most popular terms are shown per cluster. **** Clusters are represented as follows:the most popular term/the second most popular term (# of patent in popular year/total # of patents)

We place the topics of TSMC over the topics of patents in the technology field of 257.

TSMC has issued most of its patents on the major technology topics.

In addition, it seems to look that TSMC has invested a few topics that might be emerging or new technology topics. (See a dotted square)

Rank Assignee Country # of Patents

1 Samsung Electronics Co., Ltd. KR 3,162

2 International Business Machines Corporation US 2,745

3 Micron Technology, Inc. US 2,226

4 Kabushiki Kaisha Toshiba JP 1,744

5 Semiconductor Energy Laboratory Co., Ltd. JP 1,374

6 Taiwan Semiconductor Manufacturing Company, Ltd. TW 1,203

Topic Comparison: TSMC and Samsung ElectronicsTopic Comparison: TSMC and Samsung Electronics

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TSMC and Samsung Electronics have quite similar technology topics that they have invested in.

However, Samsung Electronics has the broadest topic areas among the above top 5 assignees.

Along with the major topics, Samsung Electronics has different topic areas that are a little overlapped with those of TSMC. (See a dotted square), which means a different set of patents from TSMC.








• In terms of technology topics, Samsung Electronics is a major competitor to TSMC.

Topic Comparison: TSMC and IBMTopic Comparison: TSMC and IBM

26





TSMC and IBM have quite similar technology topics that they have invested in.

However, IBM has broader topics and more patents on almost every topic than TSMC has.

We observe that while having its most patents on the major topics IBM has several patents related to emerging or less competitive topics.








• In terms of technology topics, IBM is one of major competitors to TSMC.

Topic Comparison: TSMC and Micron Technology Topic Comparison: TSMC and Micron Technology

27





TSMC and Micron Technology have invested similar technology topics.

However, Micron Technology has a different set of technology topics from TSMC. (See a dotted square)








• In terms of technology topics, Micron Technology is one major competitors to TSMC.

Topic Comparison: TSMC and ToshibaTopic Comparison: TSMC and Toshiba

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TSMC and Toshiba have very different technology topics.

Unlike TSMC, Samsung Electronics, and IBM, Toshiba has its unique technology topics, which may have high entry barriers.








• In terms of technology topics, Toshiba is not a major threat to TSMC.

Topic Comparison: TSMC and Semiconductor Energy Lab. Topic Comparison: TSMC and Semiconductor Energy Lab.

29





TSMC and Semiconductor Energy Lab. have very different technology topics.

Like Toshiba, Semiconductor Energy Lab. has its unique technology topics different from topics of other assignees.








• In terms of technology topics, Semiconductor Energy Lab. is not a major threat to TSMC.

Topic Comparison: Top 5 AssigneesTopic Comparison: Top 5 Assignees

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Red Ocean: Popular technology topics, high competition.

Blue Ocean: Popular technology topics, low competition.

Emerging Areas (Possibly): small size topics, but being invested by major assignees

We define 3 topic areas by analyzing the top 5 assignees’ technology topics.

Red Ocean: Topics in this area are popular among major assignees. However, there are high competitions.•Heavily participated assignees are TSMC, IBM, Samsung Electronics, and Micron Technology.

Blue Ocean: Japanese companies have led technology development in this area. There seems to exist high entry barriers.•Heavily participated assignees are Semiconductor Energy lab., Toshiba, and Samsung Electronics.

Emerging areas: Major assignees such as Samsung Electronics, Micron Technology, IBM, and TSMC have started to invest in these topic areas.

Findings from Topic AnalysisFindings from Topic Analysis

31

TSMC

Samsung IBM

SamsungMicron

Toshiba

Semiconductor Energy Lab.

TSMC

Samsung IBM

• TSMC has competed with Samsung Electronics, IBM, and Micron Technology.

• These competitors have very similar technology topics.

• However, Toshiba and Semiconductor Energy Lab. (and Samsung Electronics*) have their own technology topics with high entry barriers.

• Samsung Electronics and Micron technology (and IBM*) are the top 2 major assignees that have actively invested in possible emerging technology topics.

Micron

Micron

• TSMC has stayed mostly in red ocean areas. On the other hand, Toshiba and Semiconductor Energy Lab. have developed their own technology fields. Although TSMC has a few patents on possibly emerging topics, Samsung Electronics and Micron Technology (and IBM*) have actively invested in these emerging topics.

* These assignees have relatively less patents than the listed assignees.

ConclusionsConclusions• In the technology field of 257, TSMC is one of the top major

assignees in terms of the quantity of patents and the impact of them.– TSMC has issued 1,203 patents, which is the sixth largest number.– TSMC is ranked 3rd by both PageRank and Betweenness Centrality.

• In general, TSMC has issued higher quality (important and influential) patents than other assignees such as Micron Technology, Kabushiki Kaisha Toshiba, and Semiconductor Energy Laboratory.

– TSMC has invested major topics, most of which are on highly competitive areas.• Samsung Electronics, IBM, and Micron Technology are the most threatening

competitors.

• TSMC has less invested in emerging topics than Samsung Electronics, Micron Technology, and IBM.

– Unlike Toshiba and Semiconductor Energy Lab., it seems that TSMC does not have its unique technology topics.

• It would be recommended that TSMC should develop its unique technology fields like Toshiba and invest more aggressively in emerging topics like Samsung and Micron do.

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Appendix 1 – Name variationsAppendix 1 – Name variations

• There were more than 60 other names of ‘Taiwan Semiconductor Manufacturing Company, Ltd.’.

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Appendix 2 - the top 60 inventors by PageRankAppendix 2 - the top 60 inventors by PageRankRank Inventor Assignee PageRank

1 Shunpei, Yamazaki Semiconductor Energy Laboratory Co., Ltd. 38.4515642 Matthew, Thomas Illumitex, Inc. 20.630214

2 Dung, Duong Illumitex, Inc. 20.6302142 Paul, Winberg Illumitex, Inc. 20.6302145 Leonard, Forbes Micron Technology, Inc. 20.60171

6 Elliot, Pickering Illumitex, Inc. 20.2783567 Mou-Shiung, Lin MEGIC Corporation 16.0185628 Seng Guan, Chow STATS ChipPAC, Ltd. 15.922942

9 Gurtej, Sandhu Micron Technology, Inc. 15.42613910 Robert, Chau Intel Corporation 14.75635911 Edward, Nowak International Business Machines Corporation 14.531086

12 Chen-Hua, Yu Taiwan Semiconductor Manufacturing Company, Ltd. 11.64589913 Suman, Datta Intel Corporation 11.17101614 Brian, Doyle Intel Corporation 11.096367

15 Jack, Kavalieros Intel Corporation 10.54085

16 Jin-Yuan, Lee MEGIC Corporation 10.50098517 Justin, Brask Intel Corporation 9.93489718 Bruce, Doris International Business Machines Corporation 9.887414

19 Jun, Koyama Semiconductor Energy Laboratory Co., Ltd. 9.6303420 Toru, Takayama Semiconductor Energy Laboratory Co., Ltd. 9.54639321 Kyle, Kirby Micron Technology, Inc. 9.472559

22 Gordon, Haller Micron Technology, Inc. 9.42655623 Chih-Chao, Yang International Business Machines Corporation 9.28318424 Il Kwon, Shim STATS ChipPAC, Ltd. 9.214418

25 Brent, Anderson International Business Machines Corporation 9.10766226 Warren, Farnworth Micron Technology, Inc. 8.98437827 Fu-Liang, Yang Taiwan Semiconductor Manufacturing Company, Ltd. 8.972037

28 Arup, Bhattacharyya Micron Technology, Inc. 8.59217129 Kie, Ahn Micron Technology, Inc. 8.40956230 Hsiang Lan, Lung Macronix International Co. Ltd 8.2855

Rank Inventor Assignee PageRank

31 Alan, Wood Micron Technology, Inc. 8.241465

32 Haining, Yang International Business Machines Corporation 8.189883

33 Joachim, Mahler Infineon Technologies AG 8.185752

34 Mark, Doczy Intel Corporation 8.14519

35 Hsiang-Lan, Lung Macronix International Co. Ltd 8.126355

36 Po-Shing, Chiang Advanced Semiconductor Engineering, Inc. 8.096437

36 Wei-Lun, Cheng Advanced Semiconductor Engineering, Inc. 8.096437

36 Pao-Huei, Chang Chien Advanced Semiconductor Engineering, Inc. 8.096437

36 Chien-Wen, Chen Advanced Semiconductor Engineering, Inc. 8.096437

36 Ping-Cheng, Hu Advanced Semiconductor Engineering, Inc. 8.096437

41 Patrick, Quinn Xilinx, Inc 8.050288

42 Gerald, Negley Cree, Inc. 7.999377

43 Sukianto, Rusli Amkor Technology, Inc. 7.935194

44 Huilong, Zhu International Business Machines Corporation 7.822556

45 Uday, Shah Intel Corporation 7.667084

46 Belgacem, Haba Tessera, Inc. 7.641821

47 Thomas, Happ Infineon Technologies AG 7.638735

48 Ronald Patrick, Huemoeller Amkor Technology, Inc. 7.572405

49 Dureseti, Chidambarrao International Business Machines Corporation 7.511611

50 Chenming, Hu Taiwan Semiconductor Manufacturing Company, Ltd. 7.451578

51 Ying-chih, Chen MEGIC Corporation 7.299187

52 Heap Hoe, Kuan STATS ChipPAC, Ltd. 7.179708

53 Matthew, Currie AmberWave Systems Corp. 7.150259

54 Zhe, Ding Honeywell International, Inc. 7.112492

55 Salman, Akram Micron Technology, Inc. 6.995864

56 Montgomery, Manning Micron Technology, Inc. 6.973411

57 Eigo, Tange Renesas Technology, Corp. 6.972972

58 Anthony, Minervini Knowles Electronics, LLC 6.920843

59 Matthew, Metz Intel Corporation 6.894688

60 William, Hiatt Micron Technology, Inc. 6.833838

Appendix 3 - the top 60 inventors by Betweenness CentralityAppendix 3 - the top 60 inventors by Betweenness CentralityRank Inventor Assignee Betweenness

1 Shunpei, Yamazaki Semiconductor Energy Laboratory Co., Ltd. 17440011.632 Yoshinobu, Suehiro Toyoda Gosei Co., Ltd. 9652827.493 Leonard, Forbes Micron Technology, Inc. 7715643.4234 Chen-Hua, Yu Taiwan Semiconductor Manufacturing Company, Ltd. 7412117.2495 Seng Guan, Chow STATS ChipPAC, Ltd. 7016185.636 Gurtej, Sandhu Micron Technology, Inc. 6441426.8887 Mou-Shiung, Lin MEGIC Corporation 4922525.288 Salman, Akram Micron Technology, Inc. 4331923.659 David, Corisis Micron Technology, Inc. 4259508.688

10 Jeffrey, Gambino International Business Machines Corporation 4090466.11311 Chandra, Mouli Micron Technology, Inc. 3640790.80912 Paul, Goodwin Staktek Group L.P. 3523504.73513 Enchao, Yu Netlist, Inc. 3434396.36714 Abraham, Ma Super Talent Electronics, Inc. 3341930.10515 Joachim, Mahler Infineon Technologies AG 2627494.57416 Arup, Bhattacharyya Micron Technology, Inc. 2515177.46817 Edward, Nowak International Business Machines Corporation 2506756.75318 Luan, Tran Micron Technology, Inc. 2370568.49819 Il Kwon, Shim STATS ChipPAC, Ltd. 2224441.720 Robert, Chau Intel Corporation 2220226.04421 Paul, Winberg Illumitex, Inc. 1960647.64521 Dung, Duong Illumitex, Inc. 1960647.64521 Matthew, Thomas Illumitex, Inc. 1960647.64524 Venkat, Kolagunta Freescale Semiconductor, Inc, 1908787.35325 Elliot, Pickering Illumitex, Inc. 1899776.94826 Ralf, Otremba Infineon Technologies AG 1844166.56427 Dureseti, Chidambarrao International Business Machines Corporation 1830077.26928 Primit, Parikh Cree, Inc. 1725753.30129 Chih-Chao, Yang International Business Machines Corporation 1716834.551

30 Kie, Ahn Micron Technology, Inc. 1620202.191

Rank Inventor Assignee Betweenness31 Yaojian, Lin STATS ChipPAC, Ltd. 1608413.82232 Meikei, Ieong International Business Machines Corporation 1563045.74133 Qi, Wang Fairchild Semiconductor Corporation 1419098.10834 Huilong, Zhu International Business Machines Corporation 1339868.13135 Haining, Yang International Business Machines Corporation 1336927.12236 Charles, Lin Bridge Semiconductor Corporation 1299214.96837 Jun Ho, Jang LG Electronics, Inc. 1244675.91938 Hsiang Lan, Lung Macronix International Co. Ltd 1205797.71839 Brian, Doyle Intel Corporation 1198919.57840 Ronald Patrick, Huemoeller Amkor Technology, Inc. 1197329.41141 Dong-Ho, Lee Samsung Electronics Co., Ltd. 1196060.26942 Sukianto, Rusli Amkor Technology, Inc. 1173884.36643 Belgacem, Haba Tessera, Inc. 1169629.67244 Fu-Liang, Yang Taiwan Semiconductor Manufacturing Company, Ltd. 1157142.58445 Sun Kyung, Kim LG Innotek Co., Ltd. 1148682.52546 Cheng-Tien, Lai Foxconn Technology Co., Ltd. 1139898.55346 Cheng-tien, Lai Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. 1139898.55348 Scott, List Intel Corporation 1138501.70349 Gordon, Haller Micron Technology, Inc. 1135245.22550 Hyun Kyong, Cho LG Innotek Co., Ltd. 1130596.52550 Jun Ho, Jang LG Innotek Co., Ltd. 1130596.52550 Sun Kyung, Kim LG Electronics, Inc. 1130596.52550 Hyun Kyong, Cho LG Electronics, Inc. 1130596.52554 Bruce, Doris International Business Machines Corporation 1109285.77955 John, Trezza Cufer Assett Ltd. L.L.C. 1091974.90256 Sheng Teng, Hsu Sharp Laboratories of America, Inc. 1070973.49357 Wen-Chih, Chiou Taiwan Semiconductor Manufacturing Company, Ltd. 1059065.04758 Suman, Datta Intel Corporation 1055807.4159 Zhong-Xiang, He International Business Machines Corporation 1040715.218

60 Michael, Krames Philips Lumileds Lighting Company, LLC 1009508.959

Appendix 4 – Topics under US Classification of 257Appendix 4 – Topics under US Classification of 257

Cluster No. Topics # of

PatentsMost Popular

Year

1 drain region/gate electrode (1417/6189) 6,189 2011

2 semiconductor material/semiconductor structure (1090/4582) 4,582 2010

3 semiconductor package/integrated circuit (1105/4530) 4,530 2011

4 thin film/integrated circuit (974/4402) 4,402 2007

5 light emitting device/light emitting diode (1162/4220) 4,220 2011

6 integrated circuit/semiconductor wafer (768/3762) 3,762 2007

7 semiconductor chip/integrated circuit (869/3744) 3,744 2011

8 heat sink/semiconductor chip (743/3401) 3,401 2010

9 insulating film/heat treatment (756/3217) 3,217 2011

10 integrated circuit/hard mask (452/2666) 2,666 2007

11 gate electrode/insulating film (711/2577) 2,577 2011

12 integrated circuit/memory cell (466/2326) 2,326 2009

13 contact hole/gate electrode (502/2079) 2,079 2010

14 gate electrode/drain electrode (476/1708) 1,708 2010

15 general formula/electronic device (417/1479) 1,479 2011

16 thin film transistor/insulating film (334/1308) 1,308 2010

17 insulating film/semiconductor chip (285/1093) 1,093 2011

18 interconnect structure/integrated circuit (264/1068) 1,068 2010

19 light emitting device/light emitting (193/704) 704 2011

20 insulating film/gate electrode (132/575) 575 2011

21 memory cell/active region (132/506) 506 2011

22 semiconductor structure/emitting device (138/391) 391 2011

23 conductive material/dielectric material (69/297) 297 2007

Cluster No. Topics # of

PatentsMost Popular

Year

24 upper electrode/lower electrode (73/281) 281 2010

25 quantum well/thin film transistor (70/259) 259 2010

26 electronic device/heat sink (49/221) 221 2010

27 memory cell/memory device (43/185) 185 2010

28 gate electrode/drain electrode (48/174) 174 2010

29 Field-effect transistor/gate electrode (55/163) 163 2010

30 floating gate/memory cell (42/139) 139 2011

31 gate electrode/metal silicide (33/136) 136 2010

32 semiconductor chip/upper surface (39/133) 133 2010

33 electronic device/gate electrode (35/120) 120 2011

34 heat sink/integrated circuit (24/104) 104 2008

35 gate electrode/thin film transistor (25/92) 92 2010

36 gate electrode/strained silicon (23/86) 86 2011

37 memory cell/memory device (18/77) 77 2011

38 memory device/drain region (17/76) 76 2011

39 electrical connection/multiple power mode (25/73) 73 2010

40 control gate/floating gate (20/66) 66 2009

41 integrated circuit/gallium nitride (22/62) 62 2011

42 lower electrode/upper electrode (15/57) 57 2011

43 floating gate/control gate (14/55) 55 2012

44 capacitor structure/thin film (13/49) 49 2009

45 control signal/input signal (9/24) 24 2010

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