SGM3005 Ultra Low ON-Resistance, Low Voltage, Dual, SPDT ...cn.sg-micro.com/pdf/SGM3005.pdf ·...

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SGM3005 Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch MARCH 2017 – REV. E. 3 SG Micro Corp www.sg-micro.com GENERAL DESCRIPTION The SGM3005 is a dual, low on-resistance, low voltage, bidirectional, single-pole/double-throw (SPDT) CMOS analog switch designed to operate from a single 1.8V to 5.5V power supply. Targeted applications include battery powered equipment that benefit from low R ON (0.5Ω) and fast switching speeds (t ON = 50ns, t OFF = 15ns). The on-resistance profile is very flat over the full analog signal range. This ensures excellent linearity and low distortion when switching audio signals. The SGM3005 is a committed dual single-pole/ double-throw (SPDT) that consist of two normally open (NO) and two normally close (NC) switches. This configuration can be used as a dual 2-to-1 multiplexer. The SGM3005 is available in Green TDFN-3×3-10L and MSOP-10 packages. FEATURES Low Voltage Operation: 1.8V to 5.5V Low On-Resistance: 0.5Ω (TYP) Low On-Resistance Flatness -3dB Bandwidth: 15MHz Fast Switching Times t ON 50ns t OFF 15ns Rail-to-Rail Operation Typical Power Consumption (< 0.01μW) TTL/CMOS Compatible Microsize Packages APPLICATIONS Battery-powered, Handheld, and Portable Equipment Cellular/Mobile Phones Laptops, Notebooks, Palmtops Communication Systems Sample-and-Hold Circuits Audio Signal Routing Audio and Video Switching Portable Test and Measurement Medical Equipment

Transcript of SGM3005 Ultra Low ON-Resistance, Low Voltage, Dual, SPDT ...cn.sg-micro.com/pdf/SGM3005.pdf ·...

SGM3005

Ultra Low ON-Resistance, Low Voltage, Dual, SPDT Analog Switch

MARCH 2017 – REV. E. 3SG Micro Corp www.sg-micro.com

GENERAL DESCRIPTION The SGM3005 is a dual, low on-resistance, low voltage,

bidirectional, single-pole/double-throw (SPDT) CMOS

analog switch designed to operate from a single 1.8V to

5.5V power supply. Targeted applications include

battery powered equipment that benefit from low RON

(0.5Ω) and fast switching speeds (tON = 50ns, tOFF =

15ns).

The on-resistance profile is very flat over the full analog

signal range. This ensures excellent linearity and low

distortion when switching audio signals.

The SGM3005 is a committed dual single-pole/

double-throw (SPDT) that consist of two normally open

(NO) and two normally close (NC) switches. This

configuration can be used as a dual 2-to-1 multiplexer.

The SGM3005 is available in Green TDFN-3×3-10L

and MSOP-10 packages.

FEATURES Low Voltage Operation: 1.8V to 5.5V Low On-Resistance: 0.5Ω (TYP) Low On-Resistance Flatness -3dB Bandwidth: 15MHz Fast Switching Times

tON 50ns tOFF 15ns

Rail-to-Rail Operation Typical Power Consumption (< 0.01μW) TTL/CMOS Compatible Microsize Packages APPLICATIONS Battery-powered, Handheld, and Portable Equipment

Cellular/Mobile Phones

Laptops, Notebooks, Palmtops

Communication Systems

Sample-and-Hold Circuits

Audio Signal Routing

Audio and Video Switching

Portable Test and Measurement

Medical Equipment

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PACKAGE/ORDERING INFORMATION

MODEL PACKAGE DESCRIPTION

SPECIFIED TEMPERATURE

RANGE ORDERING NUMBER

PACKAGE MARKING

PACKING OPTION

SGM3005

MSOP-10 -40 to +125 SGM3005XMS/TR SGM3005

XMS XXXXX

Tape and Reel, 4000

TDFN-3×3-10L -40 to +125 SGM3005XD/TR SGM

3005D XXXXX

Tape and Reel, 3000

NOTE: XXXXX = Date Code and Vendor Code.

Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly.

ABSOLUTE MAXIMUM RATINGS V+ to GND ............................................................ -0.3V to 6V Analog, Digital voltage range (1) ...............-0.3V to (V+) + 0.3V Continuous Current NO, NC, or COM ....................... ±300mA Peak Current NO, NC, or COM ................................. ±500mA Package Thermal Resistance @ TA = +25 TDFN-3×3-10L, θJA .................................................... 33/W MSOP-10, θJA .......................................................... 205/W Junction Temperature ................................................. +150 Storage Temperature Range ........................ -65 to +150 Lead Temperature (Soldering, 10s) ............................ +260 ESD Susceptibility HBM ............................................................................. 2000V MM ................................................................................. 400V NOTE: 1. Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings. RECOMMENDED OPERATING CONDITIONS Operating Temperature Range ..................... -40 to +125

OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER SG Micro Corp reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time.

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PIN CONFIGURATIONS (TOP VIEW) (TOP VIEW)

GND

COM2

6

7

8

9

101

2

3

4

5

NO1

IN1

IN2

NO2

COM1

NC1

V+

NC2

4

1

3

5

2

7

10

8

6

9NO1

IN1

COM1

NC1 GND

COM2

IN2

NO2

NC2

GND

V+

MSOP-10 TDFN-3×3-10L

PIN DESCRIPTION

PIN NAME FUNCTION

1 V+ Power Supply.

2, 10 NO1, NO2 Normally-Open Terminal.

3, 9 COM1, COM2 Common Terminal.

4, 8 IN1, IN2 Digital Control Pin to Connect the COM Terminal to the NO or NC Terminals.

5, 7 NC1, NC2 Normally-Closed Terminal.

6 GND Ground.

NOTE: NO, NC and COM terminals may be an input or output.

FUNCTION TABLE LOGIC NC1, NC2 NO1, NO2

0 ON OFF

1 OFF ON

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ELECTRICAL CHARACTERISTICS (V+ = +5V ± 10%, GND = 0V, TA = -40 to +125, typical values are at TA = +25, unless otherwise noted.)

PARAMETER SYMBOL CONDITIONS

SGM3005

+25 -40 to +125

UNITS MIN/ MAX

ANALOG SWITCH

Analog Signal Range VNO, VNC, VCOM 0 V MIN

V+ V MAX

On-Resistance RON 0 ≤ VNO or VNC ≤ V+, ICOM = -10mA, Test Circuit 1

0.5 Ω TYP

0.9 1.1 Ω MAX

On-Resistance Match Between Channels ∆RON 0 ≤ VNO or VNC ≤ V+, ICOM = -10mA,

Test Circuit 1 0.05 Ω TYP

0.09 0.12 Ω MAX

On-Resistance Flatness RFLAT(ON) 0 ≤ VNO or VNC ≤ V+, ICOM = -10mA, Test Circuit 1

0.25 Ω TYP

0.3 0.4 Ω MAX

LEAKAGE CURRENTS

Source OFF Leakage Current INC(OFF), INO(OFF) VNO or VNC = 4.5V/1V, VCOM = 1V/4.5V, V+ = +5.5V, Test Circuit 2

±4 nA TYP

±10 ±1000 nA MAX

Channel ON Leakage Current INC(ON), INO(ON), ICOM(ON)

VNO or VNC = VCOM = 1V or 4.5V, V+ = +5.5V, Test Circuit 3

±4 nA TYP

±10 ±1000 nA MAX

DIGITAL INPUTS

Input High Voltage VINH 2.4 V MIN

Input Low Voltage VINL 0.8 V MAX

Input Current IINL or IINH VIN = VINH or VINL ±0.01 μA TYP

±0.1 ±1 μA MAX

DYNAMIC CHARACTERISTICS

Turn-On Time tON VNO or VNC = 3V, RL = 300Ω, CL = 35pF, Test Circuit 4 50 ns TYP

Turn-Off Time tOFF VNO or VNC = 3V, RL = 300Ω, CL = 35pF, Test Circuit 4 15 ns TYP

Charge Injection Q CL = 1.0nF, VG = 0V, RG = 0Ω, Test Circuit 5 20 pC TYP

Break-Before-Make Time Delay tD VNO1 or VNC1 = VNO2 or VNC2 = 3V, RL = 300Ω, CL = 35pF, Test Circuit 6 10 ns TYP

Off Isolation OISO RL = 50Ω, CL = 5pF, Test Circuit 7

f = 100kHz -69 dB TYP

f = 10kHz -85 dB TYP

Channel-to-Channel Crosstalk XTALK RL = 50Ω, CL = 5pF, Test Circuit 8

f = 100kHz -90 dB TYP

f = 10kHz -105 dB TYP

Total Harmonic Distortion THD f = 20Hz to 20kHz, VCOM = 3.5VP-P, RL = 600Ω, CL = 50pF 0.065 % TYP

-3dB Bandwidth BW RL = 50Ω, CL = 5pF, Test Circuit 9 15 MHz TYP

Source OFF Capacitance CNC(OFF), CNO(OFF) 82 pF TYP

Channel ON Capacitance CNC(ON), CNO(ON), CCOM(ON)

380 pF TYP

POWER REQUIREMENTS

Power Supply Current I+ V+ = +5.5V, VIN = 0V or 5V 0.001 μA TYP

1 μA MAX

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ELECTRICAL CHARACTERISTICS (continued) (V+ = +3V ± 10%, GND = 0V, TA = -40 to +125, typical values are at TA = +25, unless otherwise noted.)

PARAMETER SYMBOL CONDITIONS

SGM3005

+25 -40 to +125

UNITS MIN/ MAX

ANALOG SWITCH

Analog Signal Range VNO, VNC, VCOM 0 V MIN

V+ V MAX

On-Resistance RON 0 ≤ VNO or VNC ≤ V+, ICOM = -10mA, Test Circuit 1

0.6 Ω TYP

1.0 1.3 Ω MAX

On-Resistance Match Between Channels ∆RON 0 ≤ VNO or VNC ≤ V+, ICOM = -10mA,

Test Circuit 1 0.05 Ω TYP

0.1 0.13 Ω MAX

On-Resistance Flatness RFLAT(ON) 0 ≤ VNO or VNC ≤ V+, ICOM = -10mA, Test Circuit 1

0.25 Ω TYP

0.3 0.4 Ω MAX

LEAKAGE CURRENTS

Source OFF Leakage Current INC(OFF), INO(OFF) VNO or VNC = 3V/1V, VCOM = 1V/3V, V+ = +3.3V, Test Circuit 2

±5 nA TYP

±11 ±1000 nA MAX

Channel ON Leakage Current INC(ON), INO(ON), ICOM(ON)

VNO or VNC = VCOM = 1V or 3V, V+ = +3.3V, Test Circuit 3

±5 nA TYP

±11 ±1000 nA MAX

DIGITAL INPUTS

Input High Voltage VINH 2.0 V MIN

Input Low Voltage VINL 0.4 V MAX

Input Current IINL or IINH VIN = VINH or VINL ±0.01 μA TYP

±0.1 ±1 μA MAX

DYNAMIC CHARACTERISTICS

Turn-On Time tON VNO or VNC = 2V, RL = 300Ω, CL = 35pF, Test Circuit 4 50 ns TYP

Turn-Off Time tOFF VNO or VNC = 2V, RL = 300Ω, CL = 35pF, Test Circuit 4 17 ns TYP

Charge Injection Q CL = 1.0nF, VG = 0V, RG = 0Ω, Test Circuit 5 25 pC TYP

Break-Before-Make Time Delay tD VNO1 or VNC1 = VNO2 or VNC2 = 2V, RL = 300Ω, CL = 35pF, Test Circuit 6 11 ns TYP

Off Isolation OISO RL = 50Ω, CL = 5pF, Test Circuit 7

f = 100kHz -69 dB TYP

f = 10kHz -85 dB TYP

Channel-to-Channel Crosstalk XTALK RL = 50Ω, CL = 5pF, Test Circuit 8

f = 100kHz -90 dB TYP

f = 10kHz -105 dB TYP

Total Harmonic Distortion THD f = 20Hz to 20kHz, VCOM = 2VP-P, RL = 600Ω, CL = 50pF 0.06 % TYP

-3dB Bandwidth BW RL = 50Ω, CL = 5pF, Test Circuit 9 15 MHz TYP

Source OFF Capacitance CNC(OFF), CNO(OFF) 82 pF TYP

Channel ON Capacitance CNC(ON), CNO(ON), CCOM(ON)

380 pF TYP

POWER REQUIREMENTS

Power Supply Current I+ V+ = +3.3V, VIN = 0V or 3V 0.001 μA TYP

1 μA MAX

Ultra Low ON-Resistance, SGM3005 Low Voltage, Dual, SPDT Analog Switch

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TYPICAL PERFORMANCE CHARACTERISTICS

On Response vs. Frequency

-9

-6

-3

0

3

0.1 1 10 100Frequency (MHz)

On

Res

pons

e (d

B)

V+ = +5VTA = +25

Crosstalk vs. Frequency

-150

-120

-90

-60

-30

0

0.01 0.1 1 10 100Frequency (MHz)

Cro

ssta

lk (d

B)

V+ = +5VTA = +25

Off Isolation vs. Frequency

-100

-90

-80

-70

-60

-50

-40

-30

-20

0.01 0.1 1 10Frequency (MHz)

Off

Isol

atio

n (d

B)

V+ = +5VTA = +25

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TEST CIRCUITS

V1

10mA

NO or NC COM

VNO or VNC

RON = V1/10mA Test Circuit 1. On Resistance

VCOM

NO or NC COMA

VNO or VNC

INC(OFF) or INO(OFF)

Test Circuit 2. Off Leakage

VCOM

NO or NC COMA

VNO or VNC

ICOM(ON)

Test Circuit 3. On Leakage

VOUT NO or NC COM

VNO or VNC RL300Ω

V+

GND

CL35pF

IN

0.1μFV+

VOUT

VIN 50%

90%

50%

90%

tON tOFF

Test Circuit 4. Switching Times

VOUT NO or NC COM

VG

V+

GND

CL1nF

IN

0.1μFV+

VOUT

VIN

RG ΔVOUT

ON

OFF

ON

V+

0V

VIN

Test Circuit 5. Charge Injection

Ultra Low ON-Resistance, SGM3005 Low Voltage, Dual, SPDT Analog Switch

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TEST CIRCUITS (continued)

VOUT NO COM

VNO or VNC

RL300Ω

V+

GND

CL35pFIN

0.1μFV+

VOUT

VIN 50%

90%

tD

NC

VNO or VNC

0

Test Circuit 6. Break-Before-Make Time Delay, tD

VOUT NO or NC COM

V+

GND

CL5pFIN

0.1µFV+

SourceSignal

RL

50ΩRL

50Ω

Test Circuit 7. Off Isolation

VOUT

NO or NC COM

RL50Ω

V+

GND

CL5pF

IN1

0.1μFV+

SourceSignal

NO or NC COM

IN2

RL50Ω

CL5pF

Channel To Channel Crosstalk = -20×log

VNO or VNC

VOUT

N.C.

Test Circuit 8. Channel-to-Channel Crosstalk

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TEST CIRCUITS (continued)

VOUT NO or NC COM

RL50Ω

V+

GND

CL5pF

IN

0.1μFV+

SourceSignal

Test Circuit 9. -3dB Bandwidth

PACKAGE INFORMATION

TX00015.000 SG Micro Corp www.sg-micro.com

PACKAGE OUTLINE DIMENSIONS MSOP-10

Symbol Dimensions

In Millimeters Dimensions

In Inches MIN MAX MIN MAX

A 0.820 1.100 0.032 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.180 0.280 0.007 0.011 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 E 2.900 3.100 0.114 0.122

E1 4.750 5.050 0.187 0.199 e 0.500 BSC 0.020 BSC L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6°

b

E1 E

e

D

A1

L

c

A

A2θ

4.8

0.50.3

1.02

RECOMMENDED LAND PATTERN (Unit: mm)

PACKAGE INFORMATION

TX00060.000 SG Micro Corp www.sg-micro.com

PACKAGE OUTLINE DIMENSIONS TDFN-3×3-10L

Symbol Dimensions

In Millimeters Dimensions

In Inches MIN MAX MIN MAX

A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 0.203 REF 0.008 REF D 2.900 3.100 0.114 0.122

D1 2.300 2.600 0.091 0.103 E 2.900 3.100 0.114 0.122

E1 1.500 1.800 0.059 0.071 k 0.200 MIN 0.008 MIN b 0.180 0.300 0.007 0.012 e 0.500 TYP 0.020 TYP L 0.300 0.500 0.012 0.020

RECOMMENDED LAND PATTERN (Unit: mm)

1.7 2.8

2.4

0.6

0.24 0.5

A

N10

N5 N1

D1

E1

SIDE VIEW

BOTTOM VIEWTOP VIEW

A1A2

k

bL

eD

E

PACKAGE INFORMATION

TX10000.000 SG Micro Corp www.sg-micro.com

TAPE AND REEL INFORMATION NOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL

Package Type Reel Diameter

Reel Width W1

(mm) A0

(mm) B0

(mm) K0

(mm) P0

(mm) P1

(mm) P2

(mm) W

(mm) Pin1

Quadrant

DD

0001

MSOP-10 13″ 12.4 5.20 3.30 1.20 4.0 8.0 2.0 12.0 Q1

TDFN-3×3-10L 13″ 12.4 3.35 3.35 1.13 4.0 8.0 2.0 12.0 Q1

Reel Width (W1)

Reel Diameter

REEL DIMENSIONS

TAPE DIMENSIONS

DIRECTION OF FEED

P2 P0

W

P1 A0 K0

B0Q1 Q2

Q4Q3 Q3 Q4

Q2Q1

Q3 Q4

Q2Q1

PACKAGE INFORMATION

TX20000.000 SG Micro Corp www.sg-micro.com

CARTON BOX DIMENSIONS

NOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF CARTON BOX

Reel Type Length (mm)

Width (mm)

Height (mm) Pizza/Carton

DD

0002 13″ 386 280 370 5