RFID in the world of Printed Electronics
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RFID in the world of Printed Electronics
Application/Cost/Supply Chain
Dr. Andreas Schaller
ASC Andreas Schaller Technology Consulting
Dr. Andreas Schaller
RFID in the world of Printed Electronics1
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SMT Hierarchy
RFID in the world of Printed Electronics2
Connections between physically separate
systems such as host computer to
terminals, computer to printers, and so on.Level 5 Connections between systems
Level 4 Subassembly
Level 3 Connections between PWBs
Level 2 Printed Wiring Board (PWB)
Level 1 Integrated Circuits
Level 0 Monolithic Silicon Chip Gate-to-gate interconnections on a
monolithic silicon chip
Connections between two subassemblies.
For example, a rack or frame may hold
several shelves of subassemblies that
must be connected together to make up a
complete system.
Connections between PWBs, including
PWB-to-PWB interconnections or card-to-
motherboard interconnections.
Printed wiring board (PWB) level of
interconnections. Printed conductor paths
connect the device leads of components
to PWBs and to the electrical edge
connectors for off-the-board
interconnection.
Packaging of silicon chips into dual-in-line
packages (DIPs), small outline integrated
circuit (SOICs), chip carriers, multichip
packages, and so on, and the chip-level
interconnects that join the chip to the lead
frames.
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PET Hierarchy
RFID in the world of Printed Electronics3
Level 5 Connections between systems Ambient Intelligence
Level 4 Subassembly System Integration
Level 3 Connections between PWBs Smart System
Level 2 Printed Wiring Board (PWB) System-in-Foil
Level 1 Integrated Circuits Functional Layers
Level 0 Monolithic Silicon Chip Printable InkSilver Ink
Printed
Antenna
RFID Label
Battery Assisted
Label
Smart Package
RFID System
SMT PET Example
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PET Applications and KPI
RFID in the world of Printed Electronics4
PET Products
Large Area Printing
Small Feature Printing
min
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PET Market Players examples only
RFID in the world of Printed Electronics5
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PET Benefits beyond cost
RFID in the world of Printed Electronics6
Smart Objects are driven by LEVEL 5
(Content driven) Connectivity enables an object to become ”smart”
Flexible Electronics is driven by LEVEL 4
Customer Benefits is flexible-to-install vs. flexible-to-use
Integrated Smart Systems are driven by LEVEL 3
Application driven system integration
Large Area Electronics is driven by LEVEL 2
Macro electronics for functional area maximization (vs. microminiaturization)
Printed Electronics is driven by LEVEL 1
Low cost and environmental preferred manufacturing
Organic(Inorganic) Electronics is driven by LEVEL 0
Multi-functional materials for electronic and sensing functions
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Printed RFID Markets
RFID in the world of Printed Electronics7
Ticketing (Disposable)
(Integrated Smart System)Pharma (New Services )
(Smart Objects)
ehealth ( Hygiene )
(Integrated Smart System)
eMarketing ( HMI )
(Large Area Electronics )
Games (New Services)
(Smart Objects)
All use cases are disposable !
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System Integration (SMT)
RFID in the world of Printed Electronics8
<
40
<
20
<
10
Gross Margin in %
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System Integration (RFID)
RFID in the world of Printed Electronics9
Packaging
Battery
> 0,10 €
< 5 €
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System Integration (pRFID V1)
RFID in the world of Printed Electronics
10
R2R Q↑
Battery
Packaging Packaging
> 10 €
€ TBD
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System Integration (pRFID V2)
RFID in the world of Printed Electronics
11
S2S Q↑
Battery
Packaging Packaging
~ 0,10 €
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System Integration (pRFID V3)
RFID in the world of Printed Electronics
12
R2R
Battery
Packaging Packaging
€ TBD
> 10 €Packaging
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System Integration (PET)
RFID in the world of Printed Electronics13
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Additional Printed RFID Components
RFID in the world of Printed Electronics14
Contact Readout Conductive Readout RF Readout
Passive
Active
(Sensing)
ROM /WORM
RAM ROM /WORMROM /WORM
WORM / RAM
Primary Batteries Primary / Secondary Batteries
Sensing !
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Smart Packaging Examples
RFID in the world of Printed Electronics15
Smart Packaging
Non-Inductive Tag Printed EAS Tag Printed RFID Tag UHF RFID Tag Hybrid Tag
Comparison
………… …… …………
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Smart Packaging Costs
RFID in the world of Printed Electronics16
Ink
(Organic and/or Inorganic)
Foils and/or Paper Inkjet / Gravure / Screen
Printing
Assembly
(Lamination)
Lamination
Labeling
(none if integrated)
Battery and/or IC
Antenna and/or Sensor
Connectingwire / wireless
Tagged Object
( included in BOM)
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Costs Comparison
RFID in the world of Printed Electronics17
RFID
RFID
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Optimized Costs
RFID in the world of Printed Electronics18
RFID
RFID
Printing
Foils
Inks
Added Value ?
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Active Systems
RFID in the world of Printed Electronics19
Active
System
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Smart Packaging Cost Drivers
RFID in the world of Printed Electronics20
Component System
Passive Harvesting Active
Active
Passive
Driven by Higher PET Levels
Driven b
y L
ow
er
PE
T L
evels
Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3
Cost %
Cost %
TBD TBD
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Printed Sensor Tag
RFID in the world of Printed Electronics21
System-in-Foil
Write
Function : SensingEnergy Harvesting
Even
tD
ata
Function : Storing
Info
rmat
ion
Function : Computing
Function : ConnectingEnergy Harvesting
Kn
ow
led
ge
Rea
d / W
rite
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Cost Breakdown
RFID in the world of Printed Electronics22
Passive System
Running Costs
Foils
Row Material Ink
Screen Gravure
Alignment Lamination
% Cost = Bill Of Material (BOM) + Conversion Costs (CC)
Bill Of Material (BOM)= cost of purchased row materials, sub-assemblies, components, parts
Conversion Costs (CC)= cost of changing row materials into finished or semi-finished products
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Optimization Potential (Theoretical)
RFID in the world of Printed Electronics23
Level Action Potential for Reduction
• Level 5 : Update only Infrastructure Firmware
• Level 4 : Integrate Automated Inline Customization - 50%
• Level 3 : Focus on Passive Solutions
• Level 2 : Reduce Numbers of Layers (Avoid Alignment) - 85%
• Level 1 : Switch from Batch to Inline Printing Processes - 50%
• Level 0 : Change from Contactless (13.56 MHz) to a
Sweep/Contact Readout - 40%
Passive System
Running Costs
Foils
Row Material Ink
Screen Gravure
Alignment Lamination
- 60%
% Cost = Bill Of Material (BOM) + Conversion Costs (CC)
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Net Present Value Breakdown
RFID in the world of Printed Electronics24
% Net Present Value (NPV)
Net Present Value (NPV) = Method for using the time value of money to appraise long-term projects
Interest Rate =15%
Profit Margin [Level]
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Questions ?
RFID in the world of Printed Electronics25
Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)
Dr. Andreas Schaller
Email : [email protected]
Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)
Office : Schulstr. 11, 95676 Wiesau
Management : Dr. Andreas Schaller
District Court : AG Weiden, HRB 3499