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TechTalk Storage, Net work ing & IoT Journal

1st EditionMarch 2015

An Examination on the evolution of computing.By Ravi Thummarukudy, CEO of Mobiveil, Inc. Anyone attending the Linley Data Center Conference 2015 Held on February 25 and 26 at the Hyatt Regency Hotel in Santa Clara, California would come away with the impression that data centers are increasingly becoming virtualized software-defined entities. This is increasingly being made possible by the widespread availability of relatively low-cost standard hardware components: powerful interchangeable compute engines, low cost solid state and hard drive storage and ubiquitous networking. Datacenter virtualization is achieved through a layer of software above virtualized hardware: computing infrastructure, storage farms, networks, and associated security and management components.

Yuval Bachar, Hardware Network Architect, at Facebook, during the afternoon Session on February 26th Future Directions in Cloud Computing , made the point that his company constructed its data centers using standard hardware components and has virtualized hardware infrastructure to allow rapid deployment and maintenance of additional capacity anywhere in the world. Some data centers are being constructed in regions of the world where year round low temperature saves the power that would otherwise be needed to lower the high costs of cooling these huge hardware installations.

Companies such as Facebook, Twitter, YouTube and many others are continuously generating enormous amounts of data. EMC Corp. declares that by 2020 there will be nearly as many digital bits as there are stars in the universe. “It is doubling in size every two years, and by 2020 the digital universe – the data we create and copy annually – will reach 44 zettabytes, or 44 trillion gigabytes.” According to HP, “to handle the explosive amount of data being generated , an estimated 8 to 10 million new servers in the equivalent of

Cont’d on p. 2

Data Centers Become Virtualized Software-Defined Entities

MoBIvEIL INC

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MoBIvEIL INFo

In this issue

Accelerating Big Data Access

1 Data Centers Become virtualized Software-Defined Entities

2 Mobiveil - Semtech offer PCI Express® 3.0 Controller & PHY IP

3 Mobiveil to License and Support Spansion’s High-Performance HyperBus™ Controller

3 Automotive IC Market Strong & Growing

As a member of the RapidIo community for many years, I was extremely pleased to hear how RapidIo enabled such large scale connectivity and thus accelerating exciting applications in the next generation data centers RapidIo, the unified fabric for performance critical computing, addresses needs in data center and high performance computing, communications infrastructure, industrial automation and military and aerospace markets by offering high reliability and low latency unified fabric. RapidIo provides chip-to-chip, board-to-board and shelf to shelf peer to peer connectivity at performance levels scaling to 100s of Gigabits per second and beyond RapidIo.

Mobiveil and RapidIO Long Time Partners

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200 football-field-sized data centers, are needed for the cloud over the next three years. “

And this data is constantly being accessed, processed, and written and rewritten. As the speed of data movement increases, bottlenecks become glaringly apparent and just as one bottleneck is broken another one crops up to take its place. The best example of this phenomenon is the rapid deployment of solid-state storage elements to cache frequently accessed data from disk farms. while the flash storage eliminated the rotational latency of the hard drives, the interfaces between server and flash subsystem quickly became another bottleneck, just recently broken using the newly developed NvMe interface. NvMe reduces latency overhead by more than 200% percent over an interface based on SATA/SAS that flash SSDs were using previously.

Yet another bottleneck cropping up in data centers is produced by the need to perform real time analysis of data. In his informative presentation at the Linley Conference, The Growing Diversity in Today’s Data Center, Tom Bradicich, vice President

of Server Engineering at Hewlett-Packard cited several real world examples that needed different workload optimizations. Some of the examples cited were real time data Analytics by Paypal, Extreme file transfer at 20th Century Fox studios and molecular dynamics to hydro dynamics and data analysis at Sandya National Laboratories.

\ Bradicich cited the Moonshot server platform as the data center architecture HP is offering to provide real-time data analysis as well as the ability to accommodate the enormous growth of information content flooding into data centers at Facebook and other social media sites. Moonshot is an example of the software-defined server built with low-power processors and SoCs from a variety of suppliers. A single Moonshot chassis contains 1,440 DSP cores, 760 ARM cores and up to 11.5TB of storage connected via a unified 5Gbs per lane RapidIo fabric. up to 1,800 HP Moonshot servers can fit in a single server rack. The RapidIo interface was mentioned as a key contributor that enabled such large scale connectivity within the moonshot platform.

Mobiveil, Inc., a fast growing supplier of silicon intellectual property, platforms, and IP-enabled engineering services today announced its collaboration with Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, to provide SoC designers a verified PCI Express® (PCIe®) 3.0 controller and PCIe 3.0 PHY. Mobiveil’s GPEx PCI Express controller and ultra-low power, ultra-low latency PCI Express 3.0 PHY, part of Semtech’s Snowbush® IP family of IP products, provide a complete solutions for customers who need to deploy PCIe 3.0 technology on their ASIC/SoCs. The combination IP-solution saves up to 24 man months of internal design effort while providing a PCIe 3.0 controller with Single Root I/o virtualization (SR-Iov) and Alternative Routing-ID Interpretation (ARI) support.

Recently Mobiveil’s GPEx PCIe controller and Semtech’s PHY received a design win with an optical Networking equipment supplier. using this pre-verified PCIe solution to provide chip-to-chip communication for their unique hardware design, the

company plans to shorten time to market and reduce the risk to achieve first time success of their design.

“our collaboration with Mobiveil will offer SoC designers a combined PHY and controller for PCIe 3.0 technology,” said Semtech Corp. worldwide Marketing Director, Snowbush IP, Kevin walsh. “Semtech’s endpoint PHY IP for PCI Express 3.0 technology passed PCI-SIG® compliance testing and is now on the PCIe 3.0 Integrators List. It can support both long reach and short reach channels. The Snowbush PHY for PCIe 3.0 technology delivers high performance with best-in-class power efficiency in process nodes down to 28nm. This saves in-house engineering and frees these resources to concentrate on value added circuit design.”

“Semtech and Mobiveil are both long-standing members of PCI-SIG,” said Al Yanes, PCI-SIG president and chairman. “we are pleased with their efforts to provide key components that serve the PCI Express ecosystem.”

The RapidIO interface facilitates the growth in software defined computing architectures

Gopa Periyadan, Mobiveil Chief operating officer

The Semtech ultra-low power, ultra-low latency PCI Express 3.0 PHY, which is part of the Semtech’s Snowbush® IP family of IP products, provides a differentiated choice of power supplies (1.8v, 2.5v or 3.3v) to support legacy applications and ease of integration. The ultra-low power consumption for both normal and low power state modes, combined with very low wake up latencies, enable designers to reduce system power significantly. These features give designers the best IP choice when developing PCIe interfaces for the storage, server and high-performance computing markets. Building on 14 successful product tape-outs at 40nm, and six PCIe 3.0 designs at 28nm process, and growing, this offering provides designers with lowest power and lowest latency.

About the Semtech PCI Express 3.0 PHY

Mobiveil - Semtech Offer PCI Express® 3.0 Controller & PHY IP

“we are thrilled joining with Semtech to provide SoC designers our GPEx PCIe 3.0 controller with Single Root I/o virtualization and Alternative Routing-ID Interpretation (ARI) and Address Translation Services (ATS) support,” said Gopa Periyadan, Mobiveil Coo. “SRIov controls resource configuration and management and reduces hardware requirements and cost of provisioning a significant number of I/o Functions within a device. SR-Iov with other I/o virtualization technologies such as ATS and interrupt remapping allow a complete I/o virtualization solutions. Designers are assured a high speed PHY with a PCIe 3.0 endpoint controller that passed PCI-SIG’s Gold Suite compliance testing March last year, allowing them full advantage of the PCIe 3.0 interface.”

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Mobiveil, Inc., a fast growing supplier of silicon intellectual property, platforms, and IP-enabled engineering services today announced it will provide IP licensing and support for Spansion’s HyperBus™ controller. Mobilveil is licensing Spansion’s HyperBus™ intellectual property that is integrated into microcontrollers, allowing these products to interface with Spansion’s HyperFlash™ memories. Mobiveil’s decades of experience in delivering high‐

quality, configurable, production‐proven, high-speed serial interconnect silicon IP cores combined with Spansion’s leading-edge HyperBus memories will expand the use of the interface in the fast growing $22B automotive electronics market worldwide.

“we look forward to having Mobiveil support Spansion’s HyperBus memory solutions,” said Jackson Huang, vice president of product

marketing and ecosystem at Spansion. “Combining the high performance MirrorBit® architecture with the low pin-count nature of the HyperBus interface, Spansion’s HyperFlash memory achieves the industry’s highest read throughput, up to 333 megabytes per second. That’s more than five times faster than ordinary quad SPI flash currently available with one-third the pin-count of parallel flash. The balance of high performance and low

pin-count makes HyperFlash memories especially attractive for applications, including automotive instrument clusters, i n f o t a i n m e n t / n a v i g a t i o n systems and advanced driver assistance systems (ADAS).”

The new HyperBus controller is part of Mobiveil‘s High Speed Serial Interconnect family of IP solutions that also includes Gen3/2 PCI Express, Gen3/2 RapidIo, NvM Express, DDR4/3, LPDDR3/2, NAND Flash Controller, 10G/1G Ethernet MACs PCI Express Bridge and Switch solutions. Mobiveil IP offers the most feature-rich, power-efficient, highly interoperable and silicon-proven solutions for different form factors to provide the optimum balance between power and performance.

“Mobiveil is excited to be licensing and providing support for Spansion’s HyperBus

controller,” said Ravi Thummarukudy, CEo of Mobiveil. “our experience designing high-speed interfaces up to 15 gigabits per second enables us to support the unique requirements of integrating the HyperBus controller into SoC designs. In addition,

our design team has extensive background creating highly configurable silicon IP that can be easily incorporated into processor and flash memory-based automotive applications.”

HyperBus technology is immediately available from Mobiveil. For more information, e-mail IP@mobiveil.com.

Mobiveil to License and Support Spansion’s High-Performance HyperBus™ Controller

Mobiveil & Spansion Collaborate to Drive HyperFlash™ Adoption In High-Growth Automotive Electronics Market

Automotive IC Market Strong & Growing

IC Insights in its report “Automotive IC Market to Display Strongest Growth Through 2018,” released in November last year, declares, “from luxury to base models, IC content on all new cars is increasing.” The Scottsdale, AZ-based Market research firm expects the automotive IC market, predicted to be worth $21.7B in 2014, will experience a compound annual growth rate of 10.8 percent for 2013 to 2018. “The strong CAGR for automotive ICs is partly due to a steady and significant increase in IC content expected onboard all new cars throughout the forecast period. vehicle-to-vehicle communications, mandatory backup cameras, and various driver assist systems will keep the automotive IC market dynamic through 2018.”