Reference Design for SARA / LISA modules...
Transcript of Reference Design for SARA / LISA modules...
Nested Design Reference Design for SARA / LISA modules Application Note
Abstract
This document describes the nested design for SARA and LISA
modules. This reference design is intended to be used as a template to assist in making application-specific products. Reference designs,
including example schematics, Bill of Materials (BOM), and routing
suggestions, are available to u-blox’ customers.
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Nested Design - Application Note
GSM.G2-CS-12001-1 Page 2 of 26
Document Information
Title Nested Design
Subtitle Reference Design for SARA / LISA modules
Document type Application Note
Document number GSM.G2-CS-12001-1
Document status Preliminary
This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They can be downloaded from www.u-blox.com.
u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make
changes to specifications and product descriptions at any time without notice.
u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without
express permission is strictly prohibited. Copyright © 2013, u-blox AG.
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 3 of 26
Contents
Contents .............................................................................................................................. 3
1 Introduction .................................................................................................................. 4
2 Nested design description ........................................................................................... 5
2.1 Overview .............................................................................................................................................. 5
2.2 Power management ........................................................................................................................... 11
2.2.1 Module supply (VCC) .................................................................................................................. 11
2.2.2 RTC supply (V_BCKP) ................................................................................................................... 12
2.2.3 Interfaces supply output (V_INT) .................................................................................................. 12
2.3 System functions ................................................................................................................................ 12
2.3.1 Module power-on (PWR_ON) ...................................................................................................... 12
2.3.2 Module power-off ....................................................................................................................... 12
2.3.3 Module reset (RESET_N) .............................................................................................................. 13
2.3.4 External 32 kHz input (EXT32K) ................................................................................................... 13
2.4 RF connection ..................................................................................................................................... 14
2.4.1 RF interface for Tx/Rx antenna (ANT) ........................................................................................... 14
2.4.2 RF interface for Rx diversity antenna (ANT_DIV) ........................................................................... 14
2.4.3 Antenna detection interface (ANT_DET) ...................................................................................... 15
2.5 SIM interface ...................................................................................................................................... 17
2.6 Serial interfaces .................................................................................................................................. 17
2.6.1 UART interface ............................................................................................................................ 17
2.6.2 UART AUX interface .................................................................................................................... 17
2.6.3 USB interface............................................................................................................................... 17
2.6.4 SPI interface ................................................................................................................................ 18
2.6.5 DDC (I2C) interface ...................................................................................................................... 18
2.7 Audio interface ................................................................................................................................... 19
2.7.1 Analog Audio .............................................................................................................................. 19
2.7.2 Digital audio ................................................................................................................................ 21
2.8 General Purpose Input/Output (GPIO) ................................................................................................. 22
2.8.1 GPIOs with GPS / GNSS functionalities ......................................................................................... 23
2.9 Reserved pins (RSVD) .......................................................................................................................... 23
2.10 Production guidelines ...................................................................................................................... 23
2.11 Deliverable package ........................................................................................................................ 24
Related documents........................................................................................................... 25
Revision history ................................................................................................................ 25
Contact .............................................................................................................................. 26
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GSM.G2-CS-12001-1 Preliminary Page 4 of 26
1 Introduction The following symbols are used to highlight important information within the document:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
This document applies to the following products:
o SARA-G3 series
o LISA-U1 series
o LISA-U2 series
o LISA-C2 series
u-blox uses the term “Nested Design” to describe application boards on which different series of modules can
be mounted on the same space.
In this document LISA-U1 series, LISA-U2 series and LISA-C2 series modules will be referred to as LISA and
references applicable to SARA-G3 series modules will be referred to as SARA.
The Nested Design Application Note focuses at the following topics:
All SARA and LISA modules interfaces
This document includes only HW guidelines for mounting LISA and SARA modules on the same spaces of the
nested application board. Firmware topics are not considered, but SARA and LISA modules enjoy fairly
straightforward compatibility for AT commands (for more details refer to the corresponding module AT commands manual [2], [8]).
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 5 of 26
2 Nested design description
2.1 Overview
Migrating between LISA-U1, LISA-U2, LISA-C2 series and SARA-G3 series wireless module designs is a fairly
straightforward procedure that allows customers to take maximum advantage of their hardware and software
investments.
SARA wireless modules (26.0 x 16.0 mm LGA) have a different form factor than LISA wireless modules (33.2 x
22.4 mm LCC). Even so the footprints for the SARA and LISA modules have been developed so that all the pads
on the side with the antenna pin can be shared on the application board. The pins on this side have the same pitch and nearly the same functions, as described in Figure 1.
64 63 61 60 58 57 55 54
22 23 25 26 28 29 31 32
11
10
8
7
5
4
2
1
21
19
18
16
15
13
12
43
44
46
47
49
50
52
53
33
35
36
38
39
41
42
65 66 67 68 69 70
71 72 73 74 75 76
77 78
79 80
81 82
83 84
85 86 87 88 89 90
91 92 93 94 95 96
CTS
RTS
DCD
RI
V_INT
V_BCKP
GND
RSVD
RESET_N
RSVD/ GPIO1
PWR_ON
RXD
TXD
3
20
17
14
9
6
24 27 30
51
48
45
40
37
34
5962 56
GND
GND
DSR
DTR
GND
RSVD
GND
GND
RX
D_A
UX
TX
D_A
UX
EX
T3
2/R
SV
D
GN
D
RS
VD
/G
PIO
2
RS
VD
/G
PIO
3
RS
VD
/S
DA
RS
VD
/S
CL
RS
VD
/G
PIO
4
GN
D
GN
D
GND
RSVD/ SPK_P
RSVD/ MIC_BIAS
RSVD/ MIC_GND
RSVD/ MIC_P
GND
VCC
VCC
RSVD
RSVD/ I2S_TXD
RSVD/ I2S_CLK
SIM_CLK
SIM_IO
VSIM
SIM_DET
VCC
RSVD/ MIC_N
RSVD/ SPK_N
SIM_RST
RSVD/ I2S_RXD
RSVD/ I2S_WA
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
RS
VD
/A
NT
_D
ET
AN
T
SARA-G3 seriesTop View
Pin 65-96: GND
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
GND
VCC
VCC
VCC
GND
SPI_MRDY
SPI_SRDY
SPI_MISO
SPI_MOSI
SPI_SCLK
RSVD / SPK_N
GND
RSVD / SPK_P
RSVD
GPIO5
VSIM
SIM_RST
SIM_IO
SIM_CLK
SDA
SCL
RSVD / I2S_RXD
RSVD / I2S_CLK
RSVD / I2S_TXD
RSVD / I2S_WA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
V_BCKP
GND
V_INT
RSVD
GND
GND
GND
DSR
RI
DCD
DTR
GND
RTS
CTS
TXD
RXD
GND
VUSB_DET
PWR_ON
GPIO1
GPIO2
RESET_N
GPIO3
GPIO4
GND26
27
USB_D-
USB_D+
40
39
RSVD / MIC_P
RSVD / MIC_N
28 29 30 31 32 33 34 35 36 37 38
76 75 74 73 72 71 70 69 68 67 66
LISA-U1 seriesTop View
GN
D
RS
VD
GN
D
GN
D
GN
D
GN
D
GN
D
AN
T
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
GND
VCC
VCC
VCC
GND
SPI_MRDY / GPIO14
SPI_SRDY / GPIO13
SPI_MISO / GPIO12
SPI_MOSI / GPIO11
SPI_SCLK / GPIO10
GPIO9 / I2S1_WA
GND
GPIO8 / I2S1_CLK
RSVD / CODEC_CLK
GPIO5
VSIM
SIM_RST
SIM_IO
SIM_CLK
SDA
SCL
RSVD / I2S_RXD
RSVD / I2S_CLK
RSVD / I2S_TXD
RSVD / I2S_WA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
V_BCKP
GND
V_INT
RSVD
GND
GND
GND
DSR
RI
DCD
DTR
GND
RTS
CTS
TXD
RXD
GND
VUSB_DET
PWR_ON
GPIO1
GPIO2
RESET_N
GPIO3
GPIO4
GND26
27
USB_D-
USB_D+
40
39
GPIO7 / I2S1_TXD
GPIO6 / I2S1_RXD
28 29 30 31 32 33 34 35 36 37 38
76 75 74 73 72 71 70 69 68 67 66
LISA-U2 seriesTop View
GN
D
RS
VD
/A
NT
_D
IV
GN
D
GN
D
GN
D
GN
D
GN
D
AN
T
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
GND
VCC
VCC
VCC
GND
RSVD
RSVD
RSVD
RSVD
RSVD
SPK_N
GND
SPK_P
RSVD
GPIO5
VSIM
SIM_RST
SIM_IO
SIM_CLK
RSVD
RSVD
PCM_DI
PCM_CLK
PCM_DO
PCM_SYNC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
RSVD
GND
V_INT
RSVD
GND
GND
GND
RSVD
RI
RSVD
RSVD
GND
RTS
CTS
TXD
RXD
GND
VUSB_DET
PWR_ON
GPIO1
GPIO2
RESET_N
GPIO3
GPIO4
GND26
27
USB_D-
USB_D+
40
39
MIC_P
MIC_N
28 29 30 31 32 33 34 35 36 37 38
76 75 74 73 72 71 70 69 68 67 66
LISA-C2 seriesTop View
GN
D
RS
VD
GN
D
GN
D
GN
D
GN
D
GN
D
AN
T
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
Figure 1: Pin assignment on LISA series and SARA-G3 series modules: highlighted pads can be shared on the application board
This is the basis of the Nested Design concept: any SARA-G3, any LISA-U1, any LISA-U2, any LISA-C2 module
can be alternatively mounted on the same nested board, as shown in Figure 2. This enables straightforward
development of products supporting either GSM/GPRS, W-CDMA or CDMA wireless technology with the same application board.
LISA
NESTED APPLICATION BOARD
Top Layer and Solder MaskLISA mounting option
with LISA Paste Mask
SARA
SARA mounting option
with SARA Paste Mask
ANT pad
Figure 2: Nested Design concept description: LISA and SARA modules alternatively mounted on the same application board
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 6 of 26
The voltage level of all the digital interfaces of SARA and LISA series modules is 1.8 V: this allows the direct connection from a 1.8 V external device (e.g. application processor) to all the modules.
The following chapters explain the points to consider when nesting LISA and SARA modules.
For further details regarding SARA and LISA series modules characteristics, usage, or settings, refer to the relevant Data Sheet [1], [3], [4], [5], System Integration Manual [6], [7], [9] and AT commands manual [2], [8].
Table 1 summarizes the electrical differences of pins on LISA and SARA wireless modules.
Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series
Power
VCC 51-53 Normal op. range:
3.35 V – 4.5 V
Extended op. range:
3.00 V – 4.5 V
High pulse current
due to GSM TDMA
61-63 Normal op. range:
3.3 V – 4.4 V
Extended op. range:
Not applicable
No high pulse current
due to CDMA
Normal op. range:
3.4 V – 4.2 V
Extended op. range:
3.1 V – 4.2 V
High pulse current
due to GSM TDMA
Normal op. range:
3.3 V – 4.4 V
Extended op. range:
3.1 V – 4.5 V
High pulse current
due to GSM TDMA
V_BCKP 2 Output characteristics:
2.3 V typ, 2 mA max
Input op. range:
1.0 V – 2.4 V
2 Not Available Output characteristics:
2.3 V typ, 3 mA max
Input op. range:
1.0 V – 2.5 V
Output characteristics:
1.8 V typ, 3 mA max
Input op. range:
1.0 V – 1.9 V
V_INT 4 Output characteristics:
1.8 V typ, 50 mA max
4 Output characteristics:
1.8 V typ, 50 mA max
Output characteristics:
1.8 V typ, 50 mA max
Output characteristics:
1.8 V typ, 50 mA max
Antenna
ANT 56 RF input/output for Tx/Rx antenna
68 RF input/output for Tx/Rx antenna
RF input/output for Tx/Rx antenna
RF input/output for main Tx/Rx antenna
ANT_DIV Not Available 74 Not Available Not Available LISA-U230 only:
RF input for
Rx diversity antenna
ANT_DET 62 SARA-G350 only:
Input for antenna
detection circuit
Not Available Internal antenna detection circuit
Internal antenna detection circuit
System
PWR_ON 15 No internal pull-up
L-level: -0.10 V – 0.65 V
H-level: 2.00 V – 4.50 V
ON L-level time:
5 ms min
OFF L-level pulse time:
Not Available
19 180 k internal pull-up
L-level: -0.30 V – 0.30 V
H-level: 2.00 V – 4.70 V
ON L-level pulse time:
150 ms min
OFF L-level pulse time:
Not Available
No internal pull-up
L-level: -0.30 V –0.65 V
H-level: 2.00 V – 4.50 V
ON L-level pulse time:
5 ms min
OFF L-level pulse time:
Not Available
No internal pull-up
L-level: -0.30 V – 0.65 V
H-level: 1.50 V – 4.40 V
ON L-level pulse time:
50 µs min / 80 µs max
OFF L-level pulse time:
Not Available
RESET_N 18 Internal diode & pull-up
L-level: -0.30 V – 0.30 V
H-level: 2.00 V – 4.70 V
Reset L-level pulse time:
50 ms min
22 550 internal pull-up
L-level: -0.30 V – 0.63 V
H-level: 1.32 V – 2.10 V
Reset L-level pulse time:
300 ms min
10 k internal pull-up
L-level: -0.30 V – 0.65 V
H-level: 1.69 V – 2.48 V
Reset L-level pulse time:
50 ms min
10 k internal pull-up
L-level: -0.30 V – 0.51 V
H-level: 1.32 V – 2.01 V
Reset L-level pulse time:
50 ms min
EXT32K 31 SARA-G300/G310:
32 kHz input for RTC
& low power idle mode
SARA-G350:
Internal 32 kHz for RTC
& low power idle mode
Not Available Internal 32 kHz for RTC & low power idle mode
Internal 32 kHz for RTC & low power idle mode
SIM
SIM_CLK 38 1.8V / 3V SIM clock 47 1.8V / 3V SIM clock (upcoming FW releases)
1.8V / 3V SIM clock 1.8V / 3V SIM clock
SIM_IO 39 1.8V / 3V SIM data
Internal 4.7k pull-up
48 1.8V / 3V SIM data (upcoming FW releases)
Internal 10k pull-up
1.8V / 3V SIM data
Internal 4.7k pull-up
1.8V / 3V SIM data
Internal 4.7k pull-up
SIM_RST 40 1.8V / 3V SIM reset 49 1.8V / 3V SIM reset (upcoming FW releases)
1.8V / 3V SIM reset 1.8V / 3V SIM reset
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 7 of 26
Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series
VSIM 41 1.8V / 3V SIM supply 50 1.8V / 3V SIM supply (upcoming FW releases)
1.8V / 3V SIM supply 1.8V / 3V SIM supply
SIM_DET 42 1.8 V, SIM detect input
Inner pull-down: 103 µA
Not Available Provided by GPIO5:
1.8 V, SIM detect input
Inner pull-down: 55 µA
Provided by GPIO5:
1.8 V, SIM detect input
Inner pull-down: 200 µA
UART
DSR 6 1.8 V, DSR output
Driver strength: 6 mA
9 Not Available 1.8 V, DSR output
Driver strength: 4 mA
1.8 V, DSR output
Driver strength: 1 mA
RI 7 1.8 V, RI output
Driver strength: 6 mA
10 1.8 V, RI output
Driver strength: 6 mA
1.8 V, RI output
Driver strength: 4 mA
1.8 V, RI output
Driver strength: 2 mA
DCD 8 1.8 V, DCD output
Driver strength: 6 mA
11 Not Available 1.8 V, DCD output
Driver strength: 4 mA
1.8 V, DCD output
Driver strength: 2 mA
DTR 9 1.8 V, DTR input
Internal pull-up: -55 µA
12 Not Available 1.8 V, DTR input
Internal pull-up: -110 µA
1.8 V, DTR input
Internal pull-up: -125 µA
RTS 10 1.8 V, Flow ctrl input
Internal pull-up: -31 µA
13 1.8 V, Flow ctrl input
Internal pull-up: -30 µA
1.8 V, Flow ctrl input
Internal pull-up: -60 µA
1.8 V, Flow ctrl input
Internal pull-up: -240 µA
CTS 11 1.8 V, Flow ctrl output
Driver strength: 6 mA
14 1.8 V, Flow ctrl output
Driver strength: 4 mA
1.8 V, Flow ctrl output
Driver strength: 4 mA
1.8 V, Flow ctrl output
Driver strength: 6 mA
TXD 12 1.8 V, Data input
Internal pull-up: -102 µA
15 1.8 V, Data input
Internal pull-up: -30 µA
1.8 V, Data input
Internal pull-up: -60 µA
1.8 V, Data input
Internal pull-up: -240 µA
RXD 13 1.8 V, Data output
Driver strength: 5 mA
16 1.8 V, Data output
Driver strength: 4 mA
1.8 V, Data output
Driver strength: 4 mA
1.8 V, Data output
Driver strength: 6 mA
UART AUX
TXD_AUX 29 1.8 V, Data input
Internal pull-up: -102 µA
Not Available Not Available Not Available
RXD_AUX 28 1.8 V, Data output
Driver strength: 5 mA
Not Available Not Available Not Available
USB
VUSB_DET Not Available 18 5 V, Supply detection 5 V, Supply detection 5 V, Supply detection
USB_D- Not Available 26 Full-Speed USB 2.0 High-Speed USB 2.0 High-Speed USB 2.0
USB_D+ Not Available 27 Full-Speed USB 2.0 High-Speed USB 2.0 High-Speed USB 2.0
SPI
SPI_SCLK Not Available 55 Not Available 1.8 V, Clock input
Inner pull-down: 100 µA
1.8 V, Clock input
Inner pull-down: 200 µA
SPI_MOSI Not Available 56 Not Available 1.8 V, Data input
Internal pull-up: -220 µA
1.8 V, Data input
Internal pull-up: -240 µA
SPI_MISO Not Available 57 Not Available 1.8 V, Data output
Driver strength: 2.5 mA
1.8 V, Data output
Driver strength: 6 mA
SPI_SRDY Not Available 58 Not Available 1.8 V, Flow ctrl output
Driver strength: 4 mA
1.8 V, Flow ctrl output
Driver strength: 6 mA
SPI_MRDY Not Available 59 Not Available 1.8 V, Flow ctrl input
Inner pull-down: 55 µA
1.8 V, Flow ctrl input
Inner pull-down: 200 µA
DDC (I2C)
SCL 27 SARA-G350 only:
1.8 V, open drain
Driver strength: 3 mA
45 1.8 V, open drain (upcoming FW releases)
1.8 V, open drain
Driver strength: 1 mA
1.8 V, open drain
Driver strength: 1 mA
LISA-U200-00S: N.A.
SDA 26 SARA-G350 only:
1.8 V, open drain
Driver strength: 3 mA
46 1.8 V, open drain (upcoming FW releases)
1.8 V, open drain
Driver strength: 1 mA
1.8 V, open drain
Driver strength: 1 mA
LISA-U200-00S: N.A.
Audio
Analog audio
MIC_BIAS 46 SARA-G350 only:
2.2 V supply output for external microphone
Not Available Not Available Not Available
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 8 of 26
Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series
MIC_GND 47 SARA-G350 only:
Local ground sense for
external microphone
Not Available Not Available Not Available
MIC_P 49 SARA-G350 only:
Differential input (+)
No internal capacitor
for DC blocking
40 Differential input (+)
100 nF internal capacitor
for DC blocking
LISA-U120/U130 only:
Differential input (+)
100 nF internal capacitor
for DC blocking
Not Available
MIC_N 48 SARA-G350 only:
Differential input (-)
No internal capacitor
for DC blocking
39 Differential input (-)
100 nF internal capacitor
for DC blocking
LISA-U120/U130 only:
Differential input (-)
100 nF internal capacitor
for DC blocking
Not Available
SPK_P 44 SARA-G350 only:
Differential output (+)
16 Ω load capable
53 Differential output (+)
32 Ω load capable
LISA-U120/U130 only:
Differential output (+)
16 Ω load capable
Not Available
SPK_N 45 SARA-G350 only:
Differential output (-)
16 Ω load capable
54 Differential output (-)
32 Ω load capable
LISA-U120/U130 only:
Differential output (-)
16 Ω load capable
Not Available
Digital audio
I2S_TXD 35 SARA-G350 only:
1.8 V, Data Out
PCM / Normal I2S mode
Driver strength: 5 mA
42 PCM_DO:
1.8 V, PCM Data Out
LISA-U120/U130 only:
1.8 V, Data Out
PCM / Normal I2S mode
Driver strength: 2.5 mA
1.8 V, Data Out
PCM / Normal I2S mode
Driver strength: 2 mA
LISA-U200-00S: N.A.
I2S_RXD 37 SARA-G350 only:
1.8 V, Data In
PCM / Normal I2S mode
Inner pull-down: 103 µA
44 PCM_DI:
1.8 V, PCM Data In
LISA-U120/U130 only:
1.8 V, Data In
PCM / Normal I2S mode
Inner pull-down: 100 µA
1.8 V, Data In
PCM / Normal I2S mode
Inner pull-down: 200 µA
LISA-U200-00S: N.A.
I2S_WA 34 SARA-G350 only:
1.8 V, Word align. Out
Fixed frequency
Driver strength: 6 mA
41 PCM_SYNC:
1.8 V, PCM Sync Out
LISA-U120/U130 only:
1.8 V, Word align. In/Out
Configurable frequency
Inner pull-down: 100 µA
Driver strength: 2.5 mA
1.8 V, Word align. In/Out
Configurable frequency
Inner pull-down: 200 µA
Driver strength: 2 mA
LISA-U200-00S: N.A.
I2S_CLK 36 SARA-G350 only:
1.8 V, Clock Out
Fixed frequency
Driver strength: 5 mA
43 PCM_CLK:
1.8 V, PCM Clock Out
LISA-U120/U130 only:
1.8 V, Clock In/Out
Configurable frequency
Inner pull-down: 100 µA
Driver strength: 2.5 mA
1.8 V, Clock In/Out
Configurable frequency
Inner pull-down: 200 µA
Driver strength: 2 mA
LISA-U200-00S: N.A.
I2S1_WA Not Available 54 Not Available Not Available 1.8 V, Data Out
PCM / Normal I2S mode
Driver strength: 1 mA
LISA-U200-00S: N.A.
I2S1_TXD Not Available 40 Not Available Not Available 1.8 V, Data In
PCM / Normal I2S mode
Inner pull-down: 150 µA
LISA-U200-00S: N.A.
I2S1_CLK Not Available 53 Not Available Not Available 1.8 V, Word align. In/Out
Configurable frequency
Inner pull-down: 150 µA
Driver strength: 1 mA
LISA-U200-00S: N.A.
I2S1_RXD Not Available 39 Not Available Not Available 1.8 V, Clock In/Out
Configurable frequency
Inner pull-down: 150 µA
Driver strength: 1 mA
LISA-U200-00S: N.A.
Other
CODEC_CLK Not Available 52 Not Available Not Available 1.8 V, 13/26 MHz Out
Driver strength: 4 mA
LISA-U200-00S: N.A.
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 9 of 26
Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series
GPIO
GPIO1 16 SARA-G350 only:
1.8 V, configurable GPIO
Default: Pad disabled
Driver strength: 6 mA
Inner pull-down: 51 µA
20 1.8 V, configurable GPIO
Default: Pad disabled
Driver strength: 4 mA
Inner pull-down: 30 µA
1.8 V, configurable GPIO
Default: Pad disabled
Driver strength: 1 mA
Inner pull-down: 100 µA
1.8 V, configurable GPIO
Default: Pad disabled
Driver strength: 6 mA
Inner pull-down: 200 µA
GPIO2 23 SARA-G350 only:
1.8 V, configurable GPIO
Default: GPS supply ena.
Driver strength: 6 mA
Inner pull-down: 51 µA
21 1.8 V, configurable GPIO
Default: Pad disabled
Driver strength: 4 mA
Inner pull-down: 30 µA
1.8 V, configurable GPIO
Default: GPS supply en.
Driver strength: 1 mA
Inner pull-down: 85 µA
1.8 V, configurable GPIO
Default: GPS supply en.
Driver strength: 1 mA
Inner pull-down: 150 µA
GPIO3 24 SARA-G350 only:
1.8 V, configurable GPIO
Default: GPS data ready
Driver strength: 5 mA
Inner pull-down: 27 µA
23 1.8 V, configurable GPIO
Default: Pad disabled
Driver strength: 4 mA
Inner pull-down: 30 µA
1.8 V, configurable GPIO
Default: GPS data ready
Driver strength: 4 mA
Inner pull-down: 55 µA
1.8 V, configurable GPIO
Default: GPS data ready
Driver strength: 6 mA
Inner pull-down: 200 µA
GPIO4 25 SARA-G350 only:
1.8 V, configurable GPIO
Default: GPS RTC shar.
Driver strength: 6 mA
Inner pull-down: 51 µA
24 1.8 V, configurable GPIO
Default: Pad disabled
Driver strength: 4 mA
Inner pull-down: 30 µA
1.8 V, configurable GPIO
Default: GPS RTC sharing (4.7 k external pull-down
required for RTC sharing)
Driver strength: 4 mA
Inner pull-down: 55 µA
1.8 V, configurable GPIO
Default: GPS RTC sharing
Driver strength: 6 mA
Inner pull-down: 200 µA
GPIO5 Not Available 51 1.8 V, configurable GPIO
Default: Pad disabled
Driver strength: 4 mA
Inner pull-down: 30 µA
1.8 V, configurable GPIO
Default: SIM detection
Driver strength: 2.5 mA
Inner pull-down: 55 µA
1.8 V, configurable GPIO
Default: SIM detection
Driver strength: 6 mA
Inner pull-down: 200 µA
GPIO6 Not Available 39 Not Available Not Available 1.8 V, configurable GPIO
Default: I2S1_RXD
Driver strength: 1 mA
Inner pull-down: 150 µA
GPIO7 Not Available 40 Not Available Not Available 1.8 V, configurable GPIO
Default: I2S1_TXD
Driver strength: 1 mA
Inner pull-down: 150 µA
GPIO8 Not Available 53 Not Available Not Available 1.8 V, configurable GPIO
Default: I2S1_CLK
Driver strength: 1 mA
Inner pull-down: 150 µA
GPIO9 Not Available 54 Not Available Not Available 1.8 V, configurable GPIO
Default: I2S1_WA
Driver strength: 1 mA
Inner pull-down: 150 µA
GPIO10 Not Available 55 Not Available Not Available 1.8 V, configurable GPIO
Default: SPI_SCLK
Driver strength: 6 mA
Inner pull-down: 200 µA
GPIO11 Not Available 56 Not Available Not Available 1.8 V, configurable GPIO
Default: SPI_MOSI
Driver strength: 6 mA
Inner pull-down: 200 µA
GPIO12 Not Available 57 Not Available Not Available 1.8 V, configurable GPIO
Default: SPI_MISO
Driver strength: 6 mA
Inner pull-down: 200 µA
GPIO13 Not Available 58 Not Available Not Available 1.8 V, configurable GPIO
Default: SPI_SRDY
Driver strength: 6 mA
Inner pull-down: 200 µA
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 10 of 26
Pin Name N° SARA-G3 series N° LISA-C2 series LISA-U1 series LISA-U2 series
GPIO14 Not Available 59 Not Available Not Available 1.8 V, configurable GPIO
Default: SPI_MRDY
Driver strength: 6 mA
Inner pull-down: 200 µA
Table 1: Summary of pin differences and compatibility level among modules
The printed circuit board for the Nested Design application board is IP06_HW_CS_170000 (shown on the bottom side of the board). Table 2 lists the different Bills of Materials (BoM) available as mounting options on
this PCB1.
Mounting option Description Remarks
IP06_HW_BM_170000_BOM_COUNT.xls SARA-G350 mounting version Just one schematic file HS_170000 is provided with the necessary comments.
IP06_HW_BM_1700A0_BOM_COUNT.xls SARA-G310 mounting version All BOM versions refer to schematic HS_170000
IP06_HW_BM_1700B0_BOM_COUNT.xls LISA-U200 mounting version All BOM versions refer to schematic HS_170000
IP06_HW_BM_1700C0_BOM_COUNT.xls LISA-U230 mounting version All BOM versions refer to schematic HS_170000
IP06_HW_BM_1700D0_BOM_COUNT.xls LISA-C200 and LISA-U1x0 mounting version All BOM versions refer to schematic HS_170000
Table 2: Nested Design mounting options description
1 The Nested Design Reference Design can be mounted on the EVB-WL1 evaluation board for wireless modules:
In general peripheral voltages on the EVB-WL1 board can be set to 1.8 V or 2.85 V. The SARA/LISA Nested Design, HR_1700x0 sets this voltage to 1.8 V by tying to GND pin 41 of J401 in the schematic IP06_HW_HS_170000.pdf.
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 11 of 26
2.2 Power management
2.2.1 Module supply (VCC)
The same compatible external circuit can be implemented for SARA-G3 and LISA series even if there are minor differences in the VCC input voltage ranges and some differences in the current consumption figures.
The voltage provided must be within the normal operating range limits to allow module switch-on and must be
above the minimum limit of the extended operating range to avoid module switch-off. For the detailed VCC input voltage ranges values refer to Table 1 or to the Data Sheet relating to the module [1], [3], [4], [5].
The maximum average current consumption of SARA-G3 is lower than that of the LISA due to the lower data
rate or the different channel access technology. SARA-G3 modules require large current pulses in connected-mode, significantly lower than LISA-U series when a 2G call is enabled. LISA-C2 series do not require large
current pulses, due to the CDMA channel access technology. For the detailed current consumption values, refer
to the Data Sheet relating to the module [1], [3], [4], [5].
The System Integration Manual corresponding to the module [6], [7], [9] describes the detailed supply circuit
design-in guidelines.
VCC pads of SARA and LISA modules are not shared on the top layer of the nested application board, but they are positioned very close each other to facilitate routing as shown in the Nested Design top layer description
reported in Figure 6 and in Figure 5.
A bypass capacitor with Self-Resonant Frequency in the 800/900 MHz range is placed very close to the VCC pins, at the narrowing of the VCC line implemented in the design, to filter EMI in the lower bands. Additional bypass
capacitors are placed close to the VCC pins to filter EMI in higher bands and to filter the digital logic noise from
clocks and data sources, as suggested in the System Integration Manual relating to the module [6], [7], [9].
If the application device integrates an internal antenna (which is not provided on the nested design board), it is
highly recommended to implement the VCC circuit described in Figure 3 and Table 3, in particular when the
LISA-U modules are mounted, to improve the RF performance. This implementation provides a series ferrite bead for GHz band noise as close as possible to the VCC pins of the module and bypass capacitors, with SRF in the
800/900 MHz and 1800/1900 MHz ranges where the VCC line narrows close to the module.
C1
GND
C2 C4
LISA-U series
62VCC
63VCC
61VCC
3V8
C5
+
LISA-U series
C5
GND plane
VCC line
Capacitor with SRF ~900 MHz
FB1
C1 C3 C4
FB1
Ferrite Bead for GHz noise
C2
C3
Capacitor with SRF ~1900 MHz
Figure 3: Suggested schematic and layout design for the VCC line; highly recommended when using an integrated antenna
Reference Description Part Number - Manufacturer
C1 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata
C2 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata
C3 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata
C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata
C5 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET
FB1 Chip Ferrite Bead EMI Filter for GHz Band Noise
220 at 100 MHz, 260 at 1 GHz, 2000 mA
BLM18EG221SN1 - Murata
Table 3: Suggested components for VCC circuit close to module pins; highly recommended when using an integrated antenna
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 12 of 26
2.2.2 RTC supply (V_BCKP)
The same compatible external circuit can be implemented for SARA-G3 and LISA-U series even if there are minor
differences in the V_BCKP typical output voltage and input voltage range, as shown in Table 1 or in the Data
Sheet relating to the module [1], [3], [4], [5].
LISA-C2 series do not provide V_BCKP RTC supply input/output as well as the whole RTC functionality.
V_BCKP pads of SARA and LISA modules are not shared on the top layer of the nested application board, but
they are positioned very close each other to facilitate routing.
2.2.3 Interfaces supply output (V_INT)
The same compatible external circuit can be implemented for SARA-G3 series and LISA series; there are no
differences in the V_INT output characteristics.
V_INT pads of SARA and LISA modules are not shared on the top layer of the nested application board, but they are positioned very close each other to facilitate routing.
2.3 System functions
2.3.1 Module power-on (PWR_ON)
Table 4 summarizes the allowed power-on sequences of SARA-G3 series and LISA series. For more details, refer
to the System Integration Manual relating to the module [6], [7], [9].
SARA-G3 series LISA-C2 series LISA-U1 series LISA-U2 series
Rising edge on the VCC pins to a valid voltage as module supply
Rising edge on the VCC pins to a valid voltage as module supply with PWR_ON pin permanently low when VCC is applied
Rising edge on the VCC pins to a valid voltage as module supply
Rising edge on the VCC pins to a valid voltage as module supply
Low level on the PWR_ON pin for appropriate time period
Low pulse on the PWR_ON pin for appropriate time period
Low pulse on the PWR_ON pin for appropriate time period
Low pulse on the PWR_ON pin for appropriate time period
Pre-programmed RTC alarm (32 kHz signal at EXT32K input needed for SARA-G300 /
SARA-G310)
Pre-programmed RTC alarm Pre-programmed RTC alarm
RESET_N input pin released from the low level
RESET_N input pin released from the low level
Table 4: Summary of power on events among modules
The same compatible external power-on circuit can be implemented for SARA-G3 series and LISA series even if there are minor differences in the PWR_ON input voltage levels ranges and in the low level time or low pulse
time to switch-on the module, as reported in Table 1 or in the Data Sheet relating to the module [1], [3], [4], [5].
PWR_ON falling edge (i.e. low pulse) is required for LISA series, but it is not required for SARA-G3 series.
External pull-up is not needed for LISA-C2 series since internal pull-up is provided.
PWR_ON pads of SARA and LISA modules are not shared on the top layer of the nested application board, but
they are positioned very close each other to facilitate routing.
2.3.2 Module power-off
SARA-G3 and LISA series modules can be all properly switched off by means of the AT+CPWROFF command.
All LISA-U2 series modules except LISA-U200-00S modules can be additionally properly switched off by low pulse
on PWR_ON pin, as reported in Table 1 or in the LISA-U2 series Data Sheet [5].
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 13 of 26
2.3.3 Module reset (RESET_N)
Perform a reset of SARA-G3 series and LISA series modules in one of the following ways:
Forcing a low level on the RESET_N pin, causing an “external” or “hardware” reset
By means of the AT+CFUN command, causing an “internal” or “software” reset
The same compatible external reset circuit can be implemented for SARA-G3 and LISA series even if there are
minor differences in the RESET_N input voltage levels ranges and in the low level time. For these values, see Table 1 or the Data Sheet relating to the module [1], [3], [4], [5].
RESET_N pads of SARA and LISA modules are not shared on the top layer of the nested application board, but
they are positioned very close each other to facilitate routing.
On the RESET_N line of the nested application board there are spaces to mount proper bypass capacitors and
series ferrite bead / EMI suppression filter as additional circuit precautions for LISA-U series modules to satisfy
ESD immunity test requirements as suggested in LISA-U series System Integration Manual [7]. These additional components are not required for SARA-G3 series modules.
2.3.4 External 32 kHz input (EXT32K)
The external 32 kHz signal input pin (EXT32K) is available only on the SARA-G300 and SARA-G310 modules to
provide the 32 kHz reference clock for the Real Time Clock (RTC) timing, used by the module processor to reach
the low power idle mode and provide the RTC functions.
SARA-G350 series and LISA-U series are equipped with an internal 32 kHz oscillator to provide the same
functions.
LISA-C2 series do not provide RTC and the related functions.
The Y100 32 kHz oscillator, provided on the nested application board, is mounted only when SARA-G300 or
SARA-G310 is present (nested design version HR_1700A0), for implementing the application circuit described in
the SARA-G3 System Integration Manual [9].
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 14 of 26
2.4 RF connection
2.4.1 RF interface for Tx/Rx antenna (ANT)
The same compatible external circuit can be implemented for SARA-G3 and LISA series ANT pin even if there are some differences in the frequency ranges of the operating bands, as summarized in Figure 4.
VV II II
850
900
850
800 850 900 950
900 1800
1900 1900
1800
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
824 960 1710 1990
LISA-U100
LISA-U120
LISA-U260
LISA-U200
LISA-U230
VV II II
850
900
850
800 850 900 950
900 1800
1900 1900
1800
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
IIVIVI
VIIIVIII IV IV
824 960 1710 2170
850
900
850
800 850 900 950
900 1800
1900 1900
1800
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
IIVIIIVIII
824 960 1710 2170
LISA-U110
LISA-U130
LISA-U270
850
900
850
800 850 900 950
900 1800
1900 1900
1800
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
824 960 1710 1990
SARA-G310
SARA-G350
900
800 850 900 950
900 1800 1800
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
880 960 1710 1880
SARA-G300
800800
800 850 900 950
1900 1900
1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200
824 894 1850 1990
LISA-C200
Figure 4: Summary of operating bands frequency ranges among modules
On the ANT line of the nested application board there are spaces to mount a high-pass filter (series capacitor
and shunt inductor) as additional circuit precaution for LISA-U2 series modules to satisfy ESD immunity test requirements, as suggested in LISA-U series System Integration Manual [7]. These additional components are not
required for SARA-G3 series modules, which already provide ESD immunity up to ±4 kV / ±8 kV for Contact / Air
Discharge according to IEC 61000-4-2, and they are not applicable for are LISA-U1 series, which require an insulating enclosure of the device / antenna providing protection to contact / air discharge, and LISA-C2 series.
2.4.2 RF interface for Rx diversity antenna (ANT_DIV)
Only the LISA-U230 modules provide the RF input for Rx diversity antenna (ANT_DIV). So, the J200 SMA
connector and the R202 0 Ω resistor are mounted only when LISA-U230 is present (nested design version
HR_1700C0).
SARA-G3 series, LISA-C2 series, LISA-U1 series and the other LISA-U2 series modules do not support Rx diversity.
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 15 of 26
2.4.3 Antenna detection interface (ANT_DET)
An external application circuit, connecting ANT_DET to ANT pin, is implemented when the SARA-G350 module
is mounted, to provide antenna detection functionality. In the HR_170000 nested design version, the antenna
detection components are R105, L100, C104 and D100 and C103. R103 is not part of antenna detection circuit but is used only during the production to test the SARA-G350 ANT_DET pin. The antenna detection circuit is
identical to the one described in the SARA-G3 series System Integration Manual [9].
LISA-U modules are equipped with an internal circuit for antenna detection support. The external antenna detection circuit is not implemented in nested design versions with LISA-U. C103 / L101 become 15 pF / 39 nH
for LISA-U2 nested design versions that implement the recommended high pass filter to satisfy ESD immunity
test requirements at the antenna port. But by implementing this high-pass filter, the support of the antenna detection functionality is missed. C103 / L101 become 0 Ω / not-mounted for LISA-U1 version, allowing the
support of the antenna detection functionality.
SARA-G300, SARA-G310 and LISA-C2 series modules do not support antenna detection. Thus external antenna detection components are not mounted in the HR_1700A0 and HR_1700D0 nested design versions, and C103 is
a 0 Ω resistor.
Diversity antenna for LISA-U230
Common VCCline
Main antenna
Diversity antennaRF line
Tank capacitor
Common RFline
LISA-U230 diversityantenna pad
GND vias around RF lines
Common RF
antenna pad
Resistors used only for adapter testing during production
Figure 5: RF lines routing
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 16 of 26
Ground interconnection
vias
Ground vias around the RF tracks
Ground vias around the RF tracks
Ground
interconnection
vias
Ground
interconnection
vias
Ground vias around the RF tracks
Top Layer
Layer 2
Layer 3
Bottom Layer
Stack up of the board Ground vias around the RF tracks
VCC line
Common
antenna
Diversity
antenna for LISA-U2
Figure 6: Stack up of the nested design board and view of the different layers
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 17 of 26
2.5 SIM interface
The same compatible external circuit can be implemented for SARA-G3 and LISA modules: 1.8 V and 3.0 V SIM
card / IC are supported. LISA-C2 modules do not need an external SIM for Sprint and Verizon mobile operators. The LISA-C2 series SIM interface is hardware ready but the support of external SIM card / IC will be provided by
the upcoming firmware releases.
The SIM_DET pin on SARA-G3 series modules and the GPIO5 pin on LISA-U series modules provide a SIM detection function. LISA-C2 series modules do not support SIM detection. Refer to Table 7 for the availability of
this feature in the various modules.
SIM card hot insertion/removal is supported by all LISA-U2 series except LISA-U200-00S.
The SIM interface pads of SARA and LISA modules are positioned to facilitate routing in the nested design board.
2.6 Serial interfaces
2.6.1 UART interface
The same compatible external circuit can be implemented for SARA-G3 series and LISA series: 1.8 V unbalanced
asynchronous serial port with RS-232 functionality is provided on SARA-G3 modules (for AT command, data communication, MUX functionality, FW upgrade over AT), LISA-C2 modules (for AT command, data
communication, MUX functionality), LISA-U modules (for AT command, data communication, MUX functionality,
FW upgrade over AT or using the u-blox EasyFlash tool).
LISA-C2 series modules do not support DSR, DCD and DTR functions.
Table 1 and the Data Sheet relating to the module [1], [3], [4], [5] report minor differences in the internal pull-
ups and drivers strengths.
These are the default settings of the UART interfaces:
SARA-G3 series modules: automatic baud rate and frame format detection
LISA-U2 series except LISA-U200-00S modules: one-shot automatic baud rate and frame format detection
LISA-C2 series, LISA-U1 series and LISA-U200-00S modules: 115200 b/s baud rate and 8N1 frame format
For further details regarding UART interface settings and application circuits, refer to the relevant Data Sheet [1], [3], [4], [5], AT commands manual [2], [8] and System Integration Manual [6], [7], [9].
The UART pads of SARA and LISA modules are positioned to facilitate routing in the nested design board.
2.6.2 UART AUX interface
Only the SARA-G3 modules provide an auxiliary UART interface for FW upgrades using the u-blox EasyFlash tool,
and for trace log capture (debug purpose).
LISA modules do not provide auxiliary UART interface.
2.6.3 USB interface
SARA-G3 modules do not provide a USB interface.
LISA-U modules provide a High-Speed USB 2.0 interface for AT commands, data communication, FW upgrades
over AT or using the u-blox EasyFlash tool, and for trace log capture.
LISA-C2 modules provide a Full-Speed USB 2.0 interface for AT commands, data communication, FW upgrades.
In the nested design versions for LISA modules, the R200 routes the VBUS pin of the USB connector (J201) to the
VUSB_DET pad of LISA modules.
Refer to LISA series System Integration Manual [6] and [7] for suggestions about routing rules for USB_D- and
USB_D+ lines.
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 18 of 26
2.6.4 SPI interface
LISA-U modules provide an SPI interface (5-wire IPC interface for AT command, data communication, MUX
functionality, FW upgrade over AT). SARA-G3 and LISA-C2 modules do not provide an SPI interface.
Refer to LISA-U series System Integration Manual [7] for application circuits and further details.
2.6.5 DDC (I2C) interface
The same compatible external circuit can be implemented for SARA-G350 and LISA series: 1.8 V DDC (I2C bus
compatible) interface allows the communication with u-blox GNSS receivers.
SARA-G300, SARA-G310 and LISA-U200-00S modules do not support the DDC (I2C) interface.
LISA-C2 series modules will support the DDC (I2C) interface by the upcoming firmware releases.
All LISA-U2 series, except LISA-U200-00S modules, additionally support the communication with I2C slaves (other
than u-blox positioning receivers over the same DDC (I2C) interface) by means of dedicated AT commands.
Table 5 summarizes additional GPS/GNSS functionalities provided over GPIOs.
Function SARA-G350 pin name/number LISA pin name/number Comments
GPS data ready GPIO3 / pin 24 GPIO3 / pin 23 The GNSS receiver sends this interrupt to the wireless module to communicate there is data available for the DDC (I
2C) interface
GPS RTC sharing GPIO4 / pin 25 GPIO4 / pin 24 The wireless module sends this interrupt to the GNSS receiver to provide timing information
GPS supply enable GPIO2 / pin 23 GPIO2 / pin 21 This is an output of the wireless module used to enable/disable the supply of the GNSS receiver
Table 5: GPS/GNSS custom function overview over GPIOs
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 19 of 26
2.7 Audio interface
2.7.1 Analog Audio
Table 6 highlights the main characteristics and differences between the analog audio interface of LISA and SARA modules. SARA-G300 / SARA-G310, LISA-U100 / LISA-U110, LISA-U200-00S modules do not provide analog
audio interfaces.
Function SARA-G350 LISA-C2 LISA-U120/LISA-U130 LISA-U2
MIC_BIAS Supply output No bias circuit inside
Not Available Not Available Not Available
MIC_GND Reference Not Available Not Available Not Available
MIC_P Diff. signal input (+) No DC blocking capacitor inside
Diff. signal input (+) DC blocking capacitor inside
Diff. signal input (+) DC blocking capacitor inside
Not Available
MIC_N Diff. signal input (-) No DC blocking capacitor inside
Diff. signal input (-) DC blocking capacitor inside
Diff. signal input (-) DC blocking capacitor inside
Not Available
SPK_P Diff. signal out (+)
16 load
Diff. signal out (+)
32 load
Diff. signal out (+)
16 load
Not Available
SPK_N Diff. signal out (-)
16 load
Diff. signal out (-)
32 load
Diff. signal out (-)
16 load
Not Available
Table 6: Summary of analog audio pin characteristics and differences among modules supporting audio interface
2.7.1.1 Analog Audio output
In the Nested Design, the analog audio output of LISA and SARA-G350 is used to drive a speaker (Figure 7):
SARA-G350:
o SPK_P, SPK_N pads are routed as a differential pair directly to the external speaker
LISA-C2 and LISA-U1 series:
o SPK_P, SPK_N pads are routed as a differential pair by R207 and R208 resistors the external speaker
LISA-U2 series:
o I2S1_WA, I2S1_CLK pads are routed by R203 and R204 resistors towards an audio codec, which provides the conversion between digital and analog audio
o Speaker lines are routed as differential pair up to the analog output of the codec
SARA-G350
LISA-U120 / LISA-U130 / LISA-C2
LISA-U2
44SARA SPK_P
53LISA-U2 I2S1_CLK or LISA-U1/C2 SPK_P
54LISA-U2 I2S1_WA or LISA-U1/C2 SPK_N
Headset Speaker
R208
R207
Nest
ed D
esi
gn L
imit
Use
r C
ircu
it
45SARA SPK_N
APPLICATION PROCESSOR
R204
R203
CODEC
Figure 7: Analog audio output circuit in the Nested Design
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 20 of 26
2.7.1.2 Analog Audio input
In the Nested Design, the analog audio input of LISA and SARA-G350 is connected to microphone (Figure 8):
SARA-G350:
o MIC_BIAS is used to bias the microphone by means of a bridge structure created by R413, R412 and R414 resistors. The MIC_GND pad constitutes the star connection to ground for microphone lines
o MIC_P, MIC_N pads are routed as a differential pair by means of C100 and C111 capacitors to the
microphone bias circuit
LISA-C2 and LISA-U1 series:
o LDO U301 is used to bias the microphone by means of a bridge structure created by R413, R412 and R414 resistors. The R415 0 Ω resistor constitutes the star connection to ground for microphone lines
o MIC_P, MIC_N pads are routed as a differential pair by means of R209 and R210 resistors to the
microphone bias circuit
LISA-U2 series:
o I2S1_TXD, I2S1_RXD pads are routed by R205 and R206 resistors towards an audio codec, which
provides the conversion between digital and analog audio
o Microphone lines are routed as a differential pair up to the analog input of the codec, which provides
also the bias for the microphone by means of the R312 and R313 resistors circuit
SARA-G350LISA-U120 / LISA-U130 / LISA-C2
LISA-U2
49SARA MIC_P
48SARA MIC_N
40LISA-U2 I2S1_TXD LISA-U1/C2 MIC_P
39LISA-U2 I2S1_RXD LISA-U1/C2 MIC_N
IN OUT
GND
Low Noise LDO Regulator
U301
R415
R323
R412R413
C310
Forces Star
connection
VMAIN
C301
Microphone
R414
V_MIC
47SARA MIC_GND
46SARA MIC_BIAS
R209
R210
R324
C110
C111
R110
R411
R206
R205 APPLICATION PROCESSOR
Nest
ed
Desi
gn
Lim
it
Use
r C
ircu
it
CODEC
R312
R313
CODEC_BIAS
Figure 8: Analog audio input circuit in the Nested Design
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 21 of 26
2.7.2 Digital audio
2.7.2.1 First digital audio interface (I2S/PCM)
Although the pads for the digital audio interface of SARA-G350 and LISA modules are not shared on the Nested
Design application board, they are positioned to facilitate routing, as shown in Figure 9.
Digital audio interface is provided on the I2S_TXD, I2S_RXD, I2S_CLK, I2S_WA pins of SARA-G350 modules
(1.8 V, PCM & Normal I2S modes, master, fixed sample rate) and LISA-U120 / LISA-U130 and most LISA-U2
series modules (1.8 V, PCM & Normal I2S modes, master & slave, configurable sample rate). LISA-U200-00S modules do not support audio. In LISA-C2 series modules, digital audio is provided on the PCM_DO, PCM_DI,
PCM_CLK, PCM_SYNC pins (1.8 V, PCM). The same compatible external circuit can be implemented according
to external digital audio device capabilities.
SARA-G300 / SARA-G310, LISA-U100 / LISA-U110, LISA-U200-00S modules do not provide digital audio
interfaces.
LISA-U1 I2S or PCM
LISA-U2 I2S or PCMLISA-C2 PCM
SARA-G350 I2S or PCM
Figure 9: Pads for the I2S interface of LISA and SARA-G350 modules are positioned to facilitate routing
For further details regarding digital audio interface settings and application circuits, refer to the relevant Data Sheet [1], [3], [4], [5], AT commands manual [2], [8] and System Integration Manual [6], [7], [9].
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 22 of 26
2.7.2.2 Second digital audio interface (I2S1)
All LISA-U2 modules (except LISA-U200-00S) provide a second I2S interface. This interface is not available on
LISA-U1 and LISA-C2 modules, which have analog audio pins mapped there instead. On SARA-G3 modules the
second I2S interface (I2S1) is also not available.
2.7.2.3 Enabling analog audio feature on LISA-U2 series modules
Since LISA-U2 series modules supporting an audio interface do not have analog input and output, it is necessary to provide a conversion between the digital audio and the analog one. Use an external codec audio connected
to a digital audio interface of the module for this conversion, as shown in Figure 7 and Figure 8.
The DDC interface of the module can control the external audio codec. A digital clock output (CODEC_CLK pin) is provided for the external audio codec. For more details on external codec integration refer to LISA-U series
System Integration Manual [7] I2S interface application circuits.
2.8 General Purpose Input/Output (GPIO)
LISA and SARA support a different number of GPIO pins:
SARA-G3 modules support 4 GPIOs: GPIO1-GPIO4 (SARA-G350 only)
LISA-C2 modules support 5 GPIOs: GPIO1-GPIO5
LISA-U1 modules support 5 GPIOs: GPIO1-GPIO5
LISA-U2 modules support 14 GPIOs: GPIO1-GPIO14 (except LISA-U200-00S supporting GPIO1-GPIO9)
Table 7 summarizes the features provided on GPIO1-GPIO5 pins of the different modules.
The GPIO1-GPIO4 and SIM_DET/GPIO5 pads of SARA-G350 and LISA modules are positioned to ease routing
on the nested application board.
SARA-G3 LISA-U1 LISA-U2 LISA-C2
Pin Name and Functions SARA-G350 SARA-G310 SARA-G300
LISA-U1x0-00S LISA-U1x0-01S LISA-U200-00S Other LISA-U2 LISA-C200
GPIO1
General Purpose Input 16 20 20 20 20 20
General Purpose Output 16 20 20 20 20 20
Pad disabled 16 16 20 20 20 20 20
Network status indication 16 20 20 20 20
GPS supply enable 16 20 20 20
GSM Tx burst indication 16 20 20 20 20
Module status indication 20
GPIO2
General Purpose Input 22 21 21 21 21 21
General Purpose Output 22 21 21 21 21 21
Pad disabled 22 22 21 21 21 21 21
Network status indication 22 21 21 21 21
GPS supply enable 22 21 21 21
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 23 of 26
SARA-G3 LISA-U1 LISA-U2 LISA-C2
Pin Name and Functions SARA-G350 SARA-G310 SARA-G300
LISA-U1x0-00S LISA-U1x0-01S LISA-U200-00S Other LISA-U2 LISA-C200
GPIO3
General Purpose Input 24 23 23 23 23 23
General Purpose Output 24 23 23 23 23 23
Pad disabled 24 24 23 23 23 23 23
Network status indication 24 23 23 23 23
GPS supply enable 24 23 23 23
GPS data ready 24 23 23
GPIO4
General Purpose Input 25 24 24 24 24 24
General Purpose Output 25 24 24 24 24 24
Pad disabled 25 25 24 24 24 24 24
Network status indication 25 24 24 24 24
GPS supply enable 25 24 24 24
GPS RTC sharing 25 24 24
GPIO5
General Purpose Input 51 51 51 51 51
General Purpose Output 51 51 51 51 51
Pad disabled 42 51 51 51 51 51
Network status indication 51 51 51 51
SIM card detection 42 51 51 51 51
GPS supply enable 51 51 51
Module operating mode 51
SIM hot insertion/removal 51
Table 7: GPIO function compatibility among modules
In the Table 7 above, the pin number is present if the function is available on the module, and the default
settings are highlighted in bold. For more details, refer to the corresponding module Data Sheet [1], [3], [4], [5], System Integration Manual [6], [7], [9] and AT commands manual [2], [8] +UGPIOC AT command.
2.8.1 GPIOs with GPS / GNSS functionalities
When LISA or SARA modules are used with u-blox positioning chips/modules, some GPIO pins enhance the
performance of the two systems through special functions. See Table 5 and Table 7 for the GPIO special
functions for GPS/GNSS functionalities and their availability on the various series of modules.
2.9 Reserved pins (RSVD)
The RSVD pin 33 of SARA-G3 series modules must be connected to ground, as must RSVD pin 5 on LISA series modules.
2.10 Production guidelines
For more details on SARA and LISA handling and soldering on the Nested Design board, refer to the SARA-G3
series System Integration Manuals [9] and LISA series System Integration Manual [6] and [7].
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 24 of 26
2.11 Deliverable package
Five Hardware Releases (HR) are provided together with this Reference Design
1) HR_170000 SARA G350 mounting version
2) HR_1700A0 SARA-G310 or SARA-G300 mounting version
3) HR_1700B0 LISA-U200, LISA-U260 or LISA-U270 mounting version
4) HR_1700C0 LISA-U230 mounting version
5) HR_1700D0 LISA-C200 or LISA-U1x0 mounting version
It is possible to mount different modules with the same BOM, due to the hardware compatibility
between SARA-G300 / SARA-G310 modules, LISA-U200 / LISA-U260 / LISA-U270 modules, LISA-C200 /
LISA-U1 series.
The above directories contain the following subfolders:
HS_Schematic where the hardware release schematic (in PDF format) is stored. HS_Schematic is available only with release HR_170000 as it applies to all versions. The text comments inside the schematic indicate
the BOM variations for the different versions
CS_Gerber where the Gerbers for board production are stored. Gerber files are available only with HW release HR_170000, and it is the same for all HW releases
BM_BOM provide list of materials, coordinates of components and paste mask Gerber files. This is available
for all HW releases. A different stencil is needed for production because paste mask Gerber files are different for SARA and LISA versions, as described in Figure 2. BoM and component coordinates are present in the file
IP06_HW_BM_1700x0_BOM_COUNT.xls, while paste masks are present in the files:
o 07_PASTEMASK_SARA_TOP.art top paste mask for versions with SARA
o 08_PASTEMASK_LISA_TOP.art top paste mask for versions with LISA
o 09_PASTEMASK_BOTTOM.art bottom paste mask for all versions.
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 25 of 26
Related documents [1] u-blox SARA-G3 Data Sheet, Docu No GSM.G2-HW-12001
[2] u-blox AT Commands Manual, Docu No WLS-SW-11000
[3] u-blox LISA-C200 series Data Sheet, Docu No CDMA-2X-11001
[4] u-blox LISA-U1 series Data Sheet, Docu No 3G.G2-HW-10001
[5] u-blox LISA-U2 series Data Sheet, Docu No 3G.G3-HW-11004
[6] u-blox LISA-C200 & FW75-C200 System Integration Manual, Docu No CDMA-2X-11004
[7] u-blox LISA-U series System Integration Manual, Docu No 3G.G2-HW-10002
[8] u-blox C200 AT Commands Manual, Docu No CDMA-2X-11002
[9] u-blox SARA-G3 System Integration Manual Docu No GSM.G2-HW-12003
All these documents are available on our homepage (http://www.u-blox.com).
For regular updates to u-blox documentation and to receive product change notifications, register on
our homepage.
Revision history
Revision Date Name Status / Comments
- Nov. 14, 2012 ebez Initial release
1 Apr. 24, 2013 sses Updated status to Preliminary
Updated additional recommendations for VCC application circuits
Nested Design - Application Note
GSM.G2-CS-12001-1 Preliminary Page 26 of 26
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