Status of the CMS ECAL Endcaps LHCC Comprehensive Review, June 2006 D Cockerill

LHCC Comprehensive Review 26/6/06 D.J.A. Cockerill - RAL 1

Status of the CMS ECAL Endcaps

LHCC Comprehensive Review, June 2006D Cockerill

EE EE large mechanics VPTs and Supercrystal assembly Electronics Trigger The “Dee4” project

ES ES mechanics Micromodules and readout

EE and ES Planning

Conclusions


The CMS ECAL Endcaps – EE/ES

Tapered crystalsOff-Pointing ~ 3o from vertex

Crystal Endcaps: 4 Dees (2 per endcap)14648 Crystals Total mass 22.9 t

Preshower2Xo, 1Xo Pb, 2mm Si strips, 2 x 2 orthogonal layers


EndCap EE

All large mechanical pieces are at CERN

Dry assembly of env. screen produced in Russia


EE: VPT production & gluing, Supercrystals

EE VPT to crystal gluing

2800 VPTs shipped from UK to CERNAll tested upon receipt by Russia - INR

Up to 50 EE crystals/VPTs glued each week

110 of current EE crystal stock (~350 xtals) done

First “Russian” SC completed

in June 2006 built using CRISTAL database


EE electronics

Preliminary results, ~ 3900 e- per channelCross talk < 0.1%Meets EE requirements

SC HV cards 105 pre-production cards completed All R & C components for EE delivered

Motherboards 2 prototypes on Dee4 600 cards by end 2006

EE VFE cardsRC feedback on MGPA tuned for EEInput diode for VPT spark protection 30 prototypes produced in Feb 06 250 cards now under test

3130 cards by end July 06

FE cards80 pre-production cards tested

800 cards produced by Sep 2006


EE trigger

Pseudostrip (5 crystal) allocationsEE+ towards I.P

Consequent trigger towers (TCC level)EE+ towards I.P


EE : preparing for the assembly

Ensuring correct cabling of the channels

Trigger map (H.Heath)LED cabling tester from UVa


EE data and trigger readout

The fibre readout fan-out boxes (two layers) serving the EE DCCs and TCCs in the control room

900 readout fibres to correctly route per Dee


“Dee4” project

“Dee4”

First large scale test of integration philosophy

20 SCs mounted on BP Dee4 by end 2006

Trigger mapping at motherboard

10 cooling blocks, main manifold

“Dee4” to testbeam in May 2007

EE assembly has started

“Dee4” will provide crucial assembly and test beam insights

Dee1 assembly from September 2006


(Preshower) ES: Engineering

Windows ready with Paraffin : first elements to be installed before beam pipe closure

First brazing of cooling screenBlanks for outer drums/patch panels


ES: Silicon micro-modules

Si sensors availableAll ceramics supports and Al tiles producedSmall mod to allow for backplane bonding(follow. ES and Tracker experience)All ASICS available

Problem with hybrids productionFirst large series of PCBs not good ! Immediate action: change PCB manufacturing companyWill probably eat a large part of schedule contingency


ES: On and Off detector digital electronics

Successful test of Mother boards pre-seriesincluding 12 boards token ring and test of several ladders

→Production launched ESR for ES-DCC last May

OptoRx: proto ok. Final version in a few weeks

VME board end of Summer (collab. with TOTEM)

MB tester (NTU)

OptoRx


EE Planning

Dee 1 End Sep 2007Dee 2 End Dec 2007Dee 3 Mid Mar 2008Dee 4 Mid Apr 2008

CMS windowfor Dee1end Sep 07

EE+mid Jan 08

EE-mid Mar 08


EE planning

Crucial to introduce as much parallel assembly and integration as possible

Quality control at each crucial step

Suggestion to carry out all SC mounting and Dee assembly in bldg 867

This offers many very attractive features- all major activities under one roof- proximity of expert teams- realisation of the EE trigger, from motherboard level to fibre readout level- multiple DAQ test systems, needed for EE QA, available locally- cooling capacity for one entire Dee- LV power

Crystal Palace

Advance preparation of all large mechanics- Dees into OPAL frames- dry assembly tests of Environmental screens- BP cooling installation- Mounting laser monitoring system


ES planning

Good progress with engineering/mechanics

Bare micromodule production has startedProblem with hybrid PCB production: change of producer necessary; will try to minimize impact on overall ES schedule

Delay on system motherboards but production should start soon and should be faster than originally envisaged

Important progress in DAQ (software and ES-DCC) and good advances in offline/physics software

“Ready for Installation” dates so far unaffected by delays. Some contingency now exists due to revised V35 schedule but will probably be “eaten” by hybrid delay

ES+ Dee1 assembly finished 15.3.07ES+ Dee2 assembly finished 30.6.07ES- Dee1 assembly finished 30.8.07ES- Dee2 assembly finished 30.11.07

ES- RFI 31.8.07ES+ RFI 31.12.07


EE - Conclusions

EE and ES assembly has started

Much progress with the EE large mechanics, VPTs, SC assembly, electronics, and trigger and data mapping

“Dee4” will provide crucial assembly and test beam insights Dee1 assembly from September 2006

Good progress with ES engineering/mechanics Bare micromodule production has started

We are on the learning curve for EE and ES assembly


Additional info follows, next slide

Status of the CMS ECAL Endcaps LHCC Comprehensive Review, June 2006 D Cockerill

Documents

Transcript of Status of the CMS ECAL Endcaps LHCC Comprehensive Review, June 2006 D Cockerill