Printed Electronics and Gravure - TAPPI A.pdfPrinted Electronics and Gravure Eric Serenius ....
Transcript of Printed Electronics and Gravure - TAPPI A.pdfPrinted Electronics and Gravure Eric Serenius ....
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Printed Electronics and Gravure
Eric Serenius
Vice-President Daetwyler R&D Corporation
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Daetwyler R&D Corporation
• Daetwyler R&D Corporation is a precision, multi-discipline, equipment/software manufacturer with an expertise in gravure printing, which resides near Dayton, OH USA for 30+ years.
• Member of the Heliograph Holding • Our customer and equipment base extends over 50 countries. • Approached Printed Electronics in 2002
- Improved precision by a factor of 10:1 - Feature size < 5 micron - Depth control in 200 nanometer range - Improved cylinder-to-cylinder registration through machine design - Improved cylinder precision through temperature control
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Printed Electronics Overview
Wide-spread, low-cost, lower-performance circuits with unconventional use (at least in theory)
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Reality
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Deposition Techniques
• Offset • Flexo / Letter Press • Gravure • Screen
• Inkjet • Pad • Slot Die Coating
• …
• Spin Coating
• Vapor Deposition • Electrochemical Deposition
• Photolithography • …
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Print vs. Silicon
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Performance Criteria
Printing
VISUAL*
• Limited to Human Eye
• Color • Registration • Fade / Wear
• …
FUNCTIONAL
• Electron Flow performance • Conductance
• Gain • Watts
• Luminescence • …
PE ultimately combines these two functions to drive value
* Coatings are the exception
Semiconductor Fab
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Semiconductor Fab Review
Process
DEPOSITION
- Spin Coating
• PVD / CVD
• ECD • MBE
• ALD
REMOVAL - Dry Etch -Wet Etch
- Chem. Mech Planarization
PATTERNING - Photolithography
DOPING - Ion Implantation
Modern devices cycle through hundreds of process steps
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Spin Coating
Method to apply thin uniform films to flat substrates 1. Excess amount of solution placed on substrate 2. Substrate rotation uses centrifugal force to create a thin uniform
layer 3. Thickness a function of angular speed and solution / evaporating
solvent mixture 4. Photo resist is typically spun to
around 1 µm thick 5. Surface roughness often
1% of thickness 6. Ultra thin films are possible
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Photolithography
Subtractive Patterning Process
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Photolithography
Stepper System Example 1.Align 2.Expose 3.Step Repeat This is Patterning or Image Transfer
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Self-Aligned Imprint Lithography
Active Matrix Backplanes on Flexible Substrate
Source: HP FlexTech 2010 Conference
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Semiconductor Characteristics
• Small rigid substrates (wafers) • Ultrafine resolutions (50 nm) • Very expensive foundries ($1.0B) • EXTREMELY high cost per area
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Screen Printing
Versatile technique for Printed Electronics
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Screen Printing
• Uses a woven mesh to support an ink blocking stencil
• Stencil forms open areas of mesh that transfer ink as a sharp edge image onto substrate
• A roller or squeegee is moved across the screen stencil, forcing ink past the threads of the woven mesh in the open areas
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Screen Process Steps
IDTechEx Masterclass Dresden 2010
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Print Dynamic
IDTechEx Masterclass Dresden 2010
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The Screen
Parameters
1.Frame Material
• Stability for Stretched Mesh
• Method of Registration
2.Mesh Material
3.Mesh Count (wires per length)
4.Wire Thickness
5.Open Area
6.Tension
7.Weave Pattern
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Stencil
Rough Stencil Wall – Poor Edge Definition
Smooth Stencil Wall – Good Edge Definition
Source: Jay Sperry, Clemson University
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Print Quality
Print Characteristics Affected by …
1.Frame – Registration
2.Stencil & Mesh – Edge Quality
3.Mesh – Resolution & Ink Thickness
4.Squeegee material, speed & angle
5.Lift – Edge Quality
6.Ink – Uniformity
7.Surface Energy Interactions
8.…
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Rotary Screen
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Screen Printing - Summary
Already playing a significant role in PE
Printed Electronics – Screen Summary
Advantage Ink Thickness (60 µm)
Limitation Resolution (50 µm)
Applications • Conductive runs • Photovoltaic's • Batteries
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Inkjet Printing
Desktop Prototyping for Printed Electronics and more …
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Inkjet Characteristics
• Non-contact printing for Rigid & Flexible substrates
• Advanced systems can deliver ink referenced to fiducials
• Each print can be customized
• Deceptive simplicity
• Ink volume is very low – Multi-pass may be required
• R2R systems are available
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Inkjet Printing - Summary
Already playing a significant role in PE
Printed Electronics – Inkjet Summary
Advantage • Rapid Prototyping • Each copy can be customized
Limitation • Limited Single Pass Thickness • Speed & Cost-Per-Volume
Applications • Any and everything on a prototype basis
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Gravure Printing
Inherent Potential for Printed Electronics
Z Axis - Depth
120°
90° Stylus
Unique
Shapes
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Gravure Review
Think of small cups for holding ink • A copper cylinder holds the image. • The image is etched or engraved into the copper.
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Gravure Printing
Direct Gravure Offset Gravure
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Gravure Cell Shapes
100 % 50 % 5 %
Direct Laser
Diamond or
Etch Diamond
cut Sphere
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Direct Ink Transfer
Nip – Compression point where ink transfer occurs. Substrate is sandwiched between Impression Roller and Gravure Cylinder or Plate.
Source: Jay Sperry, Clemson University
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Gravure Review
Gravure’s Strengths • Variety of substrate types • High resolution / accuracy • Life of printing roll • Variable ink film thickness
- 3D Printing
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Gravure Insight – 3D Printing
Dry Ink Thickness to 50+ µm
750 dpi
X & Y Axis - Screening
150 dpi
Z Axis - Depth
120°
90° Stylus
Unique Shapes
Traditional Gravure tranScribe Gravure
1000 dpi
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Gravure Printing
Printed Electronics – Gravure
Advantage
Offers all:
• Fine resolution
• High ink transfer volume
• High speed
Limitation
• Perceived to use only for HUGE production
volumes
• Daetwyler R&D offers single cylinder making and
Lab/limited production press
Applications
• OLED’s
• High Density Transistors, Circuits
• Interconnect
• Photovoltaic, Battery, RFID
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Print Comparison
Compare Printing Methods Resolution Ink Film Thickness
Courtesy WMU CAPE November 20, 2009 * In-process, DR&D testing
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Comparison of Traditional and Electronic Printing
Requirements Traditional Electronics
Resolution 15µm – 100 µm << 20 µm
Registration Low High
Edge Sharpness High Very High
Uniformity of Layers Not Really Important Very Important
Adhesion of Layers to
Substrate Important Important
Adhesion of Layers to Other
Layers Less Important Very Important
Solvents in Ink Cost Issues Functional Issues
Purity of Solution Not Really Important Very Important
Visual Properties Very Important Not Important
Electrical Properties Not Important Very Important
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Comparison of Conventional and Printed Electronics
Solid State
(Conventional)
Organic and Printed
Electronics
Process Batch Continuous
Production Speed Slow Potentially Fast
Capital Cost Extremely High Low to Moderate
Materials Well Defined Developmental
Cost Moderate in High Volume Low to Moderate
Substrates Rigid Silicon Rigid and Flexible
Environmental Acceptable Friendly
Economic Run Length Large Small to Very Large
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Comparison between Paper and Polymer Substrates
Property Paper Polymer
Stiffness High Low
Shrinkage Low Typically high but can be
improved
Surface Modifications Possible using coatings Possible but can be costly
Absorbency High Very low
Biodegradable Yes No
Chemical stability Low High
Mechanical strength Low to Moderate High due to strong cross
linking
Surface smoothness Typically Low but can be
improved Very high surface
smoothness
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Markets and Application Areas
Source:http://www.frost.com/prod/servlet/cio/108885719
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Functional Inks
Typically Inks used for graphic printing consist of: Pigments – Resins – Solvents – Additives
In functional inks, Pigments are replaced by functional materials such as Conductive, Semiconductive or Dielectric materials that give functional attributes to the ink.
Functional Ink Type Examples of the Materials that can be Used
Conductive Inks Silver, Gold, Copper, Nickel, Carbon, ITO particles, ATO particles……
Semiconductive Inks C60, Fullerenes, Pentacene, poly(3 – hexylthiophene) (P3HT),
poly(9,9’ – dioctyl – fluorine ‐ co – bithiophene) (F8T2)….
Dielectric Inks
poly (methylmethacrylate) (PMMA), poly (4‐vinyl phenol) (PVP), polystyrene (PS), polyimide (PI)…..
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Ink Comparison Relative to Printed Electronics
Printing Method
Print Speed
Drying Needs
Viscosity
Screen Slow 1-10 fpm
High 100-150°C
5000-40,000 centipoise
Flexography Medium 25-1000 fpm
Medium 50-150°C
2000-5000 centipoise
Gravure Fast 100-3000 fpm
Low 50-100°C
500-2000 centipoise
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Good and Bad Printed Samples
Images of Solvent Based Silver Flake Inks Printed on PET Left image is a good image with an even ink lay and no pinholes whereas the image on the right shows pinholes and is probably due improper viscosity adjustments and thus improper transfer form the gravure cells to the substrate.(Images taken on ImageXpert )
Cross-sectional View of Dried Ink Film on Substrate using SEM (Scanning Electron Microscope)
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Functional vs. Visual
Opens, Shorts, Partial Transfer
Courtesy B. Bazuin of WMU CAPE
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Print Samples on Different Substrates
Examples of Samples Printed on Paper (Left) and Paper Board (Right)
Print Sample on PET using Nano-Silver Ink
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Examples of Proper and Improper Blade Wiping on the Cylinder
Examples of Proper wiping on the Cylinder (Left) and Improper Wiping on the Cylinder (Right)
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Ballantine’s PE Example
Integrated Graphic Equalizer
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Gravure Printed Product Sample
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Heliograph Holding - Products for Gravure Printing
Engraving Technology
Cylinder Handling
Laser Technology
Plating Technology
Equipment for Gravure Printing
Cranes
Finishing Technology
Full Automation
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Daetwyler R&D - Products for Printed Electronics
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MicroGravure Cycle Solutions
Completing the Micro Printing Process Cycle
Micro-Gravure
Printing
AccuPress
MicroGravure
Printing System
µStar MicroEngraving
System
Partners,
Products
Printed
Electronics
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MicroGravure Workflow
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µStar MicroEngraving™ System
• Advanced Data Processing capability with Collage-Micro Layout System
• Unique 3-D Shapes - Ink Transfer Optimization - Micron Lens Design - Features < 5 µm
• High Productivity with Ultra Fast Tool
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Ultra Diamond Cutting Tool
MicroEngraving Tool • High-Precision
- Control < 200 nm in depth • Up to 12,000 features per second
- < 50 µs rise-time !! • Feedback controlled • Cartridge tool design • Diamond tools
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µStar Applications – Printed Circuits
High Resolution Examples
5 microns
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Precision Gravure Printer
• Lab / Limited Production • Layer-to-Layer Registration • Allows Hybrid Printing • Custom Enhancements • Levels of Automation • µStar Cylinders
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Precision Gravure Printer
LEVEL 1 • High precision bearings • Accuracy to 20 µm • Option:
- Electrostatic Assist
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Precision Gravure Printer
Printed Electronics Sheet-fed Press • Single or Multi-Layer Printing • Ink Transfer Testing • Gravure Direct Printing
Production machine AccuPress Type 1/CE with fume hood and safety mat
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Precision Gravure Printer
LEVEL 3 • High precision • Air bearings • Temperature control • Accuracy to 5 µm
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Precision Gravure Printer
Printed Electronics Sheet-Fed Press • Single or Multi-layer printing • Gravure offset printing
Production machine Gravure Offset to Glass Sheet 4 m x 4 m sheet size
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Engineered Cylinders
• MicroGravure - Optimized Ink Transfer
• MicroLens for Optical Film • Precision High Accuracy Gravure • Photovoltaic • High Density Printed Electronics • Coating, Embossing, Security Work … and more
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MicroGravure Printing - Summary
Gravure/MicroGravure for Printed Electronics
Advantage • Fine resolution • High ink transfer volume • Uniform laydown
Scalability • AccuPress for prototyping • Scalable & consistent for R2R
Applications
• PLED’s • Fine Resolution Conductive Lines • High Density Transistors • Backplanes • Photovoltaic, Battery
Playing increasing role as benefits embraced & equipment is available
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For more information
www.daetwyler-rd.com • Always up-to-date • All products and services • Contact information • Sign up for our RSS
news feed
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Questions
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