Sputtering method
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ory hard disks, which comprises water and at least one abrasive selected from the group consisting of aluminum oxide, silicon diox- ide, cerium oxide, zirconium ox- ide, titanium oxide, silicon ni- tride, and manganese dioxide, and further contains succinic acid or its salt dissolved in the compo- sition and aluminum hydroxide. PROCESS FOR TREATING ALUMINIFEROUS METALS U.S. Patent 6,193,815. Feb. 27, 2001 H. Wada and K. Nakada, assignors to Henkel Corp., Gulph Mills, Pa. An aqueous liquid composition that is suitable for treating the surface of aluminiferous metals to form a corrosion-protective and paint-adherent coating thereon, comprising 0.01 to 5 parts by weight of dissolved phosphate ions; 0.1 to 2 parts by weight of dissolved molecules, ions, or both that contain titanium atoms; 0.05 to 5 parts by weight of dissolved molecules, anions, or both that con- tain fluorine atoms; and 0.01 to 2 parts by weight of water-soluble ac- celerator that is a combination of sodium nitrite and potassium per- manganate or nitric acid and am- monium heptamolybdate. TANTALUM SPUlTERlNG TARGET U.S. Patent 6,193,821. Feb. 27, 2001 H. Zhang, assignor to Tosoh SMD Inc., Grove City, Ohio A process for working substan- tially pure tantalum to form a sputter target having predomi- nantly texture and uniform grain sizes of 20-25 pm. MAGNETRON SPUTTERING APPARATUS U.S. Patent 6,193,853. Feb. 27, 2001 G. Yumshtyk and M. Zoumchtyk, assignors to Cametoid Limited, Whitby A sputtering process for applying a coating onto an elongate, hol- low, cylindrical workpiece having an internal surface and an exter- nal surface. SPUTTERING MEeHOD U.S. Patent 6,193,854. Feb. 27, 2001 K.F. Kai et al., assignors to Novellus Systems Inc., San Jose, Calif: An apparatus and method for controlling erosion profile in a hollow cathode magnetron sput- ter source. WAFER PLATING APPARATUS U.S. Patent 6,193,859. Feb. 27, 2001 R.J. Contolini et al., assignors to Nouellus Systems Inc., San Jose, Cal& and Znternational Business Machines Corp., Armonk, N.Y. An electric potential shaping ap- paratus for holding a semicon- ductor wafer during electroplat- ing. ANODE SYSTEMS U.S. Patent 6,193,860. Feb. 27, 2001 M. Weling, assignor to VLSZ Technology Inc., San Jose, Calif. A method and apparatus for im- proved copper plating uniformity on a semiconductor wafer using optimized electrical currents. ROLE FILLING MmllOD U.S. Patent 6,193,861. Feb. 27, 2001 C. E. &oh, assignor to International Business Machines Corp., Armonk, N.Y. An apparatus and method to en- hance hold fill in sub-micron plat- ing. ELECTROPLATING APPARATUS U.S. Patent 6,193,863. Feb. 27, 2001 H. Kobayashi, Shizouka-ken, Japan A product conveying mechanism for an electroplating device serv- ing to electroplate a thin-wall rib- bon-shaped product including a printed wiring board given to be plated, which mechanism sus- pends the product from an upper part thereof nipped with a jig sup- ported laterally movably by a cathode bar and laterally conveys the product in an electrolyte solu- tion held in a tank meanwhile feeding an electric current from the cathode bar to the upper part of the product through the jig. MILITARY y SPECIFICATIONS y CHEMICA:COATINGS INDUSTRIA: FINISHES ADHEbES , / CARLSTADT, NJ 07072 Phone: (201) 438-3700 l Fax: (201) 4384231 Circle 033 on reader card or go to www.thru.to/webconnect December 2001 63
Transcript of Sputtering method
ory hard disks, which comprises water and at least one abrasive selected from the group consisting of aluminum oxide, silicon diox- ide, cerium oxide, zirconium ox- ide, titanium oxide, silicon ni- tride, and manganese dioxide, and further contains succinic acid or its salt dissolved in the compo- sition and aluminum hydroxide.
PROCESS FOR TREATING ALUMINIFEROUS METALS U.S. Patent 6,193,815. Feb. 27, 2001 H. Wada and K. Nakada, assignors to Henkel Corp., Gulph Mills, Pa.
An aqueous liquid composition that is suitable for treating the surface of aluminiferous metals to form a corrosion-protective and paint-adherent coating thereon, comprising 0.01 to 5 parts by weight of dissolved phosphate ions; 0.1 to 2 parts by weight of dissolved molecules, ions, or both that contain titanium atoms; 0.05 to 5 parts by weight of dissolved molecules, anions, or both that con- tain fluorine atoms; and 0.01 to 2 parts by weight of water-soluble ac- celerator that is a combination of sodium nitrite and potassium per- manganate or nitric acid and am- monium heptamolybdate.
TANTALUM SPUlTERlNG TARGET U.S. Patent 6,193,821. Feb. 27, 2001 H. Zhang, assignor to Tosoh SMD Inc., Grove City, Ohio
A process for working substan- tially pure tantalum to form a sputter target having predomi- nantly texture and uniform grain sizes of 20-25 pm.
MAGNETRON SPUTTERING APPARATUS U.S. Patent 6,193,853. Feb. 27, 2001 G. Yumshtyk and M. Zoumchtyk, assignors to Cametoid Limited, Whitby
A sputtering process for applying a coating onto an elongate, hol-
low, cylindrical workpiece having an internal surface and an exter- nal surface.
SPUTTERING MEeHOD U.S. Patent 6,193,854. Feb. 27, 2001 K.F. Kai et al., assignors to Novellus Systems Inc., San Jose, Calif:
An apparatus and method for controlling erosion profile in a hollow cathode magnetron sput- ter source.
WAFER PLATING APPARATUS U.S. Patent 6,193,859. Feb. 27, 2001 R.J. Contolini et al., assignors to Nouellus Systems Inc., San Jose, Cal& and Znternational Business Machines Corp., Armonk, N.Y.
An electric potential shaping ap- paratus for holding a semicon- ductor wafer during electroplat- ing.
ANODE SYSTEMS
U.S. Patent 6,193,860. Feb. 27, 2001 M. Weling, assignor to VLSZ Technology Inc., San Jose, Calif.
A method and apparatus for im- proved copper plating uniformity on a semiconductor wafer using optimized electrical currents.
ROLE FILLING MmllOD U.S. Patent 6,193,861. Feb. 27, 2001 C. E. &oh, assignor to International Business Machines Corp., Armonk, N.Y.
An apparatus and method to en- hance hold fill in sub-micron plat- ing.
ELECTROPLATING APPARATUS U.S. Patent 6,193,863. Feb. 27, 2001 H. Kobayashi, Shizouka-ken, Japan
A product conveying mechanism for an electroplating device serv- ing to electroplate a thin-wall rib- bon-shaped product including a printed wiring board given to be plated, which mechanism sus- pends the product from an upper part thereof nipped with a jig sup- ported laterally movably by a
cathode bar and laterally conveys the product in an electrolyte solu- tion held in a tank meanwhile feeding an electric current from the cathode bar to the upper part of the product through the jig.
MILITARY y SPECIFICATIONS y
CHEMICA:COATINGS
INDUSTRIA: FINISHES
ADHEbES , /
CARLSTADT, NJ 07072
Phone: (201) 438-3700 l Fax: (201) 4384231
Circle 033 on reader card or go to www.thru.to/webconnect
December 2001 63
