SurfaceSurface MicromachiningMicromachining

• Low loss and low power consumption

• Eliminate dielectric loss

– Loss is high in V-band

• Previously developed modules

– Vertical monopole

– Vertical Yagi-Uda

– Elevated patch

antenna

– Elevated coupler

Enabling TechnologyEnabling Technology

--Polymer core conductorPolymer core conductor

Y-K. Yoon, J-W. Park and M. G. Allen, “Polymer-core conductor

approaches for RF MEMS,” Journal of Microelectromechanical Systems,

vol. 14, No. 5, pp. 886-894, Oct. 2005.

Metalized polymer

pillars

HighHigh--Q elevated Cavity resonatorQ elevated Cavity resonator(2(2--pole surface micromachined waveguide filter)pole surface micromachined waveguide filter)

Top plate not shown for clarity

22.5 25.0 27.5 30.0 32.5 35.0 37.5-80

-70

-60

-50

-40

-30

-20

S21 (

dB

)

Frequency (GHz)

> 219-20.2729.65 GHzMeas

23.2a planar CPW or microstrip

resonator on the same substrate

280-12.629.23 GHzSim

Unloaded QS12 (dB)fres

VV--Band Prototype IBand Prototype I(2(2--pole surface micromachined waveguide filter)pole surface micromachined waveguide filter)

Top plate not shown for clarity

-50

-40

-30

-20

-10

0

50 55 60 65 70

Measurement

S P

ara

mete

rs (

dB

)

Freq (GHz)

Simulation

1.6 GHz (2.65%)2.9 dB60.25 GHzMeas

1.6 GHz (2.65%)2.4 dB60.20 GHzSim

3-dB BWInsertion loss (dB)fcenter

VV--Band Prototype IIBand Prototype II(2(2--pole surface micromachined cavity filter)pole surface micromachined cavity filter)

Less than 1.5 dB insertion loss for 60 GHz

No waveguide transition

micromachined probe directly fed into

cavities

Top plate not shown for clarity

(Patent pending)

VV--Band Prototype IIIBand Prototype III(Prototype and Measurements)(Prototype and Measurements)

SEM picture of the cross-coupling

structureMeasured filter response vs. simulated one

2.45 dB insertion loss observed

UWB antennasUWB antennas on flexible organic on flexible organic

substratessubstrates

CPW feeding

Impedance matching technique

δtan = 0.002εr = 3.0

4 mil LCP Substrate

The objective of this research is the design and development of novel compact UWB

antennas with omni-directional radiation patterns and good matching along the whole

UWB range (3.1-10.6 GHz) that can be used for hand-held devices for personal

communications. Polygon monopoles, elliptical monopoles and elliptical slot antennas

are used to meet various required specifications.

All the presented antennas are fabricated on Liquid Crystal Polymer (LCP) (εr=3,

tanδ=0,002) and were tested in non-planar shapes to investigate their potential use in

different applications like wearable electronics.

Polygon-shaped

Antenna mounted on Cylinder

UWB (3.1-10.6 GHz)

Return Loss

CPW feeding

Impedance matching technique

δtan = 0.002εr = 3.0

4 mil LCP Substrate

Polygon AntennaPolygon Antenna

UWB (3.1-10.6 GHz)

E Plane

H Plane

Antenna mounted on Cylinder

Radiation Patterns

CPW feeding

Impedance matching technique

0

-10

-20

-30

-400

30

60

90

120

150

180

210

240

270

300

330

Measurement

Simulation0

-10

-20

-30

-400

30

60

90

120

150

180

210

240

270

300

330

Measurement

Simulation

5 GHz

0

-10

-20

-30

-400

30

60

90

120

150

180

210

240

270

300

330

Measurement

Simulation0

-10

-20

-30

-400

30

60

90

120

150

180

210

240

270

300

330

Measurement

Simulation

9 GHz

E Plane E Plane H PlaneH Plane

Elliptical-shaped

U-fed elliptical slot

CPW feeding

Impedance matching technique

2 4 6 8 10 12-35

-30

-25

-20

-15

-10

-5

0FoldedPlanar

0

-10

-20

-30

-400

30

60

90

120

150

180

210

240

270

300

330

FoldedPlanar

Antenna mounted on Cylinder

r

3-D Radiation Patterns

E plane @ 8 GHz H plane @ 8 GHz

CPW feeding

Impedance matching technique

Return loss

3-D Radiation Patterns

E plane @ 8 GHz H plane @ 8 GHz

2 4 6 8 10 12-35

-30

-25

-20

-15

-10

-5

0FoldedPlanar

0

-10

-20

-30

-400

30

60

90

120

150

180

210

240

270

300

330

FoldedPlanar

Antenna mounted on Cylinder

r

UU--fed Elliptical Slotfed Elliptical Slot

3D Integrated Modules for RF and mm-wave applications

Considering the importance of broadband and high-data rate (> 2 Gb/s) wireless

services such as a high-speed internet, real-time video streaming, high-definition

television (HDTV), wireless Gigabit Ethernet and automotive sensor, wireless

communication systems call upon miniaturization, portability, cost-saving and

performance improvement to satisfy the specifications of the next generation

multi-gigabit per second wireless transmission. The 3-D integration approach

using multilayer technologies, such as LTCC and LCP, has emerged as an

attractive solution for these systems due to its high level of compactness and

mature multilayer fabrication capability. In this research, we design, analyze and

optimize 3D millimeter-wave (mm-W) modules in multilayer substrates. It

includes the design of integrated interconnects, distributed passives and

antennas for applications up to 100 GHz. The optimal integration of mm-W

passives into a 3-D front-end module is researched to improve package

efficiency and electrical high-frequency performance and to eliminate a separate

package for passives, yielding the lower cost, reduced profile and weight.

3-Pole Cavity Band Pass Filters using LTCC

� Type I � Type II

microstrip feedlines

via wallsvia walls

metal 1

metal 2substrate 1

substrate 2-6

metal 7

substrate 7-11

metal 12

Cavity1 Cavity2

Cavity3

external slot external slot

internal slots

OSL

48 50 52 54 56 58 60 62 64 66-60

-50

-40

-30

-20

-10

0

dB

Frequency (GHz)

S21 (measured)

S21 (simulated)

S11 (measured)

S11 (simulated)

54 56 58 60 62 64 66-80

-70

-60

-50

-40

-30

-20

-10

0

dB

Frequency (GHz)

S21 (measured)

S21 (simulated)

S11 (measured)

S11 (simulated)

� Type I � Type II

Simulation & Measurement Results

Rx filter Tx filter

cross-shaped

patch antenna

external

slots

internal

slots

air cavity

port1 port2

T1 T2

M11

Rx filter

S10

Air Cavity

M10Rx feedline

cross-shaped

patch antenna

Tx feedline

microstrip Rx feedline

M9

M8

M7

M6

M5

S9

S8

S7

S6

S5

S1-S4

Tx filter

microstrip Tx feedline

� 3-D overview of the Integration

� Side view of the Integration

Port 1 (Rx Port)

Port 2 (Tx Port)

Air Cavity

Open CPW

Pads for

measurement

� Fabricated Integration

LNA

PA

Dual-band

Antenna

Duplexer

Down-Mixer

Up-Mixer

VCO

Rx port

Tx port

� V-band transceiver block diagram

Integration (Filter + Antenna)

54 56 58 60 62

-85

-80

-75

-70

-65

-60

-55

-50

-45

dB

Frequency (GHz)

S21 (measured)

54 56 58 60 62

-35

-30

-25

-20

-15

-10

-5

0

dB

Frequency (GHz)

S22 (measured)

S22 (simulated)

54 56 58 60 62-40

-35

-30

-25

-20

-15

-10

-5

0

dB

Frequency (GHz)

S11 (measured)

S11 (simulated)

� 1st Channel (Rx band)

� Isolation

� 2nd Channel (Tx band)

>51.9 (58.4-60.7GHz)>49.1 (56.2-58.6GHz)Isolation (dB)

59.8559.957.4557.5Center

Frequency

(GHz)

3.843.514.183.6510-dB

Bandwidth

(%)

Meas.Sim.Meas.Sim.

2nd Channel1st ChannelDesign

Parameters

Simulation & Measurement Results