Solder preforms for product and process improvement By Krayden Alpha technical specialist.
description
Transcript of Solder preforms for product and process improvement By Krayden Alpha technical specialist.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
1
the product:
ALPHA®
WS-819 Solder Pasteproduct guide
A world class lead free, high reliability water soluble paste offering best in class printing, resistance to BGA voids and cleanability.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Welcome to theALPHA® WS-819 Product Guide
2. Performance Summary 43. Print Performance 5 - 9
5. Post Reflow Cleaning 20 - 224. Reflow Performance 10 - 19
6 . Shelf Life 23
8. Technical Bulletin 27 - 30
CONTENTS
9. MSDS 31 - 36
7. Summary 24 - 26
1. Introduction 3
A world class lead free, high reliability water soluble paste offering best in class printing, resistance to BGA voids and cleanability.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteIntroduction
Introducing ALPHA® WS-819, the state of the art in Water Soluble, Lead Free Solder Paste.Water soluble solder pastes are commonly used for high reliability medical, military and telecom infrastructure applications. Until now, high reliability has had a price-namely poor resistance to variations in temperature and humidityin the print process, and poor resistance to BGA voiding.
WS-819 was developed to offer the widest possible print process window, with consistent high print deposit volumes, IPC Class III resistance to voiding, and ease of cleanability in a ORH0 class solder paste.
As with all Alpha brand products, WS-819 comes with complete process and product support whenever and however you need us. It’s the kind of support you would expect from a company that’s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Performance SummarySMT Process Step Performance Indicator WS-819 Performance Capability
Fine Feature Print Performance
Excellent print definition and consistant volumetric performance to 0.30mm (12 mil) circles and 0.4mm (16 mil) pitch rectangular QFP pads.
Stencil Life 8 hours at 35-65% Relative Humidity
Humidity/Temperature Window Capable of printing in temperatures from 20°C to ≥ 28°C at Relative Humidities of 50% +-15% (35% to 65%)
Stencil Cleaning Frequency3 to 10 prints per wipe, depending on smallest feature printed, and use of apeture reduction and stencil thickness
Print Speed Range25mm/second to 100mm/second (1 inch/second to 4 inches/second) down to 0.30mm (12 mil) circles and .4mm (16 mil) pitch QFP pads. Optimal results found at 100mm/second.
Solder Spread 88.6% (Average) per JIS-Z-3197:1999 8.3.1.1
Resistance to VoidsExceeds requirements of IPC 7095 Class lll using soak and ramp reflow profiles on OSP, Immersion Tin, Immersion Silver and ENIG finishes.
Resistance to Hot and Cold Slump
Exceeds the requirements of IPC J-STD-005. No slump at 0.2mm gap per JIS-Z-3284.
Reflow Process WindowStraight Ramp, or <60 second soak profile in air. Nitrogen recommended for longer (>60 second) soak profiles.
Residue Cleaning Meets IPC requirements over range of cleaning temperatures and water pressures, using DI water without additives.
Cleanability Meets/Exceeds IPC Bellcore and HP EL-EN861-00 Requirements
J-STD-004 Classification ORH0Halide Content Halide Free
Print Process Window
Reflow Yield
Post Reflow
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste8 Hour Stencil Life at High Humidity (66% RH @ 27°C)
Vol
ume
ConditionTime
80F/65-67% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr
600
500
400
300
200
100
0
Theoretical Volume (565 cubic mils)
50% Trans Efficiency
Condition80F/65-67% RH
PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA56-12 (12 mil Circles)
Vol
ume
ConditionTime
80F/65-67% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr
900
800
700
600
500
400
300
200
100
0
Theoretical Volume (884 cubic mils)
55% Trans Efficiency
Condition80F/65-67% RH
PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA36 (15 mil Circles)
Vol
ume
ConditionTime
80F/65-67% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr
1600
1400
1200
1000
800
600
400
200
0
Theoretical Volume (1571 cubic mils)
70% Trans Efficiency
Condition80F/65-67% RH
PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA256 (20 mil Circles)
Vol
ume
ConditionTime
80F/65-67% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr
3500
3000
2500
2000
1500
1000
500
0
Theoretical Volume (3150 cubic mils)
60% Trans Efficie
Condition80F/65-67% RH
PWS0608A #70329576 - 8hr Stencil Life Volume ChartQFP120-1 (16 mil pitch QFP deposits, 63x10x5 mils)
PWS-0608A was the pre-commercial laboratory name for WS-819
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste8 Hour Stencil Life at Low Humidity (23% RH @ 29°C)
Vol
ume
ConditionTime
81-94F/23-25% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr
600
500
400
300
200
100
0
Theoretical Volume (565 cubic mils)
50% Trans Efficiency
Condition81-94F/23-25% RH
PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA56-12 (12 mil Circles)
Vol
ume
ConditionTime
81-94F/23-25% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr
900
800
700
600
500
400
300
200
100
0
Theoretical Volume (884 cubic mils)
55% Trans Efficiency
Condition81-94F/23-25% RH
PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA36 (15 mil Circles)
Vol
ume
ConditionTime
81-94F/23-25% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr
1800
1600
1400
1200
1000
800
600
400
200
0
Theoretical Volume (1571 cubic mils)
70% Trans Efficiency
Condition81-94F/23-25% RH
PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA256 (20 mil Circles)
Vol
ume
ConditionTime
81-94F/23-25% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr
2500
2000
1500
1000
500
0
Theoretical Volume (2552 cubic mils)
60% Trans Efficiency
Condition81-94F/23-25% RH
PWS0608A #70329576 - 8hr Stencil Life Volume ChartQFP120-2 (16 mil pitch QFP deposits, 56.7x9x5 mils)
PWS-0608A was the pre-commercial laboratory name for WS-819
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Vol
ume
Print SpeedBoard
4 inches/sec.2 inches/sec.1 inch/sec.432143214321
600
500
400
300
200
100
0
Theoretical Volume (565 cubic mils)
50% Trans Efficiency
Print Speed1 inch/sec.2 inches/sec.4 inches/sec.
PWS0608A #70329576 - Volume Repeatability ChartBGA56-12 (12 mil Circles)
Fine Feature Print Performance1 inch (25mm) – 4 inches (100 mm)/second1
1) 5 mil laser cut stencil
Print Process Window
PWS-0608A was the pre-commercial laboratory name for WS-819
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pastePrint Process WindowIPC Tack Test
IPC TM-650 2.4.44
∆ Tack < 1 unit over 16 hours at all RH
Time 25% RH 50% RH 75% RH
Initial 2.8 2.8 2.816 hr 3.3 3.0 2.324 hr 3.4 3.1 3.0
Tack Strength (g / sq mm)
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Wipe Frequency–Number of Print Strokes between Stencil Cleaning Step
Paste: Lot Number:
Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%) Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%)1 0 0 0 0 1 0 0 0 02 0 0 0 0 2 0 0 0 03 0 0 0 0 3 0 0 0 04 1 0 2 0 4 0 0 0 05 1 0 0 0 5 0 0 0 06 0 0 0 0 6 >10 0 0 07 3 0 0 0 7 0 0 0 08 0 0 0 0 8 0 0 0 09 2 0 0 0 9 0 0 0 010 0 0 0 0 10 0 0 0 0
Inside Printer Inside Printer80*F 80 F40 % RH 40 % RH
Temperature: Relative Humidity:
Temperature: Relative Humidity:
QFP Device QFP Device
Solder Paste - Wipe Freqency.ALPHA PWSO608A
Number of Bridges Number of BridgesBoard Set 1 Board Set 2
70329576
Print Parameters: 1 in/s, 1.25 lbs/inch, 0.02 in/s
Print Process Window
PWS-0608A was the pre-commercial laboratory name for WS-819
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteReflow YieldReflow Yield
Reflow Process GuidelinesParameter Guideline Additional Information
Atmosphere Air (Straight Ramp or < 60 Second Soak)N2 for soak profiles >60 seconds up to 180 seconds
Mass production verification both in air and N2.
SnAgCu alloy melting ranges. Lower temperature=solidus; higher temperature = liquidus
SAC305: 217 – 220 •SAC405: 217 – 225
Use for reflow above liquidus setting
Profile General Guideline (Typical for SAC305)
Setting Zone Optimal Dwell Period Extended window
40oC to 220oC 105 to 180 seconds <210 seconds
130oC to 220oC 90- 100 seconds <135 seconds
170oC to 220oC 60 seconds <90 seconds
TAL (220oC) 45 - 90 seconds 30-90 seconds.
Peak temp. < 240oC for standard OSP finish
<250°C For Entek HT, Immersion Silver,
Immersion Tin or ENIG finishes
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Ramp Profile 1: 0.7C/s 235C Peak 60s TAL
Reflow Yield
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Ramp Profile 2:1.5C/s 240C Peak 60s TAL
Reflow Yield
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteSoak Reflow Profile: 175C/60s Soak 240C Peak 60s TAL(Nitrogen Required for Longer Soak Profiles)
Reflow Yield
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Spread Test MethodJIS-Z-3197:1999 8.3.1.1
Polish the surface of phosphor deoxidized copper plate (50×50×0.5mm) with #500 polishing paper applying drops of alcohol. Wash the surface with alcohol and cool in room temperature. Subject to oxidizing treatment in a dryer set at 150 for 1 hour. Put approx. 0.3g of solder paste on the center of the copper plate and weigh with high accuracy.Place the test panel onto the surface of melted solder in a solder bath set at 250.Keep heating for 30sec. after the solder melts.Remove the flux residues from the test panels with solvent. Measure the height of solder with a micrometer and calculate thespreading rate from the following formula. S=[(D-H)/D] ×100 .
S: Spreading Rate(%)H: Height of Spreading Solder (mm)D: Diameter of Solder assuming it as a sphere (mm)
D = 1.24 V 1/3 V: Mass / Specific Gravity of Solder
3.ApparatusSolder Bath POT-200C
Reflow Yield
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteReflow Yield
Result: 88.6% Spread
Density of Solder Alloy [g/cm] 7.4A.
Weight of Paste Weight of Solder Height of Solder Spreading Rate Average[g] [g] [mm] [%] [%]
#1 0.3206 0.2853 0.384 90.8%#2 0.3174 0.2825 0.441 89.4%#3 0.3751 0.3338 0.494 88.8%#4 0.3052 0.2716 0.639 84.5%#5 0.3332 0.2965 0.442 89.6%
88.6%
Sample
#1 #2 #3 #4 #5
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteReflow Yield
Reflow Yield: Application NoteDefinition of Voiding Performance
0.1d
0.25d
Solder OutlineVoid Outlines
dExample:Total Void Diameter0.10d +0.25d = 0.35d
Location of Void Class I Class II Class III
Void in Solder
(Solder Sphere)
60% of diameter
= 36% of Area
42% of diameter
= 20.25% of Area
30% of diameter
= 9% of Area
Void at interface of
Solder (Sphere)
and Substrate
50% of diameter
= 25% of Area
25% of diameter
= 12.25% of Area
20% of diameter
= 4% of Area
IPC Criteria for Voids in BGAs, IPC 7095 7.4.1.6The IPC criteria provide three classes of acceptance for both the solder sphere and the sphere-pad interface.
Where multiple voids exist, the dimensions will be added to calculate total voiding in the joint.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Void Size DistributionBGA256
0.00%
10.00%
20.00%
30.00%
40.00%
50.00%
60.00%
70.00%
80.00%
90.00%
100.00%
ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%
% of Joint area
% o
f Joi
nts
WS-819 89.5 M17 Cerf HS 160/60 soak 240Cp
WS-819 89.5 M17 Cerf St.Ramp 0.7C_S 235Cp.
Voiding PerformanceReflow Yield
WS-819 Meets Criteria for Class lll Voiding Using Soak or Ramp Profile
Per IPC 7095 7.4.1.6
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteReflow Yield
Solder Balling Resistance IPC TM-650 Method 2.4.43
Initial After 4 Hr. @ 25°C, 50% RH
Both “Preferred” per IPC Standard
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteReflow Yield
Slump ResistanceIPC TM-650 2.4.35
Pad Size 00.63 x 2.03mm 0.33 x 2.03mm 0.63 x 2.03mm 0.33 x 2.03mm
Largest Gap Bridged No Bridges 0.1 0.41 0.25
IPC max gap 0.48 0.2 0.56 0.25bridge allowed Pass Pass Pass Pass
Cold Slump 25C / 50% / 75% RH
Hot Slump Oven 150C / 10mins
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Cleanability StudyBoards were built using all five pastes and subsequently cleaned using twowater temperatures (120 and 150F) and two conveyor speed settings (2and 5 ft/min) in order to assess the relative cleanability of the pastes. Thepre-wash and wash water pressure were both set at 90 psi, while the rinsewater pressure was set at approximately 70 psi.
IPC J-STD-001 states that the contamination limit for assemblies testedusing the dynamic method of detecting ionic surface contamination(method used with the Ionograph) is 10 µg/in2 (1.56 µg/cm2) sodium chlorideequivalent ionic or ionizable flux residue.
WS-819 (known as PWS-0608A during the product development process)showed Ionograph contamination levels of results of 1.10 to 1.58 µg/in2
(0.172 to 0.256 µg/cm2 ), after two reflows and a 48 hour delay beforecleaning, exceeding the IPC requirement under the pressure andtemperature conditions described above
Post Reflow Cleaning
Paste 120F/2.5 ft/min. 120F/5 ft/min. 150F/2.5 ft/min. 150F/5 ft/min.
PWS0608A 1.5799 µg/in2
•Pass1.1996 µg/in2
Pass1.5106 µg/in2
Pass1.1015 µg/in2
Pass
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder paste
Post Cleaning CosmeticsPaste Aged 21 Days in Sealed Container Prior to Reflow
Post Reflow Cleaning
QFP208
High soak profile 160°C, 240°C peak OSP
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pastePost Reflow Cleaning
Electrical Reliability
Reflow & Cleaning 1 day 4 day 7 day
Ramp 0.7 °C/sec, 237 °C peak Clean 130 °C, 8 min DI H20 - Within 2 hours of reflow 2.4 x 109 1.0 x 1010 9.9 x 109
Ramp 0.7 °C/sec, 237 °C peak Clean 130 °C, 8 min DI H20 - Delayed 48 hours after reflow 1.4 x 109 2.4 x 109 2.5 x 109
SIR (Ω)
IPC SIR 85C / 85% RH, -48 V Bias
Req: SIR > 1 x 108 Ω after 4 & 7 days (PASS)
Reflow & Cleaning Ionic Contamination (µg/sq in)
Ramp 0.7 °C/sec, 237 °C peak Clean 130 °C, 8 min DI H20 - Within 2 hours of reflow 1.36
Ramp 0.7 °C/sec, 237 °C peak Clean 130 °C, 8 min DI H20 - Delayed 48 hours after reflow 2.43
Ionic Cleanliness
Req: Ionic contamination < 10 µg / sq in (PASS)
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteShelf Life
3 Weeks Room Temperature Stability(25°C; 77°F) in Unopened Container
0
500
1000
1500
2000
2500
3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
Days After Manufacture
10 R
PM M
alco
lm V
isco
sity
(KC
PS)
WS-819 Viscosity
Upper Limit
Low er Limit
6 Month Shelf Life When Stored in Sealed Jar at 1° to 10 ° C (34° to 50° F)
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteSummary
Delivers excellent print volume and consistency• Prints .4mm (16 mil) pitch QFP’s , .3mm (12 mil) circles with Type 3 Powder• Consistent Print Volume Repeatability at both Low (<35%) and High (65%) Relative Humidity• 8 Hour Stencil Life at Low and High Humidity• Excellent post print tack life• Wide print speed process window (25mm/sec to 100mm/sec)
High Post Reflow Yields• IPC Class III Voiding Performance (Using Soak Reflow Profile)• Resistance to cold and hot slump• Easily Cleaned with Water, after 2 lead free reflow cycles and 48 hour delay
Electrical Reliability• IPC SIR• Bellcore SIR• Bellcore Electromigration• HP EL-EN861-00 Electromigration
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteSummary
Leading Products
No Clean, SnPb• ALPHA OM-6106
•ALPHA OM-5100
No Clean, Lead-free• ALPHA OM-338 T
•ALPHA OM-338 PT
• ALPHA OM-350
Water Soluble, SnPb• ALPHA WS-809
Water Soluble, Lead-free• ALPHA WS-819
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
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WS-819 solder pasteSummary
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07
14 Tuas Avenue 10, Singapore 639138, 65-68611977, www.alphametals.com
SM919
ALPHA® WS-819 Water Soluble Lead-Free Solder Paste DESCRIPTION ALPHA® WS-819 is the newest Alpha® brand lead free, halide free solder paste offering the ideal combination of printability under varying environmental conditions, 8 hour stencil life, resistance to BGA voids, high spread combined with cleanability with water based cleaning systems. FEATURES & BENEFITS • Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features
• 8 hour stencil life at 35% to 65% Relative humidity
• High spread/wetting lead free paste compatible with lead free alloys and surface finishes
• High Reflow Yield with IPC Class III Voiding Performance when used to solder BGA components
• Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP.
• Cleanable with water based cleaning systems
PHYSICAL PROPERTIES • Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu), SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) • Application : Stencil printing (89.5% Metal Loading, M-17 Viscosity)
Dispense application (85% Metal Loading, Type 4 Powder, M9 Viscosity) • Powder Size: Type 3 (25µ-45µ) • RoHS Status: Completely free of Hazardous Materials per RoHS Directive 2002/95/EC APPLICATIONS Alpha® WS-819 was formulated to meet the requirements of water soluble solder lead free applications. Alpha® WS-819 was developed to offer best in class resistance to heat and humidity variations in the printing process, while offering exceptional post reflow cleanability and low BGA voiding.
This paste is designed to enable users of Alpha® WS-609; WS-709 and WS-809 and other leading water soluble paste brands to comply with RoHS and customer based demand for lead free materials. SAFETY While the ALPHA® WS-819 flux system is not considered toxic, its use in typical reflow will generate a small amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. Consult the MSDS for additional safety information. SHIPPING AND STORAGE ALPHA® WS-819 is shipped in thermally controlled boxes and should be stored refrigerated upon receipt at 340 - 450F (10 - 70C). ALPHA® WS-819 should be permitted to reach room temperature before opening the package prior to use.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07
ALPHA® WS-819 TECHNICAL DATA Physical PropertiesItems ALPHA® WS-819 SAC 305/405
89.5-3-M17 (stencil printing) Test Method
Appearance (flux residues after reflowed) Light yellowish color (before water washed) CEAMG PUT 001.05 Metal content (%) 89.4% +- 0.2% CEAMG STM 0355 Viscosity (Poise, Malcom spiral viscometer @10rpm)
M17 for stencil printing M9 for dispensing
CEAMG STM 0541
Stencil life (50%+- 15%RH, 25°C) >8 hours CEAMG PUT 001.01 Printability Suitable for fine pitch printing applications (Down
to 16 mil (0.4mm) pitch QFP components, 12 mil (0.3mm) BGA circles @) up to 100 mm/sec squeegee speed, using 5 mil (125µ) thick laser cut stencil
CEAMG PUT 001.01
Response to pause 0-1 Knead Stroke Required CEAMG PUT 001.08 Tack Initial 2.0 g/mm²; 1.8 g/mm² after 4 hours at 25°C
and 50% R.H. IPC TM-650 2.4.44
Random Solder Balls Preferred (Both Initial and after 4 hours at 25°C and 50% R.H.
IPC TM-650 2.4.43
Slump Resistance Pass IPC TM-650 2.4.35 Chemical Properties
Items ALPHA® WS-819 Flux System Halide content (IPC J-Std-004) ORH0 Corrosivity (IPC J-Std-004) Not applicable for water soluble solder paste
ALPHA® WS-819 PROCESSING GUIDELINES
STORAGE-HANDLING PRINTING / DISPENSING REFLOW CLEANING • Refrigerate to guarantee stability @
34-45°F (1-7°C) • Warm-up of 500g jar to room
temperature (should be ~ 6 hours). Set up printer with room temperature paste. Check paste temperature with a thermometer.
• Do not remove worked paste from
stencil and mix with unused paste in jar. This will alter rheology of unused paste.
• Do not shake or mix paste using
automatic paste shaking equipment prior to opening jar. The plunger insert used may submerge into paste and produce difficulties with plunger removal.
STENCIL: Recommend ALPHA CUT Laser Cut Stencil @ 0.005 inch (5 mil, 127µ) thick for 0.012 inch (.30 mml) pitch QFPs SQUEEGEE: Metal (Recommended) Print Speed: 2.0 -4.0 in./sec (50-100 mm/sec.) 4.0 in/sec. optimal SQUEEGEE: Pressure: 1.5 to 2.0 lbs./ linear in. (0357 Kg/cm) Stencil Release Speed: .02 in/sec (0.5 mm/second) Compatible with DEK Pro-Flow Enclosed print head. Report available upon request.
ATMOSPHERE: • Clean-dry air If soak temp ≥ 160°C) and soak time > 45-60 seconds Nitrogen recommended for longer soak profiles (60 to 180 seconds). • PROFILE (PRINTING): • See profiles evaluated in
product development below • Slow ramp from 130oC to
180oC for 90~120 seconds • Ramp @ 0.5~2oC/sec to peak
temperature 230oC - 250oC TAL for 40~80 seconds.
• Ramp down to R.T. @ 1~3oC/sec.
• ALPHA WS-819 is designed to be water rinsed in washing operations. with minimal foaming in recirculating systems.
• The flux residues from
ALPHA WS-819 are completely water soluble. This allows for more flexible washing conditions which can be board design specific.
• If lower/no foaming is desired
in cleaning equipment, Alpha P-2000 defoamer may be used.
Reflow Profiles Tested, using Clean, Dry Air CERF Straight Ramp 0.7C/s 235C Peak 60s TAL
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07
CERF Straight Ramp 1.5C/s 240C Peak 60s TAL
CERF 60s Soak @ 175°C/ 240C Peak 60s TAL
Note- profiles using a soak time > 60 seconds may require nitrogen for satisfactory results Use of air for long soak profiles have resulted in dull, grainy joints, and possible de-wetting of solder joints.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07
MATERIAL SAFETYDATA SHEET
PRODUCT NAME: ALPHA WS-819 SOLDER PASTE SAC305 & SAC405
MANUFACTURER'S NAME: ALPHA METALS, INCADDRESS: 600 ROUTE 440
JERSEY CITY, NJ 07304TRANSPORT EMERGENCY #: CHEMTREC: 1-800-424-9300
BUSINESS PHONE: 1-201-434-6778
CHEMICAL NAME CAS # % W/W OSHA PEL - TWATIN 7440-31-5 80 - 90 2.0 mg/m3SILVER 7440-22-4 1 - 5 0.01 mg/m3COPPER 7440-50-8 0.2 - 1 0.1 mg/m3 (fume)Ethoxylated-N-Tallow 61790-85-0 1 - 3 NEAlkyltrimethylenediamineFORAL AX 65997-06-0 1 - 3 **Ethoxylated octylphenol 9002-93-1 1 - 5 NE
**SENSITIZER
EMERGENCY OVERVIEW: MODERATE EYE IRRITANT.WILL NOT BURNTOXIC BY INHALATION.MODERATE GASTROINTESTINAL TRACT IRRITANT.MODERATE RESPIRATORY TRACT IRRITANT.CAUSES SKIN IRRITATION
HMIS RATING SYSTEM:Health: 1 ; Flammability: 0 ; Reactivity: 0 ; Protection: C
NFPA RATING SYSTEM:Health: 2 ; Flammability: 0 ; Reactivity: 0
ROUTES OF ENTRY: INHALATION; INGESTION; SKIN CONTACT; EYE CONTACT;ABSORPTION;
TARGET ORGANS: BLOOD; DIGESTIVE TRACT; KIDNEYS; NERVOUS SYSTEM; EYES;SKIN.
MEDICAL CONDITIONS AGGRAVATED: DIGESTIVE TRACT DISEASE; KIDNEY DISEASEEYE DISEASE. SKIN DISEASE INCLUDING ECZEMAAND SENSITIZATION.
IMMEDIATE (ACUTE) SYMPTOMS OVER-EXPOSURE BY ROUTE OF EXPOSURE:INHALATION: CAN CAUSE MODERATE RESPIRATORY IRRITATION, DIZZINESS,
WEAKNESS, FATIGUE, NAUSEA AND HEADACHE. MAY CAUSE AN
1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATION
2. INGREDIENT AND EXPOSURE LIMIT INFORMATION
3. HAZARDS IDENTIFICATION
MSDS ID: AA 00151090
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MATERIAL SAFETYDATA SHEET
ALLERGIC REACTION. MAY CAUSE RESPIRATORY TRACTSENSITIZATION, CHARACTERIZED BY ASTHMA-LIKE SYMPTOMS.
EYES: CAN CAUSE MODERATE IRRITATION, TEARING AND REDDENING, BUTNOT LIKELY TO PERMANENTLY INJURE EYE TISSUE.
SKIN CONTACT: CAN CAUSE SLIGHT IRRITATION.INGESTION: IRRITATING TO MOUTH, THROAT, AND STOMACH. CAN CAUSE
ABDOMINAL DISCOMFORT, NAUSEA, VOMITING AND DIARRHEA.
LONG TERM (CHRONIC) HEALTH EFFECTS:CARCINOGENICITY: NONE OF THE SUBSTANCES HAVE BEEN SHOWN TO CAUSE CANCER IN
LONG TERM ANIMAL STUDIES. NOT A CARCINOGEN ACCORDING TO NTP,IARC, OR OSHA.
REPRODUCTION: NO DATA AVAILABLE TO INDICATE PRODUCT OR ANY COMPONENTSPRESENT AT GREATER THAN 0.1% MAY CAUSE BIRTH DEFECTS.
MUTAGENICITY: NO DATA AVAILABLE TO INDICATE PRODUCT OR ANY COMPONENTSPRESENT AT GREATER THAN 0.1% IS MUTAGENIC OR GENOTOXIC.
SKIN EXPOSURE: WASH WITH SOAP AND WATER. REMOVE CONTAMINATED CLOTHING ANDLAUNDER. GET MEDICAL ATTENTION IF IRRITATION DEVELOPS ORPERSISTS.
EYE EXPOSURE: FLUSH EYES WITH PLENTY OF WATER FOR AT LEAST 20 MINUTESRETRACTING EYELIDS OFTEN. TILT THE HEAD TO PREVENT CHEMICALFROM TRANSFERRING TO THE UNCONTAMINATED EYE. GET IMMEDIATEMEDICAL ATTENTION.
INHALATION: REMOVE TO FRESH AIR. IF BREATHING IS DIFFICULT, HAVE ATRAINED INDIVIDUAL ADMINISTER OXYGEN. IF NOT BREATHING, GIVEARTIFICIAL RESPIRATION AND HAVE A TRAINED INDIVIDUALADMINISTER OXYGEN. GET MEDICAL ATTENTION IMMEDIATELY
INGESTION: SEEK MEDICAL ATTENTION IMMEDIATELY.NOTES TO DOCTOR: NO ADDITIONAL FIRST AID INFORMATION AVAILABLE
FLAMMABILITY SUMMARY: NOT COMBUSTIBLEFLASH POINT: N/AAUTOIGNITION TEMPERATURE: N/EEXPLOSIVE LIMITS % IN AIR: N/EEXTINGUISHING MEDIA: USE ALCOHOL RESISTANT FOAM, CARBON DIOXIDE, OR
DRY CHEMICAL WHEN FIGHTING FIRES. WATER ORFOAM MAY CAUSE FROTHING IF LIQUID IS BURNINGBUT IT STILL MAY BE USEFUL EXTINGUISHING AGENTIF CAREFULLLY APPLIED TO THE SURFACE OF THEFIRE. DO NOT DIRECT A STREAM OF WATER INTO
3. HAZARDS IDENTIFICATION (Cont.)
4. FIRST AID MEASURES
5. FIRE FIGHTING MEASURES
MSDS ID: AA 00151090
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MATERIAL SAFETYDATA SHEET
MOLTEN MATERIAL.FIRE AND EXPLOSION METHODS: MATERIAL MAY BE IGNITED ONLY IF PREHEATED TO
TEMPETURES ABOVE THE HIGH FLASH POINT, FOREXAMPLE IN A FIRE. DUST AT SUFFICIENTCONCENTRATIONS CAN FORM EXPLOSIVE MIXTURESWITH AIR.
FIRE FIGHTING METHODS: WILL NOT BURN, NO SPECIAL INSTRUCTIONSAVAILABLE. USE METHODS APPROPRIATE FORSURROUNDING MATERIALS.
HAZARDOUS COMBUSTION PRODUCTS: CARBON MONOXIDE; CARBON DIOXIDE; METAL FUMES;TOXIC FUMES.
PRECAUTIONS AND EQUIPMENT: EXPOSURE TO THE SPILLED MATERIAL MAY BE IRRITATINGOR HARMFUL. FOLLOW PERSONAL PROTECTIVE EQUIPMENTRECOMMENDATIONS FOUND IN SECTION VIII OF THISMSDS.
METHODS FOR CLEAN-UP: WEAR COMPLETE AND PROPER PERSONAL PROTECTIVEEQUIPMENT FOLLOWING THE RECOMMENDATION OF SECTIONVIII GATHER AND STORE IN A SEALED CONTAINERPENDING A WASTE DISPOSAL EVALUATION. DO NOT USEBROOM OR AIR CLEANING ETC.
HANDLING MEASURES: HARMFUL OR IRRITATING MATERIAL. AVOID CONTACTING AND AVOIDBREATHING THE MATERIAL. USE ONLY IN A WELL VENTILATEDAREA.AS WITH ALL CHEMICALS, GOOD INDUSTRIAL HYGIENE PRACTICESSHOULD BE FOLLOWED WHEN HANDLING THIS MATERIAL. AVOIDCONTACT WITH MATERIAL, AVOID BREATHING DUSTS OR FUMES, USEONLY IN A WELL VENTILATED AREA. WASH THOROUGHLY AFTERHANDLING; WASH HANDS BEFORE EATING; DO NOT GET IN EYES,ON SKIN AND CLOTHING; MINIMIZE DUST GENERATION ANDACCUMULATION; AVOID CREATING DUSTS AS AN EXPLOSIVEHIGH CONCENTRATIONS.
STORAGE MEASURES: NO SPECIAL REQUIREMENTSKEEP AWAY FROM FOOD AND DRINKING WATER. STORE IN A COOLDRY PLACE.
5. FIRE FIGHTING MEASURES (Cont.)
6. ACCIDENTAL RELEASE MEASURES
7. HANDLING AND STORAGE
MSDS ID: AA 00151090
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MATERIAL SAFETYDATA SHEET
ENGINEERING MEASURES: USE LOCAL EXHAUST VENTILATION OR OTHER ENGINEERINGCONTROLS TO MINIMIZE EXPOSURES AND MAINTAIN OPERATORCOMFORT.ENGINEERING CONTROLS MUST BE DESIGNED TO MEET THEOSHA CHEMICAL SPECIFIC STANDARD IN 29 CFR 1910.VENTILATION IS REQUIRED TO MAINTAIN OPERATOR EXPOSUREBELOW PUBLISHED EXPOSURE LIMITS. USE PROCESSENCLOSURES, LOCAL EXHAUST VENTILATION, OR OTHERENGINEERING CONTROLS TO CONTROL AIRBORNE LEVELS BELOWRECOMMENDED EXPOSURE LIMITS; EXPLOSION PROOF EXHAUSTVENTILATION SHOULD BE USED. FACILITIES STORING ORUSING THIS MATERIAL SHOULD BE EQUIPPED WITH ANEYEWASH AND SAFETY SHOWER.
RESPIRATORY PROTECTION: RESPIRATORY PROTECTION MAY BE REQUIRED TO AVOIDOVEREXPOSURE WHEN HANDLING THIS PRODUCT. GENERAL ORLOCAL EXHAUST VENTILATION IS THE PREFERRED MEANS OFPROTECTION. USE A RESPIRATOR IF GENERAL ROOMVENTILATION IS NOT AVAILABLE OR SUFFICIENT TOELIMINATE SYMPTOMS.FOLLOW A RESPIRATORY PROTECTION PROGRAM THAT MEETS 29CFR 1910.134 AND ANSI Z88.2 REQUIREMENTS WHENEVERWORK PLACE CONDITIONS WARRANT THE USE OF ARESPIRATOR. WEAR A NIOSH APPROVED RESPIRATOR IF ANYEXPOSURE IS POSSIBLE.
EYE PROTECTION: WEAR CHEMICALLY RESISTANT SAFETY GLASSES WITH SIDESHIELDS WHEN HANDLING THIS PRODUCT. DO NOT WEARCONTACT LENSES.WEAR GOGGLES AND A FACE SHIELD
SKIN PROTECTION: WEAR PROTECTIVE GLOVES. INSPECT GLOVES FOR CHEMICALBREAK-THROUGH AND REPLACE AT REGULAR INTERVALS. CLEANPROTECTIVE EQUIPMENT REGULARLY. WASH HANDS AND OTHEREXPOSED AREAS WITH MILD SOAP AND WATER BEFORE EATING,DRINKING, AND WHEN LEAVING WORK
CONTROL PARAMETERS: ----------ACGIH EXPOSURE LIMITS----------------CHEMICAL NAME TLV-TWA STEL CEILINGForax AX Sensitizer;keep
exposure as lowas possible.
TIN 2 mg/m3 TWASILVER 0.01 mg/m3 TWACOPPER 0.1 mg/m3 TWA (fume)
8. EXPOSURE CONTROLS AND PERSONAL PROTECTION
MSDS ID: AA 00151090
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MATERIAL SAFETYDATA SHEET
COLOR: GREYODOR: NONEpH: N/A
DECOMPOSITION PRODUCTS: METAL FUMES; TOXIC FUMES.INCOMPATIBLE MATERIALS: STRONG ACIDS; STRONG OXIDIZING AGENTS;CONDITIONS TO AVOID: NONE KNOWNCONTAMINATION: CONTACT WITH AIR. CONTACT WITH
WATER
COMPONENT TOXICOLOGY DATA (NIOSH)CHEMICAL NAME LD50/LC50
Ethoxylated octylphenol Acute oral toxicity (LD50):1800 mg/kg(Rat)
Ethoxylated-N-Tallow LD50: 945 mg/kg oral ratAlkyltrimethylenediamine
Floral AX Sensitizer
OVERVIEW: SLIGHT ECOLOGICAL HAZARD. IN HIGH CONCENTRATIONS, THISPRODUCT MAY BE DANGEROUS TO PLANTS AND/OR WILDLIFE.
WASTE DESCRIPTION: SPENT OR DISCARDED MATERIAL IS PROBABLY A HAZARDOUS WASTE.DISPOSAL METHODS: DISPOSE OF IN ACCORDANCE WITH FEDERAL, STATE, LOCAL, OR
PROVINCIAL LAWS AND REGULATIONS.
9. PHYSICAL AND CHEMICAL PROPERTIES
10. STABILITY AND REACTIVITY
11. TOXICOLOGICAL INFORMATION
12. ECOLOGICAL INFORMATION
13. DISPOSAL CONSIDERATIONS
MSDS ID: AA 00151090
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MATERIAL SAFETYDATA SHEET
SHIPPING BASIC DESCRIPTION: DOT & IATA: NOT RESTRICTED
TSCA STATUS: ALL COMPONENTS OF THIS PRODUCT ARE LISTED ON THE TSCA INVENTORYOF EXISTING CHEMICAL SUBSTANCES.
REGULATED CHEMICALS:
CHEMICAL NAME REGULATIONSILVER 7440-22-4 SARA 313
WHMIS rating: D2B
The information contained herein is based on data considered accurate.However, no warranty is expressed of implied regarding the accuracy of thesedata or the results to be obtained from the use thereof. Additionally, AlphaMetals, Inc. assumes no responsibility for injury to the vendee or thirdpersons proximately caused by the material even if reasonable safetyprocedures are followed. Furthermore, vendee assumes the risk in his use ofthe material.
14. TRANSPORT INFORMATION
15. REGULATORY INFORMATION
16. OTHER INFORMATION
MSDS ID: AA 00151090
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