Smart Systems Integration: Challenges, … Systems Integration: Challenges, Opportunities, and the...
Transcript of Smart Systems Integration: Challenges, … Systems Integration: Challenges, Opportunities, and the...
Smart Systems Integration: Challenges, Opportunities, and the Role of EPoSS (European Technology Platform on Smart Systems Integration)
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MICROTECH 2011Boston, 16th June 2011
Salvo CoffaGroup VP, R&D General ManagerIndustrial & Multisegment SectorSTMicroelectronics
Ultra low power
Smart Systems Definition
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Harvesting Device (PV, Piezo, etc)
Wireless Transmission : RF low power, ZigBee
Sensors Analog Front End, Back End
Energy Storage :Supercap, EnFilmBatteries
Low power digital processing
Power Management
Power Actuators : SiC, GaN, Power MOSFET, IGBT
Value Chain for Smart Systems Integration
Advanced Technologies
Final products/ applications
System solution know-how
DC/DC ConverterInverter
Electric Motor
Battery
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Emerging Applications Require Smart Integration
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More than Moore
Moo
reLa
w
Bas
elin
e C
MO
S :
CPU
, Mem
ory,
Log
ic
BiochipsSensorsActuators
HVPowerAnalog/RF Passives
130nm
90nm
65nm
45nm
32nm
22nm...V
130nm
90nm
65nm
45nm
32nm
22nm...V
Information Processing
Digital content:System-on-Chip
Interacting with people and environment
Non - Digital content :System-in-Package
Beyond CMOS:Quantum Computing, Molecular ElectronicsSpintronics
SiP
SoC
Small PCB percentage reduction via Moore LawPCB still busy mostly with bulky passive and discretesSmart Integration pass via mix of SoC and other enablers
System-on-Chip
Advanced packaging & System-in-Package
3D HeterogeneousIntegration/ TSV
Flexible ICs
Innovation and new conceptsSilicon technology scalingNew materials and processingApplication driven (or drives new applications)
Advanced CMOS, BCD technologies
SiC & GaNnew materials
MEMS & Sensors technologies
Ultra low powertechnologies
Harvesting & Thin Batteries
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Smart Systems Go Far Beyond
Smart Systems require thinking beyond the Chip!
Internet of Things
Mobility
Medicaloffer new sophisticated functionalities which replace entire perceptive and cognitive human functions
are energy autonomous and interact in a wireless environment whenever possible
reach a level of complexity which requires new processes and set new challenges of robustness and reliability
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Systems approach
Integration approach
Multi-materials approach and multi-technology approach
The Smart Systems Characteristics
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Example
Source: Sensimed, STM
Entering the world of visionSmart monitor for intraocular pressureSmart lens, containing passive and active strain gauges Output signal sent wirelessly Adhesive Antenna
Non-invasive and convenientMonitoring IOP continuously up to 24 hoursAmbulatory or in-hospital useRecording during sleep and normal activities
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Integration at systems level: realization of miniaturized systems
Integration into the macro-system
Integration into the application environment
Forming an interface for bridging orders of magnitude
Bridging the Gap from the Component to Product
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Emerging Applications Require Smart Integration
Smart systems integration is penetrating a series ofindustry sectors, bringing many market opportunitiesand a broad-based manufacturing infrastructure.
Smart systems are used in various applications,ranging from low-cost, high-volume automotiveapplications to high-cost, low-volume instrumentationapplications.
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Smart Systems will enable technology breakthroughs that providesolutions for health and aging, and sustainable mobility, safety &security, communication and ambient intelligence by
giving intelligent, self-controlled, and adaptable functionalities tothe userimproving products through optimization of the overall systemthat exceeds the sum of its componentsactivating the immense potential of new materials and solutions,e.g. functional materials, cognitive capabilities, microtechnologies, nano-effects, composite layers, nanosizedelementsredefining the interaction between the person and technologythrough new solutions for the human-machine interface (HMI).
Smart Systems in the varies application areas help to improve energy& resource efficiency, sustainable consumption and production
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Driver Status Monitoring Piezo Injection Valve
Smart PillSmart ImplantsImplantable glucose fuel cells
Autonomous (Bio)-RobotSwarming AgentInternet of Things
Examples
2nd generationSmart Systems
3rd generationSmart Systems
Integrated, miniaturized systems with advanced functionality.
Predictive & reactive systems matching harsh environments andequipped with advanced energy management capabilities.
Self aware, autonomous systemsinterfacing physical w/ virtual world, adaptive to environment, ubiquitously connected, with cognitive abilities
1st generationSmart Systems
Functions Complexity
The Evolution of Smart Systems
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Give a voice to the European Smart Systems Community
Promote Smart Systems R&D involving new disruptive technologies and leading to innovative marketable products
Address areas of economic and societal relevance
Provide roadmaps and Strategic Research Agendas
Contribute to competitiveness of European industry, esp. of SMEs
The EPoSS Rationale
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Next Milestones
1. Enlarging the range of action
Improve the presence and influence of EPoSS, e.g. in the European Green Cars Initiative, Factory of the Future, Future
Enlarge the range of networking within the European policy
2. Driving the new EPOSS SRA 2011
Identifying new application challenges, e.g. robotics
Defining development paths at technology and systems level
Clear demarkation towards other interest groups and ETPs and elaboration of a unique EPoSS approach
Estimation of markets and added value of Smart Systems production
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3. Setting the stage to Framework Programme 8 (b)
Content:Translating SRA priorities into policy priorities within FP8
Instruments:Defining research policy instruments according to industry requirements: Strategic industrial research
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3D Heterogeneous Integration and TSV
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Vertical stacking and connection of various materials, technologies and functional components together :
Bio, MEMs and other SensorsDigital processing (MCU, MPU)RF transceivers for data transmissionMicro-battery (i.e.Thin Film)
Other analog ICs & mixed technologies
Integrating multiple functions via 3D/ TSV
Integrated multi-functionality More interconnectionsReduced power consumptionSmaller packaging Increased yield and reliabilityReduced overall costs.
Advantages
Through Silicon Vias (TSV)
TSV example for IPADSilicon Vias microscopic detail
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CPUs
lamination
lamination
AM Optical Scanfrom back side
Flex Drivers with Touch
Smart Systems on Plastic Foils
Application fields-User interface (e.g. e-book)--Energy (eg. flexible solar cells, microbatteries)-
Remote Monitoring
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Standard Medical Equipment
ImagingPositron Emission TomographyUltrasound ScannerNuclear Magnetic Resonance
Portable Healthcare Systems
Remote Patient Monitoring
Drug Delivery Systems
Fitness Systems
PET Scanner
Flexible Eye Lens IC for Glaucoma
Insulin Nano Pump3D Ultrasound Machine
MEMS Micro Electro Mechanical SystemsWide MEMS portfolio at ST :
AccelerometersGyroscopesFunctional Sensors
Drug Delivery Systems Example with ST MEMS Microtechnologies
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MEMS-based Insulin Pump for Diabetes For subcutaneous infusion of insulin :
Accurate delivery of insulin 150nl (0,02U)Reproducibility ± 2% close to physiological insulin delivery Pressure sensor and error detection to prevent malfunctions Small-sized system for discrete wearability
A Complete system for blood analysis , insulin delivery and wireless connection
3D-4D Ultrasound Scanner for Advanced Echographs with TSV Integration
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HV Switch Transducer Array for 3D-4D Scanners
(BCD6/SOI technology)
TSV integrationAllow back vertical connection between HV transducer array and ASIC for processingIdeal for array transducer packaging
3D Integrationtransducer array
ASIC (TSV)TSV
2D 3D
3D enhancement vs. 2D scanner
Applications for Remote Patient MonitoringSmart Sensors and Smart Integration (iNemo)
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Wireless TransceiverBT, Low Power RF, ZigBee®
Data Storage
Data processing
Analog FE/BE
SensorsMEMS AccelerometersGyroscopesMagnetometersPressureTemperature
Thin Film Battery
ST iNemo Node for diagnostics
iNemo Today Discrete board - 30cm2
iNemo 2011SiP Integration - 50 mm2
Parameter Monitoringblood pressure, heart bit, temperature, fitness values
Patient Treatment (i.e. Insulin)Wireless Transmission of DataBattery operated
Portable Distributed Diagnostic Units example
Inertial Units for Fitness Monitoring Systems
iNEMO : Inertial Measurement Unit
Extended Connector for external module (i.e.Wireless
Connectivity)
Data Storage uSDEMIF06-MSD02N16
STM32F103R
MEMS 3xACCELEROMETER3xMAGNETOMETER
MODULELSM303DLH
MEMS GYROSCOPE
LY330ALH
TEMPERATURE SENSOR
STLM75DS2F
MEMS PRESSURE SENSOR
LPS001DL
MEMS GYROSCOPE
LPR430AL
POWER MANAGEMENTLD3985M18RLD3985M33R
USB CommunicationUSBUF02W6
*
**
*Only GPI/O and connector available ** Any Firmware available
The perfect integration and complementarity of STsensors is demonstrated by the (inertialmodule) system-on-board, giving you, for the firsttime, 10 degrees of freedom
10 degrees of freedom (DoF) inertialmeasurement unit opens the way to newapplications
Digital temperature sensor
6x geomagneticmodule
Pressuresensor
MEMS gyroscope
MEMS gyroscope
STM32MCU
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Contact Lens Sensor for Glaucoma Detection
The complete system include:- Contact Lens- Antenna and data-cable- Recorder- Software
Non-invasive solution for continuous monitoring of intraocular pressure.
A Beat Forward in Remote Monitoring
Care Server
User / Doctor PC
User set-top-box
BodyGateWay Mobilephone
Internet
scale
cuff
DUN profile
SPP profile
Integrated Remote Monitoring Solution for Advanced Telemedicine
Platforms
STM32
Bluetoothmodule
+1.5-3V-
Energymanager
3.3 V
2.8 V
LED
16Mbit Flash
I2C
SPI1
USART3
ADC
input output
ST Components
ECG-Impedancefront-end
Temperature I2C
PWM
3axis accel.
1Gbit Flash
µBUSMicrophoneOptical FE ADC
PWM
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Hybrid Electric TractionMotor DriversPower conversion Battery-Cell Management Fast Battery Charger
Photovoltaic Panel Converters
Smart GridSmart Energy MeteringSmart Appliance PlugPower-Line Modem
Thin-Film Flexible Batteries
UPS
SiC Power-Transistor applicationsIdeal for power conversion in high voltage, high
temperature, high frequency applications
Server & ConsumerHybrid Electric VehiclesPhotovoltaic, Wind TurbineMotor ControlUPS
Innovative Power Transistors with New Materials Enabling Smart System : Silicon Carbide
SiC propertiesExcellent switching behavior : low reverse-recovery current and charge radically decreases switching losses at higher switching frequenciesIncreased efficiency and power density in SiC Schottky diodes and soon in MOSFETs
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Electric Cars Servers
Integrating Materials and Solutions for Photovoltaic Energy
... products and solutions for power conversion in PV
Innovating to increase high-conversion efficiency ICs and compact solutions
Boost converter with Maximum Peak Power Tracker IC (MPPT) DC/DC & DC/AC converters for stand-alone and grid-connected systems
Si Quantum DotsIncreasing PV efficiency Nano StructureEfficiency: 20% (2015 )
Micro Crystal-Si Available technologyMicro Structure
Efficiency: 8.5 %
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Sensor Networks for Building Automation
Smart Meters for Grid Connection
Home Automation through Advanced Wired (200 Mbit/s) and Wireless Connectivity
Smart Modules for Robotics and Industrial Automation
Harvesting in Smart Systems An Example in Wireless Sensor Nodes for Automation
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Autonomous Wireless Sensor Node
Harvesting Device (PV, Piezo, etc) Low Power
RF Transceiver
Sensors
Ultra Low Power
Microcontroller
Energy Conversion
Battery Storage
Integrating Harvesting in Smart Systems
Courtesy EnOcean Alliance
Solar
Thermal
Wind
RF
Kinetic
Electro-chemical
Energy
Enabling wireless sensors for energy autonomy
Innovation in Power Technologies
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Advanced Packaging & System-in-Package
3D Heterogeneous Integration/ TSV
Advanced BCD, BCD-SOI
Si Power Transistors & Compound: SiC & GaN
Ultra Low Power Technologies
Harvesting and Thin-Film Batteries
Innovative Wire Bonding
Cutting Power losses throughPower Discrete Technologies
Higher Efficiency through Smart Power ICs
Improved Power Efficiency Through Better Technologies
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1995
PowerMESH SuperMESH
-20%today
-82% -90%2000 2005
1995 today Coming Soon
PlatinumImplantation
ElectronIrradiation
Trench /FieldStopEmitter Implant
-50%-30%
STripFET STripFET IIISTripFET VIDeepGATE
1995 today2006-30% -80%
The Current Challenge: the Use of Compound Semiconductors (SiC and GaN) in Power Electronic
Much better performances expected (and already demonstrated) based on their electrical properties:
Breakthroughs in SiC crystal growth and GaN epitaxy on Si have been achieved recently
SiC and GaN are the next technology node for power conversion
ST is working on them at R&D level since many year and is already producing SiCSchottly diode
0.1
1
10
100
1000
100 1000 10000
Ron
Area
(mO
hm*c
m2 )
Breakdown Voltage (v)
MD5Si IGBT
Si SJ
SiC MOSFET
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Power devices in new materials (SiC, GaN)
SiC Power Schottky (in production)SiC Power MOSFET (product prototype)
GaN on Si HEMTs (product Prototype)
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Smart Systems Have a Bright Future
efficiency
Growing ULP demand in:Portable electronicsHealthcare Portable MonitoringMedical Disposable DevicesPersonal Fitness, Sport and WellnessWireless Sensors Networks (WSN)i.e. in Building and Factory Automation, LogisticEnergy Harvested Systems (EHS)