ProSurf-UK July 4 2008€¦ · excel in the global market by implementing these developments and...

ProSurf activities by EIPC- Michael Weinhold 3rd Annual Conference. Friday, July 4th 2008 At Henry Ford College, Loughborough University (www.fordcollege.ac.uk)

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ProSurf EIPC dissemination and contribution 2008

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EIPC Technology update

Jisso European Council

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Future Trends of PCBs in Europe

How does the Printed Circuit Board industry need to adapt?

Presentation at the

3rd Annual Conference Friday, July 4th 2008

At Henry Ford College, Loughborough University (www.fordcollege.ac.uk)

Michael Weinhold EIPC Technical Director

European Institute of Printed Circuits

Keynote

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EIPC ProSurf Technology update 3rd Annual Conference Friday, July 4th 2008 ProSurf 2008

Keynote Presenter support for the ProSurf Project

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Presentation overview

Welcome and Introduction Background on EIPC and the Roadmap Process Program review to focus on key items

How will Europe fit in the global market

The rigid PCB roadmap and its support by the EU Technology drivers

How will flexible PCBs develop Will printed electronics impacting the OEM developments

Summary

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ProSurf: The EU support for the PCB industry

Guide manufacturing, process, material, equipment, and product research and development in order to establish and maintain leadership in electronic interconnection technology; integrate

the development of new and innovative solutions with partners in the electronics industry, academia, and government; and

excel in the global market by implementing these developments and continuously improving customer satisfaction.

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Focus on Small and Medium Enterprises (SME) in the field of Electronics


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Under the EU regulation in 2008 492 Million habitants

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The PCB fabricators market in Europe

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EIPC ProSurf Technology update 3rd Annual Conference Friday, July 4th 2008 ProSurf 2008 7

The importance of the PCB industry in the SME field in Europe

• About 400 companies producing PCBs

• 23000 people employed

• Most companies classify for “SME”

Data source: M.Gasch / VdL

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The PCB Market in Europe

The PCB market in the EU in not regarded as a fast growing market

The fabrication cost for large series are very high in Europe compared to Asia (China)

Design and developments are conducted in the EU Sample jobs and pre-production orders are manufactured in

Europe For how long? At what cost?

New technologies have to be introduced in Europe to gain or maintain technology leadership A large number of technologies and equipment is still developed in Europe

Get into a leading position when writing new standards


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WECC and IEC Standards meeting in Tokyo June, 2008

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Activities in gaining knowledge

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CPCA show and Electronic Circuit World Convention in Shanghai March 2008

New PCB fabrication

technology MUST have (get) global

acceptance


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JISSO International Council Affiliations

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JISSO to harmonize Electronics Road Maps JISSO Level Structure

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The EIPC Web Site dedicated to the PCB technology in Europe

Provide easy access Allow for fast market update

and follow up

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12 layer

ML

4.25 14 layer

ML

5.25

8 layer ML 3.00 10 layer ML 3.50

4 layer ML 1.75 6 layer

ML

2.25

Single Sided 0.67 Double sided 1.0

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Manufacturing Equipment Traditional – Little significant change EP manufacturing Testing, Cure ovens, Trim Laser technology across processes Operating environment is a factor Manufacturing Processes Traditional through hole HDI with a focus on parallel technology Surface finishes still a problem Flatness (Bow & Twist) ?? W/ LF temp EP processes (Developing) Photonic processes (Conceptual) Standards PWB – Continuous review and update PWB – Embedded passive and active components Opto – Emerging (IPC/JPCA)

Benchmark

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Current state of Substrate Technology

Product Boards

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New state of Substrate Technology

Embedding technology to improve reliability and to reduce cost

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Imaging capabilities for miniaturization

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LDI Resist used at 405 nm wave length


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New Packages and Printed Circuits

CTE of Silicon 3 ppm/°C

CTE of Silicon ≈ 3 ppm/°C CTE of FR4 PWB ≥ 17 ppm/°C CTE of RCF > 60 ppm/°C CTE of new RCF ≥ 20-30 ppm/°C CTE of Aramid ≈ 9-12 ppm/°C

Large CTE ∆ to Silicon large risk

Component package miniaturization is driving the PWB industry

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Opportunity for different surface finishes

OSP

63%

HASL

26%

Ag

6%

Sn

5%

Focusing on surfaces that are lead free soldering compatible using Nano technologies based on organic metals


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IONMET Silver CoatingProject

Silver as a surface finish for PCB is used in niche application in Europe

Existing technology does not provide a cost or environmental challenge

New immersion Silver coatings are based on Nano-Technology offer advantages (Avoid Ag migration and visibility in the

intermetallic layer) The EIPC sees the Ionic liquid technology as an innovative way of

manufacturing PCBs more cost-effective and with less impact on the environment. Ionic liquid Ag coating of PCBs would only result in a “Me too” product

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Solder-Finishes Advantages Disadvantages

OSP • Good planar surface • Most inexpensive finish • No intermetallics formed before use • Strongest solder joints • Does not stain gold tabs • 30 years history of usage

• Very narrow process window for multi-pass assembly • Difficult getting adequate hole fill • � Probing and grounding issues through Copper oxides • � Handling concerns – etch finger prints in Copper • � Shortest shelf life • �Can’t detect soldermask residue on Cu • �Incomplete pad wetting

Thick OSP • Good planar surface • Inexpensive finish • No intermetallics formed before assembly • Strongest solder joints • Withstand multiple reflow step

• Narrow process window for multiple passes • Some thick coatings deposit film on gold • Some thick coatings stain gold • Difficult getting adequate hole fill • Probing and grounding issues through hard OSP after assembly • Handling concerns • Can’t detect soldermask residue on Cu • Incomplete pad wetting

Imm Silver

• Excellent Solderability • Wets faster than OSP • Consistent flat surface for SMT • Good initial electrical probe surface • Withstands multiple process steps • No holes plugged • Visual inspect if silver has deposited on pads • Visually see tarnish • Compatible with Lead-free processes

• � Not available from all suppliers • �Multiple board finishes difficult • �Long term use as electrical contact unknown • �Long term storage issues unknown • �2 years production use - possible • unknowns as a board finish • � Possible compatibility problem with via plug • UL-796 Issue for some applications

Nano Finish Based on Organic Metal

• Excellent Solderability • Allow for multiple soldering processes comparable or better

than metallic finishes • Wets faster than OSP • Lighter color than Cu, no discoloration during reflow

(automated visual control possible) • Consistent flat surface for SMT • Good initial electrical probe surface • Withstands multiple process steps e.g. cleaning • No holes plugged • Visually see tarnish • Compatible with Lead-free processes

• � Not available from all suppliers • �Multiple board finishes difficult • �Long term use as electrical contact unknown • �Long term storage issues unknown • One years production use - possible • unknowns as a board finish

Desirable Finish Characteristics

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Future Surfaces finishes for PCBs

Application Today Future

Mobile Phones OSP/ENIG Nano Finish

Automotive Sn/Ag/OSP/HASL Nano Finish

Telecom Base Station

Sn / Ag Nano Finish

Industrial Electronics

HASL/Sn/Ag Nano Finish

Military HASL/ENIG Nano Finish

Consumer Electronics

OSP/Ag Nano Finish

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1 cm 3 cm²/g

1 µm 3 m²/g

10 nm 300 m²/g

Source: Ormecon Dr. Weßling

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Surface ENIG versus Nano-Finish

Separation crack in NiP layer in ENIG surface after reflow soldering

Reliable intermetalic phase after reflow after soldering (modern Nano finish)

Reflow solder connection

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PCB made with in Additive technology

PCB made in full additive technology using permanent additive resists (PAR) technology. Minimum in-process waste and high yields even recycle of defect PCBs during plating was possible.

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Copper de-solution with Lead Free solder that contains Ag

Plated copper at the center of the holes Plated copper = 16 – 18 µm HAL-Sn about = 10 µm

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Example: Automotive – Airbag Control Unit (Chart 1)


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Example: Automotive – Airbag Control Unit (Chart 2)

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Example: Automotive - Engine Control unit (Chart 1)


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Example: Automotive - Engine Control unit (Chart 2)

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Technologie Minimum Line width (µm)

Class Current 2007 – 2010

Medium Term 2011 – 2014

Long Term 2014 - 2017

Single Sided PCBs IS 100 100 100

LE 75 75 75

Double Sided PCBs IS 50 40 40 LE 30 25 25

Multilayer PCBs IS 50 50 40 LE 20 15 15

Build-up PCB Core Layers

IS 50 30 25 LE 20 15 10

Build-up PCB Build-up Layers

IS 50 30 25 LE 20 15 10

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Rigid PCB Roadmap for Minimum Line Width


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Technologie Minimum Via Hole Diameter (µm)

Class Current 2007 – 2010

Medium Term 2011 – 2014

Long Term 2014 - 2017

Single Sided PCBs IS 400 300 300

LE 350 300 250

Double Sided PCBs IS 150 150 100 LE 75 75 75

Multilayer PCBs IS 150 125 125 LE 60 50 50

Build-up PCB Core Layers

IS 100 100 100 LE 50 30 20

Build-up PCB Build-up Layers

IS 75 50 30 LE 50 30 30

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Rigid PCB Roadmap for Minimum Via Hole Diameter

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Manufacturing Capability - Imaging - Photo-tool Requirements


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The developments of flexible PCBs

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HDI Semi-Flex Concept

Drivers for Rigid-Flex technology Modularity

Miniaturisaton One of the main drivers for Rigid Flex technology is the 3D

assembly

Clearly more than 60% used for flex to install applications


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HDI Semi-Flex Design Freedom of the design

HDI PCB build-ups Multiple flex areas can be designed Flex layers can be designed for both

sides Flex areas can be designed fully free, to

any direction

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Flexible Circuit Interconnect

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Cannon Digital Camera

Laser Profiling by LPKF


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Printed Electronics made in 1980

Single Sided PCB with drilled holes and Printed Through Holes for electrical connection

Single Sided PCB with Printed Circuit pattern (made with Ag paste) on second side. Printed Through Holes for electrical connection

PCB for Automotive Radio application

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International Council

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Printed Electronics made in 2006

Inkjet Printing technology are using Nano particle technology

Line width of 50µm have been achieved by using Inkjet technology

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International Council


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What is needed to continue PCB Production in Europe

Faster realization of new projects Time to market

Environmental safe PCB fabrication processes Lead free REACh

Lower cost fabrication technology To maintain competitive advantages versus non EU

fabricators New PCB Fabrication Technology with the

capabilities to drive this innovation and lower unit cost

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How will NEW Project help to meet innovation objective

Example: The chemistry developed under EU Project

“IONMET”: Is environmental safe Works in a close to neutral pH Easy waste water and waste treatment Can be recycled Suitable for electroless metal deposition processes Provide an option to develop additive fabrication

processes using Permanent Additive Resists (PAR) or no resist


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Program items and future activities

Provide a focused activity program to the PCB industry to meet the objectives of: Innovative and fast Cost-effective Environmental safe Suitable for the next generations of PCBs

Get partners that will support and benefit from the the technologies that are developed with the support of the EU funding like IONMET to meet future needs

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Free copy of the EU ProSurf sponsored PCB road map


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Summary and outlook

The European industry has a large opportunity to receive EU funds for R&D activities

The Industry and the academia world should partner on meaningful programs that will help Europe to maintain or expand industrial leadership

The EIPC and its member companies are in a position to help defining meaningful projects and finding partners for cooperation

It is important that the projects are professionally managed by using the “Cluster Management Technology”

Measurable results have to be achieved

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ProSurf-UK July 4 2008€¦ · excel in the global market by implementing these developments and...

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