RFP F04701-97-R-000819 June 1998 1

EVOLVED EXPENDABLE LAUNCH VEHICLE (EELV)

DEVELOPMENT AND INITIAL LAUNCH SERVICES

REQUEST FOR PROPOSAL

ANNEX 15

EELV STANDARD INTERFACE SPECIFICATIONVERSION 5.0

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RFP F04701-97-R-000819 June 1998 ii

This document was produced and is maintained by the Evolved Expendable Launch VehicleProgram Office in conjunction with the Aerospace Corporation. The material in this documentwas developed largely from information supplied from the two EELV contractors: LockheedMartin Astronautics and The Boeing Company; with input from the payload programs at theUnited States Air Force’s Space and Missile Systems Center. Please direct any comments orquestions to the POCs below:

SMC POC EditorMaj. Jeff Joyce Randy KendallEELV Payload Integration Chief EELV Mission IntegrationSMC/MVS The Aerospace Corporation2420 Vela Way, suite 1467/A-2 PO Box 92957 (M/S: M1-131)Los Angeles AFB Los Angeles, CA 90009-2957El Segundo, CA 90245-4659

Phone: (310) 336-4020 Phone: (310)-336-5553Fax: (310) 336-4350 Fax: (310)-336-2468E-Mail: Jeff.Joyce@losangeles.af.mil E-Mail: randy.kendall@aero.org

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TABLE OF CONTENTS

1. INTRODUCTION............................................................................................................................................ 1

1.1 PURPOSE ...................................................................................................................................................... 11.2 SCOPE .......................................................................................................................................................... 11.3 DESIGN APPROACH ....................................................................................................................................... 11.4 EXCLUSIONS................................................................................................................................................. 21.5 DEFINITIONS ................................................................................................................................................ 21.6 ACRONYM LIST ............................................................................................................................................ 41.7..................................................................................................................................................................... 6REFERENCE DOCUMENTS .................................................................................................................................... 6

2. MISSION REQUIREMENTS ......................................................................................................................... 7

2.1 ORBIT REQUIREMENTS.................................................................................................................................. 7

3. PHYSICAL INTERFACES ............................................................................................................................. 8

3.1 MECHANICAL INTERFACES ............................................................................................................................ 83.2 ELECTRICAL/AVIONICS INTERFACES ............................................................................................................ 163.3 FLUID INTERFACES AND SERVICES ............................................................................................................... 283.4 ENVIRONMENTAL CONDITIONS.................................................................................................................... 303.5 CONTAMINATION CONTROL ........................................................................................................................ 313.6 ACCELERATION LOAD FACTORS .................................................................................................................. 323.7 VIBRATION................................................................................................................................................. 343.8 ACOUSTICS................................................................................................................................................. 343.9 SHOCK ....................................................................................................................................................... 373.10 GROUND PROCESSING LOAD FACTORS ....................................................................................................... 373.11 PAYLOAD FAIRING INTERNAL PRESSURE .................................................................................................... 38

4. FACILITIES AND PROCESSING................................................................................................................ 39

4.1 PROPELLANT SERVICES ............................................................................................................................... 394.2 ACCESS TO PAYLOADS - TIMELINESS ........................................................................................................... 394.3 SV BATTERY CHARGING ............................................................................................................................ 394.4 HAZARDOUS SV PROCESSING...................................................................................................................... 394.5 DETANKING................................................................................................................................................ 394.6 LIGHTNING PROTECTION............................................................................................................................. 39

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LIST OF FIGURES

FIGURE 1 - EELV STANDARD INTERFACE COORDINATE SYSTEM .............................................................................. 9FIGURE 2 - STANDARD INTERFACE PLANE - RELATIONSHIP TO SV............................................................................. 9FIGURE 3 - SMALL DIAMETER (62.010") PAYLOAD INTERFACE................................................................................ 10FIGURE 4 - LARGE DIAMETER (173") PAYLOAD INTERFACE...................................................................................... 10FIGURE 5 - EELV FLATNESS SPECIFICATION.......................................................................................................... 11FIGURE 6 - EELV HLV SPACECRAFT DYNAMIC ENVELOPE .................................................................................... 12FIGURE 7 - MLV SPACECRAFT DYNAMIC ENVELOPE .............................................................................................. 12FIGURE 8 - SMALLER (OPTIONAL) MLV SPACECRAFT DYNAMIC ENVELOPE ............................................................ 13FIGURE 9 - ALLOWABLE CG LOCATION ................................................................................................................. 14FIGURE 10 - INTERFACE WIRING HARNESS CONNECTIONS ...................................................................................... 17FIGURE 11 - MAXIMUM ALLOWABLE NARROWBAND SV RADIATED E-FIELDS ......................................................... 22FIGURE 12 - MAXIMUM ALLOWABLE BROADBAND SV RADIATED E-FIELDS ............................................................ 22FIGURE 13 - MAXIMUM ALLOWABLE NARROWBAND LV RADIATED E-FIELDS. ........................................................ 23FIGURE 14 - MAXIMUM LV RADIATED BROADBAND EMISSIONS.............................................................................. 24FIGURE 15 - MAXIMUM ALLOWABLE BROADBAND RADIATED E-FIELDS (ESD SOURCE) .......................................... 24FIGURE 16 - E-FIELD STRENGTH DERIVED RADIALLY 1 CM FROM PLF INNER SURFACE ........................................... 25FIGURE 17 - ORDNANCE TIMING............................................................................................................................ 28FIGURE 18 - MAXIMUM PLF INNER SURFACE TEMPERATURES................................................................................. 30FIGURE 19 - MLV-S QUASI-STATIC LOAD FACTORS .............................................................................................. 33FIGURE 20 - MLV QUASI-STATIC LOAD FACTORS.................................................................................................. 33FIGURE 21 - HLV QUASI-STATIC LOAD FACTORS................................................................................................... 34FIGURE 22 - MLV ACOUSTIC LEVELS .................................................................................................................... 35FIGURE 23 - HLV ACOUSTIC LEVELS..................................................................................................................... 36FIGURE 24 - EELV MAXIMUM SHOCK LEVELS ....................................................................................................... 38

LIST OF TABLES

TABLE 1 - SV MASS PROPERTIES........................................................................................................................... 15TABLE 2 - SV STIFFNESS REQUIREMENTS .............................................................................................................. 16TABLE 3 - SV MAXIMUM ACOUSTIC LEVELS .......................................................................................................... 37TABLE 4 - EELV MAXIMUM SHOCK LEVELS .......................................................................................................... 38

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1. INTRODUCTION

1.1 Purpose

This document defines the Standard Interface (SI) between the payloads and the EvolvedExpendable Launch Vehicle (EELV) system. The SI is being developed to standardizeequipment, processes and services among systems and vehicles to standardize payload integration.

This document was developed by the EELV System Program Office (SPO), in collaboration withtwo competing EELV contractors, with government representatives, and representatives of thepayload community in the Standard Interface Working Group (SIWG). It will be more fullydeveloped after the award of the Development agreements.

1.2 Scope

The Standard Interface Specification (SIS) covers those items provided as a standard service toall payloads and is intended to provide guidance for the design of new payloads. Additionalpayload requirements will be accommodated using mission-unique hardware, processes, orservices. This information is also provided as information for potential users of EELV.

Where possible, a common interface characteristic has been defined. However, differences in theMedium Launch Vehicle (MLV) and Heavy Launch Vehicle (HLV) versions of the EELV systemnecessitate different interface specifications at times, particularly in the area of payload size andenvironments. In these cases, the interface specification is shown separately for each class oflaunch vehicle (LV).

1.3 Design Approach

The information provided in this document was developed with two over-arching goals in mind:

1. Reducing the cost of launching space vehicles (SVs) into space.2. Providing users with a capability as good or better than current launch vehicles.

Therefore, the EELV SIWG philosophy is to provide an equivalent (or better) performance andSV accommodation capability to the SV users while at the same time ensuring that the SVpayload environments and launch environments are equivalent to (or less severe) than the LVscurrently used to launch military SVs. This “no worse than” policy includes the Delta and AtlasLVs for MLV spacecraft and the Titan IV LV for HLV spacecraft. The accommodationsprovided by other current launch vehicles were also considered and taken into account whereverpossible. The needs of commercial SV busses were also considered, in recognition that militarypayloads may use commercial busses in the future and that commercial viability is important to theoverall cost reduction goal.

The requirements are presented in this document in a singular, independent fashion. It is not theintent of the SIS to impose the maximum limit of all requirements simultaneously when this is nota reasonable representation for a satellite vehicle, payload, or mission. The actual requirementsthat apply to a particular mission will be documented in the negotiated LV/SV ICD.

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The SIWG believes that the capability goals have been accomplished to the greatest extentpossible, consistent with the cost reduction goals and the SIWG welcomes user comments to theSIS in order to ensure these goals are achieved.

1.4 Exclusions

The following aspects of the LV to SC interface are excluded from this SIS:- Payload destruct systems (when required by range safety) are provided by the payload- Payload adapters, which are also provided by the payload (see Section 0)

1.5 Definitions

Launch Vehicle (LV) - The LV segment consists of the means for transporting the payload fromthe launch site to the delivery orbit, through completion of the contamination and collisionavoidance maneuver (CCAM) and stage disposal. It includes, but is not limited to, production,assembly, propulsion, guidance and control, electrical power, tracking and telemetry,communication, ordnance, flight termination, payload separation initiation, structural elements,payload fairing, software, and appropriate vehicle/ground and vehicle/payload interfaces that arenecessary to meet mission requirements. The payload and its unique Airborne SupportEquipment (ASE), though transported by the EELV, are not considered as part of the EELVsystem.

Heavy Launch Vehicle (HLV) - Refers to the version of the EELV that will be used for heavycapability similar to the existing Titan IV launch vehicle.

Medium Launch Vehicle (MLV) - Refers to the version of the EELV that will be used formedium lift capability similar to the existing Atlas, Delta II or Titan II launch vehicles. For someSIS requirements a MLV-S designation is used to indicate conditions experienced by lighterpayloads that should be considered during space vehicle design. Unless noted, MLV and MLV-Sinterface requirements are identical.

Space Vehicle (SV) - The satellite payload (including payload adapter and separation system)provided by the government (or commercial users).

Mission Unique - Items or capabilities that are not part of the Standard Interface but could beprovided for a particular mission, usually at an additional cost.

Mission Specific - Items or capabilities that are dependent on the specific mission being flown.Unlike “mission unique” parameters, mission specific items are not considered to be a capabilitybeyond the standard SIS capability.

Concept Specific - Refers to technical parameters that are dependent on the EELV launch vehiclecontractor’s specific design. No attempt has been made to define these parameters in the SIS.

Standard Interface Plane (SIP) - The SIP is the plane which defines the interface between theLV-provided and the SV-provided equipment.

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Standard Electrical Interface Panel (SEIP) - The structure on which the interfacing LV and SVconnectors are supported.

Electromagnetic Interference Safety Margin Event (EMISM) Catagories - EMISM safetymargins are categorized in accordance with the worst case potential criticality of the effects ofinterference induced anomalies. The following categories shall be used:

Category I - Serious injury or loss of life, damage to property, or major loss or delay ofmission capability

Category II - Degradation of mission capability, including any loss of autonomousoperational capability

Category III - Loss of functions not essential to mission

Grade B Gaseous Nitrogen - Gaseous nitrogen with purity, by volume, of 99.99% minimum.Percent nitrogen includes trace quantities of neon, helium, and small amounts of argon (as definedby MIL-STD-27401P). Maximum total impurities, by volume, are as follows:

Total 100 ppmWater 11.5 ppmTotal hydrocarbons as methane 5.0 ppmOxygen 50 ppm

Grade C Gaseous Nitrogen - Gaseous nitrogen with purity, by volume, of 99.995% minimum.Percent nitrogen includes trace quantities of neon, helium, and small amounts of argon.Maximum total impurities, by volume, are as follows:

Total 50 ppmWater 5.7 ppmTotal hydrocarbons as methane 5.0 ppmOxygen 20 ppmHydrogen 0.5 ppm

Class 5000 (air) - Particle concentration no more than 5000(0.5/d)2.2 particles/ft3 where d =particle size in micrometers.

Class 100,000 (air) - Particle concentration no more than 100,000(0.5/d)2.2 particles/ft3 where d =particle size in micrometers.

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1.6 Acronym List

A AmperesAGE Aerospace Ground EquipmentASTM American Society For Testing and MaterialsAC Alternating CurrentA/C Air ConditioningBTU British Thermal UnitCCAM Contamination, Collision Avoidance ManeuverCDR Critical Design ReviewCG Center of GravityCVCM Collected Volatile Condensable MaterialdB DecibelDC Direct Currentdia. DiameterDOP Dioctyl PhthalateEED Electro-Explosive DeviceEELV Evolved Expendable Launch VehicleEGSE Electrical Ground Support EquipmentELV Expendable Launch VehicleEM ElectromagneticEMISM Electromagnetic Interference Safety MarginESD Electrostatic DischargeF Fahrenheitft. Footfps Feet Per SecondGEO Geosynchronous Earth OrbitGHe Gaseous HeliumGHz GigahertzGN2 Gaseous NitrogenGPS Global Positioning SystemGTO Geosynchronous Transfer OrbitHEPA High Efficiency Particulate Air filterHLV Heavy Launch Vehiclehr HourHz Hertz (frequency)ICD Interface Control DocumentI/O Input/OutputKBPS Kilobits Per SecondkHz KilohertzkV KilovoltsLAN Longitude of Ascending NodeLEO Low Earth Orbitlbs PoundsLCU Liquid Cooling UnitLSIC Launch System Integration ContractorLV Launch Vehicle

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LVC Launch Vehicle ContractorMLV Medium Launch VehicleMLV-S Medium Launch Vehicle (with smaller payload)m MetermA Milli-amperesmg MilligramMHz Megahertzmsec MillisecondNASA National Aeronautics and Space AdministrationNEC National Electrical CodeNMM AFSPC National Mission ModelNRZL None Return to Zero Phase LNSI NASA Standard InitiatorPDR Preliminary Design ReviewPLA Payload AdapterPLF Payload FairingPMP Parts, Materials and ProcessesPSI Pounds per Square InchPSU Propellant Servicing UnitRAAN Right Ascension of Ascending NodeRCS Reaction Control SystemRF Radio FrequencyRMS Root Mean SquareSCAPE Self Contained Atmospheric Protective EnsembleSCFH Standard Cubic Feet per HourSCFM Standard Cubic Feet per MinuteSGLS Space Ground Link SubsystemSEIP Standard Electrical Interface PanelSI Standard InterfaceSIP Standard Interface PlaneSIS Standard Interface SpecificationSIWG Standard Interface Working GroupSPRD System Performance Requirements Document.SPI Standard Payload InterfaceSPO System Program OfficeSRD System Requirements DocumentSV Space Vehicle (e.g., payload)TBD To Be Determined (By Government)TBR To Be Reviewed (jointly by Government and Contractors)TBS To Be Supplied (by Contractors)TML Total Mass LossµSec MicrosecondV VoltsVDC Volts Direct CurrentW Watts

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1.7 Reference Documents

1. EWR 127-1, Eastern and Western Range, Range Safety Requirements, 31 Mar 1995. 2. MIL-P-27401C, Propellant Pressurizing Agent, Nitrogen, 20 Jan. 1975.

3. EELV System Performance Requirements Document (SPRD), 18 June 1998.

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2. MISSION REQUIREMENTS

2.1 Orbit Requirements

2.1.1 Throw Weight

Requirements are as stated in the System Performance Requirements Document.

2.1.2 Orbit Insertion and Accuracy

Requirements are as stated in the System Performance Requirements Document.

2.1.3 Launch Window

The EELV shall have sufficient capability to deliver the required payload mass (including payloadgrowth, performance margin, and flight performance reserve) to the correct orbit plane whenlaunched any time within a mission dependent window, extending from some time before until atime after the maximum performance launch time as negotiated in the LV/SV ICD.

2.1.4 Attitude Rates and Accuracies

During park orbit or transfer orbit coasts, the EELV shall be capable of providing passive thermalcontrol by orienting the roll axis of the upper stage/payload to passive thermal control attitudeand holding attitude to within ± 5 degrees (3 sigma). Also during park orbit or transfer orbitcoasts, the EELV shall be capable of providing a commanded roll rate in either direction ofbetween 0.5 and 1.5 degrees per second (MLV configurations) and between 0.5 and 1.0 degrees(HLV configuration) as negotiated by the SV/LV ICD.

Prior to separation, the EELV shall be capable of pointing the upper stage/payload to any desiredattitude and either minimizing all rotation rates (3-axis stabilized missions) or providing a spinabout the longitudinal axis (spin-stabilized missions). For 3-axis stabilized missions, attitudeerrors shall be no greater than 1.4 degrees (3 sigma) about each axis and rotation rates shall beless than 0.2 degree/sec (3 sigma) in pitch and yaw and 0.25 degree/sec (3 sigma) in roll. Forspin-stabilized missions, the MLV EELV shall have the capability to provide payload spin rates of5 + 0.5 (3 sigma) rpm with spin axis orientation accurate to within 1.75 degrees (3 sigma)assuming a maximum 0.5" SV CG offset. For GPS missions, the EELV shall have the capabilityto provide payload spin rates of 55 + 11/ - 5 (3 sigma) rpm, with spin axis orientation accurate towithin 3 degrees (3 sigma) assuming a maximum 0.05" Payload CG (to include adapter) offset.

2.1.5 Separation Requirements

2.1.5.1 Separation MechanismThe separation mechanism for the SI is to be provided by the SV.

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2.1.5.2 Separation VelocityThe SV Separation System shall impart a minimum of 1 ft/sec relative separation velocity betweenthe SV and the LV/PLA at separation.

2.1.5.3 Separation InhibitsThe LV shall be capable of enabling/inhibiting the LV Reaction Control System (RCS) duringspacecraft separation operations. As required by specific mission(s), the RCS shall be inhibited upto 1 second before and up to 5 seconds after spacecraft separation.

2.1.5.4 Separation ContingenciesThe Launch Vehicle shall have the flexibility to incorporate mission unique nominal andcontingency flight sequences. Mission unique flight sequences shall be negotiated anddocumented in the mission specific LV/SV ICD.

2.1.5.5 Contamination and Collision Avoidance ManeuversContamination, collision avoidance maneuvers (CCAMs) shall be designed to preclude re-contactwith the payload and to minimize payload exposure to LV contaminants. Requirements forcontamination levels are specified in Section 3.5.

3. PHYSICAL INTERFACES

3.1 Mechanical Interfaces

3.1.1 Interface Definitions

A Cartesian coordinate system shown in Figure 1 will be used for the payload interface reference,placing the origin in the center of the standard interface plane. It is a right-handed coordinatesystem: the positive “X” is along the centerline of the vehicle and points up to the top of thevehicle. Additionally, the axial axis is defined to be the “X” axis and lateral axes are defined to bethe “Y” and “Z” axes. Some items discussed in subsequent sections of this document are shownin Figure 2. This figure shows the relation of the SIP to the SV and SV adapter.

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+X

+Y

+Z

Payload Fairing Compartment

Standard InterfacePlane (SIP)

Payload FairingEnvelope

Figure 1 - EELV Standard Interface Coordinate System

Payload Adapter

SV Sep Plane

Standard Interface Plane

Space Vehicle

Payload Fairing

LaunchVehicle

Figure 2 - Standard Interface Plane - Relationship to SV

3.1.2 Mating Surface

3.1.2.1 Bolt PatternThe LV supplies one of two standard mechanical interfaces (one for the MLV configuration andone for the HLV configuration). This interface joins the LV to the spacecraft or the payload

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adapter, as provided by the payload user. For the MLV, the bolt pattern has a 62.010” diameteras shown in Figure 3.

The HLV interface has a 173” diameter bolt pattern as shown in Figure 4. This bolt pattern isintended for use with the HLV GEO mission class and is not required to be used with HLV LEOmission class. The interface for the HLV LEO mission class is TBD.

1° 30 min

62.84 in

0.2710.265 Thru

121 Pl

270°

180°

90°

3° 111 Spaces

76° 30’

79° 06’81° 43’84° 43’87° 10’90° 10’92° 37’95° 37’98° 04’

101° 04’103° 30’

62.010±0.010Bolt Circle

Figure 3 - Small diameter (62.010") payload interface

Figure 4 - Large diameter (173") payload interface

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3.1.2.2 FlatnessThe flatness of EELV mating surfaces at the SIP are defined by a theoretical zone in which anypoint on the interface must fall within the parallel plane extremities as shown in Figure 5. ForMLV, these surfaces shall be flat to within 0.015 inch (15 Mils). For HLV, these surfaces shall beflat to within 0.030 inch (30 Mils).

MLV 15 Mils MaxHLV 30 Mils Max

Interface Plane /Bolt Circle

Two Parallel Planes

Figure 5 - EELV Flatness Specification

3.1.2.3 Master GaugeThe LV shall provide a master gauge to the SV contractor for interface hole pattern drilling.

3.1.3 Spacecraft Dynamic Envelopes

There are three standard minimum sizes for spacecraft dynamic envelopes which are derivedfrom the payload fairing size (actual fairing envelopes may be larger). These envelopes define theuseable volume inside the fairing and forward of the SIP as shown in Figure 1. However, therewill be some stay-out zones in the fairing envelope which will be negotiated as part of the SV toLV Interface Control Document. Payload fairing envelopes must accommodate existingpayloads.

For HLV the payload fairing dynamic envelope is similar in size to that for the Titan IV envelope,as shown in Figure 6. Two sizes of standard fairing envelopes have been defined for MLV, asshown in Figures 7 and 8. The nominal fairing envelope size is as shown inFigure 7. Where the SV does not require the nominal size, a smaller fairing envelope (similar toDelta II) shown in Figure 8 may be substituted at the option of the LV contractor.

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180” Dia.

480”

57” Dia.

169”

Standard Interface Plane

Figure 6 - EELV HLV Spacecraft Dynamic Envelope

29.11” (2 places)

147.6” Dia.

144.7”

SECTION A-A

208.5

35.86” dia.

143.7”

197.5”

AA

Standard Interface Plane

Figure 7 - MLV Spacecraft Dynamic Envelope

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110” Dia.

144”

90”

12” Dia.

Standard Interface Plane

Figure 8 - Smaller (Optional) MLV Spacecraft Dynamic Envelope

3.1.4 PLF Access Doors

3.1.4.1 Routine AccessThe LV shall provide two standard doors in the payload fairing for personnel access to thespacecraft. The doors may in general be placed anywhere on the fairing cylindrical sectionsubject to “stay-out zone” restrictions arising from structural, harness routing, and facility accessconsiderations.

Other doors (in addition to the two standard doors) for additional routine access to the spacecraftmay be provided on a mission-unique basis.

3.1.4.2 Emergency AccessThe EELV shall provide a capability for emergency access to the payload by installingemergency access doors (subject to “stay-out zone” restrictions) or by defining areas of the fairingwhere emergency access doors can be cut; in either case the doors shall be of a size that allows aperson wearing a SCAPE suit to reach in with both hands. These areas are near the bottom of thePLF barrel and are 48 + 12 inches above the SIP.

3.1.5 Payload Adapters

Payload adapters will interface with the LV at the SIP. All payload adapters are payload providedequipment; adapters to accommodate existing payloads interfaces for use on EELV are theresponsibility of those payloads.

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3.1.6 Payload Mass Properties

3.1.6.1 Center of Gravity LocationThe location of the SV Center of Gravity (CG) in the SI “X” axis, as measured from the SIP, shallbe restricted to the acceptable region (to the left or below the lines) shown in Figure 9. The CGin the lateral directions (SI “Y” and “Z” axes directions) shall be limited to less than 5 inchesoffset from the vehicle centerline for missions in which the LV/SV stack is 3-axis stabilized atseparation, within 0.5 inches for low spin rate (< 5.5 rpm) missions, and less than 0.05 inches forhigher spinning rate missions.

0

50

100

150

200

250

0 5000 10000 15000 20000 25000 30000 35000 40000 45000 50000

Payload Mass (lbs)

HLV

MLV

MLV-S (4,000; 120) (15,300; 120)

(20,000; 98)

(12,500; 140)

(9,200; 180)

(31,000; 225)

(39,000; 190)

(45,000; 164)

(12,500; 48)

Axial CG locations vs SV Weights(including SV adapter)

Spac

ecra

ft A

xial

CG

Loc

atio

n F

orw

ard

of S

IP (

inch

es)

MLV-S(spinning)

(2,000; 80)

(5,900; 20)

(4,860; 54)

Figure 9 - Allowable CG Location

3.1.6.2 SV Mass PropertiesThe LV system shall accommodate SVs with the mass properties indicated in Table 1. The massproperties are not intended as absolute limits to SVs, but only as design requirements for the LVsystem. SVs with exceedances of some of the features specified in these tables may beaccommodated as well, as negotiated in the SV/LV ICD. Note that the SV includes the payload,payload adapter, and its separation system. The coordinate axes are as specified in Figure 1.

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EELVMissionClass

SVSpin

Rate atSepara-

tion(rpm)

SVMass(lbs)

SV cgLocation(inchesforward of SIP)

MaxSV

Lateralcg

Offset(in.)

SV Momentsof Inertia

(slug-ft sq)

SV Products ofInertia

(slug-ft sq)

Notes

MLV-S NoneRequired

2000 -8000

40 - 110 5 Ixx = 300 - 4500Iyy= 285 - 8000Izz= 285 - 8000

Ixy= -400 to +400Ixz= -400 to +400Iyz= -400 to +400

1

MLV-S 5 2000 -4500

40 - 110 0.50 Ixx= 300 - 3000Iyy= 285 - 2000Izz= 285 - 2000

Ixy= -50 to +50Ixz= -50 to +50

Iyz= -250 to +250

1, 2, 3

MLV-S 55 4700 -4860

40 - 54 0.05 Ixx= 620 - 640Iyy= 535 - 600Izz= 535 - 600

Ixy= -0.5 to +0.5Ixz= -0.5 to +0.5Iyz= -5.0 to +5.0

1, 2, 3

MLV NoneRequired

2000 -16,900

40 - 180 5 Ixx= 500 - 8000Iyy= 750 - 12,800Izz= 750 - 12,800

Ixy= -670 to +670Ixz= -670 to +670Iyz= -670 to +670

1

MLV 5 5800 -10,500

40 - 160 0.50 Ixx= 1900 - 4000Iyy= 1300 - 5000Izz= 1300 - 5000

Ixy= -50 to +50Ixz= -50 to +50

Iyz= -250 to +250

1, 2, 3,4

HLVLEO

NoneRequired

27,000 -42,000

150 - 215 5 Ixx= 11,000 -29,500

Iyy= 50,000 -130,000

Izz= 50,000 -130,000

Ixy= -7000 to+7000

Ixz= -7000 to+7000

Iyz= -7000 to+7000

1

HLVGEO

NoneRequired

5400 -13,500

85 - 225 5 Ixx = 3,000 -19,500

Iyy = 5,000 -60,000

Izz = 5,000 -60,000

Ixy = -7000 to+7000

Ixz = -7000 to+7000

Iyz = -7000 to+7000

1

Notes:1. Values in the table represent the range of capability and the full range for all columns may not be available

simultaneously (e.g. mass and cg location combinations are subject to the restrictions shown in Figure 9).2. These are satellites requiring spin at separation.3. Pre-PL separation spin up maneuver acceptable; indicated rate not required throughout flight.4. SV cg location forward of SIP restricted to 100 inches or less for 5800 lbm SV. Linear interpolation from

that point to 160 inches forward of SIP for 10,500 lbm SV.

Table 1 - SV Mass Properties

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3.1.7 Payload Stiffness

To avoid dynamic coupling between low frequency launch vehicle and space vehicle modes, newSVs should be designed such that the stiffness of the SV structure should produce fundamentalfrequencies greater than the values shown in Table 2 when cantilevered from the LV interface.Space vehicles with fundamental frequencies less than these values may be accommodated on amission-unique basis.

EELV Vehicle Class FundamentalFrequency (Hz)

(including adapter)

Axis

MLV-S 12 Lateral30 Axial

MLV 8 Lateral15 Axial

HLV 2.5 Lateral15 Axial

Table 2 - SV Stiffness Requirements

3.2 Electrical/Avionics Interfaces

The EELV system shall provide umbilical electrical interconnection beginning at T-0 umbilicalinstallation. All SV-provided signals and power will be handled as unclassified data.

3.2.1 Electrical Connections at SV/LV Interface

The EELV system shall provide interface airborne electrical interconnection services from thetime of payload mate (electrical) to the time of SV separation on orbit. The electrical interfacebetween the SV and the LV will be at the standard electrical interface panel (SEIP) as shown inFigure 10. The SEIP is provided by the LV and is located near the standard interface plane.Wiring harnesses from the SV to the SEIP shall be provided by the SV. The SEIP shall beaccessible after SV/LV mate for connection of SV wiring harnesses.

3.2.2 Electrical Connections at EGSE Room

The SVB electrical ground support equipment (EGSE) interface connection will be at the EGSEroom interface panel as shown in Figure 10. Space shall be provided in the EGSE room such thatthe maximum distance between the SV EGSE and the EGSE room interface panel is less than 15feet.

The EELV shall provide the mating connector halves to the payload to mate to the standardinterface panel. This ensures the connectors, pins and sockets are all procured by the samevendor to the same specification minimizing any potential for a mismate.

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3.2.3 LV/SV Electrical Connector Separation

At the time SV/LV electrical connectors are to be separated, the current on any line shall be nogreater than 10 milliamps. This applies to SV/LV interfaces in the T-0 umbilical and in SVseparation connectors.

SEIP

VEHICLE SKIN LINE

SV AVIONICS, EEDs, etc.

SIPSV

LV

INTERFACE ELECTRICAL CONNECTORS (TYPE AND NUMBER ARE CONCEPT-SPECIFIC)

T-0 UMBILICAL

SV EGSE (Power, Data)

LV AVIONICS (Discretes or Switch Closures, Ordnance Firing, Interleaved SV TM, Separation Breakwires)

EGSE ROOM INTERFACE PANEL

NOTE: DOUBLE LINES INDICATE SV-PROVIDED CABLING

SV RF Telemetry and Commands

Connections to Data Landlines and Facility Power

SEPARATION PLANE

SV SEPARATION CONNECTORS

Figure 10 - Interface Wiring Harness Connections

RFP F04701-97-R-000819 June 1998 18

3.2.4 Ground Interfaces

The LV and the EELV ground facility shall provide dedicated "feed-through" cabling from theSEIP, through a LV umbilical, to an EELV-provided EGSE room SV Interface Panel (SVIP) forboth power to, and sensor signals from, the SV. Cabling connectivity shall be available from thetime the associated LV umbilical is connected until it is disconnected at liftoff.

Each wire of this dedicated cabling shall be isolated from the LV structure by a minimum of onemegaohm, measured before any connection to the SV or SV ground equipment.

3.2.4.1 Ground PowerThe LV and the EELV ground facility shall provide twelve (12) twisted-pairs for SV power thatmay include external power, full-power battery charging power, trickle battery charging power, orother power as required by the SV.

When used by the SV, each twisted-pair constitutes part of a complete circuit, with a powersource in the EGSE room and a load in the SV, and shall meet the following requirements at theSVIP interface:

Source Voltage: 126 VDC maximumCurrent: 11 Amps maximum

The maximum round-trip resistance attributed to this cabling between the SEIP and SVIP for anyone pair shall be 1.0 ohms, or less, when shorted at the opposite end.

The power return lines at the SV EGSE power source shall be isolated from earth ground by 1 +0.1 megaohm by the SV contractor, and shall be referenced to a single point ground at the SVstructure.

SV power dissipation will be typically be less than 1200 watts (average/steady state) with peakpower and duration constrained by the LV cooling capabilities as described in Section 3.3.2.1.Peak power of 2200 watts for one hour, for example, is within the envelope of Section 3.3.2.1.

3.2.4.2 Power Leads and ReturnsAll primary and secondary power leads shall be routed with an accompanying return lead. Powerconductors shall be twisted pairs, unless it is necessary to use heavy gauge which does not lenditself to twisting. In this case the high and return conductors shall be routed along a parallel path,and shall be laced or spot tied together to obtain maximum field cancellation. Connector typeswill be negotiated as a part of the SV/LV ICD process.

3.2.4.3 Power IsolationThe dedicated feed-through cabling shall be isolated from the LV structure by a minimum of 1megaohm.

3.2.4.4 Ascent PowerThe LV will not provide power to the payload following LV ignition and during boost phase ofthe flight as a part of the SI. Prior to launch, power is provided by means of facility power

RFP F04701-97-R-000819 June 1998 19

provided to the SV ground support equipment which is routed to the SV as described in Sections3.2.4.1 and 3.2.4.2. This power is available to the SV until the “launch commit” point in thecountdown, which occurs shortly before launch. The exact timing of the launch commit point isconcept-specific.

3.2.4.5 Ground Support Equipment PowerThe EELV shall provide three-phase uninterruptible power to payload ground equipment with thefollowing characteristics:

Voltage: 120/208 volts + 5%Frequency: 60 Hz + 1 HzTotal Harmonic Distortion (THD) : shall not exceed 5%Voltage transients: shall not exceed 200% nominal rms voltage for

more than 20 micro-secondsMaximum Load: 20 KVA

3.2.4.6 Ground MonitoringThe LV and the EELV ground facility shall provide 60 shielded twisted-pairs for the differentialmonitoring of power and sensor loads in the SV by the SV ground equipment in the EGSE room.These pairs may be used to monitor SV bus voltage, battery voltage sense, battery temperature,battery pressure or other payload health measurements as required by the SV. These twisted pairsmay also be used to provide commands or additional power from the SV ground equipment to theSV.

When used by the SV, each twisted-pair constitutes part of a complete circuit between the SV andSV ground equipment and shall meet the following requirements at both the SEIP and SVIPinterfaces:

Source Voltage: 126 VDC maximumSource Current: 3.0 Amps maximum

The maximum round-trip resistance attributed to this cabling between the SEIP and SVIP for anyone pair shall be 5.0 ohms, or less, when shorted at the opposite end.

Some of the ground monitoring lines may be assigned to carry SV power if the SV Contractor sochooses. In this case the power return lines at the SV EGSE power source shall be isolated fromearth ground by 1 + 0.1 megaohm by the SV contractor, and shall be referenced to a single-pointground at the SV structure. All other circuits shall continue to be isolated from earth ground byat least one megaohm.

3.2.5 Flight Command and Telemetry Interfaces

3.2.5.1 Signal ReferenceAll signals shall have a dedicated signal return line which is referenced at the source.

RFP F04701-97-R-000819 June 1998 20

3.2.5.2 LV to SV CommandsThe LV shall provide 8 redundant pairs of SV contractor-definable control commands which canbe configured as 28 volt discretes or switch closure functions. The SV contractor will select eitherall discrete commands or all switch closures.

The LV telemetry shall indicate the state of each command.

The LV shall provide the capability to issue the commands in any sequence with a maximum often events per command. An event is defined as the change of state (on or off) of one of thecommands.

The capability shall be provided to reference the initiation of commands to Upper Stage guidanceevents, mission times, and/or selected mission scheduled events.

3.2.5.2.1 Discrete CommandsThe LV provided discrete commands shall have the following characteristics at the SEIP:

Voltage: “On” state +23 VDC minimum to +33 VDC maximumCurrent: 500mA maximum per discretePulse Width: 10 sec maximum

20 msec minimum

The discrete command circuits in the SV shall be isolated from SV structure by a minimum of 1megaohm.

3.2.5.2.2 Switch Closure FunctionsThe LV provided switch closure functions shall accommodate the following electricalcharacteristics at the SEIP:

Voltage: +22 VDC minimum to +32 VDC maximumCurrent: 1 Ampere maximumPulse Width: 10 sec maximum

20 msec minimumLeakage Current 1 mA

The switch closure circuits in the LV shall be isolated from LV structure by a minimum of 1megaohm.

3.2.5.3 SV/LV Telemetry InterfaceThe LV shall provide the capability to accept two channels of serial data from the SV at the SEIPfor interleaving into the LV’s telemetry stream to the ground. Prior to launch, this LV telemetrywill be available for ground operations and space vehicle testing purposes, as specified by theLV/SV ICD.

Each channel shall consist of both a data circuit, using non-return to zero-phase L (NRZL), and aclock circuit. When utilized by the SV, each circuit shall consist of a differential RS-422 line

RFP F04701-97-R-000819 June 1998 21

driver pair from the SV and a corresponding differential receiver in the LV. Data shall be sampledby the LV on the false-to-true (logic low to high) transition of the clock.

The LV shall be capable of receiving at least two Kbps of data per channel. The data rate fromthe SV shall not exceed two Kbps per channel. However, the combined data rate of bothchannels shall not exceed two Kbps at any one time. Data format and content requirementsimposed on the SV will be defined by the SV/LV ICD.

3.2.5.4 SV Radio Frequency LinksEELV shall facilitate the transmission of Space Vehicle RF telemetry, both during groundoperations and from liftoff through SV separation. EELV does not provide encryption for SVtelemetry or data whether broadcast (RF) or hardline. All telemetry will be handled asunclassified data (both on the ground and in flight). EELV shall facilitate RF uplink commands tothe spacecraft during ground operations through liftoff.

3.2.5.5 State Vector DataThere is no provision for furnishing state vector or attitude data directly across the SIP to the SVat spacecraft separation. SVs needing state vector or attitude data will be handled on a missionunique basis.

When required by the SV, the best estimate of state vector and attitude data at the time ofseparation detection will be provided to the spacecraft operators in as close to real time aspossible (with a maximum of 20 minutes) after receipt of data at the LV contractor’s facility.

3.2.6 Electromagnetic Compatibility

The requirements for electromagnetic compatibility are outlined in the following sections. Theserequirements may be tailored for each specific payload. Individual SV circuit susceptibilities willbe addressed as part of the negotiated SV/LV ICD process.

3.2.6.1 Radiated EmissionsUnintentional radiated narrowband magnetic field levels produced by subsystems, andcomponents are mission-unique and will be negotiated as part of the SV/LV ICD process.

3.2.6.1.1 SV Radiation NarrowbandThe SV intentional and unintentional radiated emissions shall not exceed the maximum allowableemissions curve of Figure 11. Information on the SV emitters and receivers (power, frequency,E-field levels, and sensitivity of receivers) shall be supplied to the EELV contractor. The limitapplies at the SIP, and shall account for the increased field level caused by radiating inside thefairing cavity. Payload emitter radiation inside an enclosed fairing will create standing waves andexceed the field levels calculated assuming free-space conditions. Payload fairing RF energyfocusing shall be considered when determining the maximum field levels at the SIP.

RFP F04701-97-R-000819 June 1998 22

100

110

120

130

140

150

160

170

1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11

Frequency (Hz)

dB

uV

/met

er(1 GHz, 160)

(18 GHz, 160)

(1 GHz, 114)

(14 KHz, 114)

Figure 11 - Maximum Allowable Narrowband SV Radiated E-Fields

3.2.6.1.2 SV Radiation BroadbandThe SV unintentional broadband radiated emissions shall not exceed the maximum allowableemissions curve of Figure 12.

100

110

120

130

140

150

1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09

Frequency (Hz)

dB

uV

/met

er/M

Hz

(1 GHz, 128)

(14 KHz, 134)

Figure 12 - Maximum Allowable Broadband SV Radiated E-Fields

RFP F04701-97-R-000819 June 1998 23

3.2.6.1.3 LV Radiation NarrowbandThe LV narrowband intentional and unintentional radiated emissions at the SIP shall not exceedthe maximum allowable emissions curve of Figure 13. Information on the EELV emitters andreceivers (power, frequency, E-field levels, and sensitivity of receivers) shall be supplied to thepayload contractor. The levels shown in the figure will be notched at frequencies which aredependent the selected EELV configuration.

3.2.6.1.4 LV Radiation BroadbandThe LV unintentional broadband radiated emissions shall not exceed the maximum allowableemissions curve of Figure 14 at the standard interface plane.

3.2.6.1.5 Broadband Radiated Emissions Due to Electrostatic DischargeThe LV and SV materials shall be chosen such that the maximum broadband radiated emissionscaused by an electrostatic discharge shall not exceed the levels defined in Figure 15 at thestandard interface plane.

3.2.6.1.6 PLF Electrostatic DischargeElectrostatic charge on the PLF shall not be discharged directly to any portion of the SV surfacewhen the SV to PLF distance is equal to or greater than the SV/PLF minimum hardware tohardware clearance as defined in the mission specific ICD.

3.2.6.1.7 PLF Broadband E-Field LimitsMaximum electric fields as derived 1 cm from the PLF internal surface shall not exceed thebroadband E-field levels stated in Figure 16.

100

110

120

130

140

150

160

170

1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11

Frequency (Hz)

dB

uV

/met

er

(2.5 GHz, 160) (5.4 GHz, 160)

(2 GHz, 114)(14 KHz, 114)

(2 GHz, 160)

(18 GHz, 114)

(5.9 GHz, 160)

(2.5 GHz, 114) (5.9 GHz, 114)

(5.4 GHz, 114)

Figure 13 - Maximum Allowable Narrowband LV Radiated E-Fields.

RFP F04701-97-R-000819 June 1998 24

60

80

100

120

140

160

180

200

1.00E+04 1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10

Frequency (Hz)

dB

uV

/m/M

Hz

BROADBAND LIMITS: (AT SIP)172.0/180.4/172.0 dBuV/m/MHz@15.0 kHz170.8 dBuV/m/MHz@20.0 kHz168.3/169.3/168.3 dBuV/m/MHz@33.2 kHz162.8 dBuV/m/MHz@100.0 kHz152 dBuV/m/MHz@1.0 MHz152/162.8/152 dBuV/m/MHz@ 8.0 MHz152/160.2/152 dBuV/m/MHz@16.0 MHz152 dBuV/m/MHz@50.0 MHz147.3/150/147.3 dBuV/m/MHz@64.0 MHz139 dBuV/m/MHz@100.0 MHz111 dBuV/m/MHz@500.0 MHz111 dBuV/m/MHz@8.2 GHz113 dBuV/m/MHz@10.0 GHz

BROADBAND LIMITS:(1.0 METER ABOVE SIP)110/118.4/110 dBuV/m/MHz@15.0 kHz108.5 dBuV/m/MHz@20 kHz106/107/106 dBuV/m/MHz@33.2 kHz100.8 dBuV/m/MHz@100 kHz90 dBuV/m/MHz@1.0 MHz90/100.8/90 dBuV/m/MHz@8.0 MHz90/98.2/90 dBuV/m/MHz@16.0 MHz90/92.7/90 dBuV/m/NHz@64.0 MHz90 dBuV/m/MHz@8.2 GHz92 dBuV/m/MHz@10.0 GHz

Figure 14 - Maximum LV Radiated Broadband Emissions

80

100

120

140

160

180

200

220

1.00E+04 1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09

Frequency (Hz)

db

uV

/met

er//M

Hz

Figure 15 - Maximum Allowable Broadband Radiated E-Fields (ESD Source)

RFP F04701-97-R-000819 June 1998 25

3.2.6.2 Electromagnetic Interference Safety Margin (EMISM)Electromagnetic Interference Safety Margins (EMISMs) shall be included in the design process toaccount for variability in system and subsystem components, and for uncertainties involved inverification of system level design requirements. EMISMs of at least 20 dB for Category Iinterface circuits involving ordnance, and at least 6 dB for Category I non-ordnance and CategoryII interface circuits are required.

3.2.6.3 Range CompatibilityThe flight configured LV/SV shall be compatible with the launch site RF requirements (mayinclude RF mitigation measures coordinated with the launch site). The LV and SV shall each beresponsible for the individual system compatibility with the worst case theoretical value.

-20

0

20

40

60

80

100

120

140

160

180

0.01 0.1 1 10 100 1000

Frequency (MHz)

E-F

ield

Str

eng

th (

dB

µV/m

/MH

z)

(0.01, 163)

(10.0, 64)

(5.0, 70)

(1.0, 84)

(5.0, 93)

(0.05, 147)

(0.1, 135)

(50.0, 50)(100.0, 43)

(500.0, 7)

(1000.0, -3)

Figure 16 - E-Field Strength Derived Radially 1 cm from PLF Inner Surface

RFP F04701-97-R-000819 June 1998 26

3.2.7 Grounding, Bonding, and Referencing

3.2.7.1 Electrical BondingElectrical bonding of mechanical interfaces shall be implemented for management of electricalcurrent paths and control of voltage potentials to ensure required system performance, and tomitigate personnel hazards. Electrical bonding provisions shall be compatible with corrosioncontrol requirements. The launch vehicle/payload interface shall provide a conductive path forelectrical bonding of the payload to the launch vehicle. The maximum electrical bondingresistance between the payload and launch vehicle shall be 2.5 milliohms, and shall be verifiable bymeasurement when they are mated.

3.2.7.2 Interface Connector BondingConnector shells shall be bonded to structure. Bonding resistance at these points shall be 2.5milliohms maximum. The bonding resistance of the cable shield termination path through themating connector assemblies to the interface shall not exceed 10 milliohms, with no more than 2.5milliohms across a single joint.

3.2.7.3 Chassis Ground CurrentChassis grounds shall not intentionally be used to conduct power or signal currents.

3.2.7.4 PLF Acoustic and Thermal Blanket Layer Interconnection

Metallized (VDA, VDG, etc.) surfaces and semi-conductive (≤ 109 ohms per square) layers ofthermal (acoustic) insulation blankets shall be designed such that all layers are electricallyinterconnected. The resistance between any two metallized layers shall be less than or equal to100 ohms. The resistance between any two semi-conductive layers shall be less than or equal to109 ohms. Existing thermal insulation (acoustic) blanket designs shall be reviewed for acceptance.

3.2.7.5 PLF Acoustic and Thermal Blanket GroundingAcoustic and thermal insulation blankets shall be connected to the nearest available chassis groundpoint. The grounding resistance for metallized (VDA, VDG, etc.) layers of the thermal insulatedblankets and chassis shall be less than or equal to 100 ohms. The grounding resistance for semi-conductive (≤ 109 ohms per square) layers of the thermal insulative blankets and chassis shall beless than or equal to 109 ohms. There shall be at least one ground point in each square meter ofthe blanket surface with a minimum of two ground points per blanket. Existing thermal (acoustic)insulation blanket designs shall be reviewed for acceptance.

3.2.8 Separation Ordnance, Power, and Circuits

Separation ordnance power shall be provided by LV to the primary and redundant SV-providedinitiators. Each SV separation ordnance circuit (primary and redundant) shall use separate powersources and separation circuits.

The LV ordnance circuits to the SV shall be isolated from the SV structure by a minimum of 1.0megohms except for the Electrical Static Discharge (ESD) protective devices.

RFP F04701-97-R-000819 June 1998 27

The firing circuit harnesses shall be shielded to provide a 20 dB minimum margin above theEED’s firing threshold, as specified in Section 3.2.2.2.

A total of 16 electro-explosive device (EED) firing circuits, 8 primary and 8 redundant, shall beprovided by the LV to the SIP for the SV separation from its adapter. EEDs used will be lowvoltage, 1 ampere/1 watt no-fire designs that have an internal bridge wire with a resistance ofapproximately 1.0 ohm.

Both primary and redundant separation ordnance firing signals shall be capable of firing one EEDat a time or up to the whole group of 8 at the same time.

The total allowable SV resistance for each EED circuit (i.e. from SIP through SV-adapter to SVand return to SIP including EED resistance) shall be in the range of 0.9 to 2.0 ohms.

Firing signals shall be a single pulse with a duration in the range of 40 +10 milliseconds. Thefiring signal current for each EED circuit shall be at least 5.0 amperes (i.e., a total of 40 amperesminimum if firing 8 at the same time). The firing current shall also be limited at any time to 18amperes maximum for each EED circuit.

Primary and redundant firings shall be separated at the SV’s discretion by a duration of either lessthan 5 milliseconds or 80+10 milliseconds of the leading edges of the firing signals as depicted inFigure 17. The SV will specify to the LV the desired firing sequence and firing signal separationchoice.

3.2.8.1 Separation IndicationThe SV shall provide 2 separation breakwires for sense by EELV in separate interface connectors.These shall be isolated from the SV structure by a minimum of 1 megaohm.Loopback characteristics of these lines are as follows:

Maximum Resistance: 1.00 ohmMinimum Resistance after break: 1 Megaohm.

RFP F04701-97-R-000819 June 1998 28

t0

Primary

0 + 5 msec.

Redundant

Primary

Redundant

80 + 10 msec.

-OR-

40 + 10 msec. (typical)

Figure 17 - Ordnance Timing

3.3 Fluid Interfaces and Services

The LV shall provide support for fluid services as specified in the following paragraphs.There are no provisions for fueling spacecraft at LV facilities (including the launch pad) as astandard service. Considerations for SV detanking are covered in Section 4.5.

3.3.1 Coolant

No cooling fluids other than gaseous nitrogen or air are provided to the SV. These are discussedin Section 3.3.2 below. Liquid cooling fluids may be provided on a mission-unique basis.

3.3.2 Air Conditioning

3.3.2.1 Payload Compartment Air Characteristics and FlowThe LV will provide an air conditioning duct located at the top of the standard payload envelopecylinder, directed not to impinge directly on the payload. The standard duct is switchable toprovide air or nitrogen flow from a redundant source as determined by the LV and as specifiedbelow. In addition, the launch pad air conditioning provisions shall not preclude the routing of afly-off umbilical fitting located at the base of the payload fairing in addition to the standard duct to

RFP F04701-97-R-000819 June 1998 29

the top of the fairing. Air conditioning will be available from SV encapsulation through launchwith periods of interruption as negotiated in the LV/SV ICD.

Air. Air flow is provided with the following characteristics:

- Inlet temperature and relative humidity:50-85°F (controllable to +5° F) with 20-50% relative humidity

and50-70°F (controllable to +5° F) with 35-50% relative humidity when requiredfor sensitive operations

- Inlet cleanliness: Class 5000 guaranteed (HEPA filters not DOP tested)- Inlet mass flow rates (air):

HLV: 200-300 lb./min. (controllable to + 12.5 lb/min.)MLV: 80-160 lb./min. (controllable to + 5 lb/min. after start-up period)

- Flow velocity: The payload air distribution system shall provide a maximum air flowvelocity less than 32 fps for MLV in all directions and 35 fps for HLV in alldirections. There will be localized areas of higher flow velocity at, near, orassociated with the air conditioning duct outlet. Maximum air flow velocitiescorrespond to maximum inlet mass flow rates. Reduced flow velocities areachievable at lower inlet mass flow rates.

The LV shall provide for the capability to divert up to 40% of the air flow to the aft portion ofthe payload envelope.

N2. There is no provision for purge of the entire PLF with GN2 prior to launch as a standardspacecraft service. This type of purge is considered a mission-unique service.

3.3.3 SV Instrument Purge (GN2)

The LV integration facility shall have provisions for both Grade B and high purity Class C GN2 tosupply purges for individual SV instruments. The characteristics of this GN2 are as follows:

- Inlet dewpoint: Maximum of -35º F- Inlet cleanliness: Class 5000 guaranteed (HEPA filters not DOP tested)- Flow rate: 0-500 standard cubic feet per hour (SCFH)

This provision shall not preclude SV-provided carts from being used for higher purity or higherflow rate SV instrument purges.

3.3.4 GHe

There is no provision for providing gaseous Helium to the payload.

RFP F04701-97-R-000819 June 1998 30

3.4 Environmental Conditions

3.4.1 SV Compartment Thermal Environment

The worst case thermal environment in the space vehicle compartment inside the fairing duringascent is defined in Figure 18. The surfaces seen by the SV will generally fall into one of twocategories: Surfaces with low emissivity (e ≤ 0.3) and those of higher emissivity (e ≤ 0.9).Maximum temperatures as a function of the time from launch, 300°F for a surface emissivity of0.3 and 200° for a surface emissivity of 0.9, are shown in the plot. The exact configuration andpercentages of each type of surface is both mission specific and LV concept specific.Temperatures may exceed those shown but in no case shall the total integrated thermal energyimparted to the spacecraft exceed the maximum total integrated energy indicated by thetemperature profile shown in Figure 18.

Maximum Temperatures Seen By Space Vehicle

0

50

100

150

200

250

300

350

0 50 100 150 200 250 300 350 400 450 500

Time, sec.

Tem

per

atu

re,°

F

Surfaces w ith e = 0.3

Surfaces w ith e = 0.9

120

Fairing Deployment(time TBD)

Figure 18 - Maximum PLF Inner Surface Temperatures

3.4.2 Free Molecular Heating

The maximum instantaneous 3-sigma Free Molecular Heating on spacecraft surfacesperpendicular to the velocity vector at the time of fairing separation shall not exceed320 Btu/hr-ft2. Lower or higher values may be achieved at the expense of LV performance andwill be addressed on a case-by-case basis.

RFP F04701-97-R-000819 June 1998 31

3.5 Contamination Control

3.5.1 Cleanliness

Exposed LV surfaces within the payload fairing shall be cleaned and inspected to be free of visibleparticles with the unaided eye (except for vision corrected to 20-20), with a 100-125 ft-candlelight at a distance of 6 to 18 inches. Non-volatile residue left on the above surfaces shall notexceed 1.0 mg/ft2.

All payloads (SV, adapter, etc) that have a specific contamination requirement shall, at the time ofSV/LV mating, demonstrate a state of cleanliness that is consistent with their contaminationrequirement.

3.5.2 Impingement

LV plume impingement shall be controlled in accordance with the requirements given in theSPRD.

3.5.3 Windborne Contamination

The Launch Vehicle shall provide protection to the SV from windborne contamination andmaintain the cleanliness levels of Section 3.5.1 from payload transport to the launch pad throughlift-off.

3.5.4 Flight Contamination

3.5.4.1 ParticulateParticulate contamination levels from the Launch Vehicle shall not exceed 1% surface obscurationfrom payload encapsulation through CCAM.

3.5.4.2 MolecularMolecular contamination levels from the Launch Vehicle shall not exceed 150 angstroms frompayload encapsulation through CCAM.

3.5.5 Material Selection

3.5.5.1 Non-Metallic MaterialsSelection of nonmetallic materials shall include consideration of wear products, shedding andflaking properties in order to reduce particulate contamination. The nonmetallic materials withinthe PLF volume exposed to thermal vacuum shall not exceed a total mass loss of less than orequal to 1.0% and volatile condensable matter less than or equal to 0.1% when tested per ASTME-595 or equivalent method. Exceptions for usage on the flight vehicle are below:

Final acceptance of nonmetallic materials shall be determined by analysis of the materialoutgassing and deposition characteristics. If materials needed for specific applications or used inexisting design do not meet these requirements but the sum total determined by analysis meets theflight contamination requirements, a material usage agreement, including rationale for use of thematerials shall be issued by the cognizant Parts Materials and Processes (PMP) engineer and

RFP F04701-97-R-000819 June 1998 32

provided upon request to the Air Force, satellite contractor or Launch System IntegrationContractor (LSIC). Specific criteria for material selection may be dependent upon payload uniquerequirements. The list for each material requesting a materials usage agreement shall include thefollowing:

1. Manufacturer's trade name of the product or material2. Manufacturer of the material3. Thermal and vacuum stability data4. Rationale for use of non-approved materials including the mass, surface area and location

of the material used5. Contribution of the total outgassing/deposition environment

3.5.5.2 Metallic MaterialsThe selection of metallic materials shall include consideration of corrosion, wear productsshedding and flaking in order to reduce particulate contamination. Dissimilar metals in contactshall be avoided unless adequately protected against galvanic corrosion.

Mercury, compounds containing mercury, zinc plating, cadmium parts and cadmium plated partsshall not be used on flight or LV ground support equipment that comes into direct contact withSV flight hardware.

Pure tin or tin electroplate shall not be used except when refused, re-flowed, or alloyed with lead,antimony or bismuth.

3.6 Acceleration Load Factors

Figures 19, 20 and 21 define SV center-of-gravity acceleration values that when used to calculateLV/SV interface bending moments, axial loads and shear loads will yield maximum loads imposedby the LV on the SV at the SIP. For SV weights other than those given in these figures,adjustments to the axial accelerations should be made according to steady state acceleration vs.weight curves which are concept specific and will be provided during the EMD phase of theprogram. SV weights are to include any payload adapter which may be required.

Load factors for the preliminary design of the space vehicle structure should be derived for eachspace vehicle by taking into account the unique design features of the space vehicle and itsinteraction with the launch vehicle. However, these factors are to be no less than the values infigures 19, 20 and 21 (properly adjusted for spacecraft weight). Following the preliminary design,definition of SV structural loads will be accomplished by means of coupled loads analyses.

RFP F04701-97-R-000819 June 1998 33

-4

-2

0

2

4

6

8

10

-4 -3 -2 -1 0 1 2 3 4

Lateral G's

Ver

tica

l G's

Tension

Compression

SV Weight = 4000 lbs. (0.5,7.2)

(0.5,3.5)(2.5,3.5)

(2.5,0.0)

(1.5,-2.0)

Figure 19 - MLV-S Quasi-Static Load Factors

-4

-2

0

2

4

6

8

-4 -3 -2 -1 0 1 2 3 4Lateral G's

Ver

tica

l G's

Tension

Compression

SV Weight = 6000 lbs.

(0.5,6.5)

(2.0,3.5)

(2.0,0.0)

(1.2,-2)

Figure 20 - MLV Quasi-Static Load Factors

RFP F04701-97-R-000819 June 1998 34

-4

-2

0

2

4

6

8

-4 -3 -2 -1 0 1 2 3 4

Lateral G's

Ver

tica

l G's

Tension

Compression

SV Weight = 10,000 lbs. (1.5,6.0)

(2.5,3.0)

(2.5,0.0)

(1.5,-2.0)

Figure 21 - HLV Quasi-Static Load Factors

3.7 Vibration

The maximum in-flight vibration levels will be provided in the LV to SV ICD, but are not definedin this standard. SV design should be performed using the EELV acoustic data (provided in thenext section).

3.8 Acoustics

The SV maximum predicted sound pressure levels (value at 95th percentile with a 50%confidence) from liftoff through payload deployment shall not exceed the values provided in Table3. The acoustic levels are plotted in Figures 22 and 23 as one-third octave band sound pressurelevels versus one-third octave band center frequency for MLV and HLV, respectively. The valuesshown are for a typical SV with an equivalent cross-section area fill of 60 percent. The definedSV dynamic envelopes (refer to section 3.1.3) were used to calculate the 60 percent cross-sectionarea fill. The provided acoustics levels have been adjusted to represent the equivalent soundpressure levels consistent with the standard acoustic test practice of locating control microphones508 mm (20 inches) from the SV surface. Space Vehicles with a larger cross-sectional area than60 percent will incur higher acoustic levels.

RFP F04701-97-R-000819 June 1998 35

EELV MLV Space Vehicle Acoustic Environment

100.0

105.0

110.0

115.0

120.0

125.0

130.0

135.0

140.0

32 50 80

125

200

315

500

800

1250

2000

3150

5000

8000

1/3 Octave Band Center Frequency - Hz

So

un

d P

ress

ure

Lev

el -

dB

re

20 m

icro

pas

cal

OASPL=140.5 dB

Figure 22 - MLV Acoustic Levels

RFP F04701-97-R-000819 June 1998 36

EELV HLV Space Vehicle Acoustic Environment

100.0

105.0

110.0

115.0

120.0

125.0

130.0

135.0

140.0

32 50 80

125

200

315

500

800

1250

2000

3150

5000

8000

1/3 Octave Band Center Frequency - Hz

So

un

d P

ress

ure

Lev

el -

dB

re

20 m

icro

pas

cal

OASPL = 142.7 dB

Figure 23 - HLV Acoustic Levels

RFP F04701-97-R-000819 June 1998 37

1/3 Octave BandCenter Frequency

(Hz)

MLVSV Sound Pressure Level

(dB re 20 micropascal)

HLVSV Sound Pressure Level

(dB re 20 micropascal)

32 118.0 129.040 123.4 130.550 123.0 131.063 124.5 132.080 126.0 132.5

100 128.2 133.0125 129.1 133.0160 130.0 132.7200 131.1 131.8250 130.5 131.0315 130.0 130.2400 130.0 128.8500 129.8 127.5630 128.3 126.2800 126.9 124.31000 123.9 122.51250 122.0 120.71600 120.4 118.32000 120.9 116.52500 117.9 115.03150 117.2 113.04000 115.5 111.55000 114.5 109.56300 113.7 107.58000 113.9 106.0

10000 114.8 104.0

OASPL 140.5 142.7

Table 3 - SV Maximum Acoustic Levels

3.9 Shock

The maximum shock spectrum at the SIP (value at 95% probability with 50% confidence;resonant amplification factor, Q=10) shall not exceed the levels shown in Table 4. These levelsare shown graphically in Figure 24.

3.10 Ground Processing Load Factors

Ground processing loads will be provided in the LV/SV ICD. They will be less than the flightload factors shown in Section 3.6.

RFP F04701-97-R-000819 June 1998 38

3.11 Payload Fairing Internal Pressure

Payload fairing internal pressure decay rates for HLV shall be limited to 0.4 psi/sec except for abrief transonic spike to 0.6 psi/sec. Decay rates for MLV shall be limited to 0.3 psi/sec except fora brief transonic spike to 0.9 psi/sec.

Shock Spectrum from EELV to SV (G’s) Shock Spectrum from SV to EELV (G’s)(due to SV separation)

Freq-Hz HLV MLV Freq-Hz HLV & MLV100 70 40 100 150125 - - 125 175160 - - 160 220200 80 - 200 260250 - - 250 320315 - - 315 400400 - - 400 500500 - - 500 725630 - - 630 1100800 - - 800 20001600 - - 1600 50002000 3000 - 2000 50005000 3000 3000 5000 5000

10000 3000 3000 10000 5000

Refer to graph of Figure 24 for intermediate frequencies

Table 4 - EELV Maximum Shock Levels

10

100

1000

10000

100 1000 10000

Frequency (Hz)

G's

MLV to SV

HLV to SV

SV to EELV

150

70

40

3000

5000

1600

Figure 24 - EELV Maximum Shock Levels

RFP F04701-97-R-000819 June 1998 39

4. FACILITIES AND PROCESSING

4.1 Propellant Services

The SV shall complete propellant loading prior to encapsulation within the EELV payload fairing.

4.2 Access to Payloads - Timeliness

Final access to the SV will occur no later than 24 hours prior to launch. Exact timelines areconcept specific and will be provided during the Development phase of the program.

4.3 SV Battery Charging

4.3.1 Full Power Charging

The EELV shall accommodate SV pre-launch battery charging from drained state to full chargestate via the T-0 umbilical or via drag-on electrical cables at the appropriate platform level.Ground power shall be in accordance with the requirements of Section 3.2.4. The timing forproviding this service will be negotiated in the SV/LV ICD.

4.3.2 Trickle Charging

The EELV shall accommodate SV battery trickle charging to maintain battery charge via the T-0umbilical power lines. Ground power shall be in accordance with the requirements of Section3.2.4.

4.4 Hazardous SV Processing

SV hazardous processing, except for tasks which may not be carried out until just prior tomovement of the LV to the launch pad (e.g. arming of ordnance) shall be completed prior to finalclose-out of the EELV payload fairing.

4.5 Detanking

If it is required that the SV have the capability for emergency de-tanking at the launch complex,the SV shall use manually connected/disconnected interfaces accessible (as provided in Section3.2.4) on the -Z axis side without personnel entry into the fairing. Tank drain, vent purge andpressurization (if required) shall be a payload responsibility and shall be accomplished through apayload-provided propellant servicing unit.

The LV will provide measures for personnel protection, collection of hazardous fuels, and storageor disposal of collected fuels.

4.6 Lightning Protection

Lightning protection shall be provided by the LV in accordance with EWR 127-1 Chapter 5.Electrical circuits shall be designed to minimize damage due to lightning strikes.