Reducing Switching Transients from ICs in Power … Distribution System (PDS) [EXAMPLE] Steve Weir,...

Dale L. SandersX2Y Attenuators, LLC37554 Hills Tech Dr.

Farmington Hills, MI 48331

James P. MuccioliX2Y Attenuators, LLC37554 Hills Tech Dr.

Farmington Hills, MI 48331

Terry M. NorthDiamlerChrysler

800 ChryslerAuburn Hills, MI 48326

Kevin P. SlatteryIntel Corporation

JF2-54, 2111 N.E. 25th Ave.Hillsboro, OR 97124-5961

[email protected] [email protected] [email protected] [email protected]

Presented by: Dale L. Sanders

Reducing Switching Transients from ICs in Power Distribution Systems (PDS) on PCBs

04/26/05 - © X2Y Attenuators, LLC. - 10th Annual Automotive Electronics Reliability Workshop 1

mailto:[email protected]




204/26/05 - © X2Y Attenuators, LLC. - 10th Annual Automotive Electronics Reliability Workshop

Basic PDS Model – Source, Path, Receiver

Source – power supplied to PCBPath – PCB planesReceiver – ICsEnsure “clean” power

Supply instantaneous current for switching ICFilter high frequency transients Capacitors

Large value Caps – supply energyHigh Freq. Caps – Filter


What are PDS design issues?

InductanceCaps ViasComponent mounting PCB planePackage

PCB real-estate Number of caps & viasLocation/effectivenessPlacement cost Multiple power planes

Signal Integrity (SI)Number of vias (routing)Manufacturing cost (multiple plane PCBs)Functionality


Power Distribution System (PDS) [EXAMPLE]

Steve Weir, Scott McMorrow, Teraspeed® Consulting Group LLC, “High Performance FPGA Bypass Filter Networks,” DesignCon2005, Santa Clara, CA, February 2005.

http://www.x2y.com/x2y/x2y.nsf/1/HFPGA.pdf/$FILE/HFPGA.pdf


Inductance – Typical Cap Approach

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0.001 0.01 0.1 1 10 100 1000 10000

Frequency (MHz)

Impe

danc

e (o

hms)

0603 (0.1uF) X7R 16v0805 (0.1uF) X7R 16v1206 (0.1uF) X7R 50v1812 (0.1uF) X7R 50v

Smaller is better – 0603 has less inductance than 0805, 1206, 1812.To meet total capacitance requirements typically small caps increase the number of caps needed. (Package size limits number of layers.)Larger number of caps require more vias & greater distance from IC. (More PCB space)

D.L. Sanders, J.P. Muccioli, A.A. Anthony, and D.J. Anthony, “X2Y® Technology Used for Decoupling,” Published by the IEE, New EMC issues in Design: Techniques, Tools and Components Event Symposium, April 28, 2004.

http://www.x2y.com/x2y/x2y.nsf/1/051104IEE.pdf/$FILE/051104IEE.pdf


Integrated Passive Device (IPD)

X2Y® TechnologyCapacitive Circuit

Circuit 1 – 3 conductorCircuit 2 – 2 conductor

4 terminal deviceLayout attachment is inter-digitatedUnless noted, X2Y® is Circuit 2 for this presentation

IDCTM

8 terminal deviceTerminals are inter-digitated


Cap-only Performance Test Set-up

TypeVolt. Rating

(VDC) Dielectric Package

Aluminum electrolytic Capacitor 50 AL EL BAluminum electrolytic Capacitor 50 AL EL BAluminum electrolytic Capacitor 50 AL EL CAluminum electrolytic Capacitor 50 AL EL DAluminum electrolytic Capacitor 50 AL EL GAluminum electrolytic Capacitor 50 AL EL G

Tantalum Chip Capacitor 16 Tan ATantalum Chip Capacitor 16 Tan ATantalum Chip Capacitor 16 Tan ATantalum Chip Capacitor 16 Tan BTantalum Chip Capacitor 16 Tan DTantalum Chip Capacitor 16 Tan D

MLCC 10 Y5V 0603MLCC 16 Y5V 0805MLCC 10 Y5V 0805MLCC 10 Y5V 1206MLCC 6.3 X5R 1210MLCC 6.3 X5R 1812MLCC 16 X7R 0603

InterDigitated Capacitors (IDC) MLCC 10 Y5V 0612InterDigitated Capacitors (IDC) MLCC 10 X5R 0612

Reverse Aspect Ratio, MLCC (Low-inductance) 10 Y5V 0306Reverse Aspect Ratio, MLCC (Low-inductance) 10 X5R 0508Reverse Aspect Ratio, MLCC (Low-inductance) 16 X5R 0612

Rated TotalX2Y MLCC 0.47 0.94 16 X7R 1206X2Y MLCC 0.56 1.12 25 X7R 1210X2Y MLCC 0.47 0.94 63 X7R 1812X2Y MLCC 0.82 1.64 10 X7R 1206X2Y MLCC 0.82 1.64 16 X7R 1210X2Y MLCC 1.0 2.0 25 X7R 1812X2Y MLCC 5.0 10 10 Y5V 1210X2Y MLCC 6.5 13 16 Y5V 1210

DUTs

Cap. Value (uF)

10047104.72.21.0

1.01.0

0.222.21.00.1

2.21.0

10047104.7

2.21.0

10047104.7

Caps mounted to 50 ohm coplanar PCB.Shunt-through measurementsInput waveform below

Duty Cycle Frequency 50/50 100 kHz 80/20 1 MHz

10 MHz

Rise/Fall time Amplitude 1 ns 5 V 5 ns 2.2 V

Sanders, Muccioli, North, and Slattery, “ The Quantitative Measurement of the Effectiveness of Decoupling Capacitors in Controlling Switching Transients from Microprocessors,” CARTS 2005 USA, Palm Springs, CA, March 2005.

http://www.x2y.com/x2y/x2y.nsf/1/CARTSx2y.pdf/$FILE/CARTSx2y.pdf




Electrolytic & Tantalum Capacitors

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Electrolytic 1.0uF "B"Electrolytic 47.0uF "G"Tantalum 1.0uF "A"Tantalum 47.0uF "D"

80/20 duty cycle, 10 MHz, 1 ns rise/fall time, 5 V amplitude47 uF needed to “smooth” rippleMinimal HF transient suppression.






Std. MLCC, Reverse-Aspect-Ratio (LL), IDCTM , X2Y®

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MLCC 1.0uF 0603LL MLCC 1.0uF 0508IDC MLCC 1.0uF 0612X2Y 0.47uF 1206

80/20 duty cycle, 10 MHz, 1 ns rise/fall time, 5 V amplitude1 uF needed to “smooth” rippleX2Y® & IDCTM suppress HF transients.Note: X2Y total capacitance value = 0.94uFNote: Amplitude scale – order of magnitude smaller than previous slide






Additional High Frequency Test #1 – 50/50 Clock

0.4860.4870.4880.4890.49

0.4910.4920.4930.4940.4950.4960.4970.4980.499

0.50.5010.5020.5030.5040.5050.5060.5070.5080.5090.51

0.5110.5120.513

0.00E+00 5.00E-08 1.00E-07 1.50E-07 2.00E-07 2.50E-07 3.00E-07 3.50E-07 4.00E-07 4.50E-07 5.00E-07

Time (sec)

Am

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IDC 1.0uF 0612X2Y 0.56uF 1210

50/50 duty cycle, 1 GHz, 70 ps rise/fall timeNote: X2Y total capacitance value = 1.12uFNote: Amplitude scale – order of magnitude smaller than previous slide

Data courtesy of Kevin Slattery, Intel Corporation.


Additional High Frequency Test #2 - Random

0.4860.4870.4880.4890.49

0.4910.4920.4930.4940.4950.4960.4970.4980.499

0.50.5010.5020.5030.5040.5050.5060.5070.5080.5090.51

0.5110.5120.513

0.00E+00 2.00E-07 4.00E-07 6.00E-07 8.00E-07 1.00E-06 1.20E-06 1.40E-06 1.60E-06

Time (sec)

Am

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IDC 1.0uF 0612X2Y 0.56uF 1210

Random duty cycle, 1 GHz, 70 ps rise/fall timeNote: X2Y total capacitance value = 1.12uF



Insertion Loss Measurements

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s21

[Inse

rtio

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Electrolytic 1.0uF "B" Electrolytic 47uF "G" Tantalum 1.0uF "A" Tantalum 47uF "D"MLCC 1.0uF 0603 IDC MLCC 1.0uF 0612 X2Y 0.47uF 1206 X2Y 0.56uF 1210

Insertion Loss (dB) [S21] taken on Agilent ENA 5071A Network AnalyzerNote: X2Y total capacitance value = 0.94uF & 1.12uF respectively






Impedance Measurements

Impedance measurement taken on Agilent 4396B Impedance AnalyzerNote: X2Y total capacitance value = 0.94uF

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10 100 1000

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|Impe

danc

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Tant 1uF "A"IDC 1uF 0612X2Y 0.47uF 1206



What is the Performance benefit of Low-Inductive Caps?

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Impe

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(1) MLCC 0805 (0.033uF)(1) MLCC 0805 (0.047uF)(1) MLCC 0805 (0.068uF)(1) MLCC 0805 (0.1uF)(1) MLCC 0805 (0.15uF)(5) MLCC // (0.398uF total cap)(1) X2Y 1812 (0.22uF)

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]

(1) MLCC // [0805 (0.1uF)]

(2) MLCC // [0805 (0.1uF)]

(3) MLCC // [0805 (0.1uF)]

(4) MLCC // [0805 (0.1uF)]

(5) MLCC // [0805 (0.1uF)](1) X2Y 1812 (0.22uF)

Each MLCC measured individuallyTotal (5) MLCC = 0.398uFX2Y total capacitance value = 0.44uF

MLCC cumulative measuredTotal (5) MLCC = 0.5uFX2Y total capacitance value = 0.44uF

Measurements made on 50ohm Coplanar PCB with Ground Plane.

D.L. Sanders, J.P. Muccioli, A.A. Anthony, and D.J. Anthony, “X2Y® Technology Used for Decoupling,” Published by the IEE, New EMC issues in Design: Techniques, Tools and Components Event Symposium, April 28, 2004.

http://www.x2y.com/x2y/x2y.nsf/1/051104IEE.pdf/$FILE/051104IEE.pdf


Power Distribution System (PDS) [EXAMPLE]




How to Take Advantage of Low-Inductance Caps?

Lower Via/mounting InductanceMultiple parallel viasMutual inductance cancellation between viasReduce trace length from cap to via

Spreading InductanceFewer low-inductance caps are required, therefore caps can be located closer to ICs.




What Does Low-Inductance Caps Do for PDS?

9-14

11-15

Std. MLCC vs. X2Y® on Xilinx FPGA PCB.Steve Weir, Scott McMorrow, Teraspeed® Consulting Group LLC, “High Performance FPGA Bypass Filter Networks,” DesignCon2005, Santa Clara, CA, February 2005.



Xilinx FPGA PDS Result




Multi-Plane PDS Decoupling

Decoupling multiple power planes on PCB increases the number of standard caps needed.


Multi-Plane Test Fixture Insertion Loss

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PC

B F

ixtu

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03 1

00nF

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s11s12s13s14s21s22s23s24s31s32s33s34s41s42s43s44


X2Y® Circuit 1 --- Multi-Plane Decoupling

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0.00E+00 5.00E-08 1.00E-07 1.50E-07 2.00E-07 2.50E-07 3.00E-07 3.50E-07 4.00E-07

Time (sec)

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Ch 1 InputCh 2 Input

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Ch 1 X2YCh 2 X2Y


X2Y® Circuit 1 - Multi-Plane Decoupling (crosstalk)

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Time (sec)

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Ch 1 X2YCh 2 X2YCrosstalk BoardCrosstalk X2Y


Conclusion

IPDs are the foremost capacitor technology that can supply the instantaneous current needs and HF transient filtering for ICs.NEMI Roadmap shows IPDs offer cost advantages to OEMs by 2005.BOM considerations for IPDs

Fewer viasFewer solder jointsSaves PCB space

Allows for smaller, more dense designsMore room for signal routingFunctionality – plane integrity

IPDs are the future for decoupling

Questions? Please Contact:X2Y Attenuators, LLC37554 Hills Tech Dr.Farmington Hills, MI [email protected]

04/26/05 - © X2Y Attenuators, LLC. - 10th Annual Automotive Electronics Reliability Workshop 24

Resources• Sanders, Muccioli, North, and Slattery, “ The Quantitative Measurement of the Effectiveness of Decoupling

Capacitors in Controlling Switching Transients from Microprocessors,” CARTS 2005 USA, Palm Springs, CA, March 2005.

• Steve Weir, Scott McMorrow, Teraspeed® Consulting Group LLC, “High Performance FPGA Bypass Filter Networks,” DesignCon 2005, Santa Clara, CA, February 2005.

• D.L. Sanders, J.P. Muccioli, A.A. Anthony, and D.J. Anthony, “X2Y® Technology Used for Decoupling,”Published by the IEE, New EMC issues in Design: Techniques, Tools and Components Event Symposium, April 28, 2004.

• Steve Wier, “ Considerations for Capacitor Selection in FPGA Designs,” CARTS 2005 USA, Palm Springs, CA, March 2005.

• Joseph Dougherty, John Galvagni, Larry Marcanti, Rob Sheffield, Peter Sandborn, and Richard Ulrich, “The NEMI Roadmap: Integrated Passives Technology and Economics,” CARTS 2003, Scottsdale, AZ, April 2003.

• Steve Weir, Teraspeed® Consulting Group LLC, "Does position matter? Locating bypass capacitors for effective power distribution and EMC control", Santa Clara Valley Chapter of the IEEE-EMC Society, January 2005.







http://www.x2y.com/x2y/x2y.nsf/1/FPGAw.pdf/$FILE/FPGAw.pdf

http://www.teraspeed.com/papers/capacitor_placement_public.pdf



Reducing Switching Transients from ICs in Power … Distribution System (PDS) [EXAMPLE] Steve Weir,...

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