Speedstack 2014 - New features May 2014 - Richard Attrill Copyright Polar Instruments 2014.

Speedstack 2014 - New features

May 2014 - Richard Attrill

Copyright Polar Instruments 2014

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New Features

Copy / Paste Material Properties option

Speedstack includes the option to copy existing material properties and then paste them to other multiple selected materials within the stack up.

This provides a method to exchange materials very quickly within the stack – for instance, swapping all prepregs from one type to another.

Very powerful, especially useful for high layer count stack ups

New features for Speedstack v14.05 (purchasable options)

PCB Stack up data exchange using IPC-2581 Rev B IPC-2581 – an efficient single file industry-standard XML data exchange format to be used between designers and manufacturers of printed circuit boards

Replaces the multiple Gerber, NC Drill, Net List, Stack Up and Documentation files normally included within a data set that designers send for fabrication and assembly

Ucam/Integr8or .job file import

Speedstack imports files in Ucamco Job File format from both Ucam and Integr8or


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New Features

Copy / Paste Material Properties option

New ‘Copy / Paste Material Properties’ options.

Copy Material Properties

Paste Material Properties


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New Features

Step 1: Select existing material and Copy Material Properties

• Select an existing material, in this case the Prepreg 1080 between layers 1 and 2

• Select the Copy Material Properties toolbar option

• The Prepreg 1080 properties (attributes) are recorded


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New Features

Step 2: Select materials and Paste Material Properties

• Select existing materials, in this example six sheets of prepreg materials (3080 and 1651) between layers 3 and 6

• Select the Paste Material Properties toolbar option


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New Features

Step 2: Select materials and Paste Material Properties (cont’d)

• Chose which properties you would like to paste to the selected materials. For this example all Property Groups have been selected.

• Selecting Apply will update all the selected materials within the stack with the previously recorded material, for this case the Prepreg 1080.


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New Features

Step 3: Review the stack up

Review the stack up changes.

When changing multiple materials simultaneously it is important to review the stack up. It may be necessary to recalculate impedance structures especially if dielectric height and copper thickness parameters have changed.


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New Features

Drill enhancements – new ‘Laser (Stacked)’ option

A new ‘Laser (Stacked)’ option has been introduced that automatically adds stack vias to the stack up in a single operation.

Previously, it was necessary to add each via individually.


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New Features

Drill enhancements – new ‘Laser (Stacked)’ option (cont’d)

The completed stack up with stacked laser vias.


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New Features

Drill enhancements – now retains properties

The drill properties are now retained between each ‘Add Drill’ operation. This speeds up the process of adding drills, especially when multiple drills of the same type are being added to the stack up.


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New Features

Drill enhancements – new ‘Delete All Drills’ option

Delete all drills on the stack up in a single operation


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New Features

Target thickness – tolerance in percentage or absolute

This option has been enhanced to support both percentage and absolute tolerances


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New Features

Stack Up Wizard – enhancements when in Material Library mode

Stack Up Thickness (with and without solder mask) calculated as soon as materials are chosen from the Material Library. It is now easy to monitor the overall stack up thickness within the Stack Up Wizard option

Material selection enhanced. It is now possible to select multiple sheets of Prepreg that will be placed between each Foil / Core within the stack up

New symmetrical mode option, enables quick selection of planes and mixed layers


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New Features

Stack Up Wizard – enhancements when in Material Library mode

This is the 8 layer stack up created by the new wizard


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New Features

Library Mode / Virtual Material Mode

Library Mode – uses real materials to generate stack ups by referencing the Speedstack material library. This method provides an absolute definition of the stack up down to the exact materials used in the build.

Virtual Material Mode – uses ‘virtual’ materials to generate stack ups. This is useful for exploring design options before committing to real materials.


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New Features

Symmetry mode – current mode highlight improved

Symmetry mode on

Symmetry mode off


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New Features

Toolbar options and menu entry enhancements

Materials are now grouped into rigid / flex / other

Rigid Materials

Other Materials

Flex Materials


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New Features

Toolbar options and menu entry enhancements (continued)

All stack up editing options now available when Controlled Impedance structures already exist on the stack up

‘Rebuild and Calculate’ option

Controlled Impedance tab selected

When the Controlled Impedance tab is selected, all stack up editing options are now enabled. Users may now make changes to a stack that has existing structures and then recalculate the structures using the ‘Rebuild and Calculate’ option


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PCB Stack up data exchange using IPC-2581

Pre-layout stack up design

IPC-2581

Fabricator final stack up design

PCB layout system

IPC-2581

Stackup data exchange using IPC-2581 Rev B – workflow

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Pre-layout stack up designPre-layout stack up designs often use ‘Virtual Materials’, where the design engineer specifies copper / substrate thicknesses but not the actual fabrication materials used.

Once the stack arrives at the Fabricator these ‘Virtual Materials’ are exchanged for the true materials.

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Pre-layout stack up design

The finished copper thickness and final substrate heights are critical for impedance calculations.

A single dielectric substrate region could be constructed from multiple materials in order to manufacture the required height.

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Export stack up to IPC-2581 format

The completed stack is exported to IPC-2581 for import into other PCB design tools

IPC-2581

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Fabricator final stack up design – exchange Virtual Materials

On receipt of the stack, the fabricator exchanges the ‘Virtual Materials’ for real PCB materials.

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Fabricator final stack up design – final checks

Stack up is checked to ensure that the final fabrication stack up still meets the required design specification.

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Export final fabrication stack up to IPC-2581 format

It is often useful to pass the final fabrication stack “back up the chain” so that future designs can make use of accurate fabrication data.

IPC-2581

Thank you


For more information:

Contact Polar now: Phone

USA / Canada / MexicoKen Taylor ( 503) 356 5270

Asia / PacificTerence Chew +65 6873 7470

UK / EuropeNeil Chamberlain +44 23 9226 9113

Germany / Austria / Switzerland Hermann Reischer +43 7666 20041-0

www.polarinstruments.com


mailto:[email protected]

Speedstack 2014 - New features May 2014 - Richard Attrill Copyright Polar Instruments 2014.

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Transcript of Speedstack 2014 - New features May 2014 - Richard Attrill Copyright Polar Instruments 2014.