SHOCKWAVE INDUCED THIN FILM DELAMINATION (SWIFD): … notes/IOM/Presentation_LANE2016...SHOCKWAVE...

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SHOCKWAVE INDUCED THIN FILM DELAMINATION (SWIFD): A NON-THERMAL STRUCTURING METHOD OF FUNCTIONAL LAYER Pierre Lorenz, Martin Ehrhardt, Lukas Bayer, Klaus Zimmer Leibniz-Institut für Oberflächenmodifizierung e. V., Permoserstr. 15, 04318 Leipzig, Germany www.solarion.net LANE 2016 9 th Int. Conf. on Photonic Technologies SP 1: Short pulse processes September 19. – 22. 2016, Fürth, Germany

Transcript of SHOCKWAVE INDUCED THIN FILM DELAMINATION (SWIFD): … notes/IOM/Presentation_LANE2016...SHOCKWAVE...

SHOCKWAVE INDUCED THIN FILM DELAMINATION (SWIFD):

A NON-THERMAL STRUCTURING METHOD OF FUNCTIONAL

LAYER

Pierre Lorenz, Martin Ehrhardt, Lukas Bayer, Klaus Zimmer

Leibniz-Institut für Oberflächenmodifizierung e. V., Permoserstr. 15, 04318 Leipzig, Germany

www.solarion.net

LANE 2016 9th Int. Conf. on Photonic Technologies

SP 1: Short pulse processes

September 19. – 22. 2016, Fürth, Germany

2

Motivation

Set-up

Experimental results

Shockwave delamination of CIGS (SWIFD)

CIGS on PI substrate

CIGS on stainless steel

SWIFD of CIGS further dependency

Additional tension force

Confinement and laser spot size

Temperature

Conclusion and Outlook

Outline

3 1. Motivation

Selective structuring of multi-layer functional thin films using a laser-induced shockwave delamination process

• The microstructuring of thin films especially for electronic applications without damaging the layers or the substrate is a challenge for conventional methods. • Laser methods like laser ablation are on special interest.

4 1. Motivation

Selective structuring of multi-layer functional thin films using a laser-induced shockwave delamination process

Monolithic integrated interconnection

P1 P2 P3 P1 P2 P3

active area dead zone

• The Patterning of thin films especially for electronic applications without damaging the layers or the substrate is a challenge for conventional methods.

5 1. Motivation

Selective structuring of multi-layer functional thin films using a laser-induced shockwave delamination process

• The microstructuring of thin films especially for electronic applications without damaging the layers or the substrate is a challenge for conventional methods. • Laser methods like laser ablation are on special interest.

ADVANTAGE: fast, flexible, easy, and large area structuring DISADVANTAGE: laser-induced material modifications mostly due to the released heat; can be observed already at ultra short laser pulses • Alternative:

mechanically scribing SWIFD: shock-wave-induced thin-film delamination

6 2. Experimental Set-Up

7

10 µm

3. laser ablation

nanosecond picosecond femtosecond

5 µm

l = 248 nm, Dtp = 25 ns

SEM

• high ablation rate • strong molten modification

• moderate ablation rate • molten edge modification

• small ablation rate • molten edge mod.

l =1064 nm, Dtp = 10 ps l =775 nm, Dtp = 150 fs

5 µm

Summary of laser structuring at different pulse duration inclusive exemplary SEM images based on the CIGS sample produced at Solarion AG

(B) Martin Ehrhardt, Phys. Proc. 83 (2016)74-82

l =1550 nm, Dtp = 5 ns

(B)

• Stress-assisted laser lift-off delaminationB)

8 2. Experimental Set-Up

• available Laser

Excimer Laser Nd:YVO4

l [nm] 193, 248, 351 355, 532, 1064 780

25 ns 10 ps 150 fs

top hat profile

1064, 1550

Dtp

Fiber laser

nanosecond

1-600 ns

Gaussian profile Gaussian profile

picosecond

Ti:Al2O3

femtosecond

laser-induced shockwave delamination

laser ablation

Gaussian profile

9

N = 0 N = 1

laser Schematic illustration of the SWIFD process

4. SWIFD – CIGS on PI

sho

ckw

ave

pla

sma

plu

me

7.015.03.05104)( lbp

(1)

(A)

Polyimide

damping of the shockwave

pressure of the shockwave

10

N = 3 N = 4

laser

Schematic illustration of the SWIFD process

4. SWIFD – CIGS on PI

Summary SWIFD - CIGS solar cells on PI: grey: no effect on the front side; turquoise: instable region: unspecific delamination; green: delamination of CIGS including the ITO; yellow: delamination of the CIGS with damage of Mo; red: full penetration of the PI

11 4. SWIFD – CIGS on PI

(1) P. Lorenz et al., Appl. Surf. Sci. 336 (2015) 43

SEM and EDX images after the laser treatment ( ~ 2.8 J/cm², N = 1, A ~ 0.8 mm²)

SEM

ED

X

12 4. SWIFD – CIGS on PI

(2) P. Lorenz et al., Physics Procedia 56 (2014) 1015

Optical microscopic image

N = 4

N = 6

N = 8

top hat beam profile area A = 100 x 100 µm²

p = 57 MPa 82 MPa

(left) Summary of the irradiation results of the CIGS solar cells on PI (grey: no effect on the front side; turquoise: instable region: unspecific delamination; green: delamination of CIGS including the ITO front contact; yellow: delamination of the CIGS with damage of molybdenum back contact; red: full penetration of the PI). (middle) Optical microscopic image of the laser-treated CIGS solar cell at ~2.65 J/cm², N=4-8, (dark region: non-modified CIGS solar cell, bright region: uncovered Mo back contact) (right) Necessary remaining PI thickness d dependent on the laser fluence

~

2.6

5 J

/cm

²

13 4. SWIFD – CIGS on PI

(1) P. Lorenz et al., Appl. Surf. Sci. 336 (2015) 43

Shadowgraph images (~2.8 J/cm²) at different time delays Δ

Schematic illustration of the pump probe experiment used

Schematic summary of the different laser-induced effects

14 4. SWIFD – CIGS on PI

removal of material from the rear side of PI substrate

bending of the substrate delamination and “fly away” of the CIGS material

rear side shock wave formation process

(1) P. Lorenz et al., Appl. Surf. Sci. 336 (2015) 43

15 4. SWIFD – CIGS on stainless steel

Pulse number

4

9

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

Flu

en

ce [

J/cm

²] 270

257

222

173

129

84

57

(left) EDX images of the front side of a sample after the SWIFD process. (middle) magnified view of the delaminated area shown in the left images. (right) High resolution SEM image of the broken CIGS edge.

16 5. SWIFD – CIGS further dependency

5.1 additional tension force

5.2 Confinement

and laser spot size

5.3 temperature

17 5.2 Conefinement and laser spot size

103

104

105

0.1

1

10

without

H2O

fluence thre

shold

th [J/c

m²]

irradiated area A0 [µm²]

N = 1

with H2O

Schematic illustration of the set up used

CIGS delamination threshold th dependence on irradiated area A0 with and without confinement

flexible substrate

layer

SEM images of the front side of a rear side irradiated CIGS solar cell at different laser fluences and irradiated area A0 = d².

N = 1

18 5. SWIFD – CIGS further dependency

0.0 0.1 0.2 0.3 0.4

1.5

2.0

2.5

3.0

CIG

S d

ela

min

ati

on

th

resh

old

th

[J/c

m2]

normalized tension force Fn [N/mm]

N = 7

0 50 100 1500

1

2

3

4

5

6

7

8

= 3 J/cm²

= 2.8 J/cm²

= 2.5 J/cm²

Nth

temperature T [°C]

tension force Confinement temperature

103

104

105

0.1

1

10

without

H2O

fluence thre

shold

th [J/c

m²]

irradiated area A0 [µm²]

N = 1

with H2O

19 7. SWIFD – Theory

Ft

u

2

2

D

D

D

D

p

pcmJ

n

p

p

A

ttt

ttMPat

tb

tp

,00

095)(

²/8.2

l

12

0

0

)(

2

11)(

kk

Lc

tvkpvp

Schematic illustration of the used model

(a) Calculated deformation of the CIGS solar cells (b) Calculated bending-induced displacement Dz at (0,0) (c) Displacement of the “fly away” CIGS

(a) (b)

(c)

20 8. Conclusion and outlook

The shockwave delamination process allows the selective removal of the CIGS material from the Mo back contact at different substrates.

shockwave delamination laser ablation

+

-

thermal edge modification no thermal edge modification

fast structuring method + fast structuring method + low lateral precision

-

+ + fabrication of high efficient solar modules

fabrication of high efficient solar modules

The SWIFD process is especially suitable for thermal sensitive materials like OLED and

organic solar cells.

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We appreciate the support by the European Community's Seventh Framework Programme (FP7/2007-2013) under APPOLO project (grant agreement No. 609355) and the German Research Foundation (DFG) under grant ZI 660/12-1

Thank you for your attention!

AMSYS LTD. (tbd)

http://appolo-fp7.eu/