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Transcript of Russell Peak - Georgia Tech, Atlanta GA, USA Mike Dickerson - JPL/NASA, Pasadena CA, USA Lothar...
Russell Peak - Georgia Tech, Atlanta GA, USA
Mike Dickerson - JPL/NASA, Pasadena CA, USA
Lothar Klein - LKSoft, Kuenzell, Germany
Steve Waterbury - NASA-Goddard, Greenbelt MD, USA
Greg Smith - Boeing, Seattle WA, USA
Tom Thurman - Rockwell Collins, Cedar Rapids IA, USA
Jim U'Ren - JPL/NASA, Pasadena CA, USA
Ken Buchanan - ATI/PDES Inc., Charleston SC, USA
Progress on Standards-Based Engineering Frameworks that include STEP AP210 (Avionics), PDM Schema, and AP233 (Systems)
An Engineering Framework Interest Group (EFWIG) Overview
2002 NASA-ESA Workshop onAerospace Product Data Exchange
ESA/ESTEC, Noordwijk (ZH), The NetherlandsApril 9-12, 2002
v2 - 2002-04-23
2
Abstracthttp://www.estec.esa.int/conferences/aerospace-pde-2002
Progress on Standards-Based Engineering Frameworksthat include STEP AP210 (Avionics), PDM Schema, and AP233 (Systems)
This presentation overviews progress towards standards-based engineering frameworks for in-progress design collaboration at the department/workgroup level. Engineering frameworks (EFWs) are themselves viewed as a system of subsystems. We describe how content representation standards like STEP AP210, PDM Schema, and AP233 are subsystems in an EFW and discuss their combined role. Content access standards like SDAI, CORBA, and PDM Enablers are another element in EFWs that enable finer-grained interoperability than monolithic file exchange. Tools and architectures that leverage these two levels of standards are discussed, including experience to date with specific EFWs.
3
Engineering Framework Interest Group (EFWIG)A PDES Inc. Systems Engineering Subproject
http://eislab.gatech.edu/efwig/
The Engineering Frameworks Interest Group (EFWIG) is a cooperative team aimed at furthering standards-based collaborative engineering environments. In this context, similar terminology includes engineering information systems, interoperability technology, repository architectures, and integration frameworks.
The emphasis is on techniques and tools to achieve open, standards-based EFWs. We are showing how existing and emerging standards like STEP and SOAP fit within an EFW. We are also identifying gaps, developing solutions, and promoting standardization of such solutions.
The current domain orientation is towards electro-mechanical systems design (e.g., STEP AP210), including considerations for PDM/PLM, systems engineering (e.g., AP233), systems software, and engineering analysis (e.g., AP209) . The target end user level is engineering work groups and departments for in-process designs.
Another way to think of EFWIG is as an "implementers forum" or "users group", where the thing being implemented/used is not a standard or a vendor tool, but EFWs within particular organizations. Thus CAx organizations like the JPL Design Hub and its constituents are natural participants in EFWIG.
4
Contents Definitions & Scope Example Gaps Being Addressed Solution Approach Example Progress Summary
5
Engineering FrameworkAs Defined by a Question
“How do we connect people, their models, and their tools?”[Olsen, 1994]
6
Engineering FrameworkComponents & Views
Some EFW “components” …– Computing - networks, machines, software (tools)– Content - information representation (models)– Communication - content access protocols (interoperability)– Control - work flow & business processes – People - including their specific skills and roles
Some views of an EFW …– Computer Network View– Software Tool Organization View– Product Model Content View– Tool-Product Model Relationships View
Various Standards
Required
7
Example EFW: Computer Network ViewGeorgia Tech ECRC & EIS Lab (sanitized)
Adapted from 2000-07 - Chien Hsiung, Georgia Tech
8
Holding AccountBilling & Payable
E-CAE Toolsmiths and Workstations
DN
P O
pera
tion
s ToolsmithsWorkstations
SystemSystemCAECAE
DIVISION 31DIVISION 31
Servers & Sys AdminM-CAE Servers& Sys Admin Servers & SATMOD Severs
* Not DNP Operations
Design, Build, Assembly, Test (DBAT) Process
CA
E C
ost C
ente
rs
JPL Projects and Technical DivisionsCus
tom
ers
Robin MoncadaRobin MoncadaManagement and Administration
SoapSat Took Kit SDKDoorsApGenFast Flight
Ansoft HPEE SofSonnet
Mentor GraphicsCadenceMathworks MatlabSynopsysSynplicityIlogix StatemateOrcad AutoCad RelexAvant!
Place & Route- Actel- Xilinx - Atmel
(and many more)
PTC Computer VisionPTC Pro-ESDRC IdeasSDRC FemapSolid WorksCosmosNASTRANAdamsSinda/Fluent
PDMS -
EDMGSDRC MetaphaseSherpa
Visual ToolSetsCool JexPercepsRational RoseRuifyHarlequin LISPI-Logix Rhapsody
Code VLensViewTraceProZemax
Software T
ools
ElectronicsElectronicsCAECAE
DIVISION 34DIVISION 34
RF & EMRF & EMCAECAE
DIVISION 33DIVISION 33
MechanicalMechanicalCAECAE
DIVISION 35DIVISION 35
SoftwareSoftwareCAECAE
DIVISION 36DIVISION 36
OpticalOpticalCAECAE
DIVISION 38DIVISION 38
M-CAE Toolsmithsand Workstations
Adapted from “Computer Aided Engineering Tool Service at JPL” - 2001-07-22 - Mike Dickerson -NASA-JPL
Example EFW: Software Tool Organization View
9
EFW View: Specific Product Model Content A composition of standard and custom information models
Mechanical Engineering• Standard: AP203, AP214• Software Pro-E, Cadds, SolidWorks, AutoCad, SDRC IDEAS, Unigraphics, others• Status: In Production• Aerospace Industry Wide, Automotive Industry
Electrical Engineering• Standard: AP210• Software Mentor Graphics• Status: Prototyped• Rockwell, Boeing
Cabling• Standard: AP212• Software MentorGraphics• Status: Prototyped• Daimler-Chrysler, ProSTEP
Structural Analysis• Standard: AP209• Software: MSC Patran, Thermal Desktop• Status: In Production• Lockheed Martin, Electric Boat
Thermal Radiation Analysis• Standard: STEP-TAS• Software: Thermal Desktop, TRASYS• Status: In Production• ESA/ESTEC, NASA/JPL & Langely
Software Engineering• Standard::UML - (AP233 interface In Development)
• Software:Rational Rose, Argo, All-Together• Status: In Production• Industry-wide
Machining• Standard:: STEP-NC/AP224•Software:: Gibbs, •Status:: In Development / Prototyped•STEP-Tools, Boeing
Inspection• Standard: AP219• Software: Technomatics, Brown, eSharp • Status: In Development• NIST, CATIA, Boeing, Chrysler, AIAG
Systems Engineering• Standard: AP233• Software: Statemate, Doors, Matrix-X, Slate, Core, RTM• Status: In development / Prototyped• BAE SYSTEMS, EADS, NASA
PDM• Standard: STEP PDM Schema/AP232• Software: MetaPhase, Windchill, Insync• Status: In Production • Lockheed Martin, EADS, BAE SYSTEMS, Raytheon
Life-Cycle Management• Standard: PLCS• Software: SAP• Status: In Development• BAE SYSTEMS, Boeing, Eurostep
Fluid Dynamics• Standard: CFD• Software -• Status: In Development• Boeing,
Optics• Standard: NODIF• Software - TBD• Minolta, Olympus
Propulsion• Standard: STEP-PRP• Software:-• Status: In Development• ESA, EADS
Spacecraft Development
Adapted from 2001-12-16 - Jim U’Ren, NASA-JPL
10
EFW View: Generic Product Model Content Generic product development aspects
Source: SC4 Industrial Data Framework - ISO TC184 document SC4N1167 - 2001-08-01
11
EFW View: Tool-Product Model Relationships
XaiToolsPWA-B
Eagle
LKSoft, …Gap-FillingTools
XaiToolsPWA-B
LKSoft, …
Traditional Tools Mentor
Graphics
Product Model Components• AP210 • AP233• PDM Schema
STEP-Book AP210,SDAI-Edit,
STI AP210 Viewer, ...
Instance Browser/EditorPWB Stackup Tool,…
ElectricalCAD Tools
pgpdm
Core PDM Tool
AP210interface
Doors
Slate
Systems EngineeringTools
12
Target SituationCollaborative Engineering Environment with Advanced Interoperability
Domain Specific Analysis
Cross Domain Analysis
CAx Applications and PDMs
PDMSchema
AnalysisSchema(AP209)
Repository Schema Generator
Requirements Design & Analysis
Data Viewers
SystemEngineeringSchema
Catalog &ViewSchemas
Application Access/Translation Layer
ElectricalSchema(AP210)
MechanicalSchema(AP203)
Documentation Facilities
(UML)
Mfg.Capabilities(AP220)
(Text, XML,
SGML, etc.)
(STEP)
(STEP)
(STEP)
(STEP, XML)
(STEP)
Model Development and Interactive Environment
RequestBrokerOrRemoteAccessMech.
ObjectsEntities,Relations &AttributesObject Oriented or Object Relational DBMS
Data Views and PDM
AnalysisAgents
Negotiation/CommunicationsAgents
Data Dictionary Facilities
(Express)
Longer Term Vision for a Standards-based Architecture
2000-02 - Greg Smith, Boeing
13
Product Enclosure
External Interfaces
Printed Circuit Assemblies(PCAs/PWAs)
Die/Chip Package
Packaged Part
InterconnectAssembly
Printed Circuit Substrate (PCBs/PWBs)
Die/Chip
2002-04 - Russell Peak, Georgia Tech. Adapted from AP210 figure by Tom Thurman, Rockwell-Collins
EFW Analogy with Electronic SystemsA “system of systems”: parts, assemblies, technologies, configuration mgt., …
EFW Subsystems
AP233, AP210, …
An EFWat Company XYZ
CAx Tool xyz
Repository Architecture
SOAP, CORBA, …
14
Partial “Parts Library” of Relevant EFW Standards
ISO 10303 STEP AP 233
Systems engineering
ISO 10303 STEP AP 237
Fluid dynamics data based on CGNS (CFD General Notation System) www.cgns.org/ISO.html
ISO 10303 STEP PDM Schema
Product Data Management standardization across all STEP protocols www.pdm-if.org
ISO 10303 STEP Parts 50,51,52,53,107
EACM "Engineering Analysis Core Model" and the integrated resources for mathematics, representation of fields, structured and unstructured meshes and numerical analysis www.cedarlon.demon.co.uk
ISO 13584 PLIB
STEP-based Parts Library www.nist.gov/sc4/www/plibdocs.htm
W3C XML eXtensible Markup Language and related standards for web-enabled structured data applications www.w3.org/XML
W3C SOAP Simple Object Access Protocol for lightweight XML and HTTP based distributed processing www.w3.org/TR/SOAP
OMG CORBA Common Object Request Broker Architecture for object-oriented distributed processing middleware www.omg.org/corba
OMG UML Unified Modelling Language for object-oriented CASE www.omg.org/uml
OMG MDA Model Driven Architecture www.omg.org/mda
OMG MDTF Manufacturing Domain Task Force www.omg.org/homepages/mfg/index.html
IETF LDAP Lightweight Directory Access Protocol for distributed directory and dictionary services www.ietf.org/rfc/rfc2251.txt see also OpenLDAP
From http://www.estec.esa.nl/conferences/aerospace-pde-2002/relevant_standards.htm as of 2/2002
15
Scope of Engineering Framework Interest Group (EFWIG)
Interoperability in multi-disciplinary engineering development environments– Emphasis dimensions:
» Organizational Level: engineering group/department» Domains: systems & s/w engineering, electromechanical, analysis» Design stages: WIP designs at concept, preliminary, and detailed
stages
– Awareness of design interfaces to other life cycle phases: » pursuit & order capture, mfg., operation/service, and disposal
16
Contents Definitions & Scope Example Gaps Being Addressed Solution Approach Example Progress Summary
17
Challenges in Today's Engineering Frameworks
Highly dynamic & complex “objects”: users, models, relationships, tools, machines, virtual resources, …
– Frequent changes, including technology evolution– Large quantities– Version & configuration management issues– Maintaining commonality takes time, resources, & hard work
EFW structure & operation not well-defined– Little central knowledge or control
Interoperability not typical vendor intent– Primary CAx tools designed for stand-alone mode– “Integration” = “single vendor can do-it-all” tendency– Capacitor mfg. turned supercomputer mfg. analogy
Inherent humans limits– Communications bandwidth (Tower of Babel)– Time, space, language, motivation (money/politics/human nature)
18
Specific Gaps Being Addressed by EFWIG
Content coverage gaps Content semantic gaps
– Ancillary information, including “dumb” figures & notes Fine-grained associativity gaps
19
Example PWA Ancillary Information“Dumb” figures & notes
Component AssemblyInstructions
Maximum HeightRestrictions
Stackup Notes
Conformal CoatingRestrictions
PWA = printed wiring assemblyPWB = printed wiring board
20
Information Capture Gaps:Content Coverage and Semantics
Existing Tools
Tool A1 Tool An...
“dumb” information capture(only human-sensible,I.e., not computer-sensible)
LegendContent
Coverage Gaps
ContentSemantic Gaps
Product Model Components• AP210 • AP233• PDM Schema
21
e
se
tr
Pf
02
21
e
be
ht
PCf
),,( 13 hbrfK
Channel Fitting Analysis
Interoperability Gap: Lack of Fine-Grained Associativity
design model-analysis model example
Analysis Model (with Idealized Features)
Detailed Design Model
Idealizations
1 : b = cavity3.inner_width + rib8.thickness/2 + rib9.thickness/2
“It is no secret that CAD models are driving more of today’s product development processes ... With the growing number of design tools on the market, however, the interoperability gap with downstream applications, such as finite element analysis, is a very real problem. As a result, CAD models are being recreated at unprecedented levels.” Ansys/ITI press Release, July 6 1999
http://www.ansys.com/webdocs/VisitAnsys/CorpInfo/PR/pr-060799.html
No explicit
fine-grained
CAD-CAE
associativity
22
Cost of Associativity Gaps
000,000,10$gap
$10 gaps000,000,1
gaps000,000,1analysis
variables 10
part
analyses 10parts 000,10
OOO
OOOO
e
setr
Pf
02
21
e
beht
PCf
),,( 13 hbrfK
Analysis Model(with Idealized Features)
Detailed Design Model
Channel Fitting Analysis
idealizations
No explicit
fine-grained
CAD-CAE
associativity
Categories of Gap Costs Associativity time & labor
– Manual maintenance– Little re-use– Lost knowledge
Inconsistencies Limited analysis usage
– Fewer parts analyzed– Fewer iterations/part
“Wrong” values – Too conservative:
Extra costs, inefficiencies– Too loose:
Re-work, failures, law suitsRough Cost Estimate per Complex Product
23
Contents Definitions & Scope Example Gaps Being Addressed Solution Approach Example Progress Summary
24
EFWIG Teamwork Approach Twice monthly telecons Regular working sessions
– At SC4 meetings, PDES Inc. offsites, … Team website & virtual workspace
Other organizations are welcome to get involved!
25
EFWIG Solution Approach Philosophy: Consider engineering computing environments
and EFWIG deliverables as “products” themselves Follow systems engineering approach for EFWIG itself
– Decompose problem into subsystems» Architectures, components (stds., tools, …), and techniques
– Identify existing solutions where feasible– Identify & define gaps – Define solution paths
» Identify team members and/or other groups who will “supply”/develop these subsystems
– Develop & prototype solutions– Advocate solution standardization and vendor support– Test in pilots– Deploy in production usage
26
EFWIG “Subsystems” Work In-Progress(page 1 of 2 - working list)
Other participants are welcome!
The following is the initial set of enabling “components” being worked by EFWIG. Items highlighted in yellow were reviewed during one or more of the sessions at the ISO
TC184/SC4 Myrtle Beach meeting held February 25th - March 1st, 2002. References [n] are to the meeting minutes attachments.
Items marked with a question mark (?) still need to be confirmed for inclusion in EFWIG. 1) Infrastructures/Architectures
a) Architectural roadmaps - Russell Peak (GIT) [starter in 1] b) STEP-based infrastructure items - Jim U’Ren (JPL/NASA) [2]
2) Testbed/needs, verification & validation
a) AP233 testbed overview & demo - Peter Denno (NIST) [3] 3) Supporting engineering information technologies
a) Express-based repositories and applications i) General tools & techniques
(1) Express-based DBMS structure and SDAI access - Lothar Klein (LKSoft) (2) Get/put via automated ARM-AIM mapping - Lothar Klein (3) Express/XML-based user interfaces - Lothar Klein [in 1 and 4] (4) SVG-based smart figures - Russell Peak [in 4] (5) Techniques for multi-AP-based repositories and applications - Lothar Klein (6) Other vendors (?) (7) Providing ARM-level APIs (reference experience: Georg Siebes)
b) PDM aspects i) PDM schema/modules - Ken Buchanan (ATI/ADL) (?) (liaison report) ii) PGPDM and PDM interoperability - Steve Waterbury (NASA) (?) [5]
c) Constrained objects (COBs) for fined-grained associativity - Russell Peak [some in 4b, 7] See http://eislab.gatech.edu/research/XAI_Central.doc Also potential contribution to SE UML Profile (see below)
27
EFWIG “Subsystems” Work In-Progress(page 2 of 2)
1) Cross-domain coordination items a) Systems Engineering
i) AP233 - Jim U’Ren (liaison report) [see separate meeting minutes on BSCW] ii) Systems Engineering UML Profile - Sandy Friedenthal (LMCO) (liaison) (?) See SE DSIG website: http://syseng.omg.org
2) Representative domain-specific items
a) Electromechanical (see also JWG9 and PDES Electromechanical Pilot activities) i) AP210 - Lothar Klein / Tom Thurman / Greg Smith (Boeing) (liaisons) [6] ii) ECAD tools / ECAD-PDM links - Farrokh Shoar (JPL/NASA) (?) iii) Circuit board examples - Russell Peak [4]
b) Software (and its relation to product structure and other product life cycle aspects) i) Identified contact to scope out approaches (Mike Loeffler - GM) ii) Other interested parties: Kevin Fischer - RWC (?)
c) Analysis templates - Russell Peak [examples in 7] See http://eislab.gatech.edu/research/XAI_Central.doc
3) Specific implementation targets
a) Boeing avionics & SE (Greg Smith) b) Georgia Tech Manufacturing Research Center Information Systems Lab (Russell Peak)
[similar partial examples 1] c) GM Electronics & Control Systems (Mike Loeffler) d) JPL/NASA Design Hub (Mike Dickerson)
Others being considered
e) Rockwell Collins (?), NASA Goddard (?)
Other participants are welcome!
28
Contents Definitions & Scope Example Gaps Being Addressed Solution Approach Example Progress Summary
29
EFWIG “Subsystems” Work In-Progress(page 1 of 2 - working list)
Other participants are welcome!
The following is the initial set of enabling “components” being worked by EFWIG. Items highlighted in yellow were reviewed during one or more of the sessions at the ISO
TC184/SC4 Myrtle Beach meeting held February 25th - March 1st, 2002. References [n] are to the meeting minutes attachments.
Items marked with a question mark (?) still need to be confirmed for inclusion in EFWIG. 1) Infrastructures/Architectures
a) Architectural roadmaps - Russell Peak (GIT) [starter in 1] b) STEP-based infrastructure items - Jim U’Ren (JPL/NASA) [2]
2) Testbed/needs, verification & validation
a) AP233 testbed overview & demo - Peter Denno (NIST) [3] 3) Supporting engineering information technologies
a) Express-based repositories and applications i) General tools & techniques
(1) Express-based DBMS structure and SDAI access - Lothar Klein (LKSoft) (2) Get/put via automated ARM-AIM mapping - Lothar Klein (3) Express/XML-based user interfaces - Lothar Klein [in 1 and 4] (4) SVG-based smart figures - Russell Peak [in 4] (5) Techniques for multi-AP-based repositories and applications - Lothar Klein (6) Other vendors (?) (7) Providing ARM-level APIs (reference experience: Georg Siebes)
b) PDM aspects i) PDM schema/modules - Ken Buchanan (ATI/ADL) (?) (liaison report) ii) PGPDM and PDM interoperability - Steve Waterbury (NASA) (?) [5]
c) Constrained objects (COBs) for fined-grained associativity - Russell Peak [some in 4b, 7] See http://eislab.gatech.edu/research/XAI_Central.doc Also potential contribution to SE UML Profile (see below)
30
Another “System of Subsystems” Analogy:An EFW is like a 24/7 Automobile Assembly Factory …
Each is a unique “facility”– Built from standard & custom components– Include organization-specific business practices
Near-continuous operation– Facility usage to create “products”– Business critical facility!
Frequent “live/hot-swap” maintenance and upgrades
Periodic major overhauls– To support new product types– To install major new technologies
31
Example Approach in JPL/NASA EffortTypical Current Multi-PDM Architecture for Larger Organizations
(components and interfaces)
ECAD Bound Design
MGC Board Station ECAD-
Oriented PDM
MGC DMS
MCAD Bound Design
PTC Pro/Engineer 2001 MCAD-
Oriented PDM
PTC ProjectLink
Enterprise PDM
Level 1: Domain-Level PDM• Interactive WIP design collaboration: main tools• Tight Integration w/ major domain-specific CAD tools
Level 2: Workgroup-Level PDM• Interactive WIP design collaboration• Focus on inter-tool information interoperability
EDS Metaphase
Level 3: Enterprise-Level PDM• Major Releases (to manufacturer, to supplier, …)• Long Term Archiving
Gaps:• Content coverage and semantics• Fine-grained associativity
• Even within a native file • Esp. between attributes in monolithic native files
• Dynamic interactivity vs. batch releases
Software and Person-ware (manual) glue
…
Plus other enterprise resources: Document Mgt. Systems
(e.g., DocuShare), …
____________
Native Files
DBMS
____________
Native Files
DBMS
____________
Native Files
DBMS
Oracle
Oracle
Oracle
Basic Objects & Relations
32
Example Approach in JPL/NASA EffortTarget Standards-Based Multi-PDM Architecture for Larger Organizations
(components and interfaces)
____________
Native Files
DBMS
____________
Native Files
DBMS
ECAD Bound Design
MGC Board Station ECAD-
Oriented PDM
MGC DMS
MCAD Bound Design
PTC Pro/Engineer 2001 MCAD-
Oriented PDM
PTC ProjectLink
Enterprise PDM
Object Manager
Product Structure and Native File Manager
PostgreSQL
Oracle or MySQL
Level 1: Domain-Level PDM• Interactive WIP design collaboration: main tools• Tight Integration w/ major domain-specific CAD tools
Level 2: Workgroup-Level PDM• Interactive WIP design collaboration: gap filler tools• Focus on inter-tool information interoperability
Type 2a
Type 2b
LKSoft & XaiTools
PGPDM
EDS Metaphase
Level 3: Enterprise-Level PDM• Major Releases (to manufacturer, to supplier, …)• Long Term Archiving
OMG PDM Enablers Protocol(for inter-PDM/repository
communication)
Fine-Grained Objects &
Advanced Relationsw/ Multi-Schema
STEP-Based Models:233, 203, 209, 210, …
PDM Schema Context
Basic Objects & Relations
____________
Native Files
DBMS
Other CAD/CAE Tools
Standard & Custom Templates
LKSoft & XaiTools
Statemate, Ansys, Matlab, Materials DB, …
____________
Native Files
…
OMG CAD Services Protocol(for automatic usage
of geometry processing, …)
CORBA, SOAP
SOAP
SDAI
Plus other enterprise resources: Document Mgt. Systems
(e.g., DocuShare), …
Oracle
Oracle
Oracle
33
Tool-Product Model Schema Relationships in aStandards-Based Engineering Framework
Version 1 Target for Workgroup-level Product Development
XaiToolsPWA-B
Eagle
LKSoft, …Gap-FillingTools
XaiToolsPWA-B LKSoft, …
Traditional Tools Mentor
Graphics
Product Model Components• AP210 • AP233• PDM Schema
STEP-Book AP210,SDAI-Edit,
STI AP210 Viewer, ...
Instance Browser/EditorPWB Stackup Tool,…
ElectricalCAD Tools
pgpdm
Core PDM Tool
AP210interface
Doors
Slate
Systems EngineeringTools
34
Application-OrientedCustom Schema: git_pwa.exp
• Based on TIGER/ProAM/JPL Phase 1• Focused to support stackup design, analysis, etc.• Has mapping with AP210 stackup data
36
Next Gen. Gap-Filler Application (In-Progress): PWB Stackup Design & Analysis Tool
Original manually generated
“dumb” figure
Reference figure (static SVG - first prototype). Enhances end user
understanding of above attributes
Attributes captured in computer-sensible form
37
Original “dumb” figurewith computer-
insensible parameter: standoff height, hs
Reference figure (static SVG - first prototype). Enhances end user
understanding of above attributes
Attribute captured in computer-sensible form
38
EFWIG “Subsystems” Work In-Progress(page 1 of 2 - working list)
Other participants are welcome!
The following is the initial set of enabling “components” being worked by EFWIG. Items highlighted in yellow were reviewed during one or more of the sessions at the ISO
TC184/SC4 Myrtle Beach meeting held February 25th - March 1st, 2002. References [n] are to the meeting minutes attachments.
Items marked with a question mark (?) still need to be confirmed for inclusion in EFWIG. 1) Infrastructures/Architectures
a) Architectural roadmaps - Russell Peak (GIT) [starter in 1] b) STEP-based infrastructure items - Jim U’Ren (JPL/NASA) [2]
2) Testbed/needs, verification & validation
a) AP233 testbed overview & demo - Peter Denno (NIST) [3] 3) Supporting engineering information technologies
a) Express-based repositories and applications i) General tools & techniques
(1) Express-based DBMS structure and SDAI access - Lothar Klein (LKSoft) (2) Get/put via automated ARM-AIM mapping - Lothar Klein (3) Express/XML-based user interfaces - Lothar Klein [in 1 and 4] (4) SVG-based smart figures - Russell Peak [in 4] (5) Techniques for multi-AP-based repositories and applications - Lothar Klein (6) Other vendors (?) (7) Providing ARM-level APIs (reference experience: Georg Siebes)
b) PDM aspects i) PDM schema/modules - Ken Buchanan (ATI/ADL) (?) (liaison report) ii) PGPDM and PDM interoperability - Steve Waterbury (NASA) (?) [5]
c) Constrained objects (COBs) for fined-grained associativity - Russell Peak [some in 4b, 7] See http://eislab.gatech.edu/research/XAI_Central.doc Also potential contribution to SE UML Profile (see below)
39
Developing a Global STEP Usage Infrastructure:Identifying and Defining Standard Services
• Data Dictionary Services
Long-Term Vision• Develop Infrastructure of Services supporting end-to-end, interdisciplinary data integration and data reuse • Bring STEP to the desktop with easy-to-use interfaces
• Part Library Services
• Data Repository Services
• Education/Training Services
• Data Modeling Services
• Translation Services
• Validation Services
• Visualization Services
• Tool Services
Needed Services
Contact: Jim U’Ren, NASA/Jet Propulsion Laboratory
2002-01-28
40
EFWIG “Subsystems” Work In-Progress(page 1 of 2 - working list)
Other participants are welcome!
The following is the initial set of enabling “components” being worked by EFWIG. Items highlighted in yellow were reviewed during one or more of the sessions at the ISO
TC184/SC4 Myrtle Beach meeting held February 25th - March 1st, 2002. References [n] are to the meeting minutes attachments.
Items marked with a question mark (?) still need to be confirmed for inclusion in EFWIG. 1) Infrastructures/Architectures
a) Architectural roadmaps - Russell Peak (GIT) [starter in 1] b) STEP-based infrastructure items - Jim U’Ren (JPL/NASA) [2]
2) Testbed/needs, verification & validation
a) AP233 testbed overview & demo - Peter Denno (NIST) [3] 3) Supporting engineering information technologies
a) Express-based repositories and applications i) General tools & techniques
(1) Express-based DBMS structure and SDAI access - Lothar Klein (LKSoft) (2) Get/put via automated ARM-AIM mapping - Lothar Klein (3) Express/XML-based user interfaces - Lothar Klein [in 1 and 4] (4) SVG-based smart figures - Russell Peak [in 4] (5) Techniques for multi-AP-based repositories and applications - Lothar Klein (6) Other vendors (?) (7) Providing ARM-level APIs (reference experience: Georg Siebes)
b) PDM aspects i) PDM schema/modules - Ken Buchanan (ATI/ADL) (?) (liaison report) ii) PGPDM and PDM interoperability - Steve Waterbury (NASA) (?) [5]
c) Constrained objects (COBs) for fined-grained associativity - Russell Peak [some in 4b, 7] See http://eislab.gatech.edu/research/XAI_Central.doc Also potential contribution to SE UML Profile (see below)
41
Scope of the STEP PDM Schema and PDM Implementers Forum Test Campaigns
(Status: March 2002)
AliasIdentifi-cation
Contractand
Project
Work and Change
Management
Part Identification
Part Structure
Part Properties
DocumentIdentification
DocumentStructure
File Identification
Document/File
Properties
Part Management Document Management
Person and Organization
ApprovalSecurity
Classification
Date and Time
Authorization
performed
Effec-tivityConfi-
guration
External Geom. Model
Transformation
Geometry Assignment
Part Classification
ongoing upcoming
42
Geometric Shapes
• Advanced BREP Solids
• Manifold Surfaces with Topology
PDM Modules Used in AP 203 Edition 2 – Modular AP: Configuration Controlled 3D Design of Mechanical Parts and Assemblies
Product Item Structure• Specifications
Engineering Change• Work Order• Work Request
Product Identification• Definition• Version• Identification
• Geometrically Bounded Surfaces and Wireframe
• Faceted BREP Solids
• Wireframe with Topology
Configuration Effectivity• Effectivity• End Item Identification
Geometric Presentation• Colours, Layers & Groups
Geometric Validation Properties
• Constructive solid geometry
Geometric Dimensioning and Tolerancing
Solid Model Construction History
3D Associative Text
• Wireframe with Topology
PDM Modules
2002 - PDES Inc.
Pan-Galactic PDM (PGPDM)Pan-Galactic PDM (PGPDM)STEP-based Intelligent PDM andSTEP-based Intelligent PDM andSystems Engineering RepositorySystems Engineering Repository
Stephen C. Waterbury
NASA STEP Testbed
NASA / Goddard Space Flight Center
April 2002
44
PGPDM Acronyms and Definitions
API ……….... Application Programming Interface CAD ……….. Computer-Aided Design CAE ……….. Computer-Aided Engineering Express …… the STEP information modeling language Express-X … language to map one Express model to another OMG ……….. Object Management Group PDM ………... Product Data Management PDME ………. PDM Enablers (an API developed by the OMG) PGPDMTM ….. Pan-Galactic PDM SE .................. Systems Engineering STEP ………... Standard for Exchange of Product Model Data
(ISO 10303)
2002-04 - Steve Waterbury, NASA-GSFC
45
Pan-Galactic PDM
Scope and Design Intent– Standards-based PDM and Systems Engineering Repository Services
» Basic CM, Work Flow, CAX Model and Document Management Services» CAX Model Integration and Transformation Services» Parts Library Catalog, Global Search, and Federation Services
– Standard interfaces to engineering tools and systems
Implementation Approach– Create PGPDM as Open Source, using Open Source technologies
(Python, Express Engine, PostgreSQL, Apache, OpenCASCADE)– Use standard information models (STEP)– Use standard API's (OMG PDM Enablers and CAD Services, SOAP and
Web Services Architecture, HTTP, SSL, etc.)– Components:
» PGPDM Server (Repository and Services)» PGPDM Client (Cross-Platform Desktop GUI Client)
2002-04 - Steve Waterbury, NASA-GSFC
46
PGPDM: Intelligent Model ManagmentPGPDM: Intelligent Model ManagmentMaster Model Integration Using Master Model Integration Using STEPSTEP and and OMG StandardsOMG Standards
AP 233AP 210AP 209AP 203
Analysis(CAE)Tools
ElectronicCADTools
SystemsEngineering
Tools
MechanicalCADTools
Spacecraft XMaster Model
Integrated STEPMaster Model
Express-XMaps
Instrument YMaster Model
PGPDMClient
Instrument YObject
File Vault(STEP, proprietary, docs, etc.)
Database:PostgreSQL
Security,Auth.,
andRequestRoutingServices
Transactionand SearchManager
ModelIntegration and Transformation
Services:ExpressEngine
ThickClientAPI(for
PGPDMClientet al.)
CAD/CAETools
v1.0 Architecture
48
eWidget v1.2 Test Case – Product Structure
usesXYZ-431
XYZ-500Bolt
XYZ-455Backplate Type 6
XYZ-450
Corner Sheet 2
XYZ-440Back plate Type 3Main Assembly
Parts
End Block 1
End Block 2
Sheet Tie 2 Bolts
Welds
2002-03 - R Ludlow, R Peak, Georgia Tech
ExternalSystems
(PDM, etc.)
CAD/CAETools
ThickClientAPI
SystemAPI
(peer/peer,federation,
global search)
ThinClientAPIWeb Browsers
File Vault(STEP, proprietary files, docs, etc.)
DatabasePostgreSQL
(Master Model Repository)
Security,Auth.,
andRequestRoutingServices
Transactionand SearchManager
ModelIntegration and Transformation
Services(translate and
transform models,generate views)
MetaServices(Dictionaries,MOF, CWM)
LibraryServices
51
EFWIG “Subsystems” In-Progress(page 2 of 2)
(Others TBD)
1) Cross-domain coordination items a) Systems Engineering
i) AP233 - Jim U’Ren (liaison report) [see separate meeting minutes on BSCW] ii) Systems Engineering UML Profile - Sandy Friedenthal (LMCO) (liaison) (?) See SE DSIG website: http://syseng.omg.org
2) Representative domain-specific items
a) Electromechanical (see also JWG9 and PDES Electromechanical Pilot activities) i) AP210 - Lothar Klein / Tom Thurman / Greg Smith (Boeing) (liaisons) [6] ii) ECAD tools / ECAD-PDM links - Farrokh Shoar (JPL/NASA) (?) iii) Circuit board examples - Russell Peak [4]
b) Software (and its relation to product structure and other product life cycle aspects) i) Identified contact to scope out approaches (Mike Loeffler - GM) ii) Other interested parties: Kevin Fischer - RWC (?)
c) Analysis templates - Russell Peak [examples in 7] See http://eislab.gatech.edu/research/XAI_Central.doc
3) Specific implementation targets
a) Boeing avionics & SE (Greg Smith) b) Georgia Tech Manufacturing Research Center Information Systems Lab (Russell Peak)
[similar partial examples 1] c) GM Electronics & Control Systems (Mike Loeffler) d) JPL/NASA Design Hub (Mike Dickerson)
Others being considered
e) Rockwell Collins (?), NASA Goddard (?)
52
User/Owner/Operator
Acquisition Authority
Systems Engineering
Management Marketing
User/Owner/Operator
Business Strategy Concept RFP Proposal Contract
Management InfoManagement Info
Mechanical ElectricalChemical
Digital
Civil
Controls
Communications
LogisticsMaintenance
Manufacture
STEPISO SC4
Specifications
Software
UMLISO SC7
EngineeringDisciplines
What is the context of Systems Engineering?
2002-04 - Mike Dickerson, NASA-JPL
54
text
text
text
text
AP 233 - What is in System Engineering
SE Management Creation Reqt's
ChangeControl
OrgStructure
CM
Scheduling
WBS
RolePeople
Text Modeling
Structure
Optimazation
Behavior
StateChart
Contineous
CalculatePerformance
Allocation
Tracability
Derived
AP210
LibraryNot in AP233 UML
EACM
PDM
PLCS
2002-03 - Mike Dickerson, NASA-JPL
55
EFWIG “Subsystems” Work In-Progress(page 2 of 2)
1) Cross-domain coordination items a) Systems Engineering
i) AP233 - Jim U’Ren (liaison report) [see separate meeting minutes on BSCW] ii) Systems Engineering UML Profile - Sandy Friedenthal (LMCO) (liaison) (?) See SE DSIG website: http://syseng.omg.org
2) Representative domain-specific items
a) Electromechanical (see also JWG9 and PDES Electromechanical Pilot activities) i) AP210 - Lothar Klein / Tom Thurman / Greg Smith (Boeing) (liaisons) [6] ii) ECAD tools / ECAD-PDM links - Farrokh Shoar (JPL/NASA) (?) iii) Circuit board examples - Russell Peak [4]
b) Software (and its relation to product structure and other product life cycle aspects) i) Identified contact to scope out approaches (Mike Loeffler - GM) ii) Other interested parties: Kevin Fischer - RWC (?)
c) Analysis templates - Russell Peak [examples in 7] See http://eislab.gatech.edu/research/XAI_Central.doc
3) Specific implementation targets
a) Boeing avionics & SE (Greg Smith) b) Georgia Tech Manufacturing Research Center Information Systems Lab (Russell Peak)
[similar partial examples 1] c) GM Electronics & Control Systems (Mike Loeffler) d) JPL/NASA Design Hub (Mike Dickerson)
Others being considered
e) Rockwell Collins (?), NASA Goddard (?)
56
AP210 Roles in EFWIG Traditional role:
– Use for design of electronics Additional multidisciplinary roles:
– Recognize generic capabilities:»PDM, inter-model associativity, requirements,
supply chain, …– Use as starting point for needs in other product
domains»Ex. Systems Engineering (AP233) reuse of
AP210 concepts
57
Product Enclosure
External Interfaces
Printed Circuit Assemblies(PCAs/PWAs)
Die/Chip Package
Packaged Part
InterconnectAssembly
Printed Circuit Substrate (PCBs/PWBs)
Die/Chip
STEP AP 210 (ISO 10303-210) Domain: Electronics DesignR
~800 standardized concepts (many applicable to other domains)Development investment: O(100 man-years) over ~10 years
Adapted from 2002-04 - Tom Thurman, Rockwell-Collins
58
Summary of Ongoing Activities Related to STEP for Electronics
STEP Electro-Mechanical Activities
Standards Development
and Deployment
AP210, AP210, AP233
Advocacy
Producibility Analysis (DFM)
(B)
AP210 Viewers(B, STI)
IDF/AP210 Conversion
(R/B/N)
PWA/PWB Stackup (GT/N)
STEP Repository (GT/N/B)
AP203/AP210 Conversion (N)
Company Activities
AP210 Book (L)
Zuken AP210 Translation
(R/L/AT)Mentor AP210 Translation (B/N/L/AT)
Eagle AP210 Translator (L)
AP210 Primer (A)
Marketing
Implementation
Education
Related Activities
Company Legend
B – BoeingN – NASAGT – Georgia TechA – U.S.ArmyR – Rockwell-CollinsGM – General MotorsL – LK SoftwareAT - ATI/PDES Inc.STI - STEP Tools Inc.
Manufacturing Simulation (R)
Analysis Templates (GT)
2002-03 - Greg Smith, Boeing
59
PWA/PWB Producibility Analysis using AP210
Company PWA/PWBGuidelines
Codification of Guidelines(Rules Definition)
PWA/PWB Captured in Mentor Design Tools
STEP AP210
Rules
ProducibilityAnalysisReport
Manufacturing
CapabilitiesSTEP AP220
Comparison of RulesAgainst Product Data(Rules Execution)
2002-03 - Greg Smith, Boeing
62
PWA/PWB Assembly Simulation using AP210
Rules (FromDefinitionFacility)
Generic Manufacturing Equipment Definitions
SpecificManufacturing Equipment Used
User Alerted on Exceptions to ProducibilityGuidelines
2002-03 - Tom Thurman, Rockwell-Collins
63
AP210 Scope in EFWIG Traditional scope:
– Use for design of electronics Additional scope:
– Recognize generic capabilities:»PDM, inter-model associativity, requirements,
supply chain, …– Use as starting point for needs in other product
domains»Ex. Systems Engineering (AP233) reuse of
AP210 concepts
64
DeviceSupplier
Configuration ManagedCorporate Data Process (PDM/Library)
System EngineerSimulation Model Supplier
Assembly & FabricationVendor(s)
Customer
Package DataSupplier
Requirements
AP210 Usage Supply Chain
Design Team
MCAD
ECAD
2002-03 - Tom Thurman, Rockwell-Collins
65
System Engineer
EE
Initial TaskNegotiationand data dumpto EE
Vendor Web Site
Sys EngGets MoreData
Sys Engsends datato EE
EE PerformsTask
EE TransmitsData to SysEng
FinalData PackageStored inRepository
AP210 Usage Multidisciplinary Engineering Interaction
2002-03 - Tom Thurman, Rockwell-Collins
66
RequirementsDecomposition
Requirementoccurrence
Function toPhysical
Map
FunctionalPath
Subset(SingleNode)
Physical UnitNetwork Subset
(Single Node)
PhysicalUnit
Network
Omitted for Clarity:1. Details of recursive definition2. “Pin Mapping” in library3. Simulation model library and associativity aspects.
Functional Decomposition
(Network)
RequirementTo Function
FunctionDefinition
FunctionOccurrence
“Library”
“Design”
RequirementTo Assembly
PhysicalAssembly
Decomposition
Physical Macro &ComponentDefinition
PhysicalOccurrence
FunctionalPath SubsetTo Assembly
RequirementTo Interconnect
Assembly toInterconnect
LayoutNetworkSubset toImplement
NodeFunction to
Layout
Physical Interconnect
Decomposition
LayoutOccurrence
LayoutMacro &Template
Definition
Simulation Model
Definition
Requirement Verification
Model
AP210-based Multidisciplinary Model AssociativityEx. Application: Requirements & Functions Allocation Traceability
Each column is a typical “stovepipe”
(a CAx tool island of automation)
Each yellow bubble is a typical associativity gap
(problem area)
Requirements Functions (Design Intent) Parts Assemblies Assembly Backbones (e.g., PCB)
Adapted from 2002-03 - Tom Thurman, Rockwell-Collins
67
EFWIG “Subsystems” Work In-Progress(page 1 of 2 - working list)
Other participants are welcome!
The following is the initial set of enabling “components” being worked by EFWIG. Items highlighted in yellow were reviewed during one or more of the sessions at the ISO
TC184/SC4 Myrtle Beach meeting held February 25th - March 1st, 2002. References [n] are to the meeting minutes attachments.
Items marked with a question mark (?) still need to be confirmed for inclusion in EFWIG. 1) Infrastructures/Architectures
a) Architectural roadmaps - Russell Peak (GIT) [starter in 1] b) STEP-based infrastructure items - Jim U’Ren (JPL/NASA) [2]
2) Testbed/needs, verification & validation
a) AP233 testbed overview & demo - Peter Denno (NIST) [3] 3) Supporting engineering information technologies
a) Express-based repositories and applications i) General tools & techniques
(1) Express-based DBMS structure and SDAI access - Lothar Klein (LKSoft) (2) Get/put via automated ARM-AIM mapping - Lothar Klein (3) Express/XML-based user interfaces - Lothar Klein [in 1 and 4] (4) SVG-based smart figures - Russell Peak [in 4] (5) Techniques for multi-AP-based repositories and applications - Lothar Klein (6) Other vendors (?) (7) Providing ARM-level APIs (reference experience: Georg Siebes)
b) PDM aspects i) PDM schema/modules - Ken Buchanan (ATI/ADL) (?) (liaison report) ii) PGPDM and PDM interoperability - Steve Waterbury (NASA) (?) [5]
c) Constrained objects (COBs) for fined-grained associativity - Russell Peak [some in 4b, 7] See http://eislab.gatech.edu/research/XAI_Central.doc Also potential contribution to SE UML Profile (see below)
See also other presentations at
APDE 2002Workshop
68
EFWIG “Subsystems” Work In-Progress(page 2 of 2)
1) Cross-domain coordination items a) Systems Engineering
i) AP233 - Jim U’Ren (liaison report) [see separate meeting minutes on BSCW] ii) Systems Engineering UML Profile - Sandy Friedenthal (LMCO) (liaison) (?) See SE DSIG website: http://syseng.omg.org
2) Representative domain-specific items
a) Electromechanical (see also JWG9 and PDES Electromechanical Pilot activities) i) AP210 - Lothar Klein / Tom Thurman / Greg Smith (Boeing) (liaisons) [6] ii) ECAD tools / ECAD-PDM links - Farrokh Shoar (JPL/NASA) (?) iii) Circuit board examples - Russell Peak [4]
b) Software (and its relation to product structure and other product life cycle aspects) i) Identified contact to scope out approaches (Mike Loeffler - GM) ii) Other interested parties: Kevin Fischer - RWC (?)
c) Analysis templates - Russell Peak [examples in 7] See http://eislab.gatech.edu/research/XAI_Central.doc
3) Specific implementation targets
a) Boeing avionics & SE (Greg Smith) b) Georgia Tech Manufacturing Research Center Information Systems Lab (Russell Peak)
[similar partial examples 1] c) GM Electronics & Control Systems (Mike Loeffler) d) JPL/NASA Design Hub (Mike Dickerson)
Others being considered
e) Rockwell Collins (?), NASA Goddard (?)
Other participants are welcome!
69
2002 ESA-NASA APDE Workshop Presentations with Direct EFWIG Involvement
An Overview of the STEP Systems Engineering Project (AP233) – U'Ren
A Modular Application Protocol for Systems Engineering – Bailey and U'Ren
Progress on Standards-Based Engineering Frameworks that include STEP AP210 (Avionics), PDM Schema, and AP233 (Systems)
– Peak, Dickerson, Klein, Waterbury, Smith, Thurman, U'Ren, and Buchanan Standards Based Collaborative System Design across the Life Cycle
– Dickerson Creating Gap-Filling Applications Using STEP Express, XML, and SVG-based Smart
Figures - An Avionics Example – Peak, Wilson, Kim, Udoyen, Bajaj, Mocko, Liutkus, Klein, Dickerson
AP210 Converters and Applications – Liutkus and Klein
Developing a Distributed Data Dictionary Service – U'Ren and Crichton
70
Summary of ProgressEngineering Framework Interest Group (EFWIG)
Defined philosophical foundation: An EFW as a “product” itself - a “system of systems”
– Enables using similar engineering techniques and tools to address gaps
» Problem decomposition, “make/buy”, configuration mgt., versioning, maturity/TRL, …
Specific gaps addressed:– Content coverage & semantic gaps– Fine-grained associativity gaps
Example “components” in-progress: – Multi-level architecture– Global STEP services infrastructure– PGPDM: standards-based open source PDM system– Leveraging AP210 capabilities in other areas (e.g. AP233)