The worldwide semiconductor capital equip-

ment market is forecast to increase 20.8 per-

cent this year to $38.44 billion, compared with

2013’s $31.82 billion, and another 10.8 percent

in 2015 to $42.6 billion, according to Semicon-

ductor Equipment and Materials International.

Also on Monday, the Semiconductor Indus-

try Association reported that global sales of

semiconductors were $26.86 billion in May, an

8.8 percent increase from a year earlier and a 2

percent improvement from April of this year.

Jonathan Davis, SEMI’s global vice presi-

dent of advocacy, said Monday that the semi-

SEMI Forecasts Double-digit Business Growth in 2014, 2015BY JEFF DORSCH

JULY 10, 2014

MOSCONE CENTER | SAN FRANCISCO, CALIFORNIA

THURSDAYSHOW DAILYSHOW DAILYSHOW DAILY8:00am-5:15pm Global Summit for Advanced ManufacturingSan Francisco Marriott Marquis

9:00am-12:00pm STS SESSION: 450mm Technology Development UpdateMoscone North, Hall E, Room 131

10:00am-4:45pm FLEXTECH ALLIANCE WORKSHOP: Flexible Hybrid Electronics for Wearable Applications—Challenges and Solutions San Francisco Marrriott Marquis

10:30am-12:30pm3D Printing: Science Fiction or the Next Industrial Revolution?SESSION PARTNER: SEMICO ResearchTechXPOT South, South Hall

1:30pm-3:30pm IoT Startup Showcase An SK Telecom Americas Innopartners ProgramTechXPOT North, North Hall

1:30pm-3:30pm Breakthrough Research TechnologiesTechXPOT South

continued on p 6Denny McGuirk, president and CEO of SEMI

DON’T MISS

Imagine being able to not only track and ad-

dress equipment degradation in real time, but

also analyze patterns in your factories’ equip-

ment and address potential issues before they

even present a problem.

It may sound too good to be true, but Mi-

crosoft’s Sanjay Ravi explained in Wednesday

morning’s keynote that this innovation is be-

coming available now to manufacturers.

In his keynote “The Art of Possible: How

Manufacturers are Leveraging Digital Tech-

nologies to Drive Business in a Connected

World,” Mr. Ravi gave his audience a glimpse

of the brave, new world that leveraging mo-

bility, social, cloud and big data offers them,

specifically siting product offerings and de-

velopments from Microsoft.

“The key priority is taking advantage of the

connected business networks and enabling

connected customer experience,” Mr. Ravi

shared. Building a data culture across one’s

organization can drive the right business pro-

cesses and models, he explained.

He used examples from Samsung and

AMD, who both utilized Cloud-based data

analytics programs to reduce costs, manage

energy and increase data warehouse perfor-

mances by jaw-dropping percentages. AMD,

The Connected Experience: A Manufacturer’s Dream? BY SHANNON DAVIS, WEB EDITOR

continued on p 6

SEMICON West 2014 attendees enjoyed technical sessions and interesting exhibits.

Visit Us At Booth #310, South Hall

www.highvac.com

Leader in Quality Vacuum Valves

For Your Most Demanding Applications Harsh Process Valves• Wedge design

• Isolated bellows

• Easy in-situ maintenance for reduced down time

• Resilient to aggressive chemicals & high temperatures

• Tough enough for harsh processes like MOCVD, ALD, & PECVD

Valves Designed for Semiconductor Processes & Sub-Fab Environment

When Safety And Security Are Your PriorityLockout/Tagout “LOTO” Valves • Failsafe (locked) closure for safe maintenance

• OSHA compliant under USDOL federal regulations

Slit ValvesAluminum Stainless

SHOW DAILY

THURSDAY | JULY 10, 2014

3SHOW DAILY

The news hit the semiconductor industry like

a thunder clap late last year.

ASML Holding announced that it was hold-

ing back, or pausing, its development of lithog-

raphy systems that could handle 450-millime-

ter silicon wafers. That information shocked

many observers, since ASML had only the year

before got Intel, Samsung Electronics, and Tai-

wan Semiconductor Manufacturing to commit

1.38 billion euros (about $1.82 billion) toward

research and development at ASML of extreme-

ultraviolet lithography and 450mm technology

over four years.

One year after that financing commit-

ment, those three customers decided to put

the brakes on the transition to 450mm wafers.

As ASML stated in its 2013 annual report:

“In November 2013, following our cus-

tomers’ decision, ASML decided to pause

the development of 450mm lithography sys-

tems until customer demand and the timing

related to such demand is clear. We believe

that our 450mm development activities can

be restarted if and when the industry demands

the introduction of 450mm. Since 450mm re-

quires both generic developments and wafer

size-specific developments, many of our em-

ployees involved in the 450mm project are do-

ing work that is just as relevant for future DUV

and EUV platforms. The teams and people

have therefore been reassigned

to different projects.”

Pundits quickly declared that

the industry transition to 450mm

was absolutely, completely dead.

The reality is more nuanced than

that.

Ryan Young of ASML says of

450mm, “Customers are not ask-

ing for it right now. The work is

sitting on the shelf.”

And ASML is not the only

game in town. Nikon Precision

has been working the Global

450mm Consortium (G450C) to

successfully develop a 450mm

immersion tool.

The three giant chipmakers aren’t embrac-

ing 450mm as avidly as they did a little while

ago, but that doesn’t mean 450mm is dead and

buried. At SEMICON West, the new Semicon-

ductor Technology Symposium will include a

450mm Technology

Development Up-

date on Thursday

morning, July 10, in

Moscone North.

Executives of

the G$50C will be

among the speak-

ers at that session.

Earlier this year, at

the SEMI Industry

Strategy Sympo-

sium, Paul Farrar,

general manager of

the G450C consor-

tium, said early work

has demonstrated

good results and that

he sees no real barri-

ers to implementing

450mm wafers from a technical standpoint.

Farrar showed impressive results from, etch,

CVD, PVD, CMP, furnaces, electroplating, wet

cleans and lithography processes and said the

inspection/metrology tools were in place to

measure results. “I don’t believe we will find

fundamental technology limiters,” he said.

“But we will have to keep working to find ways

to maximize the efficiency.”

G450C and its related group, the Facility

450 Consortium, formed a year ago, continue

their operations at the College of Nanoscale

Science and Engineering in Albany, N.Y., part

of the State University of New York system.

Also presenting in today’s STS session will

be Hamid Zarringhalam, Executive Vice Presi-

dent at Nikon Precision. He notes that “When

looking at advanced lithography system de-

velopment–450 mm scanners must simulta-

neously satisfy the aggressive performance

requirements for scaling (imaging, overlay,

focus, etc.) and the wafer size transition (pro-

ductivity, cost, and footprint). While there are

questions regarding how lithography tooling

benefits from the wafer size transition, Nikon

is taking full advantage of this opportunity to

build the next-generation tool platform with

an emphasis on 450 mm productivity enhance-

ments and performance innovation.”

So, although no real technical barriers are

seen, the 450mm transition seems to be on life

support for now, unless and until chipmakers

with big capital-expenditure budgets give it

the green light.

450mm: No Technical Challenges but Questions AboundBY JEFF DORSCH

A 450mm wafer is more than double the size of a 300mm wafer.

Ribbon CuttingKicking off SEMICON 2014 with the ceremonial ribbon-cutting cer-

emony (left to right): Karen Savala, president of SEMI North Ameri-

cas; Mark Adams, President, Micron and opening keynote speaker;

André-Jacques Auberton-Hervé, chairman, CEO and president of

Soitec, and chairman of the SEMI Executive Committee; and Denny

McGuirk, president and CEO of SEMI.

MOSCONE CENTER | SF, CA

4

Research forms the DNA of the semiconductor

industry — few other industries invest as much

as a percentage of revenue. Semiconductor

research has always driven the Moore’s Law

Mantra of continuously making things “cheap-

er, better, faster, and smaller.” This brought

the industry into the realm of nanotechnol-

ogy, where manipulation of just a few atoms

yields complex quantum effects. This requires

multi-faceted innovation — in materials, pro-

cessing and characterization techniques, and

advanced patterning to fabricate these tiny

devices. To explore the various dimensions

of this innovation, SEMICON West 2014 fea-

tures a session on “Breakthrough Research

Technologies.”

Dr. Thorsten Lill from Lam Research, who

will present at this session, explains, “As de-

vice dimensions and their allowed tolerances

approach the same order of magnitude as inter-

atomic distances, atomic scale processing will

soon be a necessity. We will discuss the frame-

work of developing production-worthy atomic

layer etch (ALE) to achieve layer-by-layer re-

moval with atomic fidelity.” This is nanotech-

nology at its best — where we are engineer-

ing materials by each atomic layer. Precision

engineering also requires precision simulation

and modeling, as Dr. Peter Ventzek of Tokyo

Electron will describe for plasma chemistries

used in etching and other processes.

We also need novel techniques to charac-

terize materials at the atomic level. Dr. John

Mardinly of ASU, also presenting at this

session, describes one such technique: “Ab-

erration-Corrected Transmission Electron

Microscopy provides numerous advantages

over conventional Field-Emission Trans-

mission Electron Microscopes. Resolution

is improved by 2-3 times, and imaging and

analysis can be conducted with lower accel-

erating voltages so that specimen damage is

reduced.” In conventional bright field imaging,

delocalization is eliminated so that interfaces

between materials are imaged precisely. In

Scanning Transmission Electron Microscopes,

the beam current density can be 8-10 times

higher than in a convention Field-Emission

Scanning Transmission Electron Microscope.

This dramatically improves the visibility of fea-

tures and enables chemical mapping through

Electron Energy Loss Spectroscopy (EELS)

or Energy-dispersive

X-ray Spectroscopy

(EDS) with atomic

resolution.”

Aside from tech-

nology drivers, new

market forces are

now re-shaping the

industry: the rise of

the individual con-

sumer as the domi-

nant end-user; the

application of tech-

nology to diverse

fields such as energy,

transportation and

healthcare; and the

rapid proliferation of the Internet of Things.

These entail complex functionality, which of-

ten requires complementing nanoscale digital

devices with “More-than-Moore” functions

like biological sensors, better analog and

power devices other silicon. Prof. Oliver Brand

will describe research advances in the “More-

than-Moore” areas of chemical microsensors,

inertial sensors and micromachined ultrasonic

transducers at the Center for Microelectrome-

chanical Systems (MEMS) and Microsystem

Technologies on the Georgia Tech campus.

This multi-dimensional, fast-paced re-

search requires academia, research institutes,

and the industry to work closely together, not

just to push the research, but also to imple-

ment it in the “real world” successfully. Prof.

Douglas A. Keszler from OSU will describe

how the Center for Sustainable Materials

Chemistry focuses on breakthrough research

to enable next-generation capabilities in semi-

conductor and display manufacturing, high-

lighting the technologies of spin-outs Inpria

and Amorphyx. Dr. Michael Khbeis of the

Washington Nanofabrication Facility (WNF)

at the University of Washington will describe

advances in packaging/3D integration, silicon

photonics, magnetic materials, superconduc-

tivity, photovoltaics, and quantum informa-

tion systems.

It is exciting to imagine what capabilities

such breakthrough research will enable in the

future. From cramming more than a billion

electronic transistors on a thumbnail, decod-

ing the human genome, and placing a powerful

computer in everyone’s pocket, how will tech-

nology change the world? Besides richer com-

puting, communications, and entertainment,

we can now also tackle large and meaningful

topical challenges, such as climate change,

energy and water conservation, implementa-

tion of renewables, and affordable, effective

healthcare. Information Technology and the

Internet of Things are already making a dent

in these challenges and enabling research as

discussed will accelerate this and help us im-

prove our lives and our planet.

University and research institutions are

increasingly important to help accelerate

technology advances. Learn more about the

latest — from speakers working in research

at Arizona State University, Georgia Institute

of Technology, Lam Research/KU Leuven/

imec Joint Project, Oregon State University,

TEL, U. of Washington — at the Breakthrough

Research Technologies session at SEMICON

West 2014.

Research underway at Georgia Institute of Technology.

Breakthrough Research in the Semiconductor IndustryBY PUSHKAR P. APTE

SHOW DAILY 5SHOW DAILY

Intel, Samsung Electronics, and Taiwan Semi-

conductor Manufacturing have made their

moves into three-dimensional semiconduc-

tors. Now it remains to be seen how the rest

of the semiconductor industry will make the

transition to 3DICs.

It’s not going to be another dimension

shrink, by any means. As difficult as the transi-

tion to fabrication with 28-nanometer features

was for many chipmakers (and remains so for

many second-tier semiconductor manufactur-

ers), that scaling shift will seem like child’s

play as integrated device manufacturers and

silicon foundries deal with silicon interposers,

through-silicon vias, and other accoutrements

of the 3D chip world.

Yole Développement estimates the value of

semiconductors with TSVs in 3DIC and 3D wa-

fer-level chip-scale packages – including ambi-

ent light sensors, CMOS image sensors, power

amplifiers, and inertial and radio-frequency

microelectromechanical system devices – was

$2.7 billion in 2012. It forecasts that such chips

will represent 9 percent of the semiconductor

market in 2017, with nearly $40 billion in value.

Transparency Market Research has a more

modest forecast for 3DICs. It estimates the

value of 3D chips in 2012 was $2.4 billion and

will rise at a compound annual growth rate of

18.1 percent over the next five years, hitting

$7.52 billion in 2019.

“Customers like to scale their devices for

greater performance or better battery life,”

says Brian Trafas, chief marketing officer of

KLA-Tencor. “They’re moving

from 2D to 3D.”

“The logic leader” (generally

known as Intel) made its move at

the 22-nanometer process node,

Trafas notes, while “the foundry

leader” (that would be TSMC) migrated to 3D

at 16nm, Trafas notes. In advanced 3D memory

chips, “one leader is out front,” he says, an-

nouncing that its wafer fabrication facility in

China is producing 3D NAND flash memories

(that’s Samsung).

As the technology leaders enter the brave

new world of 3D chips, “we do now see some

spending for 14- and 16-nanometer by found-

ries,” Trafas says.

Making 3DICs calls for multiple patterning

in photolithography and “more process steps,”

the KLA-Tencor executive says, which is good

for sales of process control equipment. “The

logic leader” experienced yield issues when

it started making 3D chips, and “we’re seeing

the same thing with foundries,” Trafas says.

“It’s very challenging.

“It’s somewhat like 28-nanometer. It’s typi-

cal of what you see at all new nodes,” he adds.

Despite the challenges in defects and yield

with 3DICs, “it should be successful,” Trafas

concludes.

At SEMICON West, 3DICs are under

discussion in several forums, including the

TechXPOT programs in Moscone Center’s

North and South halls.

3DICs Have Finally ArrivedBY JEFF DORSCH

“�We�do�now�see�some�spending�for�14-�and�16-nanometer�by�foundries.”

Accurate and reliable position feedback is essential—accuracy and reliability at an unrivalled size; a world � rst.

The new ATOM™ optical encoder is the world’s � rst miniature encoder with � ltering optics, bringing you leading-edge dirt immunity and signal integrity.

And with class-leading speed, Atom has you in the starting block towards building uncompromising motion systems in space-critical applications.

■ Long-term signal stability Auto Gain Control (AGC) and Auto Offset Control (AOC)

■ Comprehensive range Linear and rotary scales: 20 μm and 40 μm pitch

■ Ultra-compact readhead 6.7 x 12.7 x 20.5 mm

■ Quick & easy readhead installation Built-in set-up LED and auto CAL routine enable faster optimization

New!—Miniature optical incremental encoder system

cmyk

ATOM™

The building block of motion systems

Accurate and reliable position feedback is essential—accuracy and reliability at an unrivalled size; a world � rst.

The new ATOMminiature encoder with � ltering optics, bringing you leading-edge dirt immunity and signal integrity.

And with class-leading speed, Atom has you in the starting block towards building uncompromising motion systems in space-critical applications.

New!—Miniature optical incremental encoder system

ATOM

Renishaw Inc Hoffman Estates, IL www.renishaw.com/ATOM

(actual size)

See us atBOOTH #520

AtomAd SemiconShowDaily.indd 1 6/30/14 10:22 AM

MOSCONE CENTER | SF, CA

6

conductor industry is seen growing 5 percent

to 10 percent in 2014, and noted that all world

regions posted growth in sales during May, a

statistical factor not recorded

since August 2010.

Discussing expenditures

on capital equipment, Da-

vis said, “The nature of the

spending is changing.” The

number of new wafer fabs

has dwindled in recent years,

and more spending is direct-

ed these days to upgrading

existing fabs.

2015 promises to be the

biggest year for semicon-

ductor equipment spend-

ing since 2000, Davis said.

While the equipment mar-

ket is growing more than 20

percent this year, the semiconductor materials

market will see more modest growth in 2014,

at 6 percent, he added.

Karen Savala, the president of SEMI Ameri-

cas, reviewed economic and technology trends

in the equipment and materials business dur-

ing Monday’s SEMI press conference. The

industry has gone through “one of the largest

consolidation periods in our history,” includ-

ing the pending blockbuster merger between

Applied Materials and Tokyo Electron Ltd.

(TEL), she noted.

The longstanding economics of Moore’s

Law is being challenged, she added. The In-

ternet of Things is a tremendous opportunity

for the chip-making business, yet it doesn’t

involve leading-edge technology, Savala said.

“Traditional node scaling seems to be slow-

ing,” she observed. Scaling is apparently de-

celerating below the 32-nanometer process

node, according to Savala,

but it may be advanced with

the introduction of new ma-

terials, new substrates, and

2.5D/3D packaging.

SEMI now forecasts that

wafer processing equipment

will grow 22.7 percent in

2014 to $31.12 billion, from

$25.36 billion in 2013, and

advance 11.9 percent more

in 2015 to $34.81 billion. Test

equipment is expected to see

a 12.5 percent increase this

year to $3.06 billion and pick

up by 1.6 percent next year to

$3.11 billion. Assembly and

packaging equipment is forecast to reach $2.52

billion in 2014, an 8.6 percent improvement

from last year, and growing 1.2% in 2015 to

$2.55 billion. Other equipment categories will

be up 22.5 percent this year to $1.74 billion

and up 21.8 percent next year to $2.12 billion.

SEMI 2014 mid-year equipment forecast.

Forecast� continued from p 1

for example, used Microsoft BI solutions to

improve operational agility and was reportedly

able to reduce resource support work needed

by 90 percent. Samsung, he reported, analyzed

10 times more data to make more efficient deci-

sions about energy management, using trend

statistics and histograms – decreasing their

costs by 75 percent.

“Given the explosion of the Internet of

Things, all of our equipment can be connected,”

said Mr. Ravi. “This means gathering big data

from embedded devices and transforming big

data into business information and insight.”

The implications are mind-boggling: manu-

facturers could anticipate production disrup-

tions remotely and take corrective action any-

time, anywhere.

And if that wasn’t enough to capture his

audience’s imagination, Mr. Ravi also shared

the Smart Elevator project Microsoft has in de-

velopment. When used in an office setting, the

Smart Elevators have the ability to learn office

workers behaviors and analyze their Cloud-

based work schedules to know 1) if they need

to get on the elevator as they approach it and

2) where they will need to go once they get on

the elevator. The result is a completely button-

less elevator, an elevator that anticipates your

schedule and is there right when you need it.

Whether it’s leveraging big data or Smart

Elevators, the connected workplace isn’t sci-

ence fiction: it’s possible and its potential is

undeniable.

Ravi� continued from p 1

Sanjay Ravi, Microsoft

Show�Daily�StaffPublished by Tradeshow Media Partners and Extension Media in partnership with SEMICON West.

Tradeshow Media PartnersMark LarsonPublishermark@tsmpartners.com

Extension MediaVince RidleyPublishervridley@extensionmedia.com

Kevin ClarkeLayout and Designkevin@tsmpartners.com

SEMIMichael DroegerDirector, Global Marketingmdroeger@semi.org

Pete SingerEditorpsinger@extensionmedia.com

Jeff DorschContributing Editorjdorsch@austin.rr.com

Ed KorczynskiContributing Editoredk@extensionmedia.com

Shannon DavisContributing Editorsdavis@extensionmedia.com

SHOW DAILY

THURSDAY | JULY 10, 2014

7SHOW DAILY

Everybody loves FinFETs!

Well, not everybody, really, is behind dou-

ble-gate or multiple-gate field-effect transis-

tors. There is a camp in the semiconductor

industry making the case for the leading al-

ternative, using fully-depleted silicon-on-

insulator technology. On balance, however,

most chipmakers are betting on the chips with

the tiny “fins.”

There’s also some disagreement and fudg-

ing on what is and isn’t a FinFET process. It’s

not a precisely defined term for many people.

Intel, for instance, was a leader in implement-

ing the architecture, but it doesn’t use the word

“FinFET,” preferring to describe its architec-

ture as a “3-D Tri-Gate transistor.”

Intel started using the Tri-Gate architecture

at the 22-nanometer process node and now is

employing it at 14nm.

Taiwan Semiconductor Manufacturing, the

world’s largest pure-play silicon foundry, is

using FinFETs at the 16nm process node. The

foundry has introduced its 16nm FF+ process,

a second-generation FinFET technology.

“Most of the major manufacturers are doing

FinFETs,” says Aaron Thean, vice president of

process technology and director of logic de-

velopment at imec. “Everyone is transition-

ing to FinFETs. The industry is moving in that

direction.”

Brian Trafas, chief marketing officer of

KLA-Tencor, says, “Most companies chose

FinFET.” With his company’s emphasis on

process control and yield management, KLA-

Tencor knows about some of the struggles in

implementing FinFET architectures. There is

some residual contamination with the etch-

ing and cleaning process steps, according to

Trafas. This often takes the form of “very small

residue on the sidewall of fins,” he says.

What about fully-depleted silicon-on-in-

sulator? “FD-SOI can help with some of the

scaling,” Trafas says. It is, however, what he

describes as “a niche area.”

STMicroelectronics has been the industry

champion of FD-SOI technology, and that’s

been a lonely position, for the most part, al-

though it continues to collaborate with CEA-

Leti and Soitec on implementing the technol-

ogy. GlobalFoundries committed to using ST’s

FD-SOI tech for 28nm and 20nm production

in 2012, and expects to put it into volume pro-

duction by the end of this year, for 28nm and

14nm processes.

In May, STMicroelectronics announced

that Samsung would use ST’s 28nm FD-SOI

tech for foundry customers. Samsung plans to

offer the process in early 2015.

“The agreement [for 28nm FD-SOI] con-

firms and strengthens further the business

momentum that we have experienced on this

technology,” ST Chief Operating Officer Jean-

Marc Chery said. “We foresee further expan-

sion of the 28nm FD-SOI ecosystem, to include

the leading EDA and IP suppliers.”

Meanwhile, process technologists are plan-

ning for FinFETs at 10nm, 7nm, and 5nm. Be-

yond that, it’s anyone’s guess what architecture

will prevail.

FinFETs and FDSOI Provide OptionsBY JEFF DORSCH

IPG Microsystems+1 (603) 518-3200sales.ipgm@ipgphotonics.comwww.ipgphotonics.com

Focused or Shaped Beam, Galvo Scanner

Thermal Cutting Head

Drilling & Cutting for Silicon, Sapphire, Ceramics

The IX-280-ML provides maximum micromachining flexibility by supporting up to two laser types in a single workstation. Each laser is equipped with its own beam delivery system appropriate for the application.

Expect More From Your Micromachining Tool

Visit IPG Microsystems at Semicon:

Booth 1345Advances in Laser Micromachining

Applications

Cross Section: 0.3 mm thick

Cross Section: 1 mm thick

LLO, Annealing, and Thin Film Patterning

Low Cost of Ownership

Flexible: 2 Lasers in 1 Micromachining Tool

Integration of IPG Fiber Lasers

Selective Material Removal, 3D Micromachining

IX-280-ML Features

MOSCONE CENTER | SF, CA

8

The introduction of new materials, such as

III-Vs, into high-volume manufacturing of

semiconductors, likely will occur sometime

around the 7nm and/or 5nm nodes. III-V’s

introduction, along with the potential tran-

sition to 450mm wafers, and the increasing

expansion of global regulatory requirements,

will heighten environmental, health and safety

(EHS) concerns that must be addressed as the

industry goes forward. The Sustainable Man-

ufacturing Forum, held in conjunction with

SEMICON West 2014, features experts

in the manufacture of semiconductors, micro-

electronics, nanoelectronics, photovoltaics,

and other high-tech products.

One of the Sustainable Manufacturing Fo-

rum speakers, Richard Hill, Technology Infra-

structure manager at SEMATECH, will discuss

how the addition of III-V materials into the

high-volume manufacture of semiconductors

will bring sustainability issues to the forefront,

primarily driven by the toxicity of arsenic that is

used in much greater quantities in III-V produc-

tion. Challenges include wastewater treatment,

toxic gas detection control and abatement, and

the need for robust protocols to ensure opera-

tor and maintenance personnel safety. Hill will

speak at the Next Generation Eco Fab session

Wednesday, today.

SEMATECH recently completed a joint

study of III-V EHS challenges with the College

of Nanoscale Science and Engineering (SUNY

CNSE). The assessment consisted of running

300mm wafers through a representative 5nm

III-V process flow (Figure 1). (Many semicon-

ductor industry experts agree that III-V materi-

als will enter the process flows in high volumes

at 5nm.) Among the processes that will pose

the greatest challenges with respect to III-V

materials are MOCVD, CMP, wet etch/clean,

dry etch, and film deposition. The project was

heavily focused on understanding the levels

of arsenic that would be present in wastewa-

ter, as well as loading of other III-V materials.

The impact of III-V outgassing that could occur

during processing and the amounts of gases

that could be released when a tool is opened

for maintenance were of particular interest in

the project.

Among the high-level challenges associ-

ated with wet etch are the potential for arsine

and phosphine outgassing (during process-

ing). “Wet etch tools are designed to have a

controlled environment,” said Hill, “but they

are not like high-vacuum systems that are de-

signed to contain toxic gases.” Hill told SEMI

that if the exhaust system fails during the

processing of a wafer, it is critical to know the

risks and ensure mitigation. The SEMATECH/

CNSE project looked at a range of different

chemistries and identified those that are low

risk for arsine and phosphine generation (and

therefore, a low risk of outgassing) and those

that had a high risk of outgassing. The low risk

chemistries are, naturally, the ones that the

industry should try to design into a III-V flow.

The joint project also evaluated the III-V

loading in wastewater from the wet etch pro-

cess. “There were measurable quantities of

arsenic in the waste stream,” said Hill. Though

he added that while the levels weren’t signifi-

cantly high, some treatment of the waste water

would have to be done depending on what’s

allowable within local discharge limits and per-

mits. With the industry looking ahead to 5nm

and already designing the fabs of the future,

Hill believes that these results will be impor-

tant for specifying wastewater treatment.

The joint SEMATECH/CNSE project also

evaluated the wastewater stream from the burn

wet scrubber when III-V materials are used in

a contact etch (dry) process. The study found

measurable arsenic in the wastewater. “Fabs

of the future will need wet treatment facilities

for arsenic and indium,” Hill told SEMI. “In

recent years, concerns about indium have been

elevated, and we believe that tighter restric-

tions on it will be introduced in the future.”

Chamber clean is also critical when etching

(dry) III-V materials. “If you don’t do the right

type of cleaning regimen, you could have next-

Industry Sustainability Efforts Mount with III-Vs and other Advanced TechnologiesBY DEBRA VOGLER, SEMI

Example 5 nm III-V flow: key ESH challenges

1

III-V MOCVD • Pyro/toxic chemistry • MOCVD abatement • Post epi AsH3/PH3 outgassing

CMP • AsH3/PH3 outgassing • Waste water treatment

Dry Etch • Vac system contamination • Abatement & waste water treatment

Wet Etch & Clean • AsH3/PH3 outgassing • Waste water treatment

Film Deposition • Outgassing, contamination • Abatement & waste water treatment

Figure�1. Example 5nm III-V flow: key ESH challenges. SOURCE: SEMATECH continued on p 10

SHOW DAILY

THURSDAY | JULY 10, 2014

9SHOW DAILYSCW14-ED_Jpn14_PQ.pdf 1 6/12/14 3:33 PM

Logitech demonstrates Tribo CMP SystemLogitech’s Tribo system offers nano-

meter level material removal capability

on either individual die or wafers up to

100mm diameter. This CMP solution is

suitable for a wide variety of wafer/

substrate materials used in todays de-

vice fabrication processes. The Tribo

CMP system has been designed from

the ground up to achieve the highest

possible standards of processing con-

trol. This benchtop solution is ideal for

research of wafer processes, including

their associated wafer, pad and slurry

interactions. This highly versatile so-

lution achieves industry standards in

control and layer removal for CMP

while producing laser quality surfaces

(0/0 scratch dig) and Ra to subnano-

meter levels. Logitech is in Booth 429.

YES ovens for proper curing of polyimide layersThe YES-VertaCure automated, high

temperature cure series of ovens is

designed for today’s most advanced

MEMS and semiconductor process ap-

plications (including WLP and RDL).

Up to 50 wafers (200mm or

300mm) are loaded into a stainless

steel cassette-type rack on the oven

chamber door and, when loading is

complete, it is lifted into the vacuum

chamber. Yield Engineering Systems

is in Booth 1228.

MOSCONE CENTER | SF, CA

10

wafer contamination.” Additionally, without

the proper protocol, maintenance personnel

could be exposed to arsine or phosphine when

the chamber is opened, depending on the pro-

cess. The cleaning protocol is highly dependent

on the type of etch being done, and each type

could have different requirements.

For Hill, the key takeaway from the joint

evaluation was that, while there are risks

when processing III-V materials, there are no

showstoppers — solutions can be engineered.

“People should take these risks seriously, but

they shouldn’t be scared off by them,” said Hill.

Sustainability and the Role of Collaboration and StandardsSteve Moffatt, CTO, Front-end Equipment at

Applied Materials (also a speaker at the Next

Generation Eco Fab session at the Sustainable

Manufacturing Forum at SEMICON West),

told SEMI that many established procedures

for dealing with arsine and phosphine already

exist. He views the efforts by the industry going

forward as one of accurately quantifying the

size and scope of the problem. “The methods

are in place, but the absolute quantities of III-

Vs will be substantially higher,” said Moffatt.

Additionally, other emissions (e.g., PFCs)

that are well regulated and generally under-

stood, will see an increase in the quantities as

a result of more layers being processed for 3D

chips. Even the potential transition to 450mm

wafers will figure into the industry’s need for a

more accurate scope of the EHS challenges in-

volved. The increase in wafer size will naturally

lead to larger manufacturing equipment noted

Moffatt and that, in turn, will drive increases in

energy, water, and process chemical consump-

tion at both the tool and fab levels.

As regulatory pressure increases on a global

scale, the situation also becomes more com-

plex. Beyond the use of new materials such as

III-Vs and nanomaterials, Moffatt commented

that new methods of energetics (i.e., ways of

putting energy into a processing system) will

require very careful and close assessment of

the risk control measures. Another sustain-

ability issue arises

from the basic fact

that, as opposed to

the highly prevalent

element of silicon

in the earth’s crust,

many of the newer

materials being used

in higher quantities

for semiconductor

manufacturing (e.g.,Ga, As, etc.) are much less

abundant. These exotic materials, of necessity,

must be handled in the most efficient of ways.

Going forward, there will be increased

regulatory pressure to reduce a fab’s car-

bon footprint and produce more sustainable

products. Moffatt says the industry can ex-

pect more pressure to reduce greenhouse gas

(GHG) emissions along with adhering to con-

flict minerals regulations and managing EHS

concerns throughout the entire life-cycle of a

product (Figure 2). “One company can’t do it

on its own, it’s a life-cycle consideration,” said

Moffatt. “If we have the right collaboration

together, we have a greater probability with

the right kinds of standards of bringing good,

effective green chemistry solutions to high-

value problems.”

Regarding standards activities on energet-

ics, Moffatt pointed to ongoing collabora-

tion and hazard assessment between SEMI,

SEMATECH and other industry groups. “We

will need to continually evaluate the need for

additional standards activities — both new

and updates — in addition to industry collabo-

ration on “Green” chemistry,” said Moffatt.

“As a starting point, sustainability concerns

could be built into the initial assessment of

new chemicals and processes, which will

begin the discussion and raise awareness of

these issues.”

Hill (SEMATECH) and Moffatt (Applied

Materials) will be joined by speakers from

IMEC, Intel, Samsung, Air Products, and MW

Group at the “Next Generation Eco Fab” ses-

sion of the Sustainable Manufacturing Forum.

Figure�2. Consensus building in multi-stakeholder life-cycle risk assessment of manufacturing technology and products. SOURCE: Applied Materials (used with permission of ITRS)

Sustainability� continued from p 8

“Wet�etch�tools�are�designed�to�have�a�controlled�environment,�but�they�are�not�like�high-vacuum�systems�that�are�designed�to�contain�toxic�gases.”

—RICHARD�HILL,�SEMATECH

Join an exclusive group of influential executives involved in purchasing the total spectrum of equipment, materials and services necessary for semiconductor manufacturing.

Owned & Produced by: Presented by:

Solid State Technology’s Annual Conference & Networking Event

JOIN US AGAIN IN 2015!

Encore at the Wynn Las Vegas

May 19-22,

2015

BOOK YOUR SPONSORSHIP BY JULY 31st AND SAVE 15%

www.theconfab.com

MOSCONE CENTER | SF, CA

12

Technology innovation isn’t slowing down. But

its steady acceleration isn’t happening spon-

taneously, and Tuesday’s Silicon Innovation

Forum keynote from Professor of Innovation

Dr. Bob Metcalfe outline how he believes to

effectively drive the complex cycle that is mod-

ern-day innovation.

“Change in itself is not improvement – the

crux of the matter is in innovation manage-

ment,” said Dr. Metcalfe. “Ideas are a dime a

dozen, and most are bad ideas.”

When it comes to innovating, Dr. Metcalfe

has a lengthy resume to prove he knows what

he’s talking about: Internet pioneer, inventor

of Ethernet, co-founder of 3Com Corpora-

tion, publisher-CEO of IDG/Info-World – his

credentials are seemingly endless. So, when

he began to explain the ecology he believed

needed to develop the most effective innova-

tion system, his audience sat up and took notes.

Dr. Metcalfe explained that, in his experi-

ence, the most effective, successful innova-

tion ecology is comprised of seven key players:

funding agencies, research professors, gradu-

ating students, scaling entrepreneurs, venture

capitalists, strategic investors, and early adopt-

ers. In discussing funding agencies, he also ad-

dressed the sometimes-sticky role of research

universities in driving innovation.

“Are research universities up to it? Are they

up to doing our research for us?” he mused.

“They’re not well-managed; they’re heavily

governed – we need to keep universities com-

peting with each other and that will improve

their management.”

“Universities don’t like it when I say that,”

he joked.

Research universities are also up against

a new kind of challenge, he pointed out – the

growing popularity of online campuses. Dr.

Metcalfe said that the affect of this on universi-

ties’ abilities to effectively carry out research

has yet to be seen, but it certainly something

that manufacturers ought to consider when

discussing partnerships with research univer-

sities in the future.

Dr. Metcalfe also suggested that giving IP

to researching professors or students, the true

inventors, might provide added incentive for

increased participation in research programs

at institutions.

So, where will the next great innovation be?

Dr. Metcalfe said he, albeit biasedly, supports

more innovation in networking, but encour-

aged the audience to seriously consider pursu-

ing entirely new and crucial forms of innova-

tion, such as making solar energy affordable.

“The world’s most important problems

will not be solved by yet another website,” said

Dr. Metcalfe. “We need to address how to get

this new generation to think about innovating

things that matter.”

SEMI announced this week that Martin An-

stice, president and CEO, Lam Research

Corporation; Kevin Crofton, president and

COO, SPTS Technologies; Tien Wu, COO,

ASE Group; and Guoming Zhang, executive

vice president, Sevenstar Electronics, were

elected as new directors to the SEMI Interna-

tional Board of Directors in accordance with

the association’s by-laws.

Six current board members were re-elected

for a two-year term: Nobu Koshiba, president

and representative director, JSR Corporation;

Yong Han Lee, chairman, Wonik; Sue Lin, vice

chairman, Hermes Epitek; Toshio Maruyama,

chairman, Advantest Corporation; Tetsuo

Tsuneishi, vice-chairman of the board, Tokyo

Electron, Ltd.; Natsunosuke Yago, president

and representative director, chairman of the

board, Ebara Corporation.

Additionally, the SEMI Executive Com-

mittee confirmed the continued leadership by

André-Jacques Auberton-Hervé, chairman,

CEO and president of Soitec, as SEMI chair-

man and Yong Han Lee, chairman of Wonik,

as SEMI vice-chairman.

The leadership appointments and elected

board members’ tenure becomes effective at the

annual SEMI membership meeting, to be held

Wednesday, July 9, during the SEMICON West

2014 exposition in San Francisco, California.

“We are honored to have four distinguished

industry leaders joining the SEMI Board and

appreciate the continued service of those that

have been reelected,” said Denny McGuirk,

president and CEO of SEMI. “The SEMI Board

reflects the regional and market diversity of

our worldwide membership. Their service,

commitment and leadership are tremendous

assets for our association and our industry.”

SEMI’s 20 voting directors and 11 emeritus

directors represent companies from Europe,

China, Japan, Korea, North America, and Tai-

wan, reflecting the global scope of the associa-

tion’s activities.

How to Drive and Motivate Modern-day InnovationBY SHANNON DAVIS, WEB EDITOR

SEMI Announces New Board Elections and Leadership Appointments IPG Photonics

Micromachining WorkstationIPG Microsystems (Booth 1345) is show-

ing the new IX-280-ML system which

provides maximum micromachining

flexibility by supporting up to two la-

ser types in a single micromachining

workstation. The system combines a

Class-1 workstation including part-han-

dling stages, vision systems and control

electronics, integrated with either one or

two lasers. Each laser is equipped with

its own beam delivery system appro-

priate for the application, with options

including fixed focused beam, fixed

shaped beam, scanning galvanometer,

and thermal cutting heads. Both fiber-

delivery and free-space laser types are

supported. Applications include R&D,

where extreme equipment flexibility is of

paramount importance, and production

applications where both very fine mi-

cro machining, and also thicker-material

micromachining functions are required.

The leader in covering semiconductor manufacturing and packaging technology, materials, products and news for over 50 years provides the same level of expertise and insides to decision makers for MEMS, displays, LEDs and power electronics manufacturing - in our magazine, seven e-Newsletter, comprehensive website and at The ConFab Conference and Networking event.

SEMICONDUCTORS

ADVANCED PACKAGING

MEMS

LEDS

DISPLAYS

POWER ELECTRONICS

Request your free subscription today, and see why electronics manufacturing professionals worldwide trust Solid State Technology

www.Solid-State.com

MOSCONE CENTER | SF, CA

14

Solid State Technology and SEMI yesterday

announced the recipient of the 2014 “Best of

West” Award — Nikon Corporation — for its

NSR-S630D Immersion Scanner. The award

recognizes important product and technology

developments in the microelectronics supply

chain. The Best of West finalists were selected

based on their financial impact on the industry,

engineering or scientific achievement, and/or

societal impact.

Nikon has clearly demonstrated leadership

with ArF immersion tools, particularly in the

area of 450mm.

At SEMICON West this week, a collection

of the first fully patterned 450mm wafers —

using a Nikon immersion lithography tool —

were on display at the newly merged SUNY

CNSE/SUNYIT exhibit, booth 517, located in

the Moscone Center’s South Hall.

The Nikon immersion scanner will join

existing 450mm infrastructure at the Albany

NanoTech Complex in April of 2015 in accor-

dance with the project timeline. This critical

milestone will enable G450C founding mem-

bers and CNSE to perform 10nm and below,

full wafer photolithography, while optimizing

tool configuration and performance.

The Best of West award-winning NSR-

S630D ArF Immersion Scanner leverages the

well-known Streamlign platform, incorpo-

rating further developments in stage, optics,

and autofocus technology to deliver unprec-

edented mix-and-match overlay and focus

control with sustained stability to enable the

10/7 nm node. The Nikon Corporation booth

is in South Hall, Booth 1705.

Nikon Precision Executive Vice President,

Hamid Zarringhalam, commented that “Nikon

Corporation is honored to receive this presti-

gious award. Our global Nikon team continues

to extend immersion technology with innova-

tive solutions like the NSR-S630D to meet our

customers’ aggressive next generation produc-

tion requirements. This award caps off an ex-

citing SEMICON for us, following the CNSE/

SUNYIT announcement of the Nikon delivery

of the world’s first fully patterned 450mm im-

mersion wafers.”

The NSR-S630D leverages established

immersion technology, while incorporating

key innovations to deliver MMO capabilities

below 2.5 nm and throughput greater than 250

wafers per hour, in addition to critical overlay

and focus “sustained stability.”

Six speakers discussed developments in de-

signing and manufacturing silicon photon-

ics devices in a TechXPOT North session on

Wednesday morning.

Attendees heard from representatives of

IBM, Oracle, Compass-EOS, Luxtera, CEA-

Leti, and Aurrion.

IBM’s Jean Trewhella said her company has

been working on optical interconnect for a long

time, and “we’re moving the technology into

our Burlington fab.” In developing a “flexible

platform” for silicon photonics, IBM is shoot-

ing for bringing the cost down to 2.5 cents per

gigabit per second, she noted.

IBM designed built-in self-test into its sili-

con photonics devices, so it could do wafer-lev-

el test on the chips, Trewhella said. Fabrication

was slotted at Burlington, Vt.’s 200-millime-

ter wafer fabrication facility in the interest

of containing costs. Dimensions on the chip

fell into the range of 90 nanometers down to

65nm, according to Trewhella. “There is no

additional cost benefit from scaling photonic

components,” she said.

Working with IBM in silicon photonics is

Aurrion, a startup based in Santa Barbara,

Calif. Eric Hall, the company’s vice president

of business development, said Aurrion is in-

tegrating III-V semiconductors atop silicon

waveguides to develop large wavelength-di-

vision multiplexing arrays. Indium phosphide

and silicon chips are being employed in its

products, along with indium-gallium-arsenide

absorbers in its photodiodes.

“Integrating on silicon allows photonics to

leverage the cost/volume/yield of established

fabrication and packaging infrastructure,”

Hall said. He added, “Aurrion is hiring!”

The session also heard from Jack Cunning-

ham of Oracle, Shuki Benjamin of Compass-

EOS, Peter De Dobbelaere of Luxtera, and

Hughes Metras of CEA-Leti.

Solid State Technology and SEMI Announce the 2014 “Best of West” Award Winner

Development of Silicon Photonics Devices Discussed in ForumBY JEFF DORSCH

Intel’s experimental photonics chip can move data at 50Gbps.

Receiving the Best of West award: Holly Magoon, senior marketing manager, and Butch Berry, service order administration manager, Nikon Corporation.

Need a Materials Partner thatCan Solve Your Critical

Challenges Quickly?

It’s a Done Deal.▪ Yield-enhancing materials for advanced processes

▪ Local technical collaboration and support

▪ Leadership across the entire IC fabrication process

▪ Broad process knowledge and tailored solutions to solve critical technical challenges

▪ Advanced research, development and scale-up capabilities

▪ Global manufacturing and distribution

www.entegris.comEntegris®, the Entegris Rings Design®, Creating a Material Advantage®, ATMI® and the ATMI logo® are registered trademarks of Entegris, Inc.

©2014 Entegris, Inc. All rights reserved.

Go First Class: Go ClassOne.

If you work on 200mm or smaller substrates you don’t need to buy a big, expensive 300mm plating tool from the Big Guys. Because now there’s a smarter and much more a� ordable solution — called Solstice™. . . Solstice is a unique new electroplating tool that’s speci� cally designed for the world of smaller substrates. It gives you a cost-e� ective route from wet bench or development into volume production — and higher ROI!

Now: a cost-effective route to volume productionfor smaller-substrate applications...

Two Solstice models to choose fromSelect the Solstice LT for development — or the S8 for full cassette-to-cassette auto-mation, with touch-screen control, GEM/SECSII interface, full reporting and a great deal more. It will give you a major boost, not only in throughput — but also in quality, uniformity and reliability. So you can do more, and do it better, with fewer people.

First-class products from a new ClassOne company...In over a decade ClassOne Equipment has earned its reputation as the industry’s � rst-class provider of refurbished tools. Now a new sister company, ClassOne Technology, is extending the � rst-class tradition — creating innovative new tools to address important needs that have been underserved by the big manufacturers. So check out the new Solstice and see for yourself: It brings major new automation advantages without the big price tag. It really is “advanced plating for the rest of us!”

(406) 755-2200 • info@ClassOne.comSemicon West, Booth 511, South Hall

Solstice is a trademark of ClassOne Technology

INTRODUCING SOLSTICE: ADVANCED PLATINGFOR THE REST OF US!

Designed for 100-200MM apps. Half the Big Guys’ price!

ClassOne DailyNewsCov4.indd 1 6/19/14 11:24:16 PM