Product development in micro and nano...

MANUFACTURINGENGINEERING ANDMANAGEMENT

TECHNICAL UNIVERSITY OF DENMARK

Product development in micro and nanomanufacturing

Leo Alting and Hans Nørgaard HansenTechnical University of Denmark



Department of Manufacturing Engineering and Management (IPL)

MPT PVL IOB

Materials and

Process Technology

Industrial Management

Innovation and

Sustainability

Micro/Nano Manufacturing

Modelling and Simulation



Basic research Develpm.Applied research

Indu

stry

invo

lvem

ent

Production systems

Process development

Material development

Product development

Them

es

Research programme ”Micro/Nano Manufacturing”



Research programme ”Micro/Nano Manufacturing”

IPL

DTU Other researchinstitutes

Foreign universities

Industrial companies

PR

OJE

CT

S

• Micro electronics centre• Mechanical engineering• Polymer centre• Optics and communication

• RISØ national lab.• Technol. Institute

• MIT• Univ. Stuttgart• Univ. Karlsruhe• Cranfield

• Danfoss• Grundfos• Bang & Olufsen• Novo Nordisk• Radiometer

• Coloplast• Nunc• Oticon• PINOL• A series of other SMEs

GO

AL

:50

-100

MD

KK

ove

r a

5 ye

ars

per

iod

(6-1

2 M

US

D)



Small dimensions

© QFM ERLANGEN 2002

macromechanic micromechanic nanotechnology1 m 100 mm 10 mm 1 mm 100 µm 10 µm 1 µm 100 nm 10 nm 1 nm 0,1 nm

microdrive 42 mm x 30 mm parts < 1 mm (IBM)

singlepart(FZK)

micro motor(FhG IZM)rotor diameter 320? m

linear actuator (FZK)min. lateral dimension 1? m

28 CO-molecules on a platinum surface„Molecule Man“ (IBM)

stents (FZK) grid thickness < 50? m

flat screen (IFW)nanotubes ? 100nm carbon tube (IFW)

? 1nm



Productdevelopment Production Product

Micro Product

DimensionsFunctionalityIntegration

Product/components

”Micro Engineering”

Characteristics of a micro product



Micro products / Microsystems / MEMS

Dimensions

mm? mnm

Precision EngineeringMicro and Nano Technology

• Physics• Optics• Silicon

• Materials technology• Process technology• Production systems

Micro/NanoManufacturing

IntegrationCross-disciplinary problems

Industrial productionAssembly/packaging



Analysis

Mainfunction

Sub-functionand means

Principlestructure

Quantitativestructure

Total form Form ofelements

Product development in the ”macro world”

Functionality

Specifications

Tolerances



SYSTEM

DEVICE

PHYSICAL

PROCESS

Ver

ifica

tion

Sim

ulat

ion

Micro system development

Iterative process



Considerations in product development

DESIGN

Productdevelopment

Materialdevelopment

Processdevelopment

DO

Production

QA Metrology

AssemblyHandling

USE

Functionality

Marketdemand

Technologicalpossibilities



Materials for micro products

X

SiliconUS

E IN

MIC

RO

PP

RO

DU

CTS

LOW

HIGH

MEDIUM X

X

X

X

XPolymers Metals Ceramics

Thin films

Products

Thin films

Products



Microsystem Technologies(MST)


Microengineering Technologies(MET)

Microengineering Technologies(MET)

MEMS processesMEMS processes Energy assistedprocesses

Energy assistedprocesses

Mechanicalprocesses

Mechanicalprocesses

Replicationtechniques

Replicationtechniques

Handling, assembly, quality control etc.Handling, assembly, quality control etc.

Micro ProductMicro Product

Tec

hn

olo

gie

sTechnologies for micro manufacturing



SIZE OFCRITICALPRODUCT FEATURE DOWN SCALING

UP SCALING

Manufacturing of micro components and products

NEW PROCESSES AND COMBINATIONS OF PROCESSES



Precision Engineering Technologies

Precision Engineering Technologies



The development of technologies is based on twoapproaches

Product driven approachDesign products to:• Meet customer needs • Set up cost efficient production • Integrate handling and assembly

into products

Technology driven approach• How to apply materials,

processes and production technologies to manufacture products?

DESIGN MATERIAL PROCESSING PARTS /COMPONENTS ASSEMBLY PRODUCT

SPECIFICA-TIONS

CONTROLMEASUREMENT



Known technology Trends

Existing products Known, newproducts

Market strategiesProduct strategies

Technologypush

Marketpull

Shortterm

Medium term

Longterm

Drivers of product development

???



Challenges when developing and designing microproducts

• Interdisciplinarity (scientific fields, higher degree of integration)

• Standard construction elements not available

• Modularisation

• Focus on device level – less focus on system level

• System/product level– Assembly (hetero integration)– Packaging (connections with macro world, encapsulation)

• Coupled/decoupled design

• Alternative materials and new combinations of materials



Master Mouldinsert Mould Injectionmoulding

Component

• Definition and specificationof geometry

• Lithographyand etching

• Gold layer• Electroforming• Separation of

master and insert

• Mechanicalpreparationof insert

• Fabricationof mould

• Materials• Process

parameters• Replication

quality

Typical proces chain for micro injection moulding

Si

Base for electrochemical deposition

Photo resist

Metal deposition

SiO 2



Micro injection moulding of optical nanoatructures

• Sinosoidal surface(wavelength 700 nm, amplitude 500 nm)

• Replication quality– AFM – SEM– Optical techniques

-525

-25

475

975

1475

1975

-1000 -500 0 500 1000 1500

Tools insert (SEM)

Expected part geometry

Measured part geometry(AFM)



TOOLPLASTIC PART

Replication quality



Silicon dissolved in KOH

Adhesion layers (Metallic PVD coating)Oxide layer

Silicion

Photoresist Electroplated Ni

Nikkel support

Metallic cantilever – what can we achieve usingelectroforming?



An integrated solution: support, tip and cantilever in oneconstruction element

CantileverCantileverTipTipSupportSupport

– Cantilever• thickness = 7 µm• length = 200 µm• width = 30 µm

– Tip• Pyramid height = 10 µm

– Support

• thickness = 97 µm

–– CantileverCantilever•• thicknessthickness = 7 µm= 7 µm•• lengthlength = 200 µm= 200 µm•• widthwidth = 30 µm= 30 µm

–– TipTip•• PyramidPyramid heightheight = 10 µm= 10 µm

–– SupportSupport

•• thicknessthickness = 97 µm= 97 µm



Atomic Force Microscopy

10 µm

Detector

Laser

Cantilever

Tip Sapmle



Local clean room facilities at IPL



Micro/Nano Manufacturing – on the road to sustainability

• Life Cycle Assessment (LCA) Tools– IPU/IPL has developed the EDIP methodology– New LCA Center (data, software, dissemination)– Broadly internationally accepted

• Micro/Nano Manufacturing– Design rules (CAD based)– Database (tox, ecotox)– LCA software

• LCA will be an integrated part of our program• One of the difficulties in recycling is the integration of different

materials in products



Concluding remarks

• Micro manufacturing is characterized by complex process chains• Many scientific disciplines involved• Need for both a product driven and a technology driven

approach:– In the product driven approach methodologies and principles

in design of micro and nano products must be developed– In the technology driven approach a continuous development

of materials and processes is promoted supporting the new design principles

Product development in micro and nano...

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