Sector 002 Assemblystatus report

Module loading task force meeting

25 May 2004

Contents

• Sectors• Glue • 3-D Survey• Other sector 2 Results• Tool Upgrade• Procedure Upgrades

• C6F14 Cooling

Sector

• Sector 001 (FE_I1, prototype) had been assembled in 2003 with most of the final tooling, but not final glue procedures. It was never fully characterized.

• Sector 002 is our pre-production sector (FE-I2.1). It has been loaded with 3 module so far using “production” tooling and glue.

• Some revisions to the tooling and the procedure are now being implemented, reacting from the experience of loading the first side. Side 2 will be loaded when all the upgrades are in place.

• These are incremental small changes. We are not going off in any new direction.

Glue

• Implemented CPPM standards with a few adaptations specific to sector– Our dispenser is calibrated to 16 drops/ minute

• Had some problems getting fresh glue- long lead time. Now have too much fresh glue.

• Implemented new storage method – when new tubes are opened, take out each component and mix well

– Transfer immediately to individual, very cheap, 3cc syringes for storage (store 2cc in each syringe)

– when mixing, empty each syringe out completely into cup. This gives 1-1 by volume. Do this on scale to control that it matches 1-1 by weight, which it does for fresh glue to good accuracy.

Glue (cont.)

• Implemented glue drop mask which works very well.

• Dispensing takes 10min. /module,

which is acceptable • Quantity dispensed is 4 drops in

outer hole + 3 drops in inner hole (16 drops/minute with CPPM syringe and needle)

• 80% chip area coverage (gap is 75um set by fishing line).

3-D Survey

• A 3-D survey program has been implemented.

• It only works on side 1 of a sector due to interference with the cooling pipes.

• Sectors 1 and 2 have been measured (see next slide)

• Both sectors show out-of-plane modules with a small systematic tilt and with some modules bowed.

• We suspect the tilt is an imperfection of the tool head- deviations in the steel pins for example.

• The bow as well as some random tilts are due to lack of degrees of freedom in the pickup chuck to deal with module-to-module changes in how the module “hangs” from the flex.

3-D Survey (cont.)

Other Sector 2 Results

• 3 modules have been loaded so far (1 side)

• 2 modules are within 20 microns of nominal (all alignment marks)

• 1 module has 2 alignment marks off in x-y by 100um (x+y in quadrature)– The cause is understood to be (1) operator error and (2) lack of procedure

to prevent such an error.

– New assembly checklist now safeguards against this error.

• Quick electrical test shows no digital problems in 3 modules loaded

• No cooling test until 6 module loaded.

Tool Upgrade

Extreme case of tilt in module placement shown by glue pattern on chips

Adding +/- 200um of independent vertical adjustment to each vacuum cup

Procedure Upgrades

• New step-by-step checklist. Check each item off for each module loading operation.

• Vacuum chuck planarity calibration procedure using glass slide on deposition site (need adjustable cups first

for this).

C6F14 Cooling

• Closed circuit C6F14 loop operation demonstrated with dummy sector with heaters.

• 0.2m2 heat exchange area to chiller bath implemented with coil.

C6F14 Cooling (cont.)

0.01.02.0

3.04.05.06.07.0

8.09.010.0

0 10 20 30 40 50

Heater Power (W)

T(s

ecto

r) -

T(b

ath

) D

eg.C