TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open /...
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Transcript of TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open /...
![Page 1: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/1.jpg)
TA JetApply the theory of electrostatic strength
measurement to detect the solder joint’s open / contacted BGA pins up to 100%.
![Page 2: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/2.jpg)
What’s the difference between TA Jet & HP TestJet?
TA Jet HP TestJet
TheoryElectrostatic
measurement.Capacitor coupling.
Signal Processing. Through SW CARD Through MUX CARD.
No. of Test Terminals.
3 2
Sensing signal ratio of contacted/open. 20~30 times, High. 10~15times, Low.
Test Frequency.2K~10K automatic
adjustable.Only one frequency at
10KHz.
Cost USD3,000- USD10,000-
MUX Card cost. No USD100/ board.
Sensor pad price. USD 35/set USD35-85/set.
![Page 3: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/3.jpg)
Know how(I)
MUX CARD
M
(Current Pre. AMP.)
SWITCH CARD
M
(Synchronous Detector AMP.)
HP TestJet
TA Jet
![Page 4: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/4.jpg)
Know how(II)
HP TestJet
TA Jet εElectrostatic
strength. (V/m)
Measuring the capacitance between bonding line and HP sensor
pad. (fF)
![Page 5: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/5.jpg)
Solder joints Contacted / Open sense level.
TA Jet testing ability is over 20 times of HP Test Jet.
![Page 6: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/6.jpg)
SMD coverage rate.
FQFP, SOJ, SOP, PLCC
HP TestJet test results : good.
TAJet test results : excellent.
![Page 7: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/7.jpg)
BGA coverage rate.
HP Test Jet.
TA Jet.
A
A
ε
ε Coverage rate up to
100%.
Unstable to test under 100fF level.
Normal IC
BGA
![Page 8: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/8.jpg)
Intel 845(North Bridge) coverage rate.
HP TestJet about 10%
level.
Ad
d
![Page 9: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/9.jpg)
ε
TA Jet coverage rate up to 100%.
r
SWITCH CARD
M DSP
Intel 845(North Bridge) Coverage Rate.
![Page 10: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/10.jpg)
Intel 845(North Bridge) coverage rate.
TA Jet
SWITCH CARD
M DSP
V
F
Contacted
BGA845
NoiseOKopen
SMD
fs
![Page 11: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/11.jpg)
SCSI / PCI SMD Connector.
HP TestJet
TA Jet
![Page 12: TA Jet Apply the theory of electrostatic strength measurement to detect the solder joints open / contacted BGA pins up to 100%.](https://reader033.fdocuments.net/reader033/viewer/2022051614/551759f85503460e6e8b4772/html5/thumbnails/12.jpg)
Benefits of TA Jet. • Up to 100% BGA pins of solder joint’s Contacted/
Open inspection.• Up to 100% Intel 845 BGA pins of solder joint’s
Contacted/Open inspection.• Up to 100% SCSI / PCI SMD connector solder joint’s
Contacted/Open inspection.• Make sure where the true BGA failures are.
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Parallel pins.
If circuit impedance small than 10ohms, the stimulus signal can not apply to almost a short circuit.
Logically BGA parallel pins are same circuit, we can not discriminate if one of them is open circuit.
Circuit impedance.
BGA relative components.
If the BGA relative component in O/S, missing part, wrong part fail, it may affect the test value of BGA.
Limitations of BGA Open/contacted test.