SpezielleAnalyse-und Testmethoden@ AT&S...Austria Technologie & Systemtechnik Aktiengesellschaft |...

Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-mail [email protected]

Spezielle Analyse- und Testmethoden @ AT&S

Markus Leitgeb

Programme Manager R&D

28. Februar 2013

AgendaAgendaAgendaAgenda

Specific Analysis and Test Methods at AT&S / M. Leitgeb 1

Surface AnalysisSurface AnalysisSurface AnalysisSurface Analysis

Reliability TestsReliability TestsReliability TestsReliability Tests

Thermo AnalysisThermo AnalysisThermo AnalysisThermo Analysis

SummarySummarySummarySummary

OverviewOverviewOverviewOverview


Overview Test and Analysis Methods

Specific Analysis and Test Methods Specific Analysis and Test Methods Specific Analysis and Test Methods Specific Analysis and Test Methods at at at at AT&SAT&SAT&SAT&S

Surface Analysis:

• Scanning Electron Microscopy (SEM)

• Energy Dispersive X-Ray Spectroscopy (EDX)

• Fourier Transformed Infra-Red Spectrometer

(FTIR)

• 3D-Microscopy (IFM)

Reliability Tests:

• Drop Test (DT)

• High Temperature/Humidity Storage (Climate

Chambers)

• Temperature Cycling Test (TCT)

• Thermal Shock Test (TST)

• Highly Accelerated Stress Test (HAST)

• Reflow Sensitivity Test (RS)Thermo Analysis:

• Differential Scanning Calorimetry (DSC)

• Thermo Gravimetric Analysis (TGA)

• Thermo Mechanical Analysis (TMA)

• Dynamic Mechanical Analysis (DMA)

Sample Preparation:

• Secondary Ion Mass Spectroscopy (TOF-SIMS)

• Atomic Force Microscopy (AFM)

• X-ray Photoelectron Spectroscopy (XPS)

• X-Ray Diffraction (XRD)

• Computer Tomography (CT)

• Scanning Acoustic Microscopy (SAM)

• Etc.

External Partners:

• Micro-cutter

• Laboratory Press


Surface Analysis – Scanning Electron Microscopy (SEM) / Energy Dispersive X-Ray Spectroscopy (EDX)

Specific Analysis and Test Methods at AT&SSpecific Analysis and Test Methods at AT&SSpecific Analysis and Test Methods at AT&SSpecific Analysis and Test Methods at AT&S

SEM EDXSupplier: Zeiss AMETEKType: Leo 1550 VP Genesis 2000

• Surface Topography

• Element Distribution (e.g. Contamination)

• High Magnification

• High Depth of Focus

• Electron Source:Field Emission Cathode (W/ZrO, SchottkyEmitter)

• Acceleration Voltage:100V – 30kV

• Resolution:3nm @ 1kV1nm @ 30kV

• Magnification:20X – 900.000X

• Sample Chamber Pressure Range:HV up to 100Pa

• Detectors:In-LensSEVPSEBSEEDX

• Sample Stage:XYZ, Rotation, Tilting

Example − Surface Topography



Specific Analysis and Test Methods Specific Analysis and Test Methods Specific Analysis and Test Methods Specific Analysis and Test Methods at AT&Sat AT&Sat AT&Sat AT&S

Example − Photo resist - structures (depth of focus)




Example − Embedded Devices




Connecting of µm and nm world:• Copper filled micro via: 75 µm• Copper thickness top: 25 µm• Copper thickness on RDL: 10 µm• Dielectric above RDL: 30 µm• Dielectric below RDL: 5 µm• Silicon: 120 µm

Si

Prepreg

Dielectric below RDL

Cu on RDL

µvia

Cu TopCu Top

Dielectric above RDL

Example − Solder Joint




SEM Picture

EDX Line - Scan

Sn

Ag

Ni

Cu

Overlapping SEM/EDX


Surface Analysis – Fourier Transformed Infra-Red Spectroscopy (FTIR)


Supplier: BrukerType: Vertex V70 / Hyperion 2000

• Material analysis

• Composition of the surface

• Contamination

• Analysis of volatile materials (coupling)

• Spectral Range:8000…600 cm-1(1.25 … 16.67µm)

• Spectral Resolution:0.4 cm-1

• Wavelength Resolution:0.01 cm-1 @ 2000 cm-1

• Detector:DTGSDeuterated Tri-Glycine-Sulphate)

• Diamond ATR

• IR-MicroscopeTransmission, ReflectionObjective: 4X, 15X, ATR, Grazing AnglePolarization FilterMCT (Mercury Cadmium Telluride) - Detector, LN cooled)

• Computer controlled sample stage

• TGA coupling

Example − Contamination on a Gold Surface


Surface Analysis – Fourier Transformed Infra-Red Spectroscopy (FTIR)


Discolored Au-Pads EDX

FTIR


Surface Analysis – 3D Microscopy


3D-Analysis MicroscopeSupplier: Alicona OlympusType: IFM Software BX-51

• Roughness Analysis (Ra, Rz, Wa, Wz)

• Step Heights

• 3D display of structures (e.g. µVias)

• 3D surface analysis using Infinite-Focus Microscopy

• Optical measurement for direct Height-/Depth-Analysis:

Line profilesAreasVolumes

• Roughness Analysis

• Vertical Resolution:10nm @100X

• Optical Microscope:Objective: 5X, 10X, 20X, 50X, 100XPolarization FilterHalogen/UV Light-Source

Principle




Examples




3D reconstruction of a µ-Via

3D reconstruction of a µ-Via-Array

Discolored image of a µ-Via


Thermo Analysis – Differential Scanning Calorimetry (DSC)


Supplier: Mettler ToledoType: DSC823e/400

• Glass transition temperature (Tg)

• Phase transitions

• Polymerization temperatures

• Curing behavior

• Aging behavior

• Evaporation of volatile materials

• Temperature Range:-80°C…700°C

• Temperature Accuracy:±0,2°C

• Measurement Accuracy:± 350mW (100°C), ± 250mW (300°C)

• Heating Rate:RT…500°C in 5min

• Cooling Rate:500°C…100°C in 9min

• Atmosphere:N2, O2, Air

• DSC Sensor:Ceramic senor with 56 thermocouples

• Special Analyses:Model Free KineticTOPEM (TMDSC with stochastic temperature pulses of different length)

Example − Thermal Properties of a Prepreg


Thermo Analysis – Differential Scanning Calorimetry (DSC)


Tg / relaxationB-Stage

Decomposition

Post-curing

^exo Prepreg

Tg

Cured PP

Tg after partialdecomposition

Curing Reaction

Tg1 = Tg2

acc. IPC


Thermo Analysis – Thermo Gravimetric Analysis (TGA)


Supplier: Mettler ToledoType: TGA/SDTA 851e

• Thermal decomposition

• Fraction of volatile Components

• Kinetic of decomposition

• Detection of water, solvents, etc.

• Temperature:RT…1100°C

• Temperature Accuracy:±0,3°K

• Sample Volume:up to 900µl

• Heating Rate:RT…1100°C in 8min

• Cooling Rate:1100°C … 100°C in 22min

• Atmosphere:Air, N2, O2

• TGA-FTIR coupling

• Model Free Kinetic

Example − Kinetic of Decomposition of Different Prepregs


Thermo Analysis – Thermo Gravimetric Analysis (TGA)


1st deviation

Measured CurvesMaterial 1

Material 2

Material 3

Material 4

Number of componentsFiller, Resin systems


Thermo Analysis – Thermo Mechanical Analysis (TMA)


Supplier: Mettler ToledoType: TMA/SDTA840

• Coefficient of Thermal Expansion (CTE)


• Internal tensions (e.g. mechanical pre-

treatment, Relaxations)

• Temperature:

RT…700°C

• Temperature Accuracy:

±0,3°K

• Force Range:

0.1 N to 1.0 N

• Resolution:

1.3 mN

• Heating Rate:

RT…700°C in 8min

• Cooling Rate:

700°C … 100°C in 20min

Example − Tg, CTE, Delamination of a PCB


Thermo Analysis – Thermo Mechanical Analysis (TMA)


CTE<Tg

CTE<Tg

Mech. Stress

Tg1 Tg2

CTE>Tg

CTE>Tg

Delamination


Thermo Analysis – Dynamical Mechanical Analysis (DMA)


Supplier: Mettler ToledoType: DMA/SDTA861

• Viscoelastic material properties

• Storage, Loss-modulus, tan δδδδ


• Temperature Range:

-150 … + 500 °C

• Force Range:

0,005 … 40 N

• Frequency Range:

0,001 … 1000 Hz

• Methods:

3 point bending

Shear

Tensile

Example − Tg, Storage, Loss-modulus, Tan δ (Flexible PCB)




• Sample with 2wt% adhesive fraction

• with DSC not measureable

• 2 compounds

Example − Analysis of the degree of curing using the viscoelastic behaviour (EVA)




Tan δ of 9 EVA samples with different degrees of curing

Analysis of the degree of curing with Tg not possible

Different viscoelastic behaviour degree of curing

min

max Extraction: 12h/sample

DMA: 2h/sample

Reliability Test

• A test to determine the probability of failure-free performance over a specified time frame, under specified environmental and duty-cycle conditions. Often expressed as the unreliability as a function of the test time, e.g. B5-value.

• Subcategories are defined according to the main stress parameter, i.e. mechanical, thermal or electrical.


Reliability Tests - Definition

Reliability Test CapabilitiesReliability Test CapabilitiesReliability Test CapabilitiesReliability Test Capabilities

Un

relia

bili

ty

1%

99%

Time1 hr(or 1 cycle)

1000 hrs(or 1000 cycles)

5%

210 hrs(or 210 cycles)

5% unreliability after 210hrs (or 210 cycles)B5 = 210hrs (or 210 cycles) (lower confidence bound )

RequirementB5 > 200 hrsPass

“forbiddenarea”

RequirementB5 > 500 hrsFail

“forbiddenarea”

Fitted distribution, e.g. 2P-Weibull,incl. confidence bounds, e.g. 90%


Reliability Tests – Drop Test


• Drop Test Parameter:

1500g ± 20% (cpk>1.33)0,5ms ± 20% Peak Width (cpk>1.33)Half-sinusoidal Peak Shape

• Maximum Drop Height:

1650 mm

• Calibration with Acceleration-Sensor

• Failure Detection:

Event-DetectorR > 1.5kOhm for 200ns

• 16 channels

Supplier: TeknopajaType: PWB-Level Drop Tester

• Mechanical Reliability of the System PCB

and Assembled Components

• Effect of Material, Design, Solder Process,

Components, etc.

Example − Drop Test Design




PCB design for DT with up to 15 daisy chain components according JEDEC JESD22-B104 (e.g. 22x22 4 row, 0.5 BGA)

Example − Drop Test Statistical Analysis




Pass/FailB5 ≥ 10 drops90%LCB

B5

Statistical Failure Analysis (Weibull)

Example − Drop Test Physical Failure Analysis




Example Failure Mechanism

Failure PositionsFailure Mode Labeling

Example − Project with the University in Leoben, Austria




Finite Element Simulation of the Drop Test

Velocity Field

AccelerationConstraints


Reliability Tests – Thermal Cycling Test (TCT) / Temperature Shock Test (TST)


Cycling Test:• Heating-/Cooling Rate:

Up to 17 K/min• Typical Test Parameter:

-40°C … 125°CSoak Time: 5 min2 cycles/hJESD22-A104-B

Shock Test:• Heating-/Cooling Rate:

Up to 160 K/min• Typical Test Parameter:

-55°C … 125°CTransfer-/Recovery Time < 2min2 cycles/hIPC-TM-650 2.6.7

• Data Collection:• Event Detector:

512 channelsEvent = R>1000 Ohm for 200ns

Shock CyclingSupplier: CTS CTSType: TSS -70/130 CS-70/500-17

• Thermal Reliability of the PCB and/or

PCB Component System

• Effect Material, Design, Solder Process,

Components, etc.

Example TCT/TST Statistical Analysis




Wahrscheinlichkeit-Weibull

Zeit, (t)

Unzuverlässigkeit, F(t)

100,000 2000,0001000,000500,0001,000

10,000

50,000

90,000

99,000

5,000

Wahrscheinlichkeit-WeibullCB@90% 2-seitig [T]

74_DC_bWeibull-2PRRX SRM MED FMF=6/S=42

DatenpunkteLinie WahrscheinlichkeitOberer VB-IUnterer VB-I

Zielzuverl.

R&D LeobenAT&S06.10.200811:02:28

Pass/FailB5 ≥ 500 cycles90%LCB

B5

Statistical Failure Analysis (Weibull)

Design and Physical Failure Analysis is Similar to DT





Reliability Tests – Reflow Sensitivity


• Temperature:RT … 400°C

• Heating:3 zones

• Cooling:1 zone

• Reflow area:305x508mm

• Nitrogen atmosphere:N2 - option available

• Reflow Profile:ProgrammableStandard: IPC/JEDEC J-STD-020D

Supplier: APS NOVASTAR LLCType: GF-120HC

• Thermal Reliability of the PCB and/or

PCB Component System

• Effect Material, Design, Solder Process,

Components, etc.

Example Reflow Sensitivity Analysis




Defined Reflow Profile

Customer or IPC/JEDEC J-STD-020D

Example Reflow Sensitivity Physical Failure Analysis




Delamination after RS Test


Reliability Tests – Highly Accelerated Stress Test (HAST)


• Sample Volume:2 x 46l (2 Chamber System)

• Temperature Range:+50 … +142,9°C (± 0,5°C)

• Humidity Range:75 … 100%rel.F. (± 3%RH)

• Pressure Range:0,2 … 1,96 bar (± 5%)

• 72 Channels (HAST Chamber)• 144 Channels (AMI System)• Ventilation system to prevent condensation on

the samples• Measurement Voltage:

1V … 100V• Bias Voltage:

1V … 100V• Isolation Resistivity:

200kΩΩΩΩ … 1TΩΩΩΩ (@5V)/10TΩΩΩΩ (@100V)• Short Circuit Detection (100µs/Channel) and

Online Measurement

Chamber Meas.Supplier: Espec EspecType: EHS-221 MD AMI-150-S5

• Highly Accelerated Stress Test• Up to 10 times faster than conventional

85/85 test• Online measurement of isolation

resistivity (up to 10 TΩΩΩΩ)

Example SIR Analysis


Reliability Tests - HAST


Test Parameter:110°C/85%RH/5VDC/264h

Failure Mechanism:SIR – Surface Isolation Resistance (Surface, Cleanliness)

+VDC

ground

+VDC

ground

Comb w/o SM

Serpentine w/ SM

Pass/Fail LimitR ≥ 10MΩ

Failure

Examples for DUTs Resistance Curve

Example SIR Physical Failure Analysis




Dendrites Growth after HAST (UV Microscopy)

Example CAF Analysis




Test Parameter:130°C/85%RH/3,5VDC/96h

Failure Mechanism:CAF – Conductive Anodic Filament (Volume, Material)

Via-2-Via

Plane-2-Plane

Pass/Fail LimitR ≥ 10MΩ

Failure

Examples for DUTs Resistance Curve

Example CAF Physical Failure Analysis




CAF after HAST


Reliability Tests – Special Sample Preparation with Micro Cutter


• Sample preparation with an optical microscope

• Optical Microscope:

Magnification up to 160X

• Sample Preparation Tools:

Grinding

Polishing

Cutting

Routing

• Accuracy:

0,5 µm

Supplier: LeicaType: EM-TXP

• Accurate sample preparation with following tools

• Grinding, polishing, cutting, routing (0,5µm accuracy)

Tool

Sample

Example − Analysis of Dendrites inside the Sample (after HAST)


Reliability Tests – Special Sample Preparation with Micro Cutter


L1

L6

L2

L3

L4

L5

Schematic Built-up Dendrites Growth in the Plane

Residue on the PCBDendrites Growth in z-Direction

AT&S “Standard“ Parameter


Reliability Tests – Overview


Method Measure AT&S Standard Parameter Specifications

HASTHighly Accelerated Stress Test

Insulation Resistance, Electro-chemical Migration (ECM), Conductive Anodic Filament (CAF), Surface Insulation Resistance (SIR)

Pre-Treatment: 2x Pb-free Reflow T = +110°C / RH = 85% / t = 264 hrs

U = 5VDC (bias + meas.)

Online Meas. (up to 10TΩ)Pass criteria: R >= 10MOhm

JEDEC JESD22-A110-BCondition: 110°C

TCT (Cycling)

Thermal Cycling Test

Air-to-Air(1 chamber design)

This method is to determine the physical endurance of printed boards to sudden changes of temperature.

T = -40°C … +125°C

Soak Time: 5 min (+5/-0)

2 cycles per hour

Event Detection (1kOhm, >1µs)

Pass criteria: B5 >= 500cycles (components), dR <= 20% (DC)

JEDEC JESD22-A104-CCondition G, 2, C

DTDrop Test

This method is to determine the physical endurance of printed boards to sudden mechanical shocks.

Acceleration: 1500g

Pulse Duration: 0.5ms

Event Detection (1.5kOhm, >1µs)Pass criteria: B5 >= 10 drops

JEDEC JESD22-B104CCondition B

RSReflow Sensitivity

This method is to determine the sensitive to moisture-induced stress during reflow treatment.

Pre-Treatment: drying (125°C/24h), Moisture Soak (60°C/60%RH/40h)

Pb-free reflow profile (255°C)

Pass criteria: 8x reflow w/o delamination, dR <= 20% (DC)

IPC/JEDEC J-STD-020DLevel 3 acc.

Equipment Capabilities





HAST

Highly Accelerated Stress Test


T = +50 … +142,9°C

RH = 75 … 100%

R = 10kΩ … 10TΩU = 1 … 100VDC (bias + meas.)

Online Meas. (up to 10TΩ)

JEDEC JESD22-A110-B

Temperature and Humidity Bias Life Test (Steady state and Cycling)


T = RT … +95°C

RH = 10 … 95%

R = 10kΩ … 10TΩU = 1 … 100VDC (bias + meas.)

Online Meas. (up to 10TΩ)

JEDEC JESD22-A101-B IPC-TM-650 2.6.25

IPC-TM-650, 2.6.3

IEC 61189-5, Test 5E

MIL-STD-202G, 106

Equipment Capabilities





TCT (Shock)


Air-to-Air

(2 chamber design)


T = -80/+100 … 50/200°C

Transfer time < 2 min

Recovery time < 2min

Event Detection (200ns)

Online Meas. (1-1000 Ω)

JEDEC JESD22-A104-C

IPC-TM-650, 2.6.7.2

MIL-STD-883G, 1010.8 (A, B, C, F)

MIL-STD-202G, 107G (A, B, F)

JIS C 5016, Chapter 9.2

TCT (Cycling)


Air-to-Air

(1 chamber design)


T = -70 … 180°C

Heating-/Cooling-Rate = ±17K/min (-40 … 125°C)

Event Detection (200ns)

Online Meas. (1-1000 Ω)

JEDEC JESD22-A104-C

IPC-TM-650, 2.6.7.2

MIL-STD-883G, 1010.8 (A, B, C, F)

MIL-STD-202G, 107G (A, B, F)

JIS C 5016, Chapter 9.1

DT

Drop Test

This method is to determine the physical endurance of printed boards to sudden mechanical shocks.

Acceleration: 2900…100g

Pulse Duration: 0,3…2ms

Event Detection

JEDEC JESD22-B104C

JEDEC JESD22-B111

RS

Reflow Sensitivity

This method is to determine the sensitive to moisture-induced stress during reflow treatment.

Leaded/Lead-free reflow profile

Moisture Sensitivity Level 1 … 6IPC/JEDEC J-STD-020D


Summary Specific Analysis and Test Methods at AT&S

Specific Analysis and Test Methods Specific Analysis and Test Methods Specific Analysis and Test Methods Specific Analysis and Test Methods at at at at AT&SAT&SAT&SAT&S

PCB Test and Analyses Range

• Surface Analysis (SEM, EDX, FTIR, IFM)

• Thermo Analysis (DSC, TGA, TMA, DMA)

• Reliability Tests (HAST, TCT, DT, RS)

Know-How

• Interpretation of the Results Performing custom made Analysis

• Properties of the Materials

• Properties of the Processes

• Properties of the Products

Reliability of the Product

• Basis for Reliability Improvement

• Basis for Further Development

• Development of New Technologies

AT&S – Well Positioned for the Future

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