Sil - Pad Design Guide - Farnell · PDF fileChoosing the right Sil-Pad Starts with the...

Sil-Pad® Design Guide

2000-2001 Rev. 060100 © Copyright The Bergquist Company

All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING ISMADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITYAND FITNESS FOR PURPOSE. Sellers' and manufacturers' only obligation shall be to replace such quantity of the product proved to bedefective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liabilitywhatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OF INCONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS ORREVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendationsby seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller andmanufacturer.

Registered FirmISO 9001:1994

Certificate QSR-219QS-9000 Third Edition

Certificate Number,QSR-QS-017

The Bergquist Company established the standard for elastomeric thermally conductive insulation material with thedevelopment of Sil-Pads® over 20 years ago. Sil-Pads were developed as a clean, grease-free alternative to mica and grease.Now, a complete family of materials is available to meet thediverse and changing requirements of today’s design engineer.

MICA AND GREASEMica insulators have been in use for over 30 years and are still

commonly used as an insulator. Mica is inexpensive and hasexcellent dielectric strength, but it is brittle and is easily cracked orbroken. Because mica used by itself has high thermal impedance,thermal grease is commonly applied to it. The grease flows easilyand excludes air from the interface to reduce the interfacialthermal resistance. If the mica is also thin (2-3 mils), (50-80 µm),a low thermal impedance can be achieved.

However, thermal grease introduces a number of problems tothe assembly process. It is time-consuming to apply, messy, anddifficult to clean. Once thermal grease has been applied to an electronic assembly, solder processes must be avoided to prevent

contamination ofthe solder.Cleaning bathsmust also beavoided to preventwash-out of theinterface grease,causing a dry jointand contaminationof the bath.Assembly, solderingand cleaningprocesses must be performed in one process while the greasedinsulators are installed off-line in a secondary process. If the greaseis silicone based, migration of silicone molecules occurs over time,drying out the grease and contaminating the assembly. Siliconemigration onto electrical contacts can result in pitting of thecontacts and loss of electrical conductance. For this reason, siliconebased, thermal grease has not been used in telecommunicationssystems.

POLYIMIDE FILMSPolyimide films can also be used as insulators

and are often combined with wax or grease to achievea low thermal impedance. These polyimide films areespecially tough and have high dielectric strength. Sil-Pad K-4

®, K-6

®and K-10® incorporate polyimide

film as the carrier material.

CERAMIC INSULATORSOther insulation materials include ceramic

wafer insulators which have higher thermalconductivity than mica. They are often used thicker(20-60 mils), (.5 to 1.5 mm) to reduce capacitivecoupling while maintaining a low thermal impedance.

Drawbacks to ceramic insulators are high costand they are rigid like mica and crack easily. Also,ceramic beryllia use requires careful handling sinceinhalation of beryllia dust can cause lung inflammation(berylliosis).At Bergquist's Cannon Falls, MN manufacturing facility, a Sil-Pad material runs through

a 3-story coating press.

Why Choose Sil-Pad Thermally Conductive

1

SIL-PAD® MATERIALSSil-Pad Thermally Conductive Insulators are designed to be

clean, grease-free and flexible. The combination of a tough carriermaterial such as fiberglass and silicone rubber which is conformable,provides the engineer with a more versatile material than mica orceramics and grease. Sil-Pads minimize the thermal resistance fromthe case of a power semiconductor to the heat sink. Sil-Padselectrically isolate the semiconductor from the heat sink and havesufficient dielectric strength to withstand high voltage. They arealso tough enough to resist puncture by the facing metal surface.With more than 30 different Sil-Pad materials available there is aSil-Pad matched to almost any application.

BINDERSMost Sil-Pad products use silicone rubber as the binder. Silicone

rubber has a low dielectric constant, high dielectric strength, goodchemical resistance and high thermal stability.

Silicone rubber also exhibits cold flow, which excludes air from theinterface as it conforms to the mating surfaces. This flow eliminates theneed for thermal grease. A rough surface textured insulator needs toflow more to exclude air than a smooth one. The smoother padsalso need less pressure to wet out the surfaces and obtain optimumthermal contact.

THE CARRIERThe carrier provides physical reinforcement and contributes to

dielectric strength. High dielectric and physical strength isobtained by using a heavy, tight mesh, but thermal resistance willsuffer. A light, open mesh reduces thermal resistance, dielectricstrength and cut-through resistance. The carrier materials used inSil-Pad materials include fiberglass, dielectric film and polyesterfilm which is used in Poly-Pad® materials.

SIL-PAD® CONSTRUCTIONSil-Pads are constructed with a variety of different materials

including fiberglass, silicone rubber, polyimide film, polyester filmand fillers used to enhance performance. Sil-Pads are typically constructed with an elastomeric binder compounded with a thermally conductive filler coated on a carrier.

The characteristics of your application often determine which Sil-Pad construction will produce the best performance. Sil-Padsare typically constructed with an elastomeric binder compoundedwith a thermally conductive filler coated on a carrier.

FILLERSThe thermal conductivity of Sil-Pad products is improved by

filling them with ingredients of high thermal conductivity. Thefillers change the characteristics of the silicone rubber to enhancethermal and/or physical characteristics.

For instance, some fillers make the silicone rubber hard andtough while still retaining the ability to flow under pressure. Aharder silicone helps the material resist cut-through. In otherapplications a filler is used to make the silicone rubber softer andmore conformable to rough surfaces. While the range in thermalresistance of greased mica is quite large, the average is comparableto elastomeric insulators filled with a blend of the appropriateingredients.

• Fiberglass based insulators (Sil-Pad 400®, Sil-Pad 1000® and Sil-Pad 1500®) have a rough surface texture and will show a 15-20%decrease in thermal resistance over a 24 hour period. Film based Sil-Pads (Sil-Pad K-4®, Sil-Pad K-6® and Sil-Pad K-10®) are smootherinitially and show a 5% decrease over the same period of time.

Insulators?

Choosing the right Sil-Pad Starts with the

MECHANICAL PROPERTIES

Woven fiberglass and films are used in Sil-Pads to providemechanical reinforcement. The most important mechanical propertyin Sil-Pad applications is resistance to cut-through to avoid electricalshorting from the device to the heat sink.

• SPK4®, SPK6® and SPK10® are very good at resisting cut-through from sharp burrs left on heat sinks after machining operations such as drilling and tapping

• Fiberglass is good at resisting the type of cut-through encountered when device mounting flanges are pulled into oversized mounting holes. This occurs when fastenersare torqued. (SP400®, SP1000®, SP2000®)

Cut-through resistance is very dependent on the application anddepends on several factors:

• A very sharp burr may cause cut-through with less than 100 pounds while a blunt burr may require several hundred pounds to cause cut-through

• When two flat parallel surfaces are brought together on a Sil-Pad, over 1000 pounds of force can be applied without damaging the insulator

• The Poly-Pad insulators are the most mechanically durable Sil-Pads overall. The polyester resin used has a higher modulus than silicone rubber. (Poly-Pad 400®, Poly-Pad 1000®, Poly-Pad K4® and Poly-Pad K10®)

MOUNTING TECHNIQUES ANDMOUNTING PRESSURE

Typical mounting techniques include:

• A Spring clip, which exerts a centralized clamping force on the body of the transistor. The greater the mounting force of the spring, the lower the thermal resistance of the insulator

• A screw in the mounting tab. With a screw mounted TO-220, the force on the transistor is determined by the torque applied to the fastener

In extremely low pressure applications, an insulator withpressure sensitive adhesive on each side may give the lowestthermal resistance since the adhesive wets out the interfaceeasier than the dry rubber. This decreases the interfacial thermal resistance.

Devices with larger surface areas need more pressure toget the insulator to conform to the interface than smallerdevices. In most screw mount applications, the torquerequired to tighten the fastener is sufficient to generate thepressure needed for optimum thermal resistance. There areexceptions where the specified torque on the fastener doesnot yield the optimum thermal resistance for the insulatorbeing used and either a different insulator or a differentmounting scheme should be used.

Interfacial thermal resistance decreases as time under pressure increases. In applications where high clamping forcescannot be used, time can be substituted for pressure toachieve lower thermal resistance. The only way to know precisely what the thermal resistance of an insulator will be in anapplication is to measure it in that application.

2

ELECTRICAL PROPERTIES

If your application does not require electrical insulation Q-Pad II® or Q-Pad 3® are ideal grease replacement materials.These materials do not isolate but have excellent thermalproperties.

The most important electrical property in a typical assemblywhere a Sil-Pad insulator is used is dielectric strength. In manycases the dielectric strength of a Sil-Pad will be the determiningfactor in the design of the apparatus in which it is to be used.

Here are some general guidelines regarding electricalproperties to consider when selecting a Sil-Pad material;

• Q-Pad II and Q-Pad 3 are used when electrical isolation is not required

• Dielectric breakdown voltage is the total voltage that a dielectric material can withstand. When insulating electrical components from each other and ground, it is desirable to use an insulator with a high breakdown voltage

• Breakdown voltage decreases as the area of the electrodes increases. This area effect is more pronounced as the thickness of the insulator decreases

• Breakdown voltage decreases as temperature increases

• Breakdown voltage decreases as humidity increases(SP1750® and SP1950® are less sensitive to moisture)

• Breakdown voltage decreases in the presence of partial discharge

• Breakdown voltage decreases as the size of the voltage source (kVA rating) increases

• Breakdown voltage can be decreased by excessive mechanical stress on the insulator

Dielectric strength, dielectric constant and volume resistivityshould all be taken into consideration when selecting a Sil-Pad material. If your application requires special electricalperformance please contact the factory for more detailed testing information.

Mechanical and Electrical Properties

Breakdown Dielectric Dielectric VolumeVoltage Strength Constant Resistivity

Material (kV) (Volts/mil) ( kV/mm) (Ohm-Metre)

SP400®-.007 5 700 18 5.5 1011

SP400®-.009 7 800 20 5.5 1011

SP1000® 7 700 18 4.5 1011

SP2000® 12 800 20 4.0 1011

SPK-4® 7 1200 30 5.0 1012

SPK-6® 7 1200 30 4.0 1012

SPK-10® 7 1200 30 3.7 1012

Test Method ASTM D 149* ASTM D 149* ASTM D 150 ASTM D 257*Method A, Type 3 Electrodes

TYPICAL ELECTRICAL PROPERTIES OF SIL-PADS®

3

HOW THERMAL PROPERTIESAFFECT YOUR SELECTION

The thermal properties of a Sil-Pad material and yourrequirements for thermal performance probably have more to dowith your selection of a Sil-Pad than any other factor. Discrete Semiconductors, under normal operating conditions,dissipate waste power which raises the junction temperature ofthe device. Unless sufficient heat is conducted out of the device,its electrical performance and parameters are changed. A 10° Crise in junction temperature can reduce the mean-time-to-failure of adevice by a factor of two. Also, above 25°C, the semiconductor'stotal power handling capability will be reduced by a derating factorinherent to the device.

The thermal properties of Sil-Pad products are thermalimpedance, thermal conductivity and thermal resistance. Thethermal resistance and conductivity of Sil-Pad products areinherent to the material and do not change. Thermal resistanceand thermal conductivity are measured per ASTM D5470 anddo not include the interfacial thermal resistance effects.Thermal impedance applies to the thermal transfer in anapplication and includes the effects of interfacial thermalresistance. As the material is applied in different ways the thermalimpedance values will vary from application to application.

• The original Sil-Pad material, Sil-Pad 400® continues to be Bergquist's most popular material for many applications.

• Sil-Pad 1000® is chosen when more thermal performance is required. Sil-Pad 2000® is ideal for high performance, high reliability applications.

Beyond these two standard materials many things cancontribute to the selection of the correct material for a particularapplication. Questions regarding the amount of torque andclamping pressure are often asked when selecting a Sil-Padmaterial. Here are some guidelines:

• Interfacial thermal resistance decreases as clamping pressure increases.

• The clamping pressure required to minimize interfacial thermal resistance can vary with each type of insulator.

• Sil-Pads with smooth surface finishes (Sil-Pad 600®, Sil-Pad 1500®, Sil-Pad 2000®, Sil-Pad K-4®, Sil-Pad K-6®

and Sil-Pad K-10®) are less sensitive to clamping pressure than Sil-Pads with rough surface finishes (Sil-Pad 400® and Sil-Pad 1000®).

Sil-Pad 400

(.009)

Sil-Pad 400

(.007)

Sil-Pad 600

(.009)

Sil-Pad 1000

Sil-Pad 1500

Sil-Pad 2000

Sil-Pad K-4

Sil-Pad K-6

Sil-Pad K-10

Q-Pad Poly-Pad 400

Poly-Pad 1000

Poly-Pad K-4

Poly-Pad K-10

0

0.1

0.2

0.3

0.4

0.5

0.6

OC

/Wat

t

0.5

0.45

0.35 0.35

0.230.2

0.4

0.3

0.2

0.1

0.4

0.3 0.3

0.2

Thermal Resistance of Sil-Pad Materials

Thermal Properties°C

/Wat

t

4

Based on test area of one square inch

Sil-Pad® Applications

A common Sil-Pad application includes TO-220 transistors mounted in a row on a heat rail.

Two different Sil-Pad applications show clip mounting of transistors on the left and screwmounting of transistors to an aluminum bracket on the right.

Gap Pad is applied to the top surface of heat generating components in this assembly. A heatsinkmounted over the board dissipates heat.

The application above uses punches parts to insulate thetransistors from the mounting bracket and a sheet of Sil-Pad to isolate the mounting brackets from the frame ofthe assembly.

The circuit board below shows punched parts interfacing screw-mounted transistors to a finned heatsink.

5

Sil-Pad® Thermally Conduct

SIL-PAD 400®

• The original Sil-Pad material

• Durable silicone rubber and fiberglass construction for excellent mechanical /physical characteristics

• Fiberglass provides excellent cut-through resistance

• Thermal performance improves with age

• Non-toxic and resists damage from cleaning agents

• Contact the factory for special thicknesses of Sil-Pad 400

SIL-PAD 1000®

• Specially filled silicone rubber and fiberglass for cut-through resistance

• Low thermal resistance, 33% reduction compared to Sil-Pad 400 material

SIL-PAD 1500®

• Sil-Pad 1500 is a fiberglass reinforced material with enhanced thermal properties

• Designed for high performance thermal applications while meeting specific cost considerations

SIL-PAD 2000®

• For high performance, high reliability military / aerospace and commercial applications

• Sil-Pad 2000 complies with military standards

• Special ingredients maximize thermal and dielectric performance

SIL-PAD K-4®

• Sil-Pad K-4 uses a physicallytough, thermally conductive,dielectric film and well-knownSil-Pad rubber.

SIL-PAD K-6®

• Sil-Pad K-6 is a medium performance film based material

• Filled with special ingredients to improve thermalperformance

• The film provides a continuous, physically tough dielectric barrier against “cut-through”

SIL-PAD K-10®

• Highest thermal performance of the film based insulators. Minimum thickness helps lower thermal resistance

• Designed to replace brittle, ceramic insulators: Beryllium Oxide, Boron Nitride and Alumina

Q-PAD II®

• Grease replacement material used where electrical insulation is not required

• Q-Pad II is a composite of .0015 in., aluminum foil coated on both sides with a .00225 in., thermally conductive coating

• Q-Pad II eliminates problems associated with grease such as contamination of reflow solder or cleaning operations

• Q-Pad II can be installed prior to these operations. Q-Pad II also eliminates dust collection which can result in surface shorting or heat build-up

Sil-Pad 400.007 in

Gray

.007 ± .001

(.18 ± .025)

.45

0.9

3500

-60 to 180

Silicone/Fiberglass

Sil-Pad 400.009 in

Gray

.009 ± .001

(.23 ± .025)

.50

0.9

4500

-60 to 180

Silicone/Fiberglass

Sil-Pad600

Green

.009 ± .001

(.23 ± .025)

0.35

1.0

4500

-60 to 180

Silicone/Fiberglass

Sil-Pad 1000

Pink

.009 ± .001

(.23 ± .025)

0.35

1.2

4500

-60 to 180

Silicone/Fiberglass

Sil-Pad1500

Green

.010 ± .001

(.25 ± .025)

0.23

2.0

4000

-60 to 180

Silicone/Fiberglass

Sil-Pad2000

White

.015 ± .001

(.38 ± .025)

0.2

3.5

4000

-60 to 200

Silicone/Fiberglass

Sil-Pad K-4

Gray

.006± .001

(.15 ± .025)

.40

0.9

6000

-60 to 180

Silicone/Film

Color

Thickness Inches(mm)

Thermal Resistance, C-in2/W

Thermal ConductivityW/m-K nominal

Voltage Breakdown

Continuous Use Temperature °C

Construction

6

tive Insulator Selection Guide

Q-PAD 3®

• Grease replacement material where electrical insulation is not required

• Q-Pad 3 consists of graphite imbedded in a polymer matrix

• When exposed to modest heat and pressure, the elastomer conforms to surface textures thereby creating an air free interface between surfaces

• Q-Pad 3 is fiberglass reinforced and withstands processing stresses without losing physical integrity

CPU-PAD®

• Bergquist CPU Pad is a thermally conductive, polymer based bonding material used to permanentlymount a heatsink on top of a central processing unit

•The material will adhere to the heatsink or integrated circuit with moderate heat and pressure, forming a bond between components

POLY-PADMATERIALS

• Polyester based Poly-Pad 400®, Poly-Pad 1000®, Poly-Pad K-4®

and Poly-Pad K-10®

• Designed for silicone sensitive applications

• Ideally suited for applications requiring conformal coatings or applications where silicone contamination is a concern (telecommunications and aerospace applications)

SIL-PAD 800-S®

SIL-PAD 900-S®

• Designed for low cost applications requiring high thermal performance

• These applications also typically have low mounting pressures for component clamping

• Sil-Pad 800-S material combines a smooth surface design with high thermal conductivity and electrical insulation

• Applications include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips

SIL-PAD SHIELD®

• Bergquist Sil-Pad Shield is a bonded laminate of thermally conductive, electrically isolating Sil-Pad 400 or Sil-Pad 1000 pads with a copper shield between the layers. It is supplied with a pretinned solder point for easy grounding

Sil-Pad K-6

Bluegreen

.006 ± .001

(.15 ± .025)

.30

1.1

6000

-60 to 180

Silicone/Film

Sil-Pad K-10

Beige

.006 ± .001

(.15 ± .025)

0.2

1.3

6000

-60 to 180

Silicone/Film

Q-Pad II

Black

.006 ± .001

(.15 ± .025)

0.1

2.5

N/A

-60 to 180

Silicone/Alum Foil

Q-Pad 3

Black

.005 (.15 mm)

.0055 w/ac

N/A

-60 to 180

Silicone/Fiberglass

Poly-Pad400

Mauve

.009 ± .001

(.23 ± .025)

0.4

0.9

4500

-20 to 150

Polyester/Fiberglass

Poly-Pad1000

Yellow

.009 ± .001

(.23 ± .025)

0.3

01.2

2500

-20 to 150

Polyester/Fiberglass

Poly-PadK-4

Mauve

.006 ± .001

(.15 ± .025)

0.4

0.9

6000

-20 to 150

Polyester/Film

Poly-PadK-10

Yellow

.006 ± .001

(.15 ± .025)

0.2

1.3

6000

-20 to 150

Polyester/Film

CPU Pad

Tan

.005 ± .001

0.3

0.6

N/A

FilledPolymer

TestMethod

Visual

ASTM D 374

ASTM D5470

ASTM D 5470

ASTM D 149

-

-

0.1

2.0

7

HI-FLOW™ 105

HI-FLOW™ 105 is the new “phase change” materialdesigned specifically to replace grease as a thermal interface.Bergquist Hi-Flow 105 is a filled polymer which is nowavailable in a pad form for easier handling and installation.At 65C Hi-Flow 105 changes from a solid and flows (PhaseChange Temperature) thereby assuring total wet-out of theinterface. The thixotropic characteristics of the materialkeep Hi-Flow 105 from flowing out of the interface. Theresult is a thermal interface comparable to grease, withoutthe mess, contamination and difficult handling associatedwith grease.

HI-FLOW™ 105 has thermal performance equal to greasewith .05°C-in2/W contact thermal resistance.

HI-FLOW™ 105 is used in applications where electricalisolation is not required.

Typical applications for Hi-Flow 105 include CPUsmounted on a heat sink, power conversion modules or anyother spring or clip mount application where grease is used.

HI-FLOW™ 105 is coated on both sides of the aluminumsubstrate. The product is available as a dry material or withthermal acrylic adhesive on one side to aid in positioning.

HI-FLOW™ 105 features include:

• Available in pad form as punched parts, sheets or rolls

• Low volatility - less than 1%

• Easy to handle in the manufacturing environment

• Flows but doesn't run like grease or wax under continuous heat or in vertical applications

• Low contact thermal resistance of 0.05 C-in2/W.

• Tack free at room temperature. Does not attract contaminants

• Scratch resistant at room temperature. Does not require protectiveliner in shipment when attached to heat sink.

Bergquist Hi-Flow ™ 105

Physical Properties Typical Value Test Method

Color Dark Gray Visual

Substrate Aluminum

Thickness of Substrate 0.0015 in. ASTM D3740.04 mm

Thickness of Thermal Acrylic Adhesive 0.0005" (one side) ASTM D3740.0127 mm

Thickness of Material 0.0055" ± .001" ASTM D3740.14 mm

Specific Gravity of Coating 1.8 ASTM D792

Phase Change Temperature (°C) 65

Continuous Use Temperature (°C) -30 to +130

Thermal / Electrical Properties Typical Value Test Method

Thermal Resistance (°C-in2-W-1) <0.05 w/o AC ASTM D5470* (C-mm2/watt) <.32 w/o AC

Thermal Resistance (°C-in2-W-1) 0.05 w/AC(C-mm2/watt) 0.32 w/AC

Thermal Conductivity of Coating w-m/K 0.9 ASTM D5470*

Dielectric Constant of Coating (100 Hz) 3.2 ASTM D150

* Modified ASTM D5470 test method used. Sample run at 70°C

The Grease Replacement Material with Thermal Resistance Equal to Grease

8

Bergquist Hi-Flow 625 is a film reinforced phase changematerial. The product consists of a thermally conductive65°C phase change compound coated on an electricallyinsulating film. Hi-Flow 625 is designed to be used as athermal interface material between electronic power devicesthat require electrical isolation and a heat sink. The filmreinforcement makes Hi-Flow 625 easy to handle, and the65°C phase change temperature of the coating materialeliminates shipping and handling problems. Hi-Flow 625has a continuous use temperature of 150°C.

HI-FLOW™ 625 is coated on both sides of the Bergquistproprietary film substrate.

HI-FLOW™ 625 is used in applications where electricalinsulation is required.

HI-FLOW™ 625 handles like a Sil-Pad® at roomtemperature, and flows like high quality grease at elevatedtemperature.

HI-FLOW™ 625 is Tack Free at production temperatures.

HI-FLOW™ 625 is Scratch Resistant at productiontemperature and does not require a protective liner in mostshipping situations.

HI-FLOW™ 625 has the thermal performance of 2-3 milmica and grease assemblies.

HI-FLOW™ 625 is available in punch parts, sheets orrolls, with or without pressure sensitive adhesive.

Bergquist Hi-Flow ™ 625

Physical Properties Typical Value (mm) Test Method

Color Green Visual

Thickness of Substrate 0.005 in. (0.13) ASTM D 374Tensile Strength 30 Kpsi (210 Mpa) ASTM D 882AElongation 60% ASTM D 882A

Phase Change Temperature 65°C DSC

Continuous Use Temperature 150°C

Thermal

Thermal Cond. of Coating 0.8 W/m-K ASTM D5470

Thermal Cond. of Composite 0.4 W/m-K ASTM D54701

Thermal Resistance (°C-in2-W-1)0.25 C-in2/W (1.6 C-cm2/W)ASTM D5470

Electrical

Breakdown Voltage 4000 Volt ASTM D149

Dielectric Constant, 100HZ 3.5 ASTM D150

Volume Resistivity >1010 ohm-m ASTM D257

Adhesive

Peel Strength 70 g/in (28 g/cm) ASTM D1876

Release Peel 25 g/in (10 g/cm) ASTM D1876

1. Sample run at 70°C.

9

HI-FLOW™ 625

Electrically Insulating, Thermally Conductive Phase Change Material

HI-FLOW™ 115-ACPhase Change Thermal Interface Material for Computer Processors

10

Bergquist Hi-Flow 115 AC is a thermally conductivefiber reinforced phase change material. The product consistsof a thermally conductive 65˚C phase change compoundcoated on a fiberglass web, and an adhesive coating one sidefor attachment to cold heat sink. Hi-Flow 115 is designed asa thermal interface material between a computer processorand a heat sink. The pressure sensitive adhesive makes itsimple to apply in high volume to heat sinks and the 65˚Cphase change temperature eliminates shipping and handlingproblems.

HI-FLOW™ 115 AC can be applied directly to a COLDheat sink. No need to preheat the heat sink to apply the Hi-Flow 115 AC.

HI-FLOW™ 115 AC requires no protective liner forshipping or handling. The HF 115 coating is tough at roomtemperature, and it can withstand the handling andshipping process without protection.

HI-FLOW™ 115 AC handles like a Sil-Pad® at roomtemperature and flows like high quality grease at elevatedtemperature.

HI-FLOW™ 115 AC thermal resistance of 0.18˚C in 2/watt at 50 psi.

HI-FLOW™ 115 AC is available without adhesive forslightly better thermal performance. The thermal resistanceis 0.15˚C in 2/watt at 50 psi.

Bergquist Hi-Flow ™ 115-AC


Color Gray Visual

Tensil Strength 900 psi (6.3 MPa) ASTM D882AElongation, 45˚ 40% (40%) ASTM D882AThickness .0055” .15mm ASTM D374

Phase Change Temperature 65°C DSC

Continuous Use Temperature 150°C

Thermal

Thermal Conductivity 0.8 W/m-K ASTM D5470Thermal Resistance1 0.18 °C-in2/W ASTM D5470

Electrical

Breakdown Voltage2 300 Volt ASTM D149

Dielectric Constant, 100HZ 3.5 ASTM D150

Volume Resistivity >1010 ohm-m ASTM D257

Adhesive

Peel Strength 70 g/in ASTM D1876

Release Peel 25 g/in ASTM D1876

1. Sample run at 70°C. 2. Not recommended as an insulator.

Heat Sink

Hi-Flow 115-AC

MicroProcessor

No Preheat of Heat Sink Required

The new Bergquist Softface eliminates problems associatedwith thermal grease such as contamination of electronicassemblies and reflow solder baths. Softface may be installedprior to soldering and cleaning, without worry.

Softface is supplied on a polyester film. The material istransferred to a heat sink or device using commercial hot-stamping equipment.

With Softface applied to a component or other surface youhave a built-in thermal interface. Rapid assembly of thematerial eliminates labor and Softface has the same thermalresistance as grease.

Softface can be supplied already applied to a heat sink orother surface in the assembly. The heat sink or other part canbe sent to the factory and Softface will be applied by Bergquistbefore shipping to the customer for pre-production quantities.

If rework is required, the heat sink or component can beremoved and then reused without replacing Softface.

Rolls and SheetsSoftface material is available in roll form only. Hot-stamp

equipment will accommodate many different roll sizes. Formore information on hot-stamping equipment and techniquesplease contact the factory.

TYPICAL PROPERTIES OF SOFTFACE™

SOFTFACE™

Automated, Greaseless Thermal Interface

Supplier Insulating Non-Insulating Measurement

Property Value Value MethodThickness, inches .005 & .008 .003 / .005 & .008 ASTM D374

Color White Black Visual

Thermal Conductivity, W/m-K 3.5 3.5 ASTM D5470

Thermal Resistance, C-in2/W .06/.09 .06/.09 ASTM D5470

Volume Resistivity, Ohm-Cm 1010 ASTM D257101 ASTM D4496

Dielectric Constant, @ 1 KHz 4 Non-Insulating ASTM D150

Dielectric Strength, V/mil 500 NA ASTM D149

Manufacturing Requirements

Storage Life, @ 25°C 1 year (min) 1 year (min) --

Cleanability Water and/or Isopropyl Water and/or IsopropylAlcohol (IPA) Alcohol (IPA) --

11

Gap Pad V0 is a thermally conductivematerial that acts as a thermal interfacebetween a heat sink and an electronicdevice. The conformable nature of GapPad V0 allows the pad to fill in air gapsbetween PC boards and heat sinks or ametal chassis.

Gap Pad V0 is a highly conformable,low modulus polymer on a fiberglass carrier.The material is available in thicknessesfrom .020” to .160” with a liner applied tothe pink side of the material. The range inthicknesses and the materials flexibilityallow Gap Pad V0 to be used in a variety ofapplications where surface textures vary andthe space between surfaces is uneven. Thematerial is available in die-cut parts andwith or without adhesive.

Applications

• Areas where heat needs to be transferredto the frame or other type of heat spreader

• Between a CPU and a heat spreader

• Between a semiconductor and heat sink

• Replacement for messy grease

U.L. File Number E59150

Die-Cut parts, and SheetsGap Pad is available in die-cut parts and

sheets. Standard sheet size is 8" x 16". GapPad is not available in rolls.

MODULUS * The modulus of Gap Pad is shown as being rate dependent because Gap Pad isviscoelastic. At high rates of compression Gap Pad is elastic and at low rates it is viscous. Elastic strain isinstantaneous, independent of time. The total deformation occurs at the instant the stress is applied andis completely recovered when the stress is released. Viscous strain is time dependent. The deformationis not instantaneous but occurs over time and is not completely recovered after the stress is removed. Asan example, if the low modulus Gap Pad rubber is molded into a ball and dropped on the floor it willbounce. However, if a load is placed on the ball for a long period of time it will flatten out to a certainextent and will not recover completely to it's original shape after the load has been removed.

THERMAL RESISTANCE ** With Gap Pad, the thermal resistance is dependent on the gapbetween the device and the heatsink. The engineer can minimize the thermal resistance bydesigning the gap as small as possible. A Gap Pad thickness is then chosen to be just thick enoughto fill the largest gaps while minimizing the deflection needed in the smallest gaps to decrease thestress exerted on the devices. If the size of the gaps are known, the thermal resistance across eachgap is determined from the table of thermal resistance vs. thickness.

GAP PAD VO™

Conformable, Thermally Conductive Material for Filling Air Gaps

Property Value Value Test MethodMechanical Properties

Thickness inches .020” to .160” ASTM D374Color Yellow/Pink VisualSpecific Gravity 1.6 ASTM D792Heat Capacity J/g-K 1 ASTM C351Continuous Use -60 to +200CHardness, entire composite vs. Thickness (in) (Type 00) ASTM D2240

0.020 800.040 650.060 650.080 550.100 500.125 450.160 40

Young's Modulus (psi) Rate Modulus ASTM D575vs. Rate of Strain 0.01 200(inches/minute)* 0.1 300Area = 0.5 in2 1.0 400Low Modulus Portion Only 10.0 800

Stress vs. strain and resultant deflection in mils for each Gap Pad V0 thickness. Example: Rate = 1 in/min. Modulus = stress/strain = 400 psi, Area = 0.5 in2, Low Modulus Portion Only;

Stress Strain 20 mil 40 mil 60 mil 80 mil 100 mil 125 mil 160 mil4 psi 1% 0.15 0.35 0.55 0.71 0.91 1.16 1.51 ASTM D5758 psi 2% 0.30 0.70 1.10 1.42 1.82 2.32 3.0220 psi 5% 0.75 1.75 2.75 3.55 4.55 5.80 7.5540 psi 10% 1.50 3.50 5.50 7.10 9.10 11.6 15.180 psi 20% 3.00 7.00 11.0 14.2 18.2 23.2 30.2200 psi 50% 7.50 17.5 27.5 35.5 45.5 58.0 75.5

Electrical Properties

Dielectric Constant 5.5 ASTM D150Dielectric Breakdown Voltage kV-AC >6 ASTM D149Volume Resistivity, Ohm-meters 1011 ASTM D257

Thermal Properties

Thermal Conductivity @ 10 psi, W/m-K 0.8 ASTM D5470

Thermal Resistance** vs. Thickness (in.) (C-in2/W)Entire composite 0.020 1.0 ASTM D5470

0.040 2.00.060 3.00.080 4.00.100 5.00.125 6.20.160 8.0

12

Gap Pad VO Soft is recommended for low stress applications.These include applications where the material is used as aninterface and one side is in contact with a leaded device.

Gap Pad VO Soft is a thermally conductive material that actsas a thermal interface between a heat sink and an electronicdevice. The conformable nature of Gap Pad VO Soft allows thepad to fill in air gaps between PC boards and heat sinks or ametal chassis.

Gap pad VO Soft is a highly conformable, low modulussilicone polymer filled with alumina on a fiberglass carrier. Thematerial is available in thicknesses from 0.020" to 0.160" with aliner applied to the light pink side of the material. The range inthicknesses and the materials flexibility allow Gap Pad VO Softto be used in a variety of applications where surface texture varyand the space between surfaces is uneven. The material isavailable in die-cut parts and sheets. Standard sheet size is 8" X 16", with or without adhesive.

To calculate the approximate amount of deflection for aspecific material thickness, at a given pressure, refer to the graphbelow. Multiply the thickness of the material by the percentageat the given pressure.*

GAP PAD VO SOFT™


Property Value Test MethodMechanical Properties

Thickness inches .020” to .160” ASTM D374Color Mauve/Pink VisualSpecific Gravity 1.6 ASTM D792Heat Capacity J/g-K 1.0 ASTM C351Continuous Use Temp. -60˚C to +200˚CHardness vs. Thickness (in) (Type 00) ASTM D2240(Shore Type OO) 0.020” 65

to to0.160” 25

Young's Modulus* (psi) Rate Modulus ASTM D5750.01 40

Electrical Properties

Dielectric Breakdown Voltage >6 kV ASTM D149Dielectric Constant 5.5 ASTM D150Volume Resistivity 10”Ohm-meter ASTM D257

Thermal Properties

Thermal Conductivity @ 10 psi 0.8 W/m-K ASTM D5470

Flame RatingFilm #: E59150 94V-O U.L.

MODULUS * The modulus of Gap Pad VO is rate dependent due to itsviscoelastic properties. At high rates of compression Gap Pad is elastic andat low rates it is viscous. The elastic strain (deflection) is not timedependent. A completely elastic material, when compressed will recover100% to its original shape when the force is released. Viscous strain,however, is time dependent. Deformation is not instantaneous but occursover time and is not completely recovered after the stress is removed. As anexample; if Gap Pad is molded into a ball and dropped, it will bounce, andrebound close to 100%. However, if a load is placed on the ball for a longperiod of time it will flatten out a degree and will not recover completely toit’s original shape when the load is removed. For more information on GapPad modulus refer to Bergquist Application Note #116.

*Graphs and data generated from Young’s Modulus, calculated using 0.01

inch/min. step rate of strain with a sample size of 0.79 inch2.

13

Pressure vs. Percent Deflection VO Soft

Percent Deflection (%)

Pre

ssur

e (p

si)

20181614121086420

0 5 10 15 20 25 30 35 40 45 50

Thickness vs. Thermal Resistance VO Soft

Thermal Resistance (deg C° sq in/W)

Thic

knes

s (m

ils)

1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0

160

140

120

100

80

60

40

20

Applications• Between chassis wall and other surface• CDROM Cooling• Area where heat needs to be transferred to a frame,

chassis, or other type of heat spreader.• Between CPU and Heat Spreader• Between a semiconductor and heat sink

The resultant thickness of the Gap Pad will determine thethermal resistance. Subtracting the initial gap pad thickness bythe deflection value, obtained above, will give the resultantthickness. Refer to the graph below to obtain the thermalresistance of the material.

GAP PADVO ULTRA SOFT™


14

Gap Pad VO Ultra Soft is a cost-effective material,recommended for extremely low stress applications that require athermally conductive interface material. The highly conformablenature of the material allows the pad to fill in air voids and air gapsbetween PC boards and heat sinks or metal chassis with steps, roughsurfaces, and high stack up tolerances. The viscoelastic nature ofthe material also gives excellent low stress vibration dampening andshock absorbing characteristics.

GP Ultra Soft is an electrically isolating material, which allowsits use in applications requiring isolation between heat sinks andhigh voltage, bare leaded devices.

GP Ultra Soft is a filled thermally conductive polymer suppliedon a rubber coated fiberglass carrier allowing for easy materialhandling and enhanced puncture, shear, and tear resistance.

GP Ultra Soft is offered in thicknesses from 0.020" to 0.250"with the rubber-coated carrier on one side and removable protectiveliner on the naturally tacky side of the material. Material isavailable in die-cut parts and sheets, 0.020" material is also offeredin roll form. Standard sheet size is 8" X 16", with or withoutadhesive, thickness tolerance is ± 5% of material thickness.

To calculate the approximate amount of deflection at a givenpressure, refer to the first graph. Multiply the thickness of thematerial by the percentage at the given applied pressure.*

Typical Applications• Between chassis wall and other surface

• CDROM Cooling

• Area where heat needs to be transferred to a frame, chassis, orother type of hear spreader

• Between a CPU and Heat Spreader

• Between a semiconductor and heat sink

Bergquist Gap Pad VO Ultra Soft


Color Mauve/Pink Visual

Thickness of Substrate 0.020” to .250” ASTM D374Specific Gravity 1.6 ASTM D792

Heat Capacity 1.0 J/g-K ASTM D351

Continuous Use Temperature -60˚C - 200˚C

Hardness (Shore Type 00) Thickness Hardness ASTM D22400.020” 55

to to0.250” 15

Young’s Modulus* (psi) Rate Modulus ASTM D5750.01 8

Thermal

Thermal Conductivity (@10 psi)1 W/m-K ASTM D5470

Electrical

Breakdown Voltage >6 kV ASTM D149

Dielectric Constant 5.5 ASTM D150

Volume Resistivity 1011 ohm-m ASTM D257

Pressure vs. Percent Deflection Ultra Soft


Pre

ssur

e (p

si)

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.00 5 10 15 20 25 30 35 40 45 50

Thickness vs. Thermal Resistance Ultra Soft


Thic

knes

s (m

ils)

25022520017515012510075502501.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0

The resultant thickness of the Gap Pad will determine thethermal resistance. Subtracting the initial gap pad thickness bythe deflection value, obtained above, will give the resultantthickness. Refer to the graph below to obtain the thermalresistance for a given thickness of material.

MODULUS * The modulus of Gap Pad VO is rate dependent due to itsviscoelastic properties. At high rates of compression Gap Pad is elastic andat low rates it is viscous. The elastic strain (deflection) is not timedependent. A completely elastic material, when compressed will recover100% to its original shape when the force is released. Viscous strain,however, is time dependent. Deformation is not instantaneous but occursover time and is not completely recovered after the stress is removed. As anexample; if Gap Pad is molded into a ball and dropped, it will bounce, andrebound close to 100%. However, if a load is placed on the ball for a longperiod of time it will flatten out a degree and will not recover completely toit’s original shape when the load is removed. For more information on GapPad modulus refer to Bergquist Application Note #116.

*Graphs and data generated from Young’s Modulus, calculated using 0.01

inch/min. step rate of strain with a sample size of 0.79 inch2.

GAP PAD™ 1500High Thermally Conductive Gap Filling Material

15

Gap Pad 1500 is designed to cost-effectively maximize heattransfer from electronic components to heat sinks or heatspreaders. The material has an ideal filler blend that gives it’s lowmodulus characteristic yet maintains optimal thermal performance,the combination of which minimizes thermal resistance betweenheat generating devices and heat sinks.GP1500 is an electrically isolating material that allows its use inapplications requiring isolation between heat sinks and highvoltage, bare leaded devices.GP1500 is a highly conformable low-modulus material that fills airgaps due to steps, rough surfaces, and high stack-up tolerances. The softness relieves stress and absorbs shocks minimizing damage

to delicate leads. The tacky nature of both sides of the materialallows for good compliance to adjacent surfaces of components,minimizing interfacial resistance. GP1500 is available in thicknesses from 0.020" to 0.200". The standard material is offered without reinforcement, however,the 0.015" and 0.020" thick material is also offered withreinforcement denoted as GP1500R.

Typical Applications• Heat Pipe Assemblies

• RDRAMTM Memory Modules

• CDROM Cooling

• Area where heat needs to be transferred to a frame, chassis, orother type of hear spreader.


Bergquist Gap Pad 1500


Color Black Visual

Thickness of Substrate 0.020” to 0.200” ASTM D374Specific Gravity 2.1 ASTM D792

Heat Capacity 1.0 J/g-K ASTM D351


Hardness (Shore Type 00) 40 ASTM D2240Young’s Modulus* (psi) Rate Modulus ASTM D575

0.01”/min. 45

Thermal

Thermal Conductivity (@10 psi)1.5 W/m-K ASTM D5470

Electrical

Dielectric Breakdown Voltage >6 kVAC ASTM D149


Volume Resistivity 1011 Ohm-meter ASTM D257

UL Recognized

94V-O (94V-1 for 20 mil) FIle #: E59150

Pressure vs. Percent Deflection GP 1500


Pre

ssur

e (p

si)

25

20

15

10

5

00 5 10 15 20 25 30 35 40 45 50

Thickness vs. Thermal Resistance GP 1500


Thic

knes

s (m

ils)

2502252001751501251007550250

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5

The resultant thickness of the Gap Pad will determine thethermal resistance. Subtracting the initial gap pad thickness bythe deflection value, obtained above, will give the resultantthickness. Refer to the graph below to obtain the thermalresistance for a given thickness of material.

*Graphs and data generated from Young’s Modulus, calculated using 0.01inch/min. step rate of strain with a sample size of 0.79 inch2. For moreinformation on Gap Pad modulus refer to Bergquist Application Note #116.

Gap Pad 1500 is available in die-cut parts and in roll form (converted orunconverted). The material is compatible with dispensing equipment forhigh volume production.

To calculate the approximate amount of deflection for a specificmaterial thickness, at a given pressure, refer to the graph. Multiply the thickness of the material by the percentage at the given pressure.*

GAP PAD™ 1500RHigh Thermally Conductive Gap Filling Material

16

Gap Pad 1500R has the same highly conformable lowmodulus polymer as the standard GP1500 family of productswith the addition of a fiberglass reinforcing substrate in thecenter. The fiberglass enforcement allows for easy materialhandling and enhances puncture, shear, and tear resistance.

GP1500R is an electrically isolating material that allows itsuse in applications requiring isolation between heat sinks andhigh voltage, bare leaded devices.

GP1500R has an ideal polymer and filler blend that givesit’s low modulus characteristic yet maintains optimal thermalperformance, minimizing thermal resistance. The highly

conformable low-modulus nature of the material fills air gapsdue to rough surfaces and high stack-up tolerances and is alsovibration dampening. The tacky nature of both sides of thematerial allows for good compliance to mating surfaces ofcomponents, further reducing thermal resistance.

GP1500R is available in 0.010" to 0.030" thicknesses andis available in 8" x 16" sheets, die-cut parts, and rolls inconverted or unconverted form. The material is compatiblewith dispensing equipment for high volume production.



• CDROM Cooling

• Area where heat needs to be transferred to a frame, chassis,or other type of hear spreader.


Bergquist Gap Pad 1500R


Color Black Visual


Heat Capacity 1.3 J/g-K @ 85˚C ASTM D351


Hardness (Shore Type 00) 75 (@ 20 mils) ASTM D2240Young’s Modulus* (psi) Rate Modulus ASTM D575

0.01”/min. 45

Thermal


Electrical

Dielectric Breakdown Voltage >6 kV ASTM D149



UL Recognized

94V-O (pending)

Pressure vs. Percent Deflection GP 1500R


Pre

ssur

e (p

si)

2502252001751501251007550250

0 5 10 15 20 25 30 35 40 45 50

Thickness vs. Thermal Resistance GP 1500R

Thermal Resistance (deg C˚sq. in/W)

Thic

knes

s (m

ils)

30

25

20

15

100.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80

The resultant thickness of the Gap Pad will determine thethermal resistance. Subtracting the initial gap pad thicknessby the deflection value, obtained above, will give theresultant thickness. Refer to the graph below to obtain thethermal resistance for a given thickness of material.

*Graphs and data generated from Young’s Modulus @ 10%deflection, calculated using 0.01 inch/min. step rate of strainwith a sample size of 0.79 inch2 and 20 mils thick. For moreinformation on Gap Pad modulus refer to BergquistApplication Note #116.

To calculate the approximate amount of deflection for aspecific material thickness, at a given pressure, refer to the topgraph. Multiply the thickness of the material by thepercentage at the given pressure.*

GAP PAD™ 2000High Performance Thermally Conductive Gap Filling Material

17

Gap Pad 2000 is a highly conductive filled lowmodulus polymer that acts as a thermal interface betweenelectrical components and heat sinks. The conformablenature allows the material to fill air gaps to enhance thethermal performance of electrical systems. The tackynature of both sides of the material allows for goodcompliance to the adjacent surfaces of components. Thishigh thermally conductive reinforced material is availablein thicknesses from 0.010" to 0.125".



• CDROM Cooling

• Area where heat needs to be transferred to a frame, chassis,or other type of hear spreader.




Color Grey Visual


Heat Capacity 1.0 J/g-K ASTM C351

Continuous Use Temperature -60˚C to 200˚C


to to0.125” 50

Young’s Modulus* (psi) Rate Modulus ASTM D5750.01”/min. 55

Thermal


Electrical


Dielectric Constant 5 ASTM D150

Volume Resistivity 1011 Ohm-meter ASTM D257UL Recognized 94V-O (pending) U.L.

Pressure vs. Percent Deflection GP 2000


Pre

ssur

e (p

si)

30

25

20

15

10

5

00 5 10 15 20 25 30 35 40 45 50


Thermal Resistance (deg C˚sqin/W)

Thic

knes

s (m

ils)

125

100

75

50

25

0

0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5

To calculate the approximate amount of deflection for aspecific material thickness, at a given pressure, refer to thegraph above. Multiply the thickness of the material by thepercentage at the given pressure.*

The resultant thickness of the Gap Pad will determine thethermal resistance. Subtracting the initial gap pad thicknessby the deflection value, obtained above, will give theresultant thickness. Refer to the second graph to obtain thethermal resistance for a given thickness of material.

*Graphs and data generated from Young’s Modulus,calculated using 0.01 inch/min. step rate of strain with asample size of 0.79 inch2. For more information on Gap Padmodulus refer to Bergquist Application Note #116.

Gap Pad 2000 is available in die-cut parts and in roll form(converted or unconverted). The material is compatible withdispensing equipment for high volume production.

GAP PAD™ 3000Enhanced High Performance Gap Filling Material

18

Gap Pad 3000 is a highly conductive filled polymerthat acts as a thermal interface between electricalcomponents and heat sinks. This material maintains aconformable nature, which allows it to fill air gaps andenhance the thermal performance of electrical systems.

Gap Pad 3000 is an electrically isolating material,which allows its use in applications requiring isolationbetween heat sinks and high voltage, bare leaded devices.

Gap Pad 3000 is a filled thermally conductive polymersupplied on a rubber carrier allowing for easy materialhandling and enhanced puncture, shear, and tearresistance.

Gap Pad 3000 is inherently tacky on one side for stick-in-place application, while having a non blocking surfaceon the other.

Thermal resistance is dependent on material thickness.Refer to the graph above to obtain the thermal resistanceof the material.



Color Gold Visual

Thickness of Substrate 0.010” to 0.125” ASTM D374Specific Gravity 3.2 g/cc ASTM D792




to to0.125” 55


Thermal


Electrical



Volume Resistivity 1011 Ohm-meter ASTM D257UL Recognized 94V-O (pending) U.L.



Thic

knes

s (m

ils)

125

100

75

50

25

00 0.25 0.5 0.75 1 1.25 1.5 1.75


Gap Pad 3000 is available in die-cut parts and in roll form(converted or unconverted). The material is compatible withdispensing equipment for high volume production.

Typical Applications• CPU & Heat Pipe Assemblies• Drive Cooling• CDROM Cooling• Area where heat needs to be transferred to a frame,

chassis, or other type of heat spreader.• Between CPU and Heat Spreader

GAP PAD™ HC 1100Gap Filling Material with “Gel-Like” Modulus, One Sided Tack

19

HC1100 is a cost-effective material, recommended forextremely low stress applications that require a thermallyconductive interface material. The highly conformable natureof the material allows the pad to fill in air voids and air gapsbetween heat generating devices and heat sinks or metalchassis with rough surfaces, steps, and high stack up tolerances.This thermally conductive reinforced material is available inthicknesses from 0.010" to 0.020".

HC1100 is offered with tack on the bottom side only! Thismaterial simplified material handling for part dispensing andpick-and-place automation. The top, tack-free surface does notrequire a protective liner since it does not attract dust and dirtfrom surrounding areas.

HC1100 is viscoelastic, which gives it excellent low stressvibration dampening and shock absorbing characteristics.

HC1100 is an electrically isolating material, allowing for itsuse between high voltage, bare leaded devices and metal sinks.

HC1100 is a filled thermally conductive polymer suppliedwith an imbedded reinforcement resulting in improvedmaterial handling and enhanced puncture, shear, and tearresistance.

Typical Applications• Areas where irregular surfaces need to make a

thermal interface to a heat sink• RDRAMTM Memory Modules• Between CPU’s and Heat Spreaders• For ASIC and PC Cooling• Heat interfaces to frames, chassis, or other heat

spreading devices

Bergquist Gap Pad HC 1100


Color Grey Visual




Hardness (Shore Type 00) Hardness ASTM D224060 (@ 20 mils)


Thermal

Thermal Conductivity (@10 psi)1.0 W/m-K ASTM D5470Flame Rating 94V-1 (pending) U.L.

Electrical




UL Recognized 94V-O (pending) U.L.

Pressure vs. Percent Deflection HC 1100


Pre

ssur

e (p

si)

140

120

100

80

60

40

20

00 5 10 15 20 25 30 35 40 45 50

Thickness vs. Thermal Resistance HC 1100


Thic

knes

s (m

ils)

20

18

16

14

12

100.25 0.30 0.35 0.40 0.45 0.50 0.55

To calculate the approximate amount of deflection for a specificmaterial thickness, at a given pressure, refer to the graph above.Multiply the thickness of the material by the percentage at thegiven pressure.*

The resultant thickness of the HC1100 will determine thethermal resistance. Subtracting the initial HC1100 thicknessby the deflection value, obtained above, will give the resultantthickness. Refer to the graph above to obtain the thermalresistance of the material.


Gap Pad HC 1100 is available in die cut –parts and in rollform (converted or unconverted). The material is compatiblewith dispensing equipment for high volume production.

GAP FILLER 1000Thermally Conductive Liquid Gap Filling Material

20

Gap Filler 1000 is a high performance thermally conductiveliquid GAP FILLING MATERIAL. It is supplied as a two-component,room or elevated temperature curing system. It is formulated toprovide a balance of cured material properties highlighted by"gel-like" modulus and good compression set (memory). Theseproperties result in a soft, thermally conductive, form-in-placeelastomer ideal for coupling "hot" electronic components mountedon PC boards with an adjacent metal case or heat sink. Theviscosity of the mixed uncured material also makes it suitable asa thermally conductive alternative in the following applications:

• Replacement for thermal grease – Before cure, it flows underpressure like a grease. After cure, it does not pump from theinterface as a result of thermal cycling. Unlike thermal grease,the cured product is dry to the touch.

• As a low modulus thermally conductive potting material.• As a thermally conductive vibration dampening material.

Gap Filler 1000 is supplied as a two-part kit comprised ofPart A and Part B components. The two components are coloredto assist as a mix indicator (1:1 ratio by weight or volume). Themixed system will cure at either ambient or elevated temperatureto form a soft thermally conductive interface material. Unlikecured Gap Filling materials, the liquid approach offers infinitethickness with little or no stress during displacement. It alsoeliminates the need for specific pad thickness and die-cut shapesfor individual applications.

Gap Filler 1000 is intended for use in thermal interface applicationswhere a structural bond is not a requirement. This material isformulated for low cohesive strength and "gel-like" properties.

This product is characterized by these special properties:• High Thermal Conductivity – 1.0 W/m-K• Stress Absorbing Flexibility (low modulus)• "Clean-Release" from many heat sink and electronic

packaging materials (re-workable)• Excellent Low and High Temperature Mechanical and

Chemical Stability• 100% Solids – No Cure By-Products• Versatile Cure Schedules – Both Ambient and Accelerated

Cure Schedules

ApplicationsGap Filler 1000 can be applied using the following methods:• Mixed and dispensed using dual tube cartridge packs with

static mixers and a manual or pneumatic gun• Mixed and dispensed using industry standard high volume

mixing and dispensing equipment

Bergquist Gap Filler 1000


As SuppliedAppearance Part A Grey VisualAppearance Part B White Visual

Viscosity As Mixed1 400,000 cps ASTM

Specific Gravity (Part A & B) 1.63 ASTM D792

Mix Ratio 1:1Shelf Life @ 25˚C 6 months

As Cured - PhysicalAppearance Grey VisualHardness2 20 ASTM D2240Cont. Use Operating Temp -60˚C to +200˚CHeat Capacity 1 J/g-K ASTM C351Thermal Conductivity 1.0 W/mK ASTM D5470Flame Rating 94 VO Pending

As Cured - ElectricalDielectric Strength 500 Volts/mil ASTM D149Volume Resistivity 1E+14 ohm-cm ASTM D257Dielectric Constant 5 @ 1 MHz ASTM D150

Cure SchedulePot Life @ 25˚C 15 min3

Cure @ 25˚C 60 to 120 min4

Cure @ 100˚C 5 min4

Thickness vs. Thermal Resistance

Thermal Resistance (deg C˚sq. in./W)

Thic

knes

s (m

ils)

300

250

200

150

100

50

00 1 2 3 4 5 6 7 8 9 10 11

1 Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25˚ C2 Shore Hardness Type "OO"3 Time for viscosity to double4 Cure Schedule (Rheometer – Time to reach 90% cure)

Gap Filler 1000 is available in 50 cc, 200 cc, or 400 cc MixPacTM

cartridges. It is also available in 2 Quart, 2 Gallon, and 10Gallon Kits.

GAP FILLER 1000UThermally Conductive Liquid Gap Filling Material (Non-Silicone)

21

Gap Filler 1000U is a high performance thermally conductiveliquid NON-SILICONE GAP FILLING MATERIAL. It is suppliedas a two-component, room temperature curing system. It is formulatedto provide a balance of cured material properties highlighted by"gel-like" modulus and good compression set (memory). Theseproperties result in a soft, thermally conductive, form-in-placeelastomer ideal for coupling "hot" electronic components mountedon PC boards with an adjacent metal case or heat sink. Theviscosity of the mixed uncured material also makes it suitable asa thermally conductive alternative in the following applications:

• Replacement for thermal grease – Before cure, it flows underpressure like a grease. After cure, it does not pump from theinterface as a result of thermal cycling. Unlike thermal grease,the cured product is dry to the touch.


Gap Filler 1000U is supplied as a two-part kit comprised ofPart A and Part B components. The two components are coloredto assist as a mix indicator (10:1 ratio by volume). The mixedsystem will cure at ambient temperature to form a soft thermallyconductive interface material. Unlike cured Gap Filling materials,the liquid approach offers infinite thickness variations with littleor no stress during displacement. It also eliminates the need forspecific pad thickness and die-cut shapes for individual applications.

Gap Filler 1000U is intended for use in thermal interface applicationswhere a structural bond is not a requirement. This material isformulated for low cohesive strength and "gel-like" properties.



Chemical Stability• 100% Solids – No Cure By-Products

ApplicationsGap Filler 1000U can be applied using the following methods:• Mixed and dispensed using dual tube cartridge packs with



Bergquist Gap Filler 1000U


As SuppliedAppearance Part A White VisualAppearance Part B Clear Visual


Specific Gravity (as mixed) 2.3 ASTM D792


As Cured - PhysicalAppearance White VisualHardness2 70 - 80 ASTM D2240Cont. Use Operating Temp -60˚C to +120˚CHeat Capacity 1.0 J/g-1-K-1 ASTM C351Thermal Conductivity 1.0 W-m-1-K-1 ASTM D5470Glass Transition -60˚C DSC

As Cured - ElectricalDielectric Strength 400 Volts/mil-1 ASTM D149Volume Resistivity >1E+8 ohm-cm ASTM D257Dielectric Constant 5 @ 1 MHz ASTM D150

Cure SchedulePot Life @ 25˚C3 45 - 60 minCure @ 25˚C4 4 - 6 hours


Thic

knes

s (m

ils)

300

250

200

150

100

50

00 1 2 3 4 5 6 7 8 9 10 11


1 Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25˚ C2 Shore Hardness Type "OO"3 Working life of material as a liquid4 Cure Schedule (Rheometer – Time to reach 90% cure)Recommended to cure at Room Temperature for 24 hours beforeexposing to temperatures above 80˚C.

Gap Filler 1000U is available in 37 cc, 250 cc, or 490 ccMixPacTM cartridges. It is also available in 1.1 Gallon, and 5.5Gallon Kits.

GAP FILLER 2000High Performance Thermally Conductive Liquid Gap Filling Material

22

Gap Filler 2000 is a high performance thermally conductive liquidGAP FILLING MATERIAL. It is supplied as a two-component,room or ele vated temperature curing system. It is formulated toprovide a balance of cured material properties highlighted by"gel-like" modulus and good compression set (memory). Theseproperties result in a soft, thermally conductive, form-in-placeelastomer ideal for coupling "hot" electronic components mountedon PC boards with an adjacent metal case or heat sink. Theviscosity of the mixed uncured material also makes it suitable as a thermally conductive alternative in the following applications:• Replacement for thermal grease – Before cure, it flows under

pressure like a grease. After cure, it does not pump from theinterface as a result of thermal cycling. Unlike thermal grease,the cured product is dry to the touch.


Gap Filler 2000 is supplied as a two-part kit comprised ofPart A and Part B components. The two components are coloredto assist as a mix indicator (1:1 ratio by weight or volume). Themixed system will cure at either ambient or elevated temperatureto form a soft thermally conductive interface material. Unlike curedGap Filling materials, the liquid approach offers infinite thicknesswith little or no stress during displacement. It also eliminates the needfor specific pad thickness and die-cut shapes for individual applications.

Gap Filler 2000 is intended for use in thermal interface applicationswhere a structural bond is not a requirement. This material is formulatedfor low cohesive strength and "gel-like" properties.



Chemical Stability• 100% Solids – No Cure By-Products• Versatile Cure Schedules – Both Ambient and Accelerated

Cure Schedules

ApplicationsGap Filler 2000 can be applied using the following methods:• Mixed and dispensed using dual tube cartridge packs with


mixing and dispensing equipmentmixing and dispensingequipment

Bergquist Gap Filler 2000


As SuppliedAppearance Part A Pink VisualAppearance Part B White Visual

Viscosity As Mixed1 500,000 cps

Specific Gravity (Part A & B) 2.8 ASTM D792


As Cured - PhysicalAppearance Pink VisualHardness2 75 ASTM D2240Cont. Use Operating Temp -60˚C to +200˚CHeat Capacity 1 J/g-K ASTM C351Thermal Conductivity 2.0 W/mK ASTM D5470Flame Rating 94 VO Pending

As Cured - ElectricalDielectric Strength 500 Volts/mil ASTM D149Volume Resistivity 1E+14 ohm-cm ASTM D257Dielectric Constant 7 @ 1 MHz ASTM D150

Cure SchedulePot Life @ 25˚C 15 min3

Cure @ 25˚C 60 to 120 min4

Cure @ 100˚C 5 min4


Thic

knes

s (m

ils)

300250200150100500

0 1 2 3 4 5 6


1 Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25˚ C2 Shore Hardness Type "OO"3 Working life of material as a liquid4 Cure Schedule (Rheometer – Time to reach 90% cure)

Gap Filler 2000 is available in 50 cc, 200 cc, or 400 cc MixPacTM

cartridges. It is also available in 2 Gallon and 10 Gallon Kits.

GAP FILLER 2000UThermally Conductive Liquid Gap Filling Material (Non-Silicone)

23

Gap Filler 2000U is a high performance thermally conductiveliquid NON-SILICONE GAP FILLING MATERIAL. It is suppliedas a two-component room temperature or elevated temperaturecuring system. It is formulated to provide a balance of cured materialproperties highlighted by "gel-like" modulus and good compressionset (memory). These properties result in a soft, thermally conductive,form-in-place elastomer ideal for coupling "hot" electronic componentsmounted on PC boards with an adjacent metal case or heat sink.The viscosity of the mixed uncured material also makes it suitableas a thermally conductive alternative in the following applications:• Replacement for thermal grease – Before cure, it flows under

pressure like a grease. After cure, it does not pump from theinterface as a result of thermal cycling. Unlike thermal grease,the cured product is dry to the touch.


Gap Filler 2000U is supplied as a two-part kit comprised ofPart A and Part B components. The two components are coloredto assist as a mix indicator (10:1 ratio by volume). The mixed systemwill cure at ambient temperature or elevated temperature to forma soft thermally conductive interface material. Unlike cured GapFilling materials, the liquid approach offers infinite thickness variationswith little or no stress during displacement. It also eliminates theneed for specific pad thickness and die-cut shapes for individualapplications.

Gap Filler 2000U is intended for use in thermal interface applicationswhere a structural bond is not a requirement. This material isformulated for low cohesive strength and "gel-like" properties.



Chemical Stability• 100% Solids – No Cure By-Products

ApplicationsGap Filler 2000U can be applied using the following methods:• Mixed and dispensed using dual tube cartridge packs with



Bergquist Gap Filler 2000U


As SuppliedAppearance Part A Blue VisualAppearance Part B Clear Visual


Specific Gravity (as mixed) 2.8 ASTM D792


As Cured - PhysicalAppearance White VisualHardness2 80 - 90 ASTM D2240Cont. Use Operating Temp -60˚C to +120˚CHeat Capacity 0.9 J/g-1-K-1 ASTM C351Thermal Conductivity 1.9 W-m-1-K-1 ASTM D5470Glass Transition -60˚C DSC

As Cured - ElectricalDielectric Strength 400 Volts/mil-1 ASTM D149Volume Resistivity >1E+8 ohm-cm ASTM D257Dielectric Constant 5 @ 1 MHz ASTM D150

Cure SchedulePot Life @ 25˚C3 45 - 60 minCure @ 25˚C4 4 - 6 hours


Thic

knes

s (m

ils)

300250200150100500

0 1 2 3 4 5 6


1 Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25˚ C2 Shore Hardness Type "OO"3 Working life of material as a liquid4 Cure Schedule (Rheometer – Time to reach 90% cure)Recommended to cure at or below 90˚C

Gap Filler 2000U is available in 37 cc, 250 cc, or 490 ccMixPacTM cartridges. It is also available in 1.1 Gallon, and 5.5Gallon Kits.

Typical Properties of Bond Ply 100

Property Test Method Bond Ply 105 Bond Ply 108 Bond Ply 111Thickness Inches ASTM D374 0.005 (0.13) 0.008 (0.20) 0.011 (0.28)Thermal Resistance, ˚C in2/watt ASTM D5470 0.3 0.5 ASTM D 1458Thermal Impendance, ˚C in2/watt ASTM D5470* 0.6 0.8 1.0Breakdown Voltage, KVAC ASTM D149 3 6.5 8.5Surface Flatness, inch/inch 0.001 0.002 0.0025Application PCB Processors Processors

BOND PLYTM 100Thermally Conductive, Pressure Sensitive Adhesive Tape

24

Bergquist Bond Ply 100 is a thermally conductive, double-sided pressure sensitive adhesive tape. The tape consists of ahigh performance, thermally conductive acrylic adhesivecoated with a fiberglass reinforced interweave. Bond Ply 100is designed to attain high bond strength to a variety ofsurfaces, and to maintain high bond strength with long termexposure to moderate heat and high humidity.

Use Bond Ply 100 for:• Mounting a heat sink to a BGA graphic processor• Mounting a heat sink to a computer processor• Mounting a heat sink to a drive processor• Mounting a heat spreader to a power converter PCB• Mounting a heat spreader to a motor control PCB

Use Bond Ply 100 instead of:• Heat Cure Adhesive• Screw Mounting• Clip Mounting

Bond Ply 100 is available in standard thickness of 5, 8 and11 mil. In the case that these thicknesses will not work foryour application, Bergquist will coat a custom thickness of 4to 12 mils.

Bond Ply 100 is available in sheets, rolls and die-cut parts.Standard sheet size is 10” by 10”. Standard roll size is 10” by300’. Die-cut parts can be supplied on rolls and as individualparts.

*Single Layer test that includes interfacial thermal resistance

Bergquist Bond Ply 100


Color White Visual

Short Term Temp Resistance 200˚CContinuous Use Temp -30˚C to +120˚C

Elongation, 45˚ Warp 70% ASTM D412

Tape Tensile Strength 0.9 Kpsi ASTM D412

CTE 325 ppm TMAGlass Transition -30˚C DSC

Adhesion Strengths

Lap shear 100 psi ASTM D1002Lap shear, 5 hrs @ 100˚C 200 psi ASTM D1002Lap shear, 2 min @ 200˚C 200 psiStatic Dead Weight Shear 150˚C PSTC#7

Thermals

Thermal Conductivity 0.8 W/m-K ASTM D5470

SIL-PAD 400 Sil-Pad 400 is the original Sil-Pad material. Sil-Pad 400

is a composite of silicone rubber and fiberglass. It is flameretardant and is specially formulated for use as a thermallyconductive insulator. Primary use is to electrically isolatepower sources from heat sinks.

Sil-Pad 400 has excellent mechanical and physicalcharacteristics. Surfaces are pliable and allow completesurface contact with excellent heat dissipation. Sil-Pad 400actually improves its thermal resistance with age. Thereinforcing fiberglass gives excellent cut-through resistanceand Sil-Pad 400 is non-toxic and resists damage fromcleaning agents.

SIL-PAD 600Sil-Pad 600 is a silicone elastomer filled with special

ingredients to provide higher thermal performance. Thismaterial has similar physical characteristics of the Sil-Pad400 material with enhanced thermal performance.

Special Thicknesses, Rolls and Sheets

Sil-Pad 400 can be supplied on special order in a varietyof thicknesses from .007 to .045 inches to fulfill specialrequirements of insulation path minimums or other spacingneeds. Sil-Pad 400 and 600 are available in die-cut parts,sheets (6" x 6" min., 6" x 12", 8" x 8", 10" x 10" and 12" x12") and roll form.

SIL-PAD 400®

The Original Fiberglass Based Sil-Pad

Physical Properties Sil-Pad 400, .007 in. Sil-Pad 400, .009 in Sil-Pad 600 Test MethodColor Gray Gray GreenThickness Inches .007 ± .001" .009 ± .001" .009 ± .001"(mm) 0.178 ±0.025 .229 ± .025 .229 ± .025 ASTM D 374Breaking Strength Lbs/inch (kN/m) 100 (18) 100 (18) 100 (18) ASTM D 1458Elongation, % 45° to warp and fill 40 40 40 ASTM D 412Hardness, Shore A 85 85 85 ASTM D 2240Tensile Strength, kPsi (MPa)45° to warp and fill 3 (20) 3 (20) ASTM D 412Continuous Use Temp., °C -60 to +180 -60 to +180 -60 to +180Specific Gravity 2.0 2.0 1.8 ASTM D 792Construction Silicone/Fiberglass Silicone/ FiberglassThermal Vacuum Weight Loss % (TML) as manufactured .40 .40 NASAPost Cure 24 Hrs. 400 °F .25 .25 SP-R-0022AVolatile Condensable Material % (CVCM) as manufactured .11 .11 NASAPost Cure 24 Hrs. 400°F .07 .07 SP-R-0022A

Thermal Properties Sil-Pad 400, .007 in. Sil-Pad 400, .009 in Sil-Pad 600 Test MethodThermal Resistance, °C-in2/W 0.45 0.50 0.35 ASTM D 5470Thermal Conductivity, W/m-K 0.9 0.9 1.0 ASTM D 5470

Electrical Properties Sil-Pad 400, .007 in. Sil-Pad 400, .009 in Sil-Pad 600 Test MethodBreakdown Voltage, Volts a-c Min. 3500 4500 4500 ASTM D 149 Dielectric Constant, 1000 Cps (Hz) 5.5 5.5 5.0 ASTM D 150Volume Resistivity, Ohm Metre 1.0 x 1011 1.0 x 1011 1.0 x 1011 ASTM D 257

25

SIL-PAD K-4®

Sil-Pad K-4 uses a specially developed film which has highthermal conductivity, high dielectric strength and is verydurable. Sil-Pad K-4 combines the thermal transfer propertiesof well known Sil-Pad rubber with the physical properties of afilm. The result is a durable insulator that withstands highvoltages, requires no thermal grease to transfer heat, is availablein customized shapes and sizes and saves time and costs whileincreasing productivity.

SIL-PAD K-6®

Sil-Pad K-6 is a medium performance film based thermallyconductive insulator. The film is coated with a siliconeelastomer to deliver high performance and provides acontinuous physically tough dielectric barrier against “cut-through” and resultant assembly failures.

Die-Cut parts, Rolls and SheetsSil-Pad K-4, K-6 and K-10 are available in die-cut parts,

sheets (6" x 6" min., 6" x 12", 8" x 8", 10" x 10" and 12" x 12")and roll form.

SIL-PAD K-10®

Bergquist Sil-Pad K-10 is the high performance insulator.It combines special film with a filled silicone rubber. The resultis a product with good cut-through properties and excellentthermal performance.

K-10 is designed to replace ceramic insulators such asBeryllium Oxide, boron Nitride and Alumina. These insulatorsare expensive and they break easily. K-10 eliminates breakageand costs much less than ceramics.

Physical Properties Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Test Method

Color Gray Bluegreen Beige VisualThickness Inches .006 ± .001 .006 ± .001 .006 ± .001(mm) (.15 ±.025) (.15 ±.025) (.15 ±.025) ASTM D 374Breaking Strength Lbs/inch (kN/m) 30 (5) 30 (5) 30 (5) ASTM D 1458Elongation, % 45° to warp and fill 40 40 40 ASTM D 412Hardness, Shore A 90 90 90 ASTM D 2240Tensile Strength, kPsi (MPa) 5 (35) 5 (35) 5 (35) ASTM D 412Thermal Vacuum Weight Loss NASA% (TML) as manufactured .26 .36 SP-R-0022AContinuous Use Temp., °C -60 to +180 -60 to +180 -60 to +180 --Construction Silicone/Film Silicone/Film Silicone/FilmVolatile Condensable Material NASA% (CVCM) as manufactured .07 .09 SP-R-0022A

Thermal Properties Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Test Method

Thermal Resistance, °C-in2/W 0.40 0.30 0.2 ASTM D 5470Thermal Conductivity, W/m-K 0.9 1.1 1.3 ASTM D 5470

Electrical Properties Sil-Pad K-4 Sil-Pad K-6 Sil-Pad K-10 Test Method

Breakdown Voltage, Volts a-c Min. 6000 6000 6000 ASTM D 149Dielectric Constant, 1000 Cps (Hz) 5.0 4.0 3.7 ASTM D 150Volume Resistivity, Ohm Metre 1.0x1012 1.0x1012 1.0x1012 ASTM D 257

FILM BASED

Sil-Pad K-4®, Sil-Pad K-6® and Sil-Pad K-10®

26

SIL-PAD 1000Sil-Pad 1000 has the same excellent mechanical and

physical characteristics of our Sil-Pad 400 material whileoffering a 35% reduction in thermal resistance.

Sil-Pad 1000 is a composite of silicone rubber andfiberglass. It is specially filled and offers low thermal resistance.Sil-Pad 1000 is non-toxic and resists damage from cleaningagents. It is flame retardant and specially formulated for use as athermally conductive insulator.

SIL-PAD 1500Sil-Pad 1500 is an economical, high performance insulator

with a thickness between that of Sil-Pad 1000 and Sil-Pad 2000.

SIL-PAD 2000Sil-Pad 2000 is Bergquist’s high performance, high

reliability thermally conductive insulator. Sil-Pad 2000 isdesigned for demanding military / aerospace and commercialapplications. In these applications, Sil-Pad 2000 complies withmilitary standards. This silicone elastomer is specially filled tomaximize the thermal and dielectric performance of the filler /binder matrix. The result is a “grease-free”, conformable materialcapable of meeting or exceeding the thermal and electricalrequirements of high reliability electronic packaging applications.Sil-Pad 2000 is also available in thicknesses from .010" to .060".

Die-Cut parts, Rolls and SheetsSil-Pad 1000, 1500 and 2000 are available in die-cut parts

and sheets (6" x 6" min., 6" x 12", 8" x 8", 10" x 10" and 12" x12"). Only Sil-Pad 1000 and 1500 are available in roll form.

MIL SPEC. MIL-M-38527/08MIL-I-49456MIL-I-49466/02MIL-M-87111U.L. FILE NUMBERE59150FSCM NUMBER 55285

SIL-PAD 2000 Outgassing Data for Spacecraft Materials

%TML %CVCMPost Cure (1.0% Max (0.1% MaxConditions Acceptable) Acceptable)24 hrs. @ 175°C .07 .03No Post Cure .26 .10

Physical Properties Sil-Pad 1000 Sil-Pad 1500 Sil-Pad 2000 Test Method

Color Pink Green White VisualThickness Inches .009 ± .001" 0.010 ± .001" .015 ±.002"(mm) (.23 ± .025) (.25 ± .025) (.38 ± .025) ASTM D 374Elongation, % 45° to warp and fill 45 20 20 ASTM D 412Hardness, Shore A ± 5 85 80 90 ASTM D 2240Breaking Strength Lbs/inch (kN/m) 100 (18) 65 (12) 65(12) ASTM D 1458Tensile Strength, kPsi (MPa) 4 (30) ASTM D 412Thermal Vacuum Weight Loss NASA

% (TML) as manufactured .22 see SP-R-0022AVolatile Condensable Material NASA

% (CVCM) as manufactured .08 see SP-R-0022ASpecific Gravity 1.5 1.5 1.5 ASTM D 792Continuous Use Temp., °C -60 to +180 -60 to + 200 -60 to +200 --Construction Silicone/Fiberglass Silicone/Fiberglass Silicone/Fiberglass

Thermal Properties Sil-Pad 1000 Sil-Pad 1500 Sil-Pad 2000 Test Method

Thermal Resistance, °C/-in2/W 0.35 0.23 0.2 ASTM D 5470Thermal Conductivity, W/m-K 1.2 2.0 3.5 ASTM D 5470

Electrical Properties Sil-Pad 1000 Sil-Pad 1500 Sil-Pad 2000 Test Method

Breakdown Voltage, Volts a-c Min. 4500 4000 4000 ASTM D 149Dielectric Constant, 1000 Cps (Hz) 4.5 4 4.0 ASTM D 150Volume Resistivity, Ohm Metre 1.0x1011 1.0 x 1011 1.0x1011 ASTM D 257

HIGH PERFORMANCE

Sil-Pad 1000®, Sil-Pad 1500® and Sil-Pad 2000®

27

POLY-PADS...For Silicone Sensitive ApplicationsPolyester based, thermally conductive insulators from

Bergquist provide a complete family of material for silicone-sensitive applications. Poly-Pads are ideally suited forapplications requiring conformal coatings or applications wheresilicone contamination is a concern (telecommunications andcertain aerospace applications). Poly-Pads are constructed withceramic filled polyester resins coating either side of a fiberglasscarrier or a film carrier. The Poly-Pad family offers a completerange of performance characteristics to match individualapplications.

POLY-PAD 400®

Poly-Pad 400 is a fiberglass based insulator coated with analumina-filled polyester resin. Poly-Pad 400 is economical anddesigned for most standard applications.

POLY-PAD 1000®

Poly-Pad 1000 is also a fiberglass based insulator coatedwith a boron nitride filled polyester resin. Poly-Pad 1000 offerssuperior thermal resistance for high performance applications.

POLY-PAD K-4®

Poly-Pad K-4 is a composite of film coated with a polyesterresin. PPK-4 is an economical insulator and the film carrierprovides excellent dielectric and physical strength.

POLY-PAD K-10®

Poly-Pad K-10 is a composite of film coated with a polyesterresin. PPK-10 offers superior thermal performance for your mostcritical applications with thermal resistance of 0.2 °C-in2/Watt aswell as excellent dielectric strength.

Die-Cut parts, Rolls and SheetsPoly-Pads are available in die-cut parts, sheets (6" x 6"

min., 6" x 12", 8" x 8", 10" x 10" and 12" x 12") and roll form.

Physical Properties Poly-Pad 400 Poly-Pad 1000 Poly-Pad K-4 Poly-Pad K-10 Test Method

Color Mauve Yellow Mauve Yellow VisualThickness Inches .009 ± .001 .009 ± .001 .006 ± .001 .006 ± .001(mm) (.23 ± .025) (.23 ± .025) (.15 ± .025) (.15 ± .025) ASTM D374Elongation, % 45° to warp and fill 10 10 40 40 ASTM D412Hardness, Shore A ± 5 90 90 90 90 ASTM D2240Breaking Strength Lbs/inch (kN/m) 100 (18) 100 (18) 30 (5) 30 (5) ASTM D1458Tensile Strength, kPsi 7 7 5 545° to warp and fill (MPa) (50) (50) (35) (35) ASTM D412Specific Gravity 2.0 1.5 1.8 1.3 ASTM D792Continuous Use Temperature, C -20 to 150 -20 to 150 -20 to 150 -20 to 150 --Construction Polyester/Fiberglass Polyester/Fiberglass Polyester/Film Polyester/Film

Thermal Properties Poly-Pad 400 Poly-Pad 1000 Poly-Pad K-4 Poly-Pad K-10

Thermal Resistance, °C-in2/W 0.4 0.3 0.3 0.2 ASTM D5470Thermal Conductivity, W/m-K 0.9 1.2 .9 1.3 ASTM D5470

Electrical Properties Poly-Pad 400 Poly-Pad 1000 Poly-Pad K-4 Poly-Pad K-10

Breakdown Voltage, Volts a-c Min. 4500 2500 6000 6000 ASTM D149Dielectric Constant, 1000 Cps (Hz) 5.5 4.5 5.0 3.7 ASTM D150

Volume Resistivity, Ohm Metre 1.0 x 1011 1.0 x 1011 1.0 x 1012 1.0 x 1012 ASTM D257

POLY-PADS®

For Silicone Sensitive Applications

28

Q-Pad II® Eliminates Grease

Q-Pad II is a composite of .0015" aluminum foil coated bothsides with .0025” thick thermally/electrically conductive Sil-Pad rubber. It is designed for those applications wheremaximum heat transfer is needed and electrical insulation isnot required. Q-Pad II is the ideal thermal interface materialto replace messy thermal grease compounds.

Q-Pad II eliminates problems associated with grease such ascontamination of reflow solder or cleaning operations. Q-Pad II can be used prior to these operations unlike grease.Q-Pad II also eliminates dust collection which can causepossible surface shorting or heat buildup. Some applicationswhere the material is typically used include:

• Between a transistor and a heat sink. • Between two large surfaces such as an L-Bracket and the

chassis of an assembly.• Between a heat sink and a chassis. • Under electrically isolated power modules or devices such

as resistors, transformers and solid state relays.

Q-PAD 3®

The new Bergquist Q-Pad 3 eliminates problems associatedwith thermal grease such as contamination of electronicassemblies and reflow solder baths. Q-Pad 3 may be installedprior to soldering and cleaning, without worry. When

clamped between two surfaces, the elastomer conforms tosurface textures thereby creating an air free interfacebetween heat generating components and heat sinks.

Fiberglass reinforcement enables Q-Pad 3 to withstand processingstresses without losing physical integrity. Q-Pad II and 3 are bothavailable with or without adhesive.

Die-Cut parts, Rolls and SheetsQ-Pad II and Q-Pad 3 are available in die-cut parts and

sheets (6" x 6" min., 6" x 12", 8" x 8", 10" x 10" and 12" x 12")and roll form.

Q-PAD II®, Q-PAD 3®

Grease Replacement Materials without Electrical Isolation

Physical Properties Q-PAD II Q-PAD 3 Test Method

Color Black Black VisualThickness Inches .006/.0065 w/ac ±.001.005/.0055 (w/ac) ASTM D374(mm) .152 ±.025 (.15) ASTM D374

Service Temperature °C 180 wo/ac --

150 w/ac

Thermal Properties Q-PAD II Q-PAD 3 Test Method

Thermal Resistance, °C-in2/W 0.10 w/o ac 0.10 w/o ac0.20 w/ac 0.14 w/ac

Metric (cm2-K/w) .65 w/o ac .65 w/o ac1.3 w/ac 0.9 w/ac

Thermal Conductivity, W/m-K 2.5 wo/ac 2.0 w/o ac1.3 w/ac 1.6 w/ac ASTM D5470

Electrical Properties Q-PAD II Q-PAD 3 Test Method

Volume Resistivity, Ohm Metre 1.0 x 102 w/o ac 10-1 w/o ac ASTM D4496 103 w/ac 101 w/ac

29

The Sil-Pad 800 and 900 family of thermally conductiveinsulation materials are designed for low cost applicationsrequiring high thermal performance. These applications alsotypically have low mounting pressures for componentclamping.

The Sil-Pad 800-S material combines a smooth surfacedesign with high thermal conductivity and electricalinsulation. These features optimize the thermal resistanceproperties at low pressure.

Applications requiring low component clamping forcesinclude discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips provide quickassembly but apply a limited amount of pressure to thesemiconductor. The smooth surface texture of Sil-Pad 800-Smaximizes thermal performance.

Die-Cut parts, Rolls and SheetsSil-Pad 800-S and Sil-Pad 900-S are available in die-cut

parts, sheets (6" x 6" min., 6" x 12", 8" x 8", 10" x 10" and 12" x12") and roll form.

LOW PRESSURE

Sil-Pad 800-S® and Sil-Pad 900-S®

Physical Properties Sil-Pad 800-S Sil-Pad 900-S Test Method

Color Gold Mauve VisualThickness Inches .005 ± .001 .009 ± .001(mm) (.13 ±.025) (.23 ±.025) ASTM D 374Tensile Elongation45° to warp and fill 20 20 ASTM D 412Tensile Strength, MPa 12 9 ASTM D 41245° to Warp & Fill, (kPsi) (1.7) (1.3)

Thermal Properties Sil-Pad 800-S Sil-Pad 900-S Test Method

C-in2/Watt 0.1 0.2Thermal Resistance, cm2/Watt 0.85 1.5 ASTM D 5470Thermal Conductivity, W/m-K 1.6 1.6 ASTM D 5470

Electrical Properties Sil-Pad 800-S Sil-Pad 900-S Test Method

Breakdown VoltageType 1 Electrodes, kVa-c 1.7 5.5 ASTM D 149Type 3 Electrodes, kVa-c 3.0 8.3 ASTM D 149

Volume Resistivity, Ohm Metre 1.0x1010 1.0x1010 ASTM D 257Dielectric Constant, 1kHz 6.0 6.0 ASTM D 150

30

SIL-PAD SHIELD®

Bergquist Sil-Pad Shield is a bonded laminate of thermallyconductive, electrically isolating Sil-Pad 400 or Sil-Pad 1000 padswith a copper shield between the layers. It is supplied with apretinned solder point for easy grounding.

RFI Produced by Heat Sink Current

The capacitance between a TO-3 encapsulated transistor andits heat sink is typically 100 pf when a mica or other insulatingwasher is used. A power supply constructed with a standardinsulator and a grounded heat sink can be expected to produceabout 10 times more interference than is permitted.

A solution to the problem can be accomplished by:

1. The use of chokes, filters and LC networks which have to be designed into the circuitry.

OR 2. Constructing a shield between the transistor and its heatsink by:

Replacing the mica insulator with a Sil-Pad Shield (Fig.1).

Sil-Pad Shield is a laminate of copper with Sil-Pad thermallyconductive insulators. Sil-Pad Shield provides:•Shielding effectiveness of 50dB or higher. •Electrical isolation of 500 volts minimum. •Good thermal transfer.•Reduced labor costs due to the elimination of having to applythermal grease. See information on Sil-Pad 400. SPECIAL SHAPES: Sil-Pad Shield is available in any customconfiguration to meet special requirements. Tooling charges areabout $300-$500 for simple parts.

TRANSISTOR

SIL-PAD 400

COPPER SHIELD

GROUNDEDSINK

LEAD WIRETO NEGATIVE

Thickness (total) inches .019 +.004 ---.002(.48mm)

Shield Thickness inches .0015 (.04mm) --Copper ThicknessApprox. Thermal Resistance (TO-3) .85° to 1.0°C/W --Min. Breakdown VoltageBetween Device & Copper 4500 Volts ASTM D149Capacitance at 1000 Hz and5 Volts 50 pico FDissipation Factor at 1000 Hzand 5 Volts (TO-3) Power Factor .0155 ASTM D150Dielectric Constant at 1000 Hz and 5 Volts 5.5 ASTM D 150Continuous Use Temp. °C -60 to +180 --Recommended Torque (TO-3) 6-8 inch Lbs. --

(0.7-0.9 Nm)

Table 6 Typical pr oper ties of Sil-P ad Shield

SIL-PAD SHIELD® CONFIGURATIONS

SIL-PAD SHIELD®

Bonded Laminate of Sil-Pad with a Copper Shield

.187 DIA.

.125 DIA tinnedcopper (to ground)

1.117.887

.456

1.46

71.

878

.228

P/N 09SPS01-133 (TO-3P)(continued on following page)

31

1.07

8.2

20

SIL-PAD SHIELD®

Sil-Pad Shield Standard Configurations

1.125.375

.437

.1.1

25

.375

.250

.125 DIA. tinned copper (to ground)

.125 DIA 3 HOLES

.215

.430

1.673.374

33°

.062

.6661.187 .393

1.3

78

.673

.125 DIA. tinned copper(to ground)

.147 DIA. .171 DIA.2 HOLES

.31

2

1.1

25 .5

62

.450

.312

1.125

.157 DIA

.125 DIA. tinnedcopper (to ground)

.875

.250 .040DIA

3 HOLES

.200 DIA

..4

06


.125

.500

.500

.250

.093 DIA

.215.4

30

.072

.125 DIA. tinned copper (to ground)

1.25

0

.625

.250

.250

.140 DIA (2).593

1.187C

1.980

.995

.140 DIA2 HOLES

.100

.480.100

.960

.075 DIA2 HOLES

.590 .125 DIA. tinnedcopper (to ground)

.840

.600.3

50

.200

1.20

0

1.680

.260 DIA


.438

.625

1.250

.625

.438

1.25

0

.093 DIA2 HOLES

.605

.447

.187

.652.070

.875

.140 DIA 2 HOLES.595

1.190 N.T.S.

30°

.215 .4

30

1.21

0

.152.305

1.750

.125 DIA.tinned copper (to ground)

.860

.430

.187

.187.430

.860

.200 DIA.

P/N 09SPS01-002 (TO-220) P/N 09SPS01-001 (TO-3) P/N 09SPS01-009

P/N 09SPS01-011 (TO-5) P/N 09SPS01-016 (TO-3) P/N 09SPS01-017 (TO-66)

P/N 09SPS01-020 (DO-5) P/N 09SPS01-023 (TO-3) P/N 09SPS01-019 (DO-4)

Contact the factory for other confi gurations.

32

SIL-PAD 1750®

The combination of high thermal conductivity andexcellent dielectric strength retention after humidityexposure is formulated into the Sil-Pad 1750 elastomericpad.

Sil-Pad 1750 relies on new processes that minimize theeffect of high humidity on the electrical properties offinished material. Therefore, exposure to humidenvironments during assembly, or over long term operatingconditions, will not severely affect the ability of the materialto perform.

Sil-Pad 1750 may be purchased as sheets or punchedparts. The material is available with either a Silicone orAcrylic adhesive. Sil-Pad 1750 is not available in rolls.Sheet sizes: (6" x 6", 6" x 12", 8" x 8", 10" x 10", 12" x 12")

SIL-PAD 1950®

The combination of high thermal conductivity andexcellent dielectric strength retention after humidityexposure is formulated into the Sil-Pad 1950 elastomericpad. The material transfers heat due to its high loading ofspecial fillers and its ability to exclude air from largeinterfaces.

Sil-Pad 1950 relies on new processes that minimize theeffect of high humidity on the electrical properties offinished material. Therefore, exposure to humidenvironments during assembly, or over long term operatingconditions, will not severely affect the ability of the materialto perform.

Sil-Pad 1950 may be purchased as sheets or punchedparts. The material is available with either a Silicone orAcrylic adhesive. Sil-Pad 1950 is designed to be aneconomical material solution for high humidity, highdielectric requirements. Sil-Pad 1950 is not available in rolls.Sheet sizes: (6" x 6", 6" x 12", 8" x 8", 10" x 10", 12" x 12")

U.L. File Number E59150

Physical Properties Sil-Pad 1750 Sil-Pad 1950 Test Method

Color Green Yellow VisualThickness Inches 0.012 ± .001 0.010 + .002 - .001(mm) (.30) (.25) ASTM D 374Breaking Strength, Lbs/inch 65 65

(kN/m) (12) (12) ASTM D 1458Hardness Shore A 85 85 ASTM D 2240

Thermal Properties Sil-Pad 1750 Sil-Pad 1950 Test Method

Thermal Resistance, °C-in2/W 0.20 0.23(m2-°K/w) (1.5 x 10-4) (1.5 x 10-4) ASTM D 5470

Thermal Conductivity, W/m-K 2.2 1.7 ASTM D 5470

Electrical Properties Sil-Pad 1750 Sil-Pad 1950 Test MethodBreakdown Voltage 6000

VAC, min. 6000* 4000* ASTM D 149Volume Resistivity, Ohm Metre

As manufactured 1.0x1012 1.0x1012 ASTM D 257After 48 Hours at 90% rh and 35°C 3 x1011

After 4 Hours at 150°C 2 x1014

High Humidity Sil-Pad 1750® and Sil-Pad 1950®

33

TestSPT 400 SPT 1000 Method

Color Gray/Green Brown VisualThermal Resistance C-in2/Watt 0.6 0.4 ASTM D5470

Thermal Conductivity, W/m-k 0.9 1.2 ASTM D5470

Breakdown Voltage, minimum 5000 5000 ASTM D149

Dielectric Constant, 1000 (Hz) 5.5 4.5 ASTM D150

Continuous Use Temp. °C -60 to + 180 -60 to + 200 —

Hardness, Shore A 80 80 ASTM D2240

Thickness/Wall (Inches) (mm) .012 (.30) .012 ( .30) ASTM D374

Breaking Strength lbs./in. (kN/m) 6 (1) 6 (1) ASTM D1458

Volume Resistivity, Ohm Meter 1.0 x 1011 1.0 x 1011 ASTM D257

SPT 400 and SPT 1000(“Sil-Pad Tubes”) providethermally conductive insulation for clip mounted plasticpower packages. Sil-Pad Tubes are made of silicone rubberwith high thermal conductivity. Sil-Pad Tube 1000 is bestsuited for higher thermal performance and Sil-Pad Tube 400is ideal for applications requiring average thermalperformance and economy.

Sil-Pad Tube standard configurations are available forTO-220, TO-218, TO-247 and TO-3P plastic powerpackages. Special thicknesses and diameters can also beordered. SPT 400 and SPT 1000 are designed to meet VDE,UL and TUV agency requirements. Typical properties of Sil-Pad Tube are shown in the table below.

A

B

C

SPT 400 and SPT 1000

Standard Dimensions

A = Wall Thickness: .30 mm (.012") + .10 mm/-0.0 mm (+.004"/-0.0") B = Inner Diameter: 11 mm (.433") and 13.5 mm (.532") ±1.0 mm (±.039")C = Length 25 mm (.985") and 30 mm (1.18") +3.18 mm/-0.0 mm (+.125"/-0.0")

Special lengths are available. For more information contact the factory.

Ordering Procedure:

Sample: SPT400 ___ ___ ___"A" -"B" -"C"

34

Ordering Procedure

The last 2 or 3 digits define the part number selected. The“foot print” and dimensions are shown on previous pages. Eachmaterial has a prefix as shown on the next page.

Special Shapes: For applications requiring non standard orcustom Sil-Pad configurations contact the factory.

We produce thousands of specials. Tooling charges are about$150 to $200 for simple parts. Increased complexity or tightertolerances increase tooling charges.

Tolerances: .015 inches, (.4mm) are held on width, length,hole diameter and hole location. Contact the factory if tightertolerances are required.

Sheets: 6" x 6", 6" x 12", 8" x 8", 10" x 10", or 12" x 12" sheetsare available from stock, with or without adhesive.

When ordering sheets, state material, thickness and sheet sizeincluding dimensions.

Rolls: Sil-Pad materials are available in roll form, with orwithout adhesive. Contact the factory. Sil-Pad 2000 is notavailable in rolls. Sil-Pad 2000, maximum sheet size, 12" x 16".

Adhesive Characteristics: TYPE: Low tack dimethylsilicone, pressure sensitive (SP400, SP600 SP1000, SP1500).High tack pressure sensitive acrylic adhesive. (K-4, K-6, K-10, Q2,SP2000, Poly-Pad materials).

THICKNESS: .0005-.001,(12-25µm) (Adhesive only)

PEEL STRENGTH: Approx. 100 to 250 grams/inch width(5 to 10gm/mm). Adhesive coated Sil-Pads are provided on arelease liner.

SHELF LIFE: One year for silicone adhesive, 18 months foracrylic adhesive.

TAC (thermal adhesive coating) six (6) months inwarehouse below 90 degrees.

Mil-Spec Reference Guide

Bergquist will supply a Thermal Insulation Material CrossReference Listing for all pertinent military part numbers includedin the following Mil-Specs:

MIL M-38527 / 08MIL I-49466 / 02MIL H-87111MIL I-49456A

Each Bergquist part number specifies a Bergquist grade ofthermal insulation material and a transistor case configuration.Details of different Bergquist thermal insulation materials as wellas details on different thermal insulator configurations are foundon previous pages of the Sil-Pad Design Guide.

MIL-I-49456A specifies a fiberglass reinforced elastomericsheet material showing type and class. MIL-I-49466-02, MIL M-38527 / 08 and MIL-H-87111 specify thermal insulatorconfigurations.

MIL I-49466 / 02 supersedes the part numbers covered underMIL M-38527 / 08. M49466 / 02 is the most complete listing ofmilitary part numbers. Each of the military part numbers inM49466 / 02 is cross referenced to specific Bergquist part numbers.Please use MIL-I-49466 whenever possible. Please contact TheBergquist Company for the complete MIL Spec Reference Guide.

U.L. FILE NUMBER E59150 FSCM NUMBER 55285

PSA Characteristics

Standard pressure sensitive adhesive (AC) coated on one side ofa Sil-Pad will increase the thermal resistance (per ASTM D5470) by0.2 C/in2/W. Standard psa on 2 sides increases the thermal impedanceby 0.4 C/in2/W.

Thermally conductive psa (TAC) on one side increases thethermal resistance by 0.05 C/in2/W and on two sides by 0.1 C/in2/W.

The effect of AC and TAC on the thermal impedance in anapplication will vary. In low pressure applications, the pressuresensitive adhesive will wet out the interface easier and eliminate theinterfacial thermal resistance.

Bergquist recommends the use of dispensing equipment forcertain adhesive coated parts. Please contact the factory for additionalinformation.

Peel adhesion data is available from the factory. Contact TheBergquist Company.

Ordering Procedure, PSA Characteristics, Mil-Spec

35

MATERIAL THICKNESS:

SIL-PAD 400®

■■ .007" ■■ .009"■■ .015" ■■ .030"■■ .045"■■ ADHESIVE 1 SIDE■■ ADHESIVE 2 SIDES

SIL-PAD 600®

■■ .009"■■ ADHESIVE 1 SIDE■■ ADHESIVE 2 SIDES

SIL-PAD 1000®

■■ .009"■■ .015"■■ ADHESIVE 1 SIDE■■ ADHESIVE 2 SIDES

SIL-PAD 1500®


SIL-PAD 2000®

■■ .010" ■■ .015" ■■ .020" ■■ .030" ■■ .040" ■■ .050" ■■ .060" ■■ .080" ■■ ADHESIVE 1 SIDE■■ ADHESIVE 2 SIDES

SIL-PAD SHIELD®

■■ SP400" ■■ SP1000"

SIL-PAD K-4®


SIL-PAD K-6®


SIL-PAD K-10®


SIL-PAD 800-S®

■■ .005" DRY■■ .005" ADHESIVE

SIL-PAD 900-S®

■■ .009" DRY■■ .009" ADHESIVE

SIL-PAD 1750®

■■ .012" DRY■■ .012" ADHESIVE

SIL-PAD 1950®

■■ .010" DRY■■ .010" ADHESIVE

POLY-PAD 400®


BUILDING A PART NUMBER

Insert standard configuration,2 or 3 digit part number suffix.

SP400 - 7 mil - dry 3223-07FR-____SP400 - 9 mil - dry 7403-09FR-____

SP400 - 7 mil - adhesive 3223-07AC-____SP400 - 9 mil - adhesive 7403-09AC-____

SP1000 - 9 mil - dry 1009-____SP1000 - 9 mil - adhesive 1009AC-____

SP600 - 9 mil - dry SP600-____SP600 - 9 mil - adhesive SP600AC-____



K4 - 6 mil - dry K4-____K4 - 6 mil - adhesive K4AC-____



Q2 - 6 mil - dry Q2-____Q2 - 6 mil - adhesive Q2AC-____

Q3 - 5 mil - dry Q3-____Q3 - 5 mil - adhesive Q3AC-____

PP400 - 9 mil - dry PP400-____PP400 - 9 mil - adhesive PP400AC-____

PP1000 - 9 mil - dry PP1000-____PP1000 - 9 mil - adhesive PP1000AC-____

PPK10 - 6 mil - dry PPK10-____PPK10 - 6 mil - adhesive PPK10AC-____

SIL-PAD SHIELD 400 09SPS01-____SIL-PAD SHIELD 1000 01SPS01-____

SIL-PAD 800-S - 5 mil - dry SP800S-____SIL-PAD 800-S - 5 mil - adhesive SP800SAC____SIL-PAD 900-S - 9 mil - dry SP900S-____SIL-PAD 900-S - 9 mil - adhesive SP900SAC____

SP1750 - 12 mil - dry 1750-____SP1750 - 12 mil - adhesive 1750AC____SP1950 - 10 mil - dry 1950-____SP1950 - 10 mil - adhesive 1950AC____

POLY-PAD 1000®


POLY-PAD K-4®


POLY-PAD K-10®


Q-PAD II®

■■ .006"■■ ADHESIVE 1 SIDE

Q-PAD 3®

■■ .005"■■ ADHESIVE 1 SIDE

SOFTFACE™

(INSULATING) (NON-INSULATING)

■■ .003" ■■ .005"■■ .005" ■■ .008"■■ .008"

BOND PLY™

■■ .005"■■ .008"■■ .011"

HI FLOW™

■■ .005"Contact the factory for other thicknesses.

GAP PAD VO SOFT™

■■ .020" ■■ .100"■■ .040" ■■ .125"■■ .060" ■■ .160"■■ .080"■■ ADHESIVE 1 SIDE

GAP PAD VO™ & VO ULTRA SOFT™

■■ .020" ■■ .080" ■■ .160"■■ .040" ■■ .100" ■■ .200"■■ .060" ■■ .125" ■■ .250"■■ ADHESIVE 1 SIDE

GAP PAD™ 1500■■ .020" ■■ .100"■■ .040" ■■ .125"■■ .060" ■■ .160"■■ .080" ■■ .200"

GAP PAD™ 1500R■■ .010" ■■ .020"■■ .015" ■■ .030"

GAP PAD™ 2000 & 3000■■ .010" ■■ .060"■■ .015" ■■ .080"■■ .020" ■■ .100"■■ .040" ■■ .125"

Building a Part Number

36

4 Lead Part NumberTO-66 Suffix "A" "B" "C" "D" "E" "F" "G"

-84 1.312 .762 .140 .062 .960 .200 .100

Plastic Part Number Dimensions Part Number DimensionsPower Suffix "A" "B" "C" "D" Suffix "A" "B" "C" "D"

Various -35 .710 .500 .160 .141 Various -104 1.000 .750 .300 .140(Clip Mount) -43 .750 .500 Various -107 .810 .910 .170 .147TO-126 -50 .437 .312 .140 093 Various -110 .984 .787Various -51 .687 .562 .218 .125 Various -114 .827 .945 .197 .150Various -52 .855 .630 .230 .093 Various -116 .855 .630 .228 .122TO-220 -54 .750 .500 .187 .147 Various -117 .827 .709 .256 .126TO-202 -55 .610 .560 .245 .125 Various -118 .748 .551 .217 .126Various -56 .855 .562 .218 .125 Various -119 .437 .311 .142 .110TO-220 -58 .750 .500 .187 .125 Various -120 .728 .472 .157 .098TO-126 -60 .437 .312 .140 .122 TO-3P -122 1.140 .810 .355 .147Various -61 .750 .410 .225 .156 Various -126 .945 .748 .256 .162TO-220 -62 .750 .600 .240 .150 Various -128 .984 1.654 .315 .157Various -63 .750 .600 .240 .115 Various -131 .709 .512 .177 .122Various -64 .500 .385 .170 .120 Various -132 .472 .315 .157 .126TO-218 -68 1.125 .625 .200 .145 Various -133 .866 .709 .256 .126Various -70 1.410 .810 .355 .147 Various -134 .945 .709 .228 .126Various -90 .860 .740 .200 .160 Various -136 1.250 1.000Various -102 .866 .650 .217 .142 Various -137 1.250 1.000 .258 .127Various -103 .750 .800 .150 .160 Various -138 1.250 1.000 .258 .148

Power Part NumberModule Suffix "A" "B" "C" "D" "E" "F"

-67 1.500 .900 .150 1.200 .450 .075-101 2.500 2.000 .344 1.812 1.000 .156

Plastic Part NumberPower Suffix "A" "B" "C" "D" "E" "F" "G"

-57 .910 .500 .200 .125 .580 .046 .265-89 .983 .750 .432 .156 .665 .101 .217

Plastic Part NumberPower Suffix "A" "B" "C" "D" "E" "F" "G" "H"

-66 1.000 .500 .200 .141 .626 .046 .219 .032

Power Part NumberResistors Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I"

RH-25 -94 1.187 1.205 .234 .469 .212 .156 .719 .781 .140RH-50 -95 2.093 1.265 .265 .530 .210 .255 1.563 .845 .140RH-5 -96 .725 .771 .140 .280 .140 .156 .445 .491 .093RH-10 -97 .805 .890 .127 .250 .130 .190 .551 .630 .121RH-25 -98 1.150 1.180 .231 .425 .190 .270 .688 .800 .147RH-50 -99 1.965 1.236 .198 .404 .132 .263 1.569 .972 .130

TO-220 Part NumberMultiples Suffix "A" "B" "C" "D" "E" "F" # Of Holes

2 Parts -34 1.000 .750 .187 .125 .250 .500 23 Parts -36 1.500 .750 .187 .125 .250 .500 3

-37 2.000 .750 .187 .125 .250 .500 4-38 2.500 .750 .187 .125 .250 .500 5-39 3.000 .750 .187 .125 .250 .500 6-40 3.500 .750 .187 .125 .250 .500 7-41 4.000 .750 .187 .125 .250 .500 8


-108 4.600 2.400 2.125 .500 1.800 .125

Sil-Pad® Standard Configurations

TO-220

37

Part NumberMultiwatt Suffix "A" "B" "C" "D" "E"

-124 .872 .790 .160 .148 .118 x 45°-125 .866 .787 .157 .154 .079 x 45°

Multi-Lead Part NumberTO-66 Suffix "A" "B" "C" "D" "E" "F"

-93 1.350 .800 .140 .400 .960 .480

Diode Part Number Dimensions Part Number DimensionsWasher Suffix "A" "B" Suffix "A" "B"

Various -19 .510 .140 Various -75 .360 .260DO-4 -20 .510 .200 Various -76 .750 .125DO-5 -21 .800 .260 Various -77 .800 .190DO-4 (oversized) -22 .625 .200 DO-8 -78 .875 .313DO-5 (oversized) -25 1.000 .260 Various -79 1.180 .515Various -26 .812 .145 Various -80 1.250 .380Various -27 .812 .115 Various -81 1.500 .200Various -28 1.000 .140 Various -82 .512 .161Various -32 1.500 .500 Various -111 .591 .217

Part Number DimensionsTO-36 Suffix "A" "B" "C"

-08 1.063 .690 .190

Small Power Part NumberDevices Suffix "A" "B" "C"

TO-5, 3 Holes -09 .360 .200 .040TO-18, 3 Holes -12 .250 .100 .036TO-18, 4 Holes -13 .250 .100 .036TO-5, 4 Holes -33 .360 .200 .040TO-5, 3 Holes -44 .390 .200 .040TO-5, 4 Holes -45 .390 .200 .040

Part Number DimensionsRectifier Suffix "A" "B" "C"

-46 1.250 1.250 .200-47 1.125 1.125 .140-48 1.000 1.000 .187

TIP Part NumberPackages Suffix "A" "B" "C" "D" "E"

Clip Mount -42 .984 .787 .205TIP-36 Plastic Tip -53 .865 .650 .650 .140 .205TO-3P -65 1.260 .787 .984 .142 .205Plastic Clip -73 .984 .787 .708 .142 .205

Power Part Number Dimensions Module Suffix "A" "B" "C" "D" "E" "F" "G"

-100 2.510 1.260 .630 .305 1.900 .205 .205-123 1.614 1.102 .551 .157 1.220 .118 .118

SIP Part NumberPackage Suffix "A" "B" "C" "D" "E" "F" "G"

-105 1.450 .838 .612 .245 .960 .170 .120

Part NumberQuarz Suffix "A" "B" "C" "D"

-115 .472 .197 .193 .031

Power Part NumberModule Suffix "A" "B" "C" "D" "E" "F" "G"

-109 1.350 .642 .321 .195 .960 .060 .125

B

A

D-DIA EC


A

B

C

D

A

D

CB

(2) G Dia

F RAD(TYP)

E

38

TO-3 & TO-66 Part Number DimensionsStyle Suffix "A" "B" "C" "D" "E" "F" "G"

-02 1.780 1.250 .140 .093 1.187 .430 .072-03 1.563 1.050 .140 .080 1.187 .430 .072-04 1.650 1.140 .122 .062 1.187 .430 .072-05 1.650 1.140 .140 .093 1.187 .430 .072-06 1.650 1.140 .165 .062 1.187 .430 .072-07 1.780 1.250 .165 .094 1.187 .430 .072-10 1.440 1.000 .140 .075 .960 .200 .100-11 1.312 .762 .140 .062 .960 .200 .100-15 1.780 1.250 .140 .046 1.187 .430 .072-16 2.070 1.560 .122 .062 1.187 .430 .072-17 1.650 1.140 .140 .046 1.187 .430 .072-18 1.563 1.050 .140 .140 1.187 .430 .072-23 1.593 1.100 .156 .062 1.187 .430 .072-24 1.700 1.187 .156 .062 1.187 .430 .072-29 1.650 1.065 .140 .046 1.187 .430 .072-30 1.250 .700 .140 .062 .960 .200 .100-31 1.375 .825 .140 .062 .960 .200 .100

-59 Leadless 1.650 1.140 .165 1.187-112 1.780 1.248 .165 .063 1.185 .429 .073-113 1.563 1.051 .165 .079 1.185 .429 .073-127 1.307 .819 .165 .063 .909 .236 .061-129 1.654 1.063 .138 .059 1.181 .433 .071-135 1.650 1.142 .165 .142 1.187 .429 ..072

3 Lead Part Number DimensionsTO-3 Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I"

-92 1.650 1.140 .140 .093 1.187 .430 .400 .155 .718


-86 1.560 1.050 .156 .080 1.170 .470 72°-87 1.563 1.050 .156 .063 1.187 .470 72°


-88 1.655 1.187 .156 .060 1.187 40° .500

10 Lead Part NumberTO-3 Suffix "A" "B" "C" "D" "E" "F" "G" "H"

-91 1.650 1.140 .165 .040 1.187 .593 .500 32.7°


-85 1.275 .750 .156 .100 .960 .200 .100 .200


-83 1.440 1.000 .140 .055 .960 .480 .325 36°

Power Part NumberModule Suffix "A" "B" "C" "D" "E"

-130 1.600 .480 .165 1.197 .240

AI

F B

E

C DIA. (2)

D DIA. (3)

H

G


AF DIA.

B

E

C DIA. (2)

D DIA. (4)

18°

G°

A

B

ED

C - DIA. (2)

39


-84 33.32 19.35 3.56 1.57 24.38 5.08 2.54

Plastic Part Number Dimensions Part Number DimensionsPower Suffix "A" "B" "C" "D" Suffix "A" "B" "C" "D"

Various -35 18.03 12.70 4.06 3.58 Various -104 25.40 19.05 7.62 3.56(Clip Mount) -43 19.05 12.70 Various -107 20.57 23.11 4.32 3.73TO-126 -50 11.10 7.92 3.56 2.36 Various -110 24.99 19.99Various -51 17.45 14.27 5.54 3.18 Various -114 21.01 24.00 5.00 3.81Various -52 21.72 16.00 5.84 2.36 Various -116 21.72 16.00 5.79 3.10TO-220 -54 19.05 12.70 4.75 3.73 Various -117 21.01 18.01 6.50 3.20TO-202 -55 15.49 14.22 6.22 3.18 Various -118 19.00 14.00 5.51 3.20Various -56 21.72 14.27 5.54 3.18 Various -119 11.10 7.90 3.61 2.79TO-220 -58 19.05 12.70 4.75 3.18 Various -120 18.49 11.99 3.99 2.49TO-126 -60 11.10 7.92 3.56 3.10 TO-3P -122 28.96 20.57 9.02 3.73Various -61 19.05 10.41 5.72 3.96 Various -126 24.00 19.00 6.50 4.11TO-220 -62 19.05 15.24 6.10 3.81 Various -128 24.99 42.01 8.00 3.99Various -63 19.05 15.24 6.10 2.92 Various -131 18.01 13.00 4.50 3.10Various -64 12.70 9.78 4.32 3.05 Various -132 11.99 8.00 3.99 3.20TO-218 -68 28.58 15.88 5.08 3.68 Various -133 22.00 18.01 6.50 3.20Various -70 35.81 20.57 9.02 3.73 Various -134 24.00 18.01 5.79 3.20Various -90 21.84 18.80 5.08 4.06 Various -136 31.75 25.40Various -102 22.00 16.51 5.51 3.61 Various -137 31.75 25.40 6.55 3.23Various -103 19.05 20.32 3.81 4.06 Various -138 31.75 25.40 6.55 3.76

Power NumberModule Suffix "A" "B" "C" "D" "E" "F"

-67 38.10 22.86 3.81 30.48 11.43 1.90-101 63.50 50.80 8.74 46.02 25.40 3.96

Plastic Part NumberPower Suffix "A" "B" "C" "D" "E" "F" "G"

-57 23.11 12.70 5.08 3.18 14.73 1.17 6.73-89 24.97 19.05 10.97 3.96 16.89 2.57 5.51

Plastic Part NumberPower Suffix "A" "B" "C" "D" "E" "F" "G" "H"

-66 25.40 12.70 5.08 3.58 15.90 1.17 5.56 0.81

Power Part NumberResistors Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I"

RH-25 -94 30.15 30.61 5.94 11.91 5.38 3.96 18.26 19.84 3.56RH-50 -95 53.16 32.13 6.73 13.46 5.33 6.48 39.70 21.46 3.56RH-5 -96 18.42 19.58 3.56 7.11 3.56 3.96 11.30 12.47 2.36RH-10 -97 20.45 22.61 3.23 6.35 3.30 4.83 14.00 16.00 3.07RH-25 -98 29.21 29.97 5.87 10.80 4.83 6.86 17.48 20.32 3.73RH-50 -99 49.91 31.39 5.03 10.26 3.35 6.68 39.85 24.69 3.30

TO-220 Part NumberMultiples Suffix "A" "B" "C" "D" "E" "F" # Of Holes

2 Parts -34 25.40 19.05 4.75 3.18 6.35 12.70 23 Parts -36 38.10 19.05 4.75 3.18 6.35 12.70 3

-37 50.80 19.05 4.75 3.18 6.35 12.70 4-38 63.50 19.05 4.75 3.18 6.35 12.70 5-39 76.20 19.05 4.75 3.18 6.35 12.70 6-40 88.90 19.05 4.75 3.18 6.35 12.70 7-41 101.60 19.05 4.75 3.18 6.35 12.70 8


-108 116.84 60.96 53.97 12.70 45.72 3.18

Sil-Pad® Standard Configurations SI Measurements

TO-220

40

Part NumberMultiwatt Suffix "A" "B" "C" "D" " E"

-124 22.15 20.07 4.06 3.76 3.0 x 45°-125 22.00 19.99 3.99 3.91 2.0 x 45°

Multi-Lead Part NumberTO-66 Suffix "A" "B" "C" "D" "E" "F"

-93 34.29 20.32 3.56 10.16 24.38 12.19

Diode Part Number Dimensions Part Number DimensionsWasher Suffix "A" "B" Suffix "A" "B"

Various -19 12.95 3.56 Various -75 9.14 6.60DO-4 -20 12.95 5.08 Various -76 19.05 3.18DO-5 -21 20.32 6.60 Various -77 20.32 4.83DO-4 (oversized) -22 15.88 5.08 DO-8 -78 22.23 7.95DO-5 (oversized) -25 25.40 6.60 Various -79 29.97 13.08Various -26 20.62 3.68 Various -80 31.75 9.65Various -27 20.62 2.92 Various -81 38.10 5.08Various -28 25.40 3.56 Various -82 13.00 4.09Various -32 38.10 12.70 -111 15.01 5.51

Part Number DimensionsTO-36 Suffix "A" "B" "C"

-08 27.00 17.53 4.83

Small Power Part NumberDevices Suffix "A" "B" "C"

TO-5, 3 Holes -09 9.14 5.08 1.02TO-18, 3 Holes -12 6.35 2.54 0.91TO-18, 4 Holes -13 6.35 2.54 0.91TO-5, 4 Holes -33 9.14 5.08 1.02TO-5, 3 Holes -44 9.91 5.08 1.02TO-5, 4 Holes -45 9.91 5.08 1.02

Part Number DimensionsRectifier Suffix "A" "B" "C"

-46 31.75 31.75 5.08-47 28.58 28.58 3.56-48 25.40 25.40 4.75

TIP Part NumberPackages Suffix "A" "B" "C" "D" "E"

Clip Mount -42 24.99 19.99 5.21TIP-36 Plastic Tip -53 21.97 16.51 16.51 3.56 5.21TO-3P -65 32.00 19.99 24.99 3.61 5.21Plastic Clip -73 24.99 19.99 17.98 3.61 5.21

Power Part Number Dimensions Module Suffix "A" "B" "C" "D" "E" "F" "G"

-100 63.75 32.00 16.00 7.75 48.26 5.21 5.21-123 41.00 27.99 14.00 3.99 30.99 3.00 3.00

SIP Part NumberPackage Suffix "A" "B" "C" "D" "E" "F" "G"

-105 36.83 21.29 15.54 6.22 24.38 4.32 3.05

Power Part NumberModule Suffix "A" "B" "C" "D"

-115 11.99 5.00 4.90 0.79

Power Part NumberModule Suffix "A" "B" "C" "D" "E" "F" "G"

-109 34.29 16.31 8.15 4.95 24.38 1.52 3.18

B

A

D-DIA EC


A

B

C

D

A

D

CB

(2) G Dia

F RAD(TYP)

E

41

TO-3 Part Number DimensionsStyle Suffix "A" "B" "C" "D" "E" "F" "G"

-02 45.21 31.75 3.56 2.36 30.15 10.92 1.83-03 39.70 26.67 3.56 2.03 30.15 10.92 1.83-04 41.91 28.96 3.10 1.57 30.15 10.92 1.83-05 41.91 28.96 3.56 2.36 30.15 10.92 1.83-06 41.91 28.96 4.19 1.57 30.15 10.92 1.83-07 45.21 31.75 4.19 2.39 30.15 10.92 1.83-10 36.58 25.40 3.56 1.90 24.38 5.08 2.54-11 33.32 19.35 3.56 1.57 24.38 5.08 2.54-15 45.21 31.75 3.56 1.17 30.15 10.92 1.83-16 52.58 39.62 3.10 1.57 30.15 10.92 1.83-17 41.91 28.96 3.56 1.17 30.15 10.92 1.83-18 39.70 26.67 3.56 3.56 30.15 10.92 1.83-23 40.46 27.94 3.96 1.57 30.15 10.92 1.83-24 43.18 30.15 3.96 1.57 30.15 10.92 1.83-29 41.91 27.05 3.56 1.17 30.15 10.92 1.83-30 31.75 17.78 3.56 1.57 24.38 5.08 2.54-31 34.92 20.96 3.56 1.57 24.38 5.08 2.54

-59 Leadless 41.91 28.96 4.19 30.15-112 45.21 31.70 4.19 1.60 30.10 10.90 1.85-113 39.70 26.70 4.19 2.01 30.10 10.90 1.85-127 33.20 20.80 4.19 1.60 23.09 5.99 1.55-129 42.01 27.00 3.51 1.50 30.00 11.00 1.80-135 41.91 29.01 4.19 3.61 30.15 10.90 1.83

Dimensions3 Lead Part NumberTO-3 Suffix "A" "B" "C" "D" "E" "F" "G" "H" "I"

-92 41.91 28.96 3.56 2.36 30.15 10.92 10.16 3.94 18.24


-86 39.62 26.67 3.96 2.03 29.72 11.94 72°-87 39.70 26.67 3.96 1.60 30.15 11.94 72°


-88 42.04 30.15 3.96 1.52 30.15 40° 12.70


-91 41.91 28.96 4.19 1.02 30.15 15.06 12.70 32.7°


-85 32.38 19.05 3.96 2.54 24.38 5.08 2.54 5.08

9 Lead Part NumberTO-66 Suffix "A" "B" "C" "D" "E" "F" "G""H"

-83 36.58 25.40 3.56 1.40 24.38 12.19 8.26 36°

Power Part NumberModule Suffix "A" "B" "C" "D" "E"

-130 40.64 12.19 4.19 30.40 6.10

AI

F B

E

C DIA. (2)

D DIA. (3)

H

G

AF DIA.

B

E

C DIA. (2)

D DIA. (4)

18°

G°


A

B

ED

C - DIA. (2)

42

VISIT OUR WEBSITE

http://www.bergquistcompany.com

43

For access to 38 technical papers on Sil-Pad Products go to the "Technical Corner" in the Bergquistwebsite. Here's a sample of the technical papers available from The Bergquist Company:

• What is Thermal Management at Bergquist by StaffTopic: InsulationPublished by Bergquist

• Comparison of Semiconductor Isolation Materials by HansonTopic: Insulation; Compares Sil-Pad type materialsPublished by PCIM

• Thermal Testing Procedures by HansonTopic: TSPPublished by Bergquist

• Two Layer Thermal Clad™, Thermal Clad Bond Ply™, and Low Modulus Bond Ply™

by FickTopic: T-Clad, Two LayerPublished by Bergquist

DOMESTIC AGENTS

For a complete list of Bergquist sales representatives in the U.S. contact The Bergquist Company: 1-800-347-4572.

INTERNATIONAL AGENTS

For a complete list of European Bergquist salesrepresentatives contact the European salesoffices.

EUROPEAN SALES OFFICES

The Bergquist Co./EuropeBramenberg 9a3755 BT EemnesThe NetherlandsPhone: 31-35-5380684 Fax: 31-35-5380295Peter de Vries, European Sales Director

GERMANYBergquist ITC GmbHHaderslebener Str. 19A, D-25421PinnebergTel: 49-4101-803-230Fax: 49-4101-803-100

ENGLANDBergquist UK Ltd. Unit 27 Darin CourtCrownhill Ind. Est. Milton Keynes MK80ADTel: 44-1908-263663 Fax: 44-1908-263773

ASIAN SALES OFFICES

KOREAThe Bregquist Company, Korea Ltd.324-7, Dang Jung-DongKun Po-SiKyung Gi-Do435-030 Seoul, KoreaTelephone: 82-343-457-8345Direct: 82-11-341-0330Fax: 82-343-457-8344S.K. Chung, Director

HONG KONGHong Kong Sales Office & WarehouseBlock B, Rm. 9-16, 10/FVeristrong Industrial Centre34-36 Au Pui Wan Street,Fo Tan, Shatin, N.T., Hong KongFrank Weng, Sales ManagerTelephone: 852-2698-5006Direct Line: 852-2690-9296Fax Line: 852-2690-2344Frank Wong, Sales Manager

INTERNATIONAL AGENTSAUSTRALIA MALAYSIAAUSTRIA MEXICOBELGIUM NEW ZEALANDBRAZIL NORWAYCANADA PORTUGALCHINA RUSSIADENMARK SINGAPOREFINLAND SPAINFRANCE SWEDENHOLLAND SWITZERLANDHONG KONG TAIWANISRAEL THAILANDITALY TURKEYJAPAN

5300 Edina Industrial Blvd. ❖ Minneapolis, MN 55439Toll Free: 800/347-4572 ❖ Phone: 952/835-2322 ❖ Fax: 952/835-4156

The Bergquist Company is

on the World Wide Web!

Visit us at

http://www.bergquistcompany.com

OVERVIEW

THERMAL PRODUCTS GROUP

The Thermal Products Group is the largest division and the world leaderin the development and manufacture of thermal management products.

• Sil-Pad thermally conductive insulators are the industry standard. • More than 30 different materials designed to transfer heat.• The engineers choice for combating heat in electronic assemblies. • Bergquist R&D develops new materials and technologies.

BERGQUIST SWITCH

Bergquist Switch designs and manufactures membrane switches for harshenvironments using their HeatSeal technology.

Custom built for OEM applications in these industries:

• medical instrumentation• exercise equipment• construction equipment• applications with harsh chemical environments

Sil - Pad Design Guide - Farnell · PDF fileChoosing the right Sil-Pad Starts with the...

Documents

Transcript of Sil - Pad Design Guide - Farnell · PDF fileChoosing the right Sil-Pad Starts with the...