SFH 4558 · — Industrial Automation (Machine Controls, Light Barriers, Vision Controls) —...
Transcript of SFH 4558 · — Industrial Automation (Machine Controls, Light Barriers, Vision Controls) —...
SFH 4558
1 Version 1.4 | 2020-02-06
Produktdatenblatt | Version 1.1 www.osram-os.com
Applications
SFH 4558
Radial SMR Infrared Emitter (850nm) in SMR® Package
— Electronic Equipment
— Highbay Industrial
— Industrial Automation (Machine Controls, Light Barriers, Vision Controls)
— Safety and Security, CCTV
— Smoke Detectors
— White Goods
Features: — Package: black epoxy
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
— Wavelength 850nm — SMR® (Surface Mount Radial) package — Same package as photodiode SFH 2505 FA — Device with straight leads — UL version E9548 available (details & test conditions on request)
Ordering Information
Type Radiant intensity 1)2) Radiant intensity 1) Ordering Codetyp.
IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 msIe Ie
SFH 4558 180 ... 710 mW/sr 350 mW/sr Q65111A5984
SFH 4558 E9548 180 ... 710 mW/sr 350 mW/sr Q65112A8626
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Maximum RatingsTA = 25 °C
Parameter Symbol Values
Operating temperature Top min. max.
-40 °C85 °C
Storage temperature Tstg min. max.
-40 °C85 °C
Forward current IF max. 100 mA
Surge current tp ≤ 200 µs; D = 0
IFSM max. 1 A
Reverse voltage 3) VR max. 12 V
Power consumption Ptot max. 200 mW
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
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CharacteristicsIF = 100 mA; tp = 20 ms; TA = 25 °C
Parameter Symbol Values
Peak wavelength λpeak typ. 860 nm
Centroid wavelength λcentroid typ. 850 nm
Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 30 nm
Half angle φ typ. 10 °
Dimensions of active chip area L x W typ. 0.3 x 0.3 mm x mm
Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω
tr typ. 12 ns
Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω
tf typ. 12 ns
Forward voltage 4) VF typ. max.
1.7 V1.9 V
Forward voltage 4) IF = 1 A; tp = 100 µs
VF typ. max.
3.6 V4.5 V
Reverse current 3) VR = 5 V
IR max. 10 µA
Radiant intensity 1) IF = 1 A; tp = 100 µs
Ie typ. 1450 mW/sr
Total radiant flux 5) Φe typ. 80 mW
Temperature coefficient of voltage TCV typ. -0.6 mV / K
Temperature coefficient of brightness TCI typ. -0.3 % / K
Temperature coefficient of wavelength TCλ typ. 0.3 nm / K
Thermal resistance junction solder point real 6) RthJS real max. 240 K / W
Thermal resistance junction ambient real 7) RthJA max. 430 K / W
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Brightness Groups TA = 25 °C
Group Radiant intensity 1)2) Radiant intensity 1)2)
IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 msmin. max.Ie Ie
BW 180 mW/sr 280 mW/sr
CW 280 mW/sr 450 mW/sr
DW 450 mW/sr 710 mW/sr Only one group in one packing unit (variation lower 2:1)
Relative Spectral Emission 8), 9)
Ie,rel = f (λ); IF = 100 mA; tp = 20 ms
7000
nm
%
OHF04132
20
40
60
80
100
950750 800 850
Irel
λ
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Radiation Characteristics 8), 9)
Ie,rel = f (φ)
OHF05688
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0ϕ
Forward current 8), 9)
IF = f (VF); single pulse; tp = 100 µsOHF05645
FI
V
mA
0
FV
5
5
210
310
101
100
1 2 3 4
Radiant Intensity 8), 9)
Ie/Ie(100mA) = f (IF); single pulse; tp = 100 µsOHF05641
310
Ιe
(100 mA)e
Ι
FI102110100 mA
10-3
10-2
10-1
100
110
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Max. Permissible Forward CurrentIF,max = f (TA); Rthja = 430K / W; single pulse
00
˚CTA
FImA
OHF05687
20 40 60 80 100
20
40
60
80
100
120
Permissible Pulse Handling CapabilityIF = f (tp); duty cycle D = parameter; TA = 25°C
210-1-2-3-4-5 1010 1010 10tp
10 10s100
TtA
IF D = IP
T
F
PtOHF05646
10.5
0.01
0.050.10.2
0.02
0.005D =
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
Permissible Pulse Handling CapabilityIF = f (tp); duty cycle D = parameter; TA = 85°C
210-1-2-3-4-5 1010 1010 10tp
10 10s100
TtA
IF D = IP
T
F
PtOHF05647
10.5
0.01
0.050.10.2
0.02
0.005D =
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
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Dimensional Drawing 10)
GEOY6961
3.9 (0.154)
4.5 (0.177)
Cathode
7.1 (0.280)7.7 (0.303)
2.54
(0.1
00)
spac
ing
14.7 (0.579)15.5 (0.610)
7.4 (0.291)
8.0 (0.315) ((3.2) (0.126))
5.4 (0.213)6.0 (0.236)
((3.2) (0.126))
2.7
(0.1
06)
2.4
(0.0
94)
4.4
(0.1
73)
4.8
(0.1
89)
((R2.8 (0.110))R2.05 (0.081)1.95 (0.077)
Chip position
3.9 (0.154)4.5 (0.177)
(-0.0
06...
0.00
6)-0
.15.
..0.1
5
Further Information:
Approximate Weight: 240.0 mg
Package marking: Cathode
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Recommended Solder Pad 10)
OHF02450
5.9 (0.232)
1.3
(0.0
51)
2.54
(0.1
00)
7 (0.276)
3 (0
.118
)
Cu-Fläche > 20 mmCu-area > 20 mm 2
Paddesign for
verbesserte Wärmeableitung
improved heat dissipation
Padgeometrie für
LötstopplackSolder resist
Component Location on PadBauteil positioniert
Aussparung 4.85 (0.191)
5.2 (0.205)
Lötpad (1 (0.039))
1.5 (0.059)
2
±0.05 (0.002)
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Reflow Soldering ProfileProduct complies to MSL Level 3 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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Taping 10)
Taping 10)
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Tape and Reel 11)
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel DimensionsA W Nmin W1 W2 max Pieces per PU
330 mm 24 + 0.3 / - 0.1 mm 60/100 mm 24.4 + 2 mm 30.4 mm 1000
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Barcode-Product-Label (BPL)
Dry Packing Process and Materials 10)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes
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Disclaimer
Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.
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Glossary1) Radiant intensity: Measured at a solid angle of Ω = 0.001 sr2) Brightness: The brightness values are measured with a tolerance of ±11%.3) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.4) Forward Voltage: The forward voltages are measured with a tolerance of ±0.1 V.5) Total radiant flux: Measured with integrating sphere.6) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)7) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 20 mm² each8) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
9) Testing temperature: TA = 25°C (unless otherwise specified)10) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.11) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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Revision HistoryVersion Date Change
1.4 2020-02-06 Features Ordering Information
SFH 4558
17 Version 1.4 | 2020-02-06
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.