www.semicontaiwan.org

POST SHOW REPORT SEPT 13–15, 2017 TAIPEI NANGANG EXHIBITION CENTER, HALL 1, TAIWAN

SEMICON® Taiwan 2017Sept. 13–15, 2017 TAIPEI NANGANG EXHIBITION CENTER, HALL 1, TAIWAN

Highlights

Global semiconductor fab equipment spending is expected to reach an industry all-time record - more than US$46 billion in 2017. Taiwan is expected to continuously increase spending on fab equipment and remain the world’s largest consumer of semiconductor materials for the seventh consecutive year. Under the strong market demand, the scale of SEMICON Taiwan 2017 again breaks record reaching a historical high.

• Theme Pavilions and Regional Pavilions: The Theme and Regional Pavilions at SEMICON Taiwan focus visitor attention on critical markets, regions, and technologies, speeding connections between buyers, suppliers, and prospective business partners in areas including Automated Optical Inspection (AOI), Chemical Mechanical Planarization (CMP), Circular Economy, Compound Semiconductor, High-Tech Facility, Laser, Materials, Opto Semiconductor, Precision Machinery, Secondary Market, Smart Manufacturing & Automation, and Taiwan Localization, and 8 country/region pavilions, including Cross-Strait, Kyushu (Japan), German, Holland High Tech, Korea, Okinawa(Japan), Silicon Europe, and Singapore pavilions.

• A Diverse Activities and Business Opportunities:– 27 International Programs: SEMICON Taiwan programs attracted more than 4,000

attendees, covering areas including smart manufacturing, smart medtech, smart automation, IoT, packaging and more.

– International Test Conference Asia (ITC-Asia): NEW for 2017. ITC, the world’s leading professional conference for semiconductor test technology was held for the first time ever in conjunction with SEMICON Taiwan.

– Executive Summit: The Grand Opening Keynote Session featured leading international executives including Dr. Yu-Chin Hsu, Deputy Minister, MOST; Mr. S. C. Chien, UMC; Dr. Frank Huang, Powerchip; Mr. Wayne Allan, Micron; Mr. Steve D. Kelley, Amkor; and Mr. Bill Wiseman, McKinsey & Company.

– SiP Global Summit: Focused on the three key system-in-package topics: Package Innovation in Automotive, 3D IC, 3D interconnection for AI and High-end Computing, Innovative Embedded Substrate and Fan-Out Technology to Enable 3D-SiP Devices, SiP Global Summit 2017 will share trends and challenges of semiconductor advanced packaging technologies.

– Leadership Gala Dinner: An annual most important networking event forexecutives in the microelectronics industry. Including the presentation of the Industry Contribution Award to Dr. Nicky Lu, TSIA and chairman, CEO, and founder, Etron Technology

– TechXPOT 1F & 4F: Covering the hottest topics like Smart Manufacturing & Automation, Materials, Silicon Europe, High-Tech Facility, Laser, and Emerging Semi-conductor Technology, more than 70 presentations will be given on but also great opportunities to meet potential partners.

Registration

Registered Visitors 45,025Total Attendance 34,505Total Forum Attendance 4,011

Exhibits

Total Exhibitors 650Net Occupied Area 16,074 sqm.Exhibiting Booths 1,811

Key Participating Companies & Organizations

• Advantest

• Amkor

• Applied Materials

• ASE

• ASM

• ASML

• Chipbond

• ChipMos

• DAS

• DISCO

• Episil

• Epistar

• GLOBALFOUNDRIES

• GPM

• Hanmi

• Henkel

• Hermes

• JSR

• KLA-Tencor

• K&S

• KYEC

• Lam

• Lintec

• Marketech

• MediaTek

• Merck

• Micron

• MXIC

• Nanya Technology

• NAURA Technology Group

• nVIDIA

• NXP

• Panasonic

• Powerchip

• Qualcomm

• Realtek

• RORZE

• SCREEN

• SMEE

• SONY

• SPIL

• STMicroelectronics

• Synopsys

• Tianshui Huatian

• TEL

• Toshiba

• TSMC

• UMC

• Versum

• VIS

• Win Foundry

• Winbond

• Wonik

POST SHOW REPORT SEPT 13–15, 2017 TAIPEI NANGANG EXHIBITION CENTER, HALL 1, TAIWAN

www.semicontaiwan.org

Visitor ProfileAs the premier electronics manufacturing supply chain event in Taiwan, SEMICON Taiwan is the best platform to connect buyers, engineers, key influencers, and decision-makers involved in the equipment, materials, and services buying cycle. Among SEMICON Taiwan visitors, Among SEMICON Taiwan visitors, 48% are manager level or above, and 54% influence purchasing decisions.

Influential Buyers

Primary Job Functions

SEMICON Taiwan attracts multi-level buying teams, with broad representation across all levels, functions and industries.

Engineering—Design / R&D / Software / Hardware / Systems 16%

Engineering—Assembly / Test / Packaging / QA 7%

Engineering—Fabrication and Process / Facilities 7%

Engineering—Chemicals / Materials 5%

Marketing / Sales / Business Development 20%

Executive Management / Board Member 10%

Product / Operations Management 8%

Human Resources 4%

Manufacturing and Production 4%

Purchasing / Procurement 4%

Training / Education 4%

Financial / Industry Analyst 2%

Environment / Health and Safety (EHS) 1%

Government / Public Policy / Investor Relations 1%

Other 7%

35% of SEMICON Taiwan visitors represent

engineering functions, including design, R&D,

materials, and process engineering.

PURCHASING AUTHORITY

14% Final Decision Maker/ Co-deciding/Crucial

33% Recommend/Evaluate/Consult

7% Specify

46% No Role

JOB LEVELS 12% Executive Management (Chairman,

CEO, CFO, CMO, President, Chief, Managing Director)

1 1% Senior Management (Vice President, Director)

25% Other Management (Program Manager, Manager)

45% Non-management (Staff, Professional)

4% Student

4% Other

POST SHOW REPORT SEPT 13–15, 2017 TAIPEI NANGANG EXHIBITION CENTER, HALL 1, TAIWAN

www.semicontaiwan.org

Areas of InterestSEMICON Taiwan visitors are interested in a broad range of industries, technologies, and products from across the supply chain, from design to final manufacturing.

Segment/Application Interests

Semiconductors/Compound 48% Semiconductors

Automotive Electronics 23%

MEMS and Sensors/Nanoelectronics 21%

LED/Solid State Lighting 20%

Smart Manufacturing/Automation/ 19% Robotics

Electronics Applications 14%

Displays 13%

Internet of Things (IoT) 13%

Power Electronics 13%

Laser Processing Application 10%

Wearables/Consumer Electronics 10%

Flexible Hybrid Electronics (FHE)/ 9% Printed Electronics

Photovoltaics (PV) 9%

Medical Electronics/MedTech 8%

Environmental Health and Safety 6% (EHS)/Waste Management

Product/Technology Areas of Interest

MANUFACTURINGSemiconductor Device Manufacturing (IDM, foundry) 36%

Electronic Manufacturing Services (EMS) 31%

Packaging Assembly and Test Services 30%

LED/MEMS/PV/Display Manufacturing 18%

Fabless Semiconductor Manufacturer 14%

Other 4%

EQUIPMENTWafer Processing/Front-end 36%

Assembly and Packaging 26%

Test 23%

Inspection and Measurement/Metrology 15%

Factory Automation/Robotics 14%

Laser Systems for Production Engineering 9%

Printing /Coating /Roll-to-Roll Equipment 8%

Secondary 5%

Circular Economy/Recycling/Waste Management 4%

Other Equipment 1%

MATERIALSWafer and Silicon Related Substrates 33%

Assembly and Packaging Materials 22%

Gases /Liquids /Chemicals /Solids 16%

LED/MEMS/PV/Display Materials 15%

Photolithography/Deposition Materials 13%

Consumables (test and process) 1 1%

Inks /Pastes and Printing 8%

Other Materials 1%

SUB-SYSTEMS/COMPONENTS/OTHERR&D/Technology Transfer 13%

Manufacturing Services and Consulting (directly related to mfg.) 12%

Electronic Components and Instrumentation 1 1%

Sub-systems 1 1%

Key Component and Others, Laser Source 8%

General Business Service/Consulting 7%

Outsourced Manufacturing 5%

Other 1%

DESIGNSoftware/EDA/Modeling 26%

Fabless 17%

Other Design/Software 1%