Printed Sensors in Packaging

Oliver BrandSchool of Electrical and Computer Engineering

Georgia Institute of TechnologyAtlanta, GA 30332-0250

E-mail: oliver.brand@ece.gatech.edu

IPST Executive Conference, March 9-10, 2011, Atlanta, GA

Outline

Introduction to Sensors Sensors & Electronics in Packaging

Time-Temperature Indicators Chemical Sensors RFID Tags

Georgia Tech Capabilities for Smart Packaging Micro/Nanofabrication and MEMS Sensor, Circuitry and RFID Capabilities

Summary

IPST Executive Conference, March 9-10, 2011, Atlanta, GA

Sensors are NOT new ….

Paper-Ribbon HygrometerVincenzo VivianiSecond half 17th century

Hair HygrometerHorace-Benedict de SaussureLate 18th century

AnemometerFirst half 19th century

Magnetic CompassMichael Butterfield17th century

Source: Institute and Museum of the History of Science, Florence, Italy

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…. but they have changed!

LEGO MindStorm

OregonScientificWeatherStation

TissotT-touch

VictorinoxAltimeter

AppleiPhone 4

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Smart/Intelligent Packaging

Benefits of Smart Packaging Brand protection & anti-counterfeiting Quality & safety Brand enhancement Display and stick out Communicate Track & trace Supply chain efficiencies Tamper evidence & resistance

Source: VTT Center for Printed Intelligence

StoraEnso Pharma DDSi Package

To-Genkyo Freshness Label

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How to Manufacture?Printed Intelligence

Use of large substrate (roll-to-roll) printing techniques

Solution-printable materials include conductive/semi-conductive polymers, nano-particle materials & chem/bio-active materials

Hot embossing, lamination, laser processing, thermal processing, etc., can be added as needed

Incorporation of classical silicon-based electronics (e.g. RFID tags) into packaging is possible S

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Source: Dimatix

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Time-Temperature Indicators (TTI) TTI monitor temperature history

by providing signal proportional to temperature “integral” over time

Output signal is color change Labels are activated at desired

time point Combination with RFID allows

to log temperature history Examples include OnVu™ TTI

(BASF), CheckPoint® (VITSAB), Food Sentinel System™ (SIRA), and MonitorMark™ (3M)

CheckPoint®Label

Food Sentinel System™ Label

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OnVu™ TTI

Based on organic pigments that change color with time with rate affected by temperature

Activation by UV light (UV filter is added afterwards)

TTI can be applied as label or printed directly on package

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RFID-Enabled TTIKSW Microtec VarioSens® Data Logger

RFID tag with temperature logging capabilities

Monitoring temperature-sensitive goods, e.g. pharmaceuticals and other medical products

Logging capability requires Si-based circuitry with memory (8kBit EEPROM), antenna and battery (MnO2-Zn printed battery)

Can such a system be fully printed in the future?

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RFID-Enabled Tamper ProtectionSecurePak by CYPAK

Printed resistive loops on package to detect damage to package

Printed sealing sensor (open/close)

Tamper events stored in ASIC with timestamp

CYPAK RFID technology to retrieve data

Source: CYPAK, http://www.cypak.com/

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From TT-Indicators to(Bio)Chemical Sensors

Time-temperature indicators and T-loggers can provide valuable information on the cold chain of perishables

However, temperature sensors still provide no direct indication on the status of perishables

This requires sensors beyond temperature sensors, in particular bio(chemical) sensors to monitor e.g. O2 content in package or chemical/biological food spoilage markers (or food freshness, ripeness)

ripeSense® Label

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(Bio)Chemical Sensors in Packaging

What can be sensed besides oxygen penetration into package? Ammonia release by meat (e.g. Freshness Label by To-Genkyo) Printed biosensors (based on chimeric avidin) targeting detection of

small molecules or even bacteria/viruses (e.g. VTT BioFace project)

Many more analytes can be targeted with proper surface functionalization

To-GenkyoFreshness Label

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So, where do we stand today? We have in Smart Packaging

Printed barcodes Printed time-temperature indicators Chemical sensor labels (a few) RFID technology (capable but still expensive)

What is missing? More applications of micro/nanotechnology in packaging to

increase functionality without adding much cost Mechanical structures (drop/shock sensors), (bio)chemical sensor arrays

Interdisciplinary research efforts to apply above technologies to packaging Move from devices to SYSTEMS

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How can Georgia Tech Innovate inSmart Packaging Development?

In addition to IPST, Georgia Tech has widely acknowledged core strengths in Micro & Nanoelectronics

(Nanotechnology Research Center, www.nrc.gatech.edu)

MEMS (Center for MEMS and Microsystem Technologies, www.cmmt.gatech.edu)

Organic Electronics/Photonics (Center for Organic Photonics and Electronics, www.cope.gatech.edu)

Georgia Tech actively promotes interdisciplinary research activities

Georgia Tech Marcus Nanotechnology Building

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What are MEMS?MEMS – Micro Electro Mechanical Systems

Use integrated circuit (IC) fabrication steps in combination with micromachining steps to fabricate miniaturized electro-mechanical components

Applied to batch fabricate microsensors, acting as “senses of electronic systems”

Current key applications: Hard disk read/write heads Inkjet nozzles Pressure sensors Accelerometers & Gyroscopes

Advantage: High volume & low cost, added functionality, circuitry integration

MEMS Market: $ 7 Billion in 2009 (Source: Yole Development)

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Accelerometers

Simple spring/mass systems with inertial mass suspended by spring system; sensed is mass deflection upon acceleration

Applications Automotive, e.g. air bag

triggering Consumer, e.g. cell phone,

game controllers Medical, e.g. pace makers

Cost in high-volume applications: <$1 per sensor

Analog DevicesADXL 202

Nintendo WiiRemote

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Bio(Chemical) Sensors

Miniaturized bio(chemical) sensors are widely investigated using MEMS (microelectro-mechanical systems) and nanotechnology processes

Microsensors based on electro-chemical, thermal, mechanical and optical techniques probe chemical (in gas and liquid) and biological analytes

Polymers and printing techniques play an ever increasing role Source: K. Suslick, UIUC

Source: A. Majumdar, UC Berkeley

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Mass-Sensitive VOC Sensors400 µm

f0 = 368 kHz∆fmin ≈ 0.1 Hz

K.S. Demirci, O. Brand et al., Transducers 2011

PIB + Toluene Resonant micro-scale

weighing analyte molecules absorbed into polymer coating

Sub-pg mass resolution enables gas-phase detection of volatile organics in low ppm range

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How are MEMS related toSmart/Intelligent Packaging?

While traditionally mainly applied to silicon, MEMS technologies using polymers (or paper) and based on printing have been demonstrated

MEMS technologies applied to paper and polymers enable new functionalities through use of mechanical elements and micro-channels Paper-based sensors & microfluidics

G. Whitesides et al., Harvard University

Polymer-based biosensorsA. Boisen et al., DTU, Denmark

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Polymer MicromachiningProf. Paul Kohl, ChBE, Georgia Tech

Polymer-MEMS requires formation of micromechanical structures with polymers

Example: Thermal decomposition of sacrificial polymer (Unity) through polymer overcoat (Avatrel)

Application: encapsulation/protection, channels/air-gaps, microstructure release

P. Monajemi, P.J. Joseph, P.A. Kohl, F. Ayazi,J. Micromech. Microeng. 16 (2006) 742-750

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Piezoresistive PolymersProf. Oliver Brand, ECE, Georgia Tech

Fundamental investigation of piezoresistivity in conducting polymer films

Example: PEDOT:PSSpoly(3,4-ethylenedioxythiophene): poly(4-styrenesulfonate)

PEDOT:PSS shows small negative piezoresistive effect

T. Schweizer, MS Thesis, Georgia Tech

Baytron P (128 nm)

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RFID/Sensor Module IntegrationProf. M. Tentzeris, ECE, Georgia Tech

Radiating body

Feed loop

Terminals for IC

Radiating bodies

Resistive + inductive stub

Resistive stub

Operation modesPassive Tags

System uses RF/EM power from readerSemi-Passive Tags

IC uses RF/EM power, sensor uses battery Increased node lifetime & data range (≈ 30 ft)

Active tag IC and sensor utilize battery Increased S/N & data range (>100 ft)

• Goal: All printed RFID tag (antenna, IC, battery, and sensor) on paper or polymers

• Operating frequency: UHF (900 MHz), RF (2.45 GHz), potentially up to 60 GHz

IPST Executive Conference, March 9-10, 2011, Atlanta, GA

RFID Printed on Paper: Conductive InkProf. M. Tentzeris, ECE, Georgia Tech

PAPER• Environmental friendly and low cost; Large reel to reel processing• Compatible for printing circuitry by direct write methodologies• Can be made hydrophobic and can host nano-scale additives

(e.g. fire retardant textiles)• Dielectric constant εr (~2) close to air’sINK• Consisting of nano-spheres melting and sintering at low temperatures (100 °C)

• After melting a good percolation channel is created for electrons flow• Provides a better result than traditional polymer thick film material approach

SEM images of printed silver nano-particle ink, after 15 minutes of curing at 100°C and 150°C

IPST Executive Conference, March 9-10, 2011, Atlanta, GA

Outlook: Smart Packaging Research at Georgia Tech

Combining paper S&T, micro/nanofabrication, MEMS, and organic electronics expertise to Move beyond optical indicators

and embed printed electronic capabilities

Include mechanical features such as e.g. drop/shock sensors

Move from devices to complete systems including sensor, circuitry, power source (e.g., printed battery or solar cell), and communication (e.g., RFID)

Source: Harry Potter, The Daily Prophet