RF Front-End Module Comparison 2020 Volume 2 - …...RF Front-End Module Comparison 2020 –Volume 1...
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Each year System Plus opens up hundreds of Front-End Modules (FEMs) and components to provide an overview of the Radio Frequency (RF) FEM market in selected flagship smartphones. Gathering the information into one report offers an opportunity to keep track of the evolution of this technology market. This year, System Plus Consulting offers different volumes of technical and cost comparisons of Smartphones’ RF FEMs. Every report will focus on a specific subject that can be a player’s evolution, a specific technology, or a comparison of flagship devices. This second volume provides insights into technology and cost data for FEMs and several other components found in ten smartphones: the Huawei Mate 8, P9, Mate 9, P10, Mate 10, P20 Pro, Mate 20, P30 Pro, Mate 20 X (5G), and Mate 30 Pro 5G. It features a comprehensive overview of the evolution of Huawei’s choices, like changes in architecture from separate Power Amplifier Module with integrated Duplexer (PAMiD) to an integrated solution for Mid- and High Bands. A drop in the number, area and cost of American components is revealed in latest Mate series. Also, the report reveals how Huawei is able to still produce a highly competitive smartphone with 5G Sub- 6GHz technology despite the political situation. With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed, from the output of the transceiver to the antenna. Packaging, sizes and technologies are studied to provide a large panel of technical and economical choices and an overview of the market. Also, the report features a comparison with other flagship release by the end of 2019 in term of cost, components and architecture. Moreover, the report includes a database based on the teardown and provides a statistical analysis for most front-end modules. It also tries to explain the smartphone makers’ choices and supplier tendencies. Wifi and Bluetooth module analyses are not included in this report. COMPLETE TEARDOWN WITH • Detailed photos • Precise measurements • Module opening • Die measurements • Complete Bills-of-Materials for the modules • Comparison between suppliers • Historical evolution of the suppliers • Historical evolution of RF architecture • Cost comparisons and evolution • Detailed technical and cost analysis of 80 components Technical and cost overview of Huawei’s Mate and P series Radio Frequency Front-End Module technologies from 2015 to 2019. REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT Title: RF Front-End Module Comparison 2020 Volume 2 Pages: 304 Date: April 2020 Format: PDF & Excel file Price: EUR 6,490 Reference: SP20522 RF Front-End Module Comparison 2020 – Volume 2 IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
Transcript of RF Front-End Module Comparison 2020 Volume 2 - …...RF Front-End Module Comparison 2020 –Volume 1...
Each year System Plus opens up hundredsof Front-End Modules (FEMs) andcomponents to provide an overview of theRadio Frequency (RF) FEM market inselected flagship smartphones. Gatheringthe information into one report offers anopportunity to keep track of the evolutionof this technology market.
This year, System Plus Consulting offersdifferent volumes of technical and costcomparisons of Smartphones’ RF FEMs.Every report will focus on a specificsubject that can be a player’s evolution, aspecific technology, or a comparison offlagship devices.
This second volume provides insights intotechnology and cost data for FEMs andseveral other components found in tensmartphones: the Huawei Mate 8, P9,Mate 9, P10, Mate 10, P20 Pro, Mate 20,P30 Pro, Mate 20 X (5G), and Mate 30 Pro5G. It features a comprehensive overviewof the evolution of Huawei’s choices, likechanges in architecture from separatePower Amplifier Module with integratedDuplexer (PAMiD) to an integratedsolution for Mid- and High Bands. A dropin the number, area and cost of Americancomponents is revealed in latest Mateseries. Also, the report reveals howHuawei is able to still produce a highlycompetitive smartphone with 5G Sub-6GHz technology despite the politicalsituation.
With teardowns of the smartphones, themain RF modules and components havebeen extracted and physically analyzed,from the output of the transceiver to theantenna. Packaging, sizes and technologiesare studied to provide a large panel oftechnical and economical choices and anoverview of the market. Also, the reportfeatures a comparison with other flagshiprelease by the end of 2019 in term of cost,components and architecture.
Moreover, the report includes a databasebased on the teardown and provides astatistical analysis for most front-endmodules. It also tries to explain thesmartphone makers’ choices and suppliertendencies. Wifi and Bluetooth moduleanalyses are not included in this report.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Module opening
• Die measurements
• Complete Bills-of-Materials for the modules
• Comparison between suppliers
• Historical evolution of the suppliers
• Historical evolution of RF architecture
• Cost comparisons and evolution
• Detailed technical and cost analysis of 80 components
Technical and cost overview of Huawei’s Mate and P series Radio FrequencyFront-End Module technologies from 2015 to 2019.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: RF Front-End Module Comparison 2020 Volume 2
Pages: 304
Date: April 2020
Format: PDF & Excel file
Price: EUR 6,490
Reference: SP20522
RF Front-End Module Comparison 2020 –Volume 2
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
Company Profile
Smartphone Teardowns
Mate 8, P9, Mate 9, P10, Mate 10, P20 Pro, Mate 20, P30 Pro, Mate 20 X (5G), and Mate 30 Pro 5G
Physical Analysis
• Front-End Modules
Packages view and dimensions
Packages opening
Active die views and dimensions
o Power amplifier
o SPxT switch
o LNA
o RFIC
AUTHOR
Passive die views and dimensions
o SAW filters
o BAW filters
o IPDs
o SMD components
Component summary
Area and distribution number comparison
Comparison Analysis
• Evolution of Suppliers
• Supported Bands
• Integration Comparison including Area per Supplier, Area per Function and Filters
• Material Comparison including Substrate and Silicon Consumption
• Cost Evolution
RF FRONT-END MODULE COMPARISON 2020 VOLUME 2
RELATED REPORTS
Dr. Stéphane Elisabeth has joined System Plus Consulting's team in2016. He has a deep knowledge of Materials characterizations andElectronics systems. He holds an Engineering Degree in Electronics andNumerical Technology, and a PhD in Materials for Microelectronics.
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Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052A study from modem to antenna of the very first compact-form 5G millimeter-wave chipset for handset applications.September 2019 - EUR 3,990*
Qorvo QM76018 RFFEM in the Apple iPhone XrFirst mid/high-band front-end module from Qorvo in an Apple phone with advanced packaging.October 2019 - EUR 3,990*
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
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WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
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Our analysis is performed with our costing tools IC Price+, MEMS CoSim+ and 3D Package CoSim+.
System Plus Consulting offers powerful costing tools to evaluate any process or device, the production cost
and selling price, from single chip to complex structures. All these tools are on sale under corporate
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