SPD Mechanics and Cooling Status of the activity in Padova Rosario Turrisi Contents: Calibration of...

SPD Mechanics and SPD Mechanics and CoolingCooling

Status of the activity in PadovaStatus of the activity in Padova

Rosario TurrisiRosario TurrisiContents: • Calibration of Johansson measuring machine • Cooling components• Half-stave test

February 18, 2004February 18, 2004 Rosario Turrisi - SPD Meeting - CERNRosario Turrisi - SPD Meeting - CERN 22

Strong efforts for:Strong efforts for:• Learning and testing the new software PCDMIS 3.2 (DEA, Italy)Learning and testing the new software PCDMIS 3.2 (DEA, Italy)• Software development for semi-automatic measurements;Software development for semi-automatic measurements;• Analysis procedure for CFSS, mandrels, supports Analysis procedure for CFSS, mandrels, supports

(reference frame, checking points…)(reference frame, checking points…)• Non-trivial results interpretation;Non-trivial results interpretation;

First results:First results:New mandrel (l=140 mm) PLANARITY less than 30 New mandrel (l=140 mm) PLANARITY less than 30 mmOld mandrel (l=280 mm) PLANARITY less than 50 Old mandrel (l=280 mm) PLANARITY less than 50 mm

What’s going on/next:What’s going on/next:• Mandrels being produced at EuroMeccanicaMandrels being produced at EuroMeccanica• CFSS: prototype existing, new ones waiting for molds CFSS: prototype existing, new ones waiting for molds

Status of Johansson Status of Johansson machinemachine


Status of cooling Status of cooling componentscomponents

• Received from Medelec:Received from Medelec:– Phynox tubesPhynox tubes– CuNi capillariesCuNi capillaries

• Processing started: Processing started: – SqueezingSqueezing– Ni+Cu layer on tubes endsNi+Cu layer on tubes ends– Fittings procurement Fittings procurement


Half-stave test: assemblyHalf-stave test: assembly• Support: carbon fiber + rohacellSupport: carbon fiber + rohacell• Interface card as supportInterface card as support• AOS 54012 thermal grease, 50 to AOS 54012 thermal grease, 50 to

100 100 m thickness (borders to center m thickness (borders to center of the half-stave)of the half-stave)

• Ladder fixed by u.v. gluingLadder fixed by u.v. gluing

• Hydraulic connectivity as of final Hydraulic connectivity as of final project: phynox tube + capillaries project: phynox tube + capillaries (55 cm in - 22 cm out) (55 cm in - 22 cm out)

• p,T pick-up points along the p,T pick-up points along the cooling line + 2 pt1000 on ladderscooling line + 2 pt1000 on ladders

• IR camera for temperature map IR camera for temperature map recordingrecording


Cooling prototype schemeCooling prototype scheme


PointsA 25.00°C B 25.68°C C 28.74°C D 33.11°C E 38.16°C F 38.16°C

P=1.17 W, no coolingP=1.17 W, no cooling

TAVE=32 oC

chip number


P=1.11W, cooling onP=1.11W, cooling on

TOUT=12 oC

PointsA 15.91°C B 15.31°C C 15.91°C D 20.13°C E 19.56°C

TAVE=17 oC

chip number


P=8.92 WP=8.92 W

PointsA 21.69°C B 22.11°C C 22.80°C D 34.86°C E 40.20°C

TOUT=12 oC

TAVE=28 oC

chip number


Wires cut…Wires cut…


Disconnected chipsDisconnected chips

Bus extender chip 1 chip 2

Many thanks toM. Tessaro (CMS)INFN Padova

When/where damage happened?• No defects noticed at a visual inspection (by magnifing glasses) • Always protected by plastic cover, except:

• during mount• during measurement• for chip disconnection

• main drawbacks: temporary jig used and no automated movement


Half-stave V vs. AHalf-stave V vs. A


P=1.35W, cooling onP=1.35W, cooling on

TOUT=18 oC

PointsA 14.25°C B 14.55°C 1st chipC 14.25°CD 14.86°C E 16.35°C F 16.35°C G 15.31°C H 15.31°C I 14.86°C J 14.71°C K 14.71°C 10th chip

TAVE=15 oC

chip number


P=4.75 W (cooling on!)P=4.75 W (cooling on!)

PointsA 18.98°C B 20.98°C 1st chipC 21.41°C D 22.25°C E 24.18°C F 25.27°C G 22.53°C H 21.83°C I 20.13°C J 18.70°C K 18.41°C 10th chip

TOUT=18 oC

TAVE=21 oC

chip number


Temperature vs. Power – Temperature vs. Power – before before cutcut


Temperature vs. Power – Temperature vs. Power – 2 chips 2 chips cutcut


Transverse T profilesTransverse T profiles3.5 w – last 2 chips disconnected

2

1

before disconnection


Summary and conclusionsSummary and conclusions

• Mechanics and Cooling– Mandrel production started – Cooling components produced, processing started

• Half-stave test– Cooling principle verified with real chips– Origin of wire bonding damage under investigation

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