RIT Senior Design Project 10662 D3 Engineering Camera Platform
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Transcript of RIT Senior Design Project 10662 D3 Engineering Camera Platform
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RIT Senior Design Project 10662D3 Engineering Camera Platform
Friday October 9, 2009 11:30 to 1:00pm
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Team Members
• Gregory Hintz (EE)• Samuel Skalicky (CE)• Jeremy Greene (EE)• Jared Burdick (EE)• Michelle Bard (ME)• Anthony Perrone (ME)
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Power Distribution FPGA DDR2 OEM
Board Flash MEM SSD INS D3 Cameras Connector Board
1.2V 1.8V 5V 3.3V 3.3V, 5V, 12V 15V 3.3V 9-36V
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Power Distribution(cont.)
-Schematic Using LT1933 taken from Linear Technology
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Camera: MT9J003 CMOS Digital Image SensorWhy This Camera?
Imaging Array 3664(H) x 2748(V)Speed/Output• Frame Rate:
15 fps (HiSPi serial I/F) 7.5 fps (parallel I/F)
• Data Rate: 2.8 Gb/s (HiSPi serial I/F) 80 Mp/s (parallel I/F)
• Data Format: 12-bit RAW
Temperature Range• –30°C to +70°C
Power• Supply: 1.8V – 2.8V
638mW @ full resolution
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Interfaces
D3 Camera Interface-16-bit parallel output-6 Miscellaneous positions-Two wire I²C bus interface-Several clock and control positions
CameraLink -LVDS to achieve theoretical transmission
rate of 1.923Gbps-Not dependent on a particular supply
voltage because of low signal voltage swing
GigE-High bandwidth for high-speed, and high
resolution cameras-Downward compatible with 10/100 Mhz
Ethernet-Operates at a fast frame rate
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The Connector Board
• Speculation of finished product:
• Ports for data I/O.
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Where We Started
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Initial Concept• Specifications call for external ports:
– (2) CameraLink (LVDS)– (2) Gigabit Ethernet– Power in (9V to 36V)– Sync– Serial (RS-232)
Courtesy D3 Engineering
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Things to Consider• Q: What does this do beyond wire connectors?
– Will include some IC's that might otherwise be on the main, FPGA board.
• Q: Do all of these connectors need to be on a circuit board?
– Probably not
• Q: Is there anything else that needs an I/O port?
– The Inertial Navigation System (INS) will be housed separately
– An external Serial ATA (SATA) will be included
• Q: How will data be transferred from the connector board to the FPGA board and vice-versa?
– A ribbon cable to carry data signals
– CameraLink & GigE interfaces adapted to D3
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After Initial Brainstorming
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The Inertial Navigation System Provides location and
directional data. Location determined by a Global
Positioning System (GPS) device. Direction determined by an
Inertial Measurement Unit (IMU). Important information to have
for this kind of camera system.
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Considering the Options MicroStrain 3DM
Both can be used with RS232 port.
NovAtel SPAN
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Enclosure Consideration Some models contain the GPS and IMU in a
single unit, others separate them. May have noteworthy impact on size and
design of the system enclosure.
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Digital Operations
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FPGA Board
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Camera/INS Speeds
• 10 MP Visual Band Image Sensor– 1 image/sec– 1 image approx 32MB
• VGA IR Band Image Sensor– 30 images/sec– 1 image approx 1MB
• INS Sensor– 1 capture/image (30/sec)– 1 capture approx 2MB
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FPGA Hardware Requirements
• Flash Based (SPI) Configuration Memory– 64MB covers all Spartan 6 LXT packages
• DDR2 Ram– Image Data: RGB 24 bits, upto 30 bits per pixel
• Dual Modules -> 32bits wide– Density 2Gb total
• Approx 62MB image data/sec• Approx 60MB INS data/sec
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FPGA I/O Pin Requirements
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Spartan 6 FPGA Family
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End of Electrical Discussion
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Needs Considerations Approach
• Maintain optimal temperature range required by components
• Prevent the heat produced by the electronics from interfering with the operation of cameras
• Maintain an air/water tight environment
Heat Mitigation
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• External environment• Temperature on ground : assume 40-70 °F• Temperature at 30,000 ft (5.7 miles):
-66.8°F to -36.8°F
Image ID: wea00041, NOAA's National Weather Service (NWS) Collection Photographer: Ralph F. Kresge #1059
•Internal environment• External temperature plus
temperature of heat generated by electronic components
Needs Considerations ApproachHeat Mitigation
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• 2 Thermally isolated enclosures
• Conductive heat transfer methods inside the chassis
• Passive convective heat transfer
methods outside
Needs Considerations ApproachHeat Mitigation
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• Ensure imaging system is securely attached to airframe
• Reduce vibration of system
Image from: www.airamericafc.com/imaging/
Needs Considerations Approach
Airframe Mounting
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• Pre-existing bolt patterns in aircraft• Pre-existing opening in aircraft for imaging
systems• Does not interfere with other components of
imaging system
Needs Considerations Approach
Airframe Mounting
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• Utilize airplane’s pre-existing bolt pattern in vibration damping mount to attach vibration damping mount directly to airframe
Initial sketch for vibration damping airframe-mount
Needs Considerations ApproachAirframe Mounting
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Needs
• Stabilize Image• Prevent Hardware Damage/Malfunctioning
Considerations
• Frequencies of Aircraft• Allowable Vibration in Image• Component Resonant Frequencies
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Approach
Mechanical isolation of chassis
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Stock Hardware
• Interchangeable as needs change• Large body of established data
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Chassis DesignPhase 1: Individual Compartments
Separate Enclosures Thermally Isolated
ModularMinimal Leak Paths
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Chassis DesignPhase 2: Scale
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Chassis DesignPhase 3: Detail
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RIT Senior Design Project 10662D3 Engineering Camera Platform
Friday October 9, 2009