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Sony’s 3D Time-of-Flight System... · 2019-03-26 · ©2019 by System Plus Consulting | Sony’s...
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22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr Sony’s 3D Time - of - Flight System Sony IMX316 and Flood Illuminator in the Oppo RX 17 Pro IMAGING report by Stéphane ELISABETH March 2019 – Version 1 REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
Transcript of Sony’s 3D Time-of-Flight System... · 2019-03-26 · ©2019 by System Plus Consulting | Sony’s...
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Sony’s 3D Time-of-Flight SystemSony IMX316 and Flood Illuminator in the Oppo RX 17 Pro
IMAGING report by Stéphane ELISABETHMarch 2019 – Version 1
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Sony
o Oppo RX 17 Pro Edition Teardown
Market Analysis 21
o Ecosystem & Forecast
Physical Analysis 25
o Summary of the Physical Analysis 26
o 3D Sensing System Assembly 28
Module Views
Module Opening
System Cross-Section
o NIR Camera Module 35
Module View & Dimensions
Module Cross-Section
o NIR ToF Sensor 45
Die Overview & Dimensions
Die Process
Die Cross-Section
Die Process Characteristic
o Flood Illuminator 75
Module View & Dimensions
Module Cross-Section
o NIR VCSEL Die 84
Die View & Dimensions
Die Process
Die Cross-Section
Die Process Characteristic
Oppo vs. Lenovo 97
Manufacturing Process 104
o NIR ToF Sensor Die Front-End Process & Fabrication Unit
o Flood Illuminator NIR VCSEL Process Flow & Fabrication Unit
o Summary of the main parts
Cost Analysis 115
o Summary of the cost analysis 116
o Yields Explanation & Hypotheses 118
o NIR Camera Module 120
Pixel Array, BSI & Optical Front-End Cost
NIR ToF Sensor Wafer & Die Cost
o Flood Illuminator Module 129
NIR VCSEL Front-End Cost
NIR VCSEL Probe Test, Thinning & Dicing
NIR VCSEL Die Wafer Cost
Component Cost
o 3D ToF Module 137
Lens Module & Component Cost
Feedbacks 141
SystemPlus Consulting services 143
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Sony IMX316 and the Flood Illuminator found in the Oppo RX 17 Pro.
• The rear optical hub packaged in one metal enclosure features several cameras and a flood illuminator. The complete system features a Telephoto and a Wide-angle Camera Module and a 3D Time of Flight Camera. The specify of the 3D Depth sensing camera is the addition of a NIR flood illuminator.
• This report will be focused on the analysis of the 3D depth sensing system. All components are standard that can be found on the market. That includes a BSI Time of Flight image sensor featuring 10 µm size pixels and resolution of 46 kilopixeldeveloped by Sony Depth Sensing Solution and one vertical cavity surface emitting laser (VCSEL) for the flood illuminator coming from a major supplier. This the first Time of Flight imager found on the market featuring Backside Illumination technology commonly used by Sony coupled with Current Assisted Photonic Demodulation (CPAD) developed by Sony Depth Solution (formerly SoftKinetic).
• Along with the complete 3D depth sensing system, this report goes with cost analysis and price estimation for the system. It also includes a physical and technical comparison with another 3D sensing system from Lenovo in the Phab2Pro using first generation of the pmd/Infineon ToF Imager. The comparison looks at system integration, the NIR camera module and the Flood Illuminator architecture.
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 4
Overview / Introduction
Company Profile & Supply Chain o Sonyo Oppo RX 17 Pro Teardown
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Oppo RX 17 Pro Teardown
Oppo RX 17 Pro Front View©2019 by System Plus Consulting
Oppo RX 17 Pro Front View – Opened©2019 by System Plus Consulting
Wide angle
NIR camera
RGB camera
Flood illuminator
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 5
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 3D ToF Moduleo NIR Camera Module
o Overviewo Cross-Section
o NIR ToF Sensor Dieo Views & Dimensionso Delayering & Processo Die Cross-section
o Flood Illuminator Moduleo Overviewo Cross-Section
o NIR VCSEL Dieo Views & Dimensionso Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Summary of the Physical Analysis
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 3D ToF Moduleo NIR Camera Module
o Overviewo Cross-Section
o NIR ToF Sensor Dieo Views & Dimensionso Delayering & Processo Die Cross-section
o Flood Illuminator Moduleo Overviewo Cross-Section
o NIR VCSEL Dieo Views & Dimensionso Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
3D Depth Sensing Module Views & Dimensions
Module Front, Side and Back View – Optical View©2019 by System Plus Consulting
XX mm
XX
mm
XX mm
X
X
X
X
X
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 3D ToF Moduleo NIR Camera Module
o Overviewo Cross-Section
o NIR ToF Sensor Dieo Views & Dimensionso Delayering & Processo Die Cross-section
o Flood Illuminator Moduleo Overviewo Cross-Section
o NIR VCSEL Dieo Views & Dimensionso Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
3D Depth Sensing Module Cross-Section
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 3D ToF Moduleo NIR Camera Module
o Overviewo Cross-Section
o NIR ToF Sensor Dieo Views & Dimensionso Delayering & Processo Die Cross-section
o Flood Illuminator Moduleo Overviewo Cross-Section
o NIR VCSEL Dieo Views & Dimensionso Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
3D Depth Sensing Module – Sensor Die Overview & Dimensions
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 3D ToF Moduleo NIR Camera Module
o Overviewo Cross-Section
o NIR ToF Sensor Dieo Views & Dimensionso Delayering & Processo Die Cross-section
o Flood Illuminator Moduleo Overviewo Cross-Section
o NIR VCSEL Dieo Views & Dimensionso Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Sensor Die – Die Delayering – Pixels
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 3D ToF Moduleo NIR Camera Module
o Overviewo Cross-Section
o NIR ToF Sensor Dieo Views & Dimensionso Delayering & Processo Die Cross-section
o Flood Illuminator Moduleo Overviewo Cross-Section
o NIR VCSEL Dieo Views & Dimensionso Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Sensor Die – Die Cross-Section – Substrate
Sensor Die – Cross-Section Plan©2019 by System Plus Consulting
Sensor Die – Die Cross-Section – Substrate – SEM View©2019 by System Plus Consulting
XXXXX
XXXXX XX µm
• Sensor die thickness: XX µm
XXX
XX µm
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o 3D ToF Moduleo NIR Camera Module
o Overviewo Cross-Section
o NIR ToF Sensor Dieo Views & Dimensionso Delayering & Processo Die Cross-section
o Flood Illuminator Moduleo Overviewo Cross-Section
o NIR VCSEL Dieo Views & Dimensionso Die Processo Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
VCSEL Die Overview & Dimensions
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparisono Oppo vs. Lenovo
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Oppo vs. Lenovo – NIR Camera Module
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo NIR Sensor Die Front-End
Processo NIR Sensor Process Flowo NIR Sensor Fabrication Unito NIR VCSEL Process Flowo NIR VCSEL Fabrication Unit
Cost Analysis
Related Reports
About System Plus
Pixel Array & DSP Circuit Process Flow
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso NIR Camera Module Costo Flood Illuminator Module Costo 3D ToF Module Cost
Related Reports
About System Plus
NIR Camera Module – Pixel Array Front-End Cost
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso NIR Camera Module Costo Flood Illuminator Module Costo 3D ToF Module Cost
Related Reports
About System Plus
NIR Camera Module – Module Cost
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso NIR Camera Module Costo Flood Illuminator Module Costo 3D ToF Module Cost
Related Reports
About System Plus
Complete System Price
©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING• Status of the Camera Module Industry 2019 – Focus on Wafer
Level Optics • Status of the CMOS Image Sensor Industry 2018• 3D Imaging & Sensing 2019• VCSELs - Technology, Industry and Market Trends• Consumer Biometrics: Market and Technologies Trends 2019
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING• Huawei Mate 20 Pro’s 3D Depth-Sensing System• Mantis Vision’s 3D Depth Sensing System in the Xiaomi
Mi8 Explorer Edition• Orbbec’s Front 3D Depth Sensing System in the Oppo
Find X• STMicroelectronics’ Near Infrared Camera Sensor in the
Apple iPhone X• Apple iPhone X – Infrared Dot Projector• Lenovo Phab2Pro 3D ToF Camera
Following its first introduction of a 3Dstructured light camera on the front ofthe Find X, last year, Oppo is nowpioneering the use of 3D Time-of-Flight(ToF) in its Rx17 Pro. Lenovo did a similarintegration on the rear of one of itsproducts a few years ago, integrating apmd/Infineon solution in a high-endphone. In doing this, Asus and Lenovoadded an additional Near Infra-Red (NIR)Global Shutter (GS) camera, but Oppodoesn’t have such a dedicated NIR GSCamera. Instead, Oppo uses the latestgeneration of ToF camera technologyfrom Sony Depthsensing Solutions,formerly known as SoftKinetic.
The rear optical hub is packaged in onemetal enclosure and features severalcameras and a flood illuminator. Thecomplete system features a telephoto andwide-angle camera module and a 3D ToFcamera. The distinguishing characteristicof the 3D depth sensing camera is theaddition of a NIR flood illuminator.
This report focuses its analysis on the 3Ddepth sensing system. All components arestandard and can be found on the market.That includes a BackSide Illumination (BSI)ToF image sensor featuring 10 µm x 10µm size pixels and resolution of 46kilopixel, developed by Sony DepthsensingSolutions. It also has one vertical cavitysurface emitting laser (VCSEL) for the
flood illuminator, coming from a majorsupplier. This is the first ToF imager foundon the market featuring BSI technology,which is commonly used by Sony, coupledwith Current Assisted Photonic Demo-dulation (CPAD) developed by SonyDepthsensing Solutions.
Along with the complete 3D depth sensingsystem, this report analyses the system’scost and estimates its price. It alsoincludes a physical and technicalcomparison with another 3D sensingsystem from Lenovo in the Phab2Pro,using the first generation pmd/InfineonToF Imager. The comparison looks atsystem integration, the NIR cameramodule and the flood illuminatorarchitecture.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
Deep analysis of the Sony’s 3D ToF Sensor and the VCSEL in the Oppo RX17 Pro.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Oppo RX17 pro – 3D ToF Depth Sensing System
Pages: 147
Date: March 2019
Format: PDF & Excel file
Price: EUR 3,990
Sony’s 3D Time-of-Flight Depth Sensing Camera Module
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
Sony Company Profile
Oppo RX17 Pro – Teardown and Market Analysis
Physical Analysis
• Physical Analysis Methodology• 3D Sensing System Disassembly and Cross-
Section• NIR Camera ToF Sensor
o View, dimensions, and cross-section• NIR Camera ToF Sensor Die
o View, dimensions, pixels, delayering and main block IDs
o Process and cross-section• Flood Illuminator Module Disassembly and
Cross-Section• NIR VCSEL Dies
o View, and dimensionso Dies process and cross-section
• Physical Data Summary
Physical Comparison: Lenovo Phab2Pro
• System Integration• NIR Camera Module and ToF Sensor• Flood Illuminator and VCSEL
AUTHORS
Manufacturing Process Flow
• Die Fabrication Unit : NIR Image Sensor, NIR VCSEL,
• NIR Image Sensor and VCSEL Process Flow
Cost Analysis
• Cost Analysis Overview• Supply Chain Description and Yield
Hypotheses• NIR Image Camera Module Cost
o Front-end (FE), microlens, BSI and total FE cost
o Wafer and die costo Lens module and assembly cost
• NIR Flood Illuminator Cost o Front-End (FE) costo FE cost per process stepo Wafer and die costo Assembly cost
Estimated Price Analysis: NIR Camera Module, Flood Illuminator Module, and Optical Hub
SONY'S 3D TIME OF FLIGHT DEPTH SENSING CAMERA MODULE
RELATED REPORTS
Huawei Mate 20 Pro’s 3D Depth-Sensing SystemThe complete system includes a 3D camera, flood illuminator, and DOT projector featuring a DOE.February 2019 - EUR 3,990*
Orbbec’sFront 3D Depth Sensing System in the OppoFind XThe first introduction of Orbbec’s3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.November 2018 - EUR 3,990*
Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer EditionThe first introduction of Mantis Vision’s technology into a mobile application, featuring coded structured light.December 2018 - EUR 3,990*
Dr. Stéphane Elisabeth has joinedSystem Plus Consulting's team in 2016.He has a deep knowledge of Materialscharacterizations and Electronicssystems. He holds an EngineeringDegree in Electronics and NumericalTechnology, and a PhD in Materials forMicroelectronics.
Nicolas Radufe is in charge of physicalanalysis at System Plus Consulting. Hehas a deep knowledge in chemical andphysical analyses. He previouslyworked in microelectronics R&D forCEA/LETI in Grenoble and forSTMicroelectronics in Crolles.
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©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 18
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©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 19
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©2019 by System Plus Consulting | Sony’s 3D Time-of-Flight Depth Sensing Camera Module 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Pluso Company serviceso Contact
Contact
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