Tacky Assembly Flux

Nich Top Company

Hallway International Trading Corporation© All Right Reserved

TACKY ASSEMBLY TACKY ASSEMBLY FLUXESFLUXES

1616 JJul.ul. 20092009

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Typical Applications

1) SMT & Rework

2) Ball-Attach (BA)

3) Package on Package (PoP)

4) Stud Bumping (SB)

BGA Back End Component Flip Chip Component

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Typical ApplicationsAu Wire

Solder sphereTacky Flux

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Product OverviewTACKYFLUXES & PASTES

Dispensing

Printing

Dipping

Water-Clean No-Clean

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SC88 Key Benefits

DISPENSING APPLICATION ONLY

Product Overview

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SC88 Key BenefitsAir free filled syringes, no misses.Compatible with epoxy under fill (REL0 formulation).Adapted for lead-bearing and lead-free alloys.Suitable for fast dispensing (1mg in 100ms) without choking.Regular dots from Day 1 to Day 5 at 22-24°C.No component movement.Thermally stable at up to 280°C.Low, clear no-clean post-soldered flux residue.Easy-clean formula, if desired (isopropanol, Zestron & Vigon products).

Properties desired for Tacky Flux

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Dispensing Printing

Flux Type: No-CleanApplication: Dispensing

AF 218-1 AF 218-2

Solids content: 39 %Density @25°C: 0.92 g/cm3

Viscosity @25°C: 12 000 cPPeak Tack Force: 2.8 g/mm2

Flux Type: REL0SIR (J-STD-004): 1 x 108 ΩSIR (Bellcore): >2 x 104 MΩCopper Mirror: PassAg chromate test: Pass



Flux Type: ROL0SIR (J-STD-004): 1 x 108 ΩSIR (Bellcore): >2 x 104 MΩ aCopper Mirror: PassAg chromate test: Pass

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Dispensing PrintingAF 918-1 AF 918-2

Flux Type: Water-CleanApplication: Dispensing



Flux Type: ORL0SIR (J-STD-004)*: >1 x 108 ΩSIR (Bellcore)*: >2 x 104 MΩ

* after cleaning



Flux Type: ORH1SIR (J-STD-004)*: >1 x 108 ΩSIR (Bellcore)*: >2 x 104 MΩ

* after cleaning

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Dispensing Dispensing performanceperformance

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Dispensing performanceDispensing performanceWhat most assemblers expectWhat most assemblers expect

• Regular deposits at 20-25°C

• Homogeneous through complete use of syringe

• No choking at 20-25°C up to 5 days.

• Deposits remain tacky up to 16 hours

• Steady dispensing equipment

AF 218 0,4mm; 1 bar; 100 ms

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Soldering Soldering performanceperformance

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Suitable Temperature ProfilesSuitable Temperature ProfilesAF 218 & AF 918 SAC 305AF 218 & AF 918 SAC 305 (Alpha Lead(Alpha Lead--free tinfree tin--bar)bar)

MMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMMIIII

Tpeak 245°C

Tliq217°C 30-45s

Time/s

Temp/°C

Ramp: 1-2 °C/s

Hallway Reflow Profile

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Amkor Reflow Profile

Suitable Temperature ProfilesSuitable Temperature ProfilesAF 918 SAC 305AF 918 SAC 305

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Stats ChipPAC Reflow Profile

Suitable Temperature ProfilesSuitable Temperature ProfilesAF 918 SAC 305AF 918 SAC 305

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Soldering performanceSoldering performanceAF 918 SAC 305 600AF 918 SAC 305 600µµm BGA spheresm BGA spheres

AF 918

Senju WF6300LFHV

OSP Cu ENIG

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AFD 218AFD 218AFD 218AFD 218IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIAF 918 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIISenju WF6300LFHV

IIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

Soldering performanceSoldering performanceAF 918 SAC 305 600AF 918 SAC 305 600µµm BGA spheresm BGA spheres

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Soldering performanceSoldering performanceAF 218 with 600AF 218 with 600µµm SAC 305 spheres (air)m SAC 305 spheres (air)

Reflection from camera‘s LEDs

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RELIABILITY TESTRELIABILITY TESTAF 918 Sn96.5Ag3.6 600AF 918 Sn96.5Ag3.6 600µµm spherem sphere

High reliability for good circuit functionHigh reliability for good circuit function

Ball Cross-sectionBall-Shear

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Low void content (<3%)Low void content (<3%)


IMC’s

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Low void content (<1%)Low void content (<1%)


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Cleaning Cleaning performanceperformance

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Cleaning performanceCleaning performanceBefore cleaningBefore cleaning After cleaningAfter cleaning

1. In-line DI water cleaner

2. Water temperature: 60C

3. Belt speed of 1 m/min

4. Pressure: 60PSI spray.

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Free of flux and solder debris after cleaning

Excellent cleaning performance

Bright solder surface

Consistently good results at different cleaning stations

Cleaning performanceCleaning performance

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Key benefitsKey benefits

Regular flux shots and stable dispensingNo component movementLong green strength (minimum 2 hours for a 1mm3 dot)Excellent wettingExcellent cleaning performanceLow solder void contents (<1%)

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for your kind attention andfor your kind attention and

patience for listening to mypatience for listening to my

presentationpresentation

Thank You

Tacky Assembly Flux

Self Improvement

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