S73-MTM-DEV: MTM Development BoardThe Acroname MTM Development Board (MTM-DEV) is designed to allow...

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S73-MTM-DEV: MTM Development Board MTM UART connections (use UART0 for firmware recovery) MTM Network I2C Bus Up to 1MHz Additional generic PCIe connector breakout. Fits 164-pin PCIe connector. Use for additional development, or MTM-RELAY breakout MTM-IO-SERIAL Downstream USB MTM-IO-SERIAL Upstream USB Power Input 6-12VDC MTM-PM-1 K-type Thermocouple MTM-PM-1 Rail Outputs Module Hardware Offsets – one per module Reset button – applies to all modules Module capability breakouts

Transcript of S73-MTM-DEV: MTM Development BoardThe Acroname MTM Development Board (MTM-DEV) is designed to allow...

Page 1: S73-MTM-DEV: MTM Development BoardThe Acroname MTM Development Board (MTM-DEV) is designed to allow development using MTM modules. All standard features are exposed for the MTM-PM-1,

S73-MTM-DEV: MTM Development Board

MTMUARTconnections(useUART0forfirmwarerecovery)

MTMNetworkI2CBusUpto1MHz

Additio

nalgen

ericPCIeconn

ectorb

reakou

t.Fits164

-pinPCIeconn

ector.Usefo

radd

ition

al

developm

ent,orM

TM-RELAY

breakou

t

MTM-IO-SERIALDownstreamUSB

MTM-IO-SERIALUpstreamUSB

PowerInput6-12VDC

MTM-PM-1K-typeThermocouple

MTM-PM-1RailOutputs

ModuleHardwareOffsets–oneper

module

Resetbutton–appliestoallmodules

Modulecapabilitybreakouts

Page 2: S73-MTM-DEV: MTM Development BoardThe Acroname MTM Development Board (MTM-DEV) is designed to allow development using MTM modules. All standard features are exposed for the MTM-PM-1,

Overview TheAcronameMTMDevelopmentBoard(MTM-DEV)isdesignedtoallowdevelopmentusingMTMmodules.AllstandardfeaturesareexposedfortheMTM-PM-1,MTM-IO-SERIAL,MTM-USBSTEMandMTM-ETHERSTEMmodules.Ageneric164-pinPCIeconnectorbreakoutisalsoprovided,withbasicssuchasaUART04-pinheader(forfirmwarerecovery)andamodulehardwareoffsetDIPswitch.

General Features (applicable to all modules) - PowerInput:Powersufficientforeachpresentmoduleaswellasentitiesinuse,at6-12VDC,mustbesuppliedhere.Refertoeach

module’sdatasheetforbasepowerconsumption.Threeoptionsareprovided:barrelconnector,screwterminalconnector,andposts,allofwhicharetieddirectlytogether.

- Reset:Theresetbuttonistiedtotheresetpinofallmodulebreakoutsandcanbeusedtoresetallpresentmodules(singlepressandrelease),ortoputallpresentmodulesinto“bootstrap”mode(holdResetfor4+secondsandrelease).

- UART0:UseUART0forfirmwarerecoveryonly(MTM-IO-SERIALisanexception).Themodulemustbepoweredandin“bootstrap”mode(see“Reset”).

- I2C:ThisheaderprovidesexternalaccesstotheMTMBrainStemSMBusNetwork.AccessfromeachmoduleisprovidedbytheI2C0entity.TheBrainStemnetworkoperatesat1MHz,butI2C0issoftware-programmableto100kHz,400kHz(FM),or1Mhz(FM+).

- ModuleHardwareOffsets:EachMTMmodule,includingthenon-populated164-pinPCIeBreakout,hasa4-pinDIPswitchprovidedthatconnectsdirectlytotheModuleHardwareOffsetpins0-3onthemodule’sedgeconnector.(NOTE:onRevisionB,pins0-1ontheMTM-PM-1DIPswitcharenon-functional–DONOTusetheseoffsetpins).

- GNDtestpoints:GroundforallMTMmodules,rails,etc.,areconnectedtoasingleGNDplane.Usethesetestpointsforaccess.

MTM-PM-1 Features - Pass-throughUSBLink:UpstreamUSBconnection.ThisconnectionroutesdirectlyfromtheedgeconnectordownstreamUSB

connectionforport4oftheMTM-IO-SERIALmoduletotheedgeconnectorupstreamUSBconnection.- DIO0-1:BothDigitalentitypinsarebrokenouttobothathrough-holesolderpadandafemaleheaderlocatedbetweentheMTM-STEM

connectorandtheUARTheaders.- RAIL0_STATUSandRAIL0_IOUT:TheStatuspin(RAIL0_STATUS)andcurrent-mirrorpin(RAIL0_IOUT)arebrokenouttobothathrough-

holesolderpadandafemaleheaderlocatedbetweentheMTM-STEMconnectorandtheUARTheaders.- RAIL1:Thepass-throughpowerrailoutputisprovidedasposts,screwterminalconnector,andthrough-holesolderpads.Alloutputs

routedirectlyfromtheedgeconnectorpinsforRAIL1.

Page 3: S73-MTM-DEV: MTM Development BoardThe Acroname MTM Development Board (MTM-DEV) is designed to allow development using MTM modules. All standard features are exposed for the MTM-PM-1,

- RAIL0:Theprogrammablepowerrailoutputisprovidedasposts,screwterminalconnector,andthrough-holesolderpads.AlloutputsroutedirectlyfromtheedgeconnectorpinsforRAIL0.Additionally,through-holesolderpadsareprovidedfortheRAIL0KelvinSenseconnections.Thesepadsconnectdirectlytotheedgeconnectorpinsandshouldbeconnectedasclosetotheloadaspossible.

MTM-IO-SERIAL Features - UpstreamUSB(mini-B):OptionalupstreamUSBconnection.ThisconnectorroutesdirectlytotheedgeconnectorupstreamUSB

connection.- DownstreamUSB(Type-Ax4):DownstreamUSBconnections.Theseconnectorsroutedirectlyfromtheedgeconnectordownstream

USBconnectionsforports0-3.- Pass-throughUSBLink:DownstreamUSBconnection.ThisconnectionroutesdirectlyfromtheedgeconnectordownstreamUSB

connectionforport4totheedgeconnectorupstreamUSBconnectionfortheMTM-PM-1module.- DIO0-7:All8Digitalentitypinsarebrokenouttobothathrough-holesolderpadandafemaleheaderlocatedbetweentheMTM-STEM

connectorandtheUARTheaders.- RAIL0-2:All3Railentitypinsarebrokenouttobothathrough-holesolderpadandafemaleheaderlocatedbetweentheMTM-STEM

connectorandtheUARTheaders.- UART0-3:All4UARTentitiesarebrokenoutto4-pinmaleheaders.Locatedalongtheedgeoftheboardnexttothedigitalsbreakout.

MTM-STEM Features (MTM-STEM is designed to work for both MTM-USBSTEM and MTM-ETHERSTEM)

- DIO0-14:All15Digitalentitypinsarebrokenouttobothathrough-holesolderpadandafemaleheaderlocatedbetweentheMTM-STEMconnectorandtheUARTheaders.

- A2D0-3:All4Analogentitypins(0-2areA2D,3isDAC)arebrokenouttobothathrough-holesolderpadandafemaleheaderlocatedbetweentheMTM-STEMconnectorandtheUARTheaders.

- I2C1:BothSCLandSDAfortheI2C1entityarebrokenouttobothathrough-holesolderpadandafemaleheaderlocatedbetweentheMTM-STEMconnectorandtheUARTheaders.