RD 51 December mini week 2015 Resistive protections Rui de Oliveira 09/12/15 1.
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![Page 1: RD 51 December mini week 2015 Resistive protections Rui de Oliveira 09/12/15 1.](https://reader036.fdocuments.net/reader036/viewer/2022062500/5697bfde1a28abf838cb2435/html5/thumbnails/1.jpg)
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RD 51 December mini week 2015
Resistive protectionsRui de Oliveira
09/12/15
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outline
• Resistive protection in Micromegas• Resistive protection with well
detectors• Resistive MSGC development status• Conclusion
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Surface or embedded resistorfor low or High rate applications
2 layers with one embeddedSurface resistor
-The thickness above the pad is similar in both structures
-Around 50 to 75um to minimize the signal loss
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Surface protection
• Smaller signals by 10-20% related to insulator thickness• Gives the possibility to ground the mesh or the drift• Resistive lines are connected together
Resistive lines(see Silvia Franchino &… study)
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PCB
PCB
PCB
PCB
PCB
Photolithography
PCB
PCB
PCB
Possibility to go down to 0.1mm pitch
Screen printing
Resistive strips production :
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Semi automatic machine20 boards/hour Printing area 1.5m x 0.9m
Full automatic line also available. On going study.Many hundred foils/hourpossible rate
Subcontracted to the company Charbonney nearCERN
Screen printing :
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• Picture : 2m x 1m x 0.5 mm read-out board with pillars in 4 parts
• 10 mm thick Aluminum honeycomb
• Max size for 1 PCB : 2.2m x 0.6m
Maximum sizes
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PCB
PCB
PCB
Resistive layer for mass production :
Screen printed or vacuum deposited resistors (KOBE style) on a Kapton foil
Bare STD read-out PCB
Thin solid cast Glue (12um)
High pressure, High tempgluing
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Embedded resistor with LAPP
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Production steps
Bare PCB
Coverlay gluing + via fill
Inner resistor printing
Coverlay gluing + via fill+top resistive layer print
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Production steps
Bare PCB
Coverlay gluing + via fill
Inner resistor printing
Coverlay gluing + via fill+top resistive layer print
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Production steps
Bare PCB
Coverlay gluing + via fill
Inner resistor printing
Coverlay gluing + via fill+top resistive layer print
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Production steps
Bare PCB
Coverlay gluing + via fill
Inner resistor printing
Coverlay gluing + via fill+top resistive layer print
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Shapes and values for embedded resistorR1 Detectors for the LAPP
Real values: 40 to 60 KOhms with 10KΩ/Sq400 to 750 KOhms With 100KΩ/Sq
Real values: 400 KOhms with 10KΩ/Sq4 MOhms With 100KΩ/Sq
Real values: 4 MOhms with 10KΩ/Sq40 MOhms With 100KΩ/Sq
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Results with embedded resistors in Micromegas
• Results are corresponding to expectations
• Up to 11 mega events per cm2 with good linearity (rate VS current) have been measured
• For deeper details please contact Maxime Chefdeville at LAPP.
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outline
• Resistive protection in Micromegas• Resistive protection with Well
detectors• Resistive MSGC development status• Conclusion
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Well detectors• Introduced by Ronaldo Bellazini in 1997 • Simple and accurate structure• Single stage amplification• More robust than MSGC• But suffering anyway from spark Bottom lines Top electrode
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Embedded resistors in well structure
High rate
Medium rate
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Process medium rate
Bottom resistive DLC deposition on 50um Kapton
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Glue to read-out board
Process medium rate
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Top layer patterning + kapton etching
Process medium rate
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Process high rate
Bottom resistive deposition
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Bottom coverlay + via fill + second resistive layer print
Process high rate
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Strip or pad flex gluing + via fill
Process high rate
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Rigidizer gluing if needed
Process high rate
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Top layer patterning + kapton etching
Process high rate
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Problems in first high rate production
-due to the multiple gluing steps and the high value targeted (80Mohm/square) the first resistive layer value increased in a non controllable way
-after many test we have discover that the 1MOHMS/square paste is polluted by the glue
-new samples are planned , we will use DLC resistor for the fist layer. The Second one will be screen printed with 100Kohms paste
-For preliminary results please contact Giovanni Bencivenni
Layer 1
Layer 2
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outline
• Resistive protection in Micromegas• Resistive protection with well
detectors• Resistive MSGC development status• Conclusion
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MSGC
No introduction needed
We are still investigating this device because it is still one of the simplest
existing MPGD
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MSGC production with PCB technologies
• We have produced many samples with PCB technologies and materials
• They work as expected:– Good gain– Good energy resolution– They suffer from spark damages– They charge up– They show polarization effects
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First improvement
-We have change the material of the cathode electrode. From metal we went to 100Kohms/square paste
-This modification solved the spark problem
-But we were still suffering from charging up and polarization
-Looking in literature we have found a lot of papers dealing with this problem and giving solutions ,one of them was to deposit a thin resistive high value layer over the full structure
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After resistive deposition
-We have subcontracted resistive Vacuum deposition in 2 institutes .
-We have discovered that one of them already did in the past the deposition on Glass MSCG mentioned in literature
-We have asked for 4 different resistive value depositions on 20 small pieces from 10^12 to 10^15 ohms/square
-After this coating 2 situations appeared : high values do not improve the behavior low values are showing the expected effect but totally degrading the device at the same time
-None of the suppliers were ready to guaranty their resistive value
-Due to the last statement this direction is abandoned (still ALD deposition could be investigated but completely out of our budget)
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New direction:remove material between electrodes where
charges are attaching
Type 1 etching the substrate
Type 2 etching the substrateAdding an electrode
Type 3Removing top electrode
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New direction:remove material between electrodes where
charges are attaching
Type 1 etching the substrate
Type 2 etching the substrateAdding an electrode
Type 3Removing top electrode
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New direction:remove material between electrodes where
charges are attaching
Type 1 etching the substrate
Type 2 etching the substrateAdding an electrode
Type 3Removing top electrode
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Micro gap
• Even more simple than MSGC• We are now producing some micro-
gap structures• This time we will study first that the
charging up and polarization effects are as expected negligible by construction .
• We will then introduce the resistive layer for spark protection
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Micro gap pad prototype layout
1cm x 1cm pad structure 4 pads structure
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Micro gap production
• We expect some samples in the coming weeks
• STD qualification test will be then performed– Gain– Energy resolution– Rate– Stability in time and rate
• If OK we will produce a resistive version
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Conclusion
• We know 2 ways of resistor deposition
• We have applied them to Micro megas , R-Well and THGEM successfully
• We are trying to apply it to Micro Gap detectors
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Thank you