Printed Board Handling and Storage Guidelines IPC- · PDF fileMany!documents!were!! •...
Transcript of Printed Board Handling and Storage Guidelines IPC- · PDF fileMany!documents!were!! •...
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PRINTED BOARD HANDLING AND STORAGE GUIDELINES
An introduction by IPC D-‐35 subcommittee member, Bob Lazzara
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To preserve the quality and reliability of PCBs during shipment and storage, military specifications and guidelines defined packaging methods
Prior to the IPC-1601
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Many documents were • obsolete • incomplete • did not address lead-‐free assembly processes
• did not cover newer laminates or final surface finishes
Prior to the IPC-1601
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Alternative surface finishes added concerns/requirements for PCB packaging & handling to preserve surface finish and assure solderability.
Prior to the IPC-1601
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The IPC-‐1601 provides suggestions for proper: • handling • packaging materials and methods
• environmental conditions
• storage for PCBs
Scope and Intent
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The 1601 intends to protect PCBs from: • contamination • physical damage • solderability degradation
• electrostatic discharge (ESD)
• moisture uptake
Scope and Intent
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Moisture absorbed by PCBs will expand at soldering temperatures. The resulting vapor pressure can lead to: • internal delamination • excessive strain on plated-‐hole walls (e.g., post separation)
Scope and Intent
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The 1601 covers: • Fabrication of the PCB • Delivery to Assembler
• Receiving the PCB • Stocking the PCB • Assembly & soldering
Scope and Intent
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Targets these functions involving PCB…
• DESIGNERS • MANUFACTURING • ASSEMBLY • SHIPPING • STORAGE • WARRANTY
Information was supplied by individual serving all of these functions, as well as material and equipment suppliers.
Scope and Collaboration
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PCB Raw Material Handling & Storage guidelines include: • Laminates • Handling and Foreign Object Concerns
• Environmental Concerns
• Inner Layer Production right: foreign object between inner layers, Drilling operation.
Guidelines for Fabricators: Raw Materials
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Core Materials, Prepreg and Resin Coated Foils are sensitive to damage. Guidelines for handling & storage of prepregs and resin coated foils include: • Handle prepreg by the edges
using clean latex or nitrile gloves.
Guidelines for Fabricators: Raw Material Examples
• Store prepreg flat in a cool, dry environment (< 23 °C [73 °F], <50% RH).
• Reseal opened bags of unused prepreg.
• In cases where storage temperature is significantly below room temperature, allow prepreg to acclimate to ambient conditions prior to layup. Keep prepreg in a sealed package during the stabilization period to prevent moisture condensation.
• Do not fold prepreg.
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Because moisture control is critical prior to inner layer lamination, key recommendations are made for the following: • Storage Conditions • Pre-‐lamination • Subcomposite Cores
(Sequential Lamination) right: edge-‐view of PCB, pre-‐press,
depicting two “cores” (green)
Guidelines for Fabricators: Etched Cores & Subcomposites
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After the layers are pressed together, the 1601 continues with guidelines for the following areas and processes: • Processing Validation &
Control • Handling & Transport of
Product • Environment • Test • Inspection • Recommended Moisture
Levels Prior to Packaging
Guidelines for Fabricators: Post Lamination
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Non-‐PCB Issues: • Phototooling • Temperature and Humidity
• Handling and Storage • Process Equipment • Capability
right: automatic solder mask coating system
Guidelines for Fabricators: Non-Product Issues
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Temperature and humidity levels where photo tools are used & stored should be the same as where the photo tools were manufactured. Variation between areas can cause growth (moisture gain) or shrinkage (moisture loss).
right: light passes through photo-‐tool (black) casting the circuit image onto photo-‐polymer (blue)
Guidelines for Fabricators: Non-Product Example
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PCB moisture sensitivity will depend on… • the resin system • details of design and construction
• assembly processes • soldering temperatures
…that the PCB will be exposed to by the Assembler.
Moisture Levels Prior to Packaging
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Because verification may affect cost and schedule, limitations on moisture content prior to packaging should be as agreed between user and supplier (i.e., Assembler and Board House).
Moisture Content: Verification Agreement
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Baking may be necessary to remove residual moisture absorbed into the PCB during the time between completion of the fabrication process and exposure to the assembly soldering .
Guidelines for Assemblers: Baking for Moisture Removal
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If process controls are in-‐effective, the most practical remedy is baking. However, baking: • increases cost & cycle time • can degrade solderability • increase the likelihood of
handling damage or contamination
Problems Caused By Baking
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Recommendations for PCB Baking Profiles
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Packaging should include moisture barrier bags, desiccant to absorb any moisture that enters the bag, Humidity Indicator Cards to provide a visual indication of moisture level, and heat-‐sealing of the bag.
Recommendations for PCB Packaging
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WVTR is the rate that water vapor passes through a specific area of barrier material. The WVTR for dry packaging PCBs should meet requirements of IPC-‐J-‐STD-‐033 (a WVTR of < 0.002 gm/100 in2/24 hrs.) A lower WVTR value may increase shelf life of the PCB, or reduce the amount of desiccant required.
Water Vapor Transmission Rate (WVTR)
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The quantity and quality of the desiccant material selected should be in accordance with IPC-‐J-‐STD-‐033 and should be sulfur free.
About Desiccant
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After going through the effort to prevent, mitigate and eliminate moisture, don’t keep moisture sensitivity a secret. Before you let it go, let the next person know.
Moisture-‐Sensitive Marking
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Thank you for watching Introduction to the IPC-‐1601: Printed Board Handling and Storage Guidelines. Bob Lazzara VP, Technology BobL@Circuit-‐Connect.com (800) 560-‐9457, ext. 1 Circuit Connect, Inc.
Thank You.