least a machined edge having a bordering margin; the improvement comprising only the machined edge being primed with a cured, coalesced powder coating so that the remainder of the SMC exterior surface is primerless.

Electrodeposition Photoresist Composition U.S. Patent 5,624,761. Apr. 29> 1997 K. Naruse ef a/., assignors to Kansai Paint Co. Ltd., Hyogo-ken, Japan

A positive anionic electrodeposition photoresist composition comprising, as a main component, a water-dispersible resin composition obtained by neutralizing, wilh a base. an iadmixture comprising an acrylic resin. a vinylphenol resin, and an ester.

Thermosetting Powder Coating Composition U.S. Patent $625,026. Apr. 29, 1997 R.6. Barbee and B.S. Phillips, assignors lo Eastman Chemical Co., Kingsport Term.

A semicrystalline polyester consisting essentially of diol and/or trio] and dicar- hoxylic acid residues.

Electrical Connector Formed by Metal Plating U.S. Patent 5,626,463. May 6, 1997 T Naifoh, assignor to The Whitaker Corp., Wilmington, Del.

An electrical connector comprising a di- electric housing made oF a heat-resistant plastic that can accept metal plating having a roughened surface covered with a metal layer, a conductor pattern formed by pho- tolithography on the metal layer. excess metal removed from the housing leaving the conductor pattern thereon in the form of closely spaced contact members, the hous- ing including a contact section and a sol- dering section. with the contact members extending along one surface of the contact section and along one part of the soldering section including a side surface and a bot- tom surface of the soldering section, and the side surface of the soldering section having arcuate depressions along which the contact members extend.

Abrasive Articles U.S. Patent 5,626,639. May 6, 1997 W.8. King, assignor to 3M Co., St Paul, Minn

An abrasive article comprising a suh- strate having a first major surface bearing an abrasive layer and a second major sur- face having a layer of pressure-,sensitive adhesive and a protective liner covering the layer of pressure-sensitive adhesive, the liner having a perimeter coterminous with the perimeter of the substlrate in which the liner has a lift flap secured thereto with a greater bond strength therebetween than the bond strength develolped between the liner and the pressure-sensitive adhesive. the lift flap not extending beyond the pe- rimeter of the liner and having a free por- tion accessible to finger grip.

Sputtering Apparatus U.S. Patent 5,626,727. May 6, 1997 H. Yamanishi et al., assrgnors lo Mafsushffa Electric Industrial Co. Ltd., Osaka-fu, Japan

A sputtering apparatus using a plurality of rectangular targets to form a thin film on a substrate comprising a plurality of mag- nets disposed along both srde edges of each target in such a manner that the polarities of adjacent magnets along the side edges of the target are opposite, and the polarities of’

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the magnets confronting each other across the target are opposite, the surfaces of at least two said targets being inclined to a

surface of the substrate at an angle not smaller than 30” and not larger than 60”.

Electroplating Process U.S. Patent 5,626,736. May 6, 1997 SM. Florio et al. assignors to Ship/ey Co. L.L.C., Marlborough, Mass.

A process for depositing metal on the walls of openings passing through a cop-

per-clad nonmetallic planar substrate com- prising forming a sacrificial coating over the copper cladding, without removing the sacrificial coating. providing a dispersion

of carbonaceous particles in an aqueous medium and contacting the substrate hav- ing the openings with the dispersion to

form a porous coating of the carbonaceous dispersion over the surfaces, of the suhstrate including the sacrificial cclating over the

copper cladding, removing the carhon- aceous coating from the copper cladding hy contacting with an etchant that dissolves

the sacrificial coating preff:rentially to the copper cladding. and plating Imetal on at least those portions of the :,ubstrate coated with the carbonaceous coating from an

electrolytic metal plating sl.)lution.

Multilayer Coating U.S. Patent 5,626,917. May 6, 1997 T: Brock and E. Wiiczek, assignors lo Herberts GmbH, Wupperlal, Gennany

A process for the multilayer coating of a

substrate by applying a base layer of an aqueous coating composition onto an op-

tionally precoated substrate and suhse- quently overcoating with ;I clear coating characterized in that the clear coating used

contains at least one copolymer containing hydroxyl groups, one or more polyisocy;u- ates, and one or more solvc:nts

Base Paint for Coating PVC U.S. Patent 5626,958. May 6, 1997 8. D’Herbecourl and T Moulin. assignors to Elf Atochem S.A., Pans-/a-Defense, ,rrance

A composition suitable fol coating polyvi- nyl chloride (PVC) articles being curable in an oven at a temperature hetween 20 and 80°C or under infrared at a surface tempera-

ture between SO and IW(’ comprising a vehicle of polyacrylate. epoxy resin. poly- ether, polyester, polycaprolactone. vinyl chlo- ride polymers, or mixtures thereof: an ixcxy- anate crosslinking agent; a solvent: and finely

divided thermoplastic resin particles.

Multilayer Coating Simulating Brass U.S. Patent 5,626,972. May 6, 1997 S.R. Moysan, 111 and R. W Sugg, assignors to Baldwn Hardware Corp.. Reading. Pa.

92 METAL FINISHING l JANUARY 1998