Solid State Sensors - Auburn Universitydeanron/Lecture_22713.pdf · 2013-03-04 · Cleanliness Very...
Transcript of Solid State Sensors - Auburn Universitydeanron/Lecture_22713.pdf · 2013-03-04 · Cleanliness Very...
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Solid State Sensors
Tour of Auburn’s MicrofabricationLab
2/27/13
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Microfabrication Lab Safety
Many dangerous chemicals and equipment usedSafety is VERY importantChemical safety
Acids – severe burnsToxic liquids and gasesFlammable liquidsExplosive potential
Equipment safetyHigh voltageUV radiationHigh pressureHigh/low temperaturesGlassware (sharp if broken)
Proper clothing requiredClean room suitProtective glovesSafety goggles
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A Microlab when Safety is Ignored
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Cleanliness
Very important in microfabrication100µm width human hair: 10µm device featureClass X cleanroom: less than X 0.5µm particles per cubic foot
Ex: Class 10,000: > 10,000 0.5µm particles per ft3
AU microlab:Class 1000/2000 in open areasClass 100/200 in photolithography room
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Typical Cleanroom Clothing
Low particulate cleanroom suit
Protective gloves
Hair net
Booties
Safety glasses required when working with
chemicals
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Oxidation and Diffusion Furnace
For thermally growing Silicon Dioxide (SiO2) on Si wafers
Uses an oxygen torch and a hydrogen torchOxidation process
For diffusion doping of Si wafers
To make n-type or p-type regionsSuch as piezoresistors
Oxidation and Diffusion Furnace
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LPCVD System
“Low Pressure Chemical Vapor Deposition”For growing a layer of polysilicon on a waferAlso for growing a layer of silicon nitride on a waferTypically thin films, ≤ 5µm thick
LPCVD System
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PECVD System
“Plasma Enhanced Chemical Vapor Deposition”Low temp Si dioxide (LTO) depositionLow temp silicon nitride (SiN) depositionDeposition of other conformal thin film coatings via plasma processing
PECVD System
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Photograph of a Photolithography Mask
Glass maskDark features are chrome on the glass surface
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Spinner for Applying Photoresist to a Wafer
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Photograph of a MA/BA6 Mask Aligner
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Wet Chemical Processing
Acids and solvents processed separately
Vapors are pulled up and out of the lab through a ventilation hood
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When Acids and Solvents Mix
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Removing Used Photoresist
Can be removed chemically using solvents such as acetoneCan be removed by Ashing
An oxygen plasma treatment that burns organics off the surface
Matrix Asher
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Sputtering and Electron Beam Deposition
Has 2 electron guns a one sputtering gun Holds 1 sputter target and 7 E-beam targets
Can deposit 8 different materials without breaking vacuum
With the 2 E-guns, can co-deposit 2 materials at the same time
Can deposit alloys on a substrate
Typical cleanroom suit Mark 50
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STS Advanced Silicon Etcher
Bosch process DRIE etcher for Si wafersHolds 4” diameter wafersCan obtain a 10:1 aspect ratio when etching through a Si waferReal “workhorse” for most MEMS fabrication projects at Auburn
STS ASE Bosch Process Si DRIE Etcher
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A Dry Etched Si Wall
Bosch dry etching process results in horizontal micro trenches on vertical surfaces
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STS Advanced Oxide Etcher
Non-Bosch process RIE system for non-Si materials:
GlassTitanium thin filmsplastics
STS AOE RIE Etcher
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Profilometer
Measures the depth of etched featuresUsed along with RIE to determine when the desired etch depth has been reached
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Electroplating System
Electroplating used to grow metal micro-structuresCu, Ni, Au, Sn, etc. can be electroplated
Wafer Plating System
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Plating Working Electric Car
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Polyimide Processing
Polyimides are special plasticsWafers can be coated with polyimide layersThe polyimide can then be cured in this special vacuum furnace
Polyimide Vacuum Curing Oven
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Automated Dicing Saw
Dices a wafer into dieUses a diamond saw bladeWater cooledWafer attached to a tape told hold die in place
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Automatic Thermosonic Wirebonder
Die are wire bonded to package pads for electrical connectionsGold wire bond wire is used (~25µm diameter)
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Photo of Wire Bonds
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The End