Presentation on ADS Momentum

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    This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or

    inaccurate references. We regret any inconvenience this may cause. For the latest information on Agilents

    line of EEsof electronic design automation (EDA) products and services, please go to:

    www.agilent.com/find/eesof

    Agilent EEsof EDA

    resentaton on omentum

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    Keefe Bohannan

    Agilent EEsof Applications Engineer

    April 2003

    ADS Momentum

    A Half-Day Seminar

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    Momentum Seminar

    Agenda for Half-day Momentum Seminar

    30 minutes Brief overview of Getting Started with Momentum

    Creating/importing artwork in ADS Layout Momentum versus Momentum RF

    Creating substrate stack-ups and mapping layout layers as metallization laye Placing and defining ports Defining mesh parameters

    30 minutes Overview of Viewing and Using Momentum Results

    Momentum Datasets Momentum Visualization: currents, fields, s-parameters, gamma, Z0 ADS Data Display: s-, y-, and z-parameters, reactance (L/C), Q, etc.

    60 minutes Advanced Topics [Part 1]

    Momentum Co-simulation (EM/circuit co-simulation) using Layout Component Momentum Co-optimization (EM/circuit co-optimization) using Layout Compon Thick conductor simulations {LAB} Spiral Inductor simulations {LAB}

    15 minutes Break

    105 minutes Advanced Topics [Part 2]

    Advanced Model Composer (AMC) Advanced Model Composer (AMC) {LAB}

    15 minutes Final Q&A Session

    4 hours 15 minutes

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    Momentum Seminar

    What is meant by Planar EM simulation ?

    Substrate - multiple dielectrics

    Metals - traces on different layers forming component aninterconnect

    Vias - connecting different layers

    Method of Moments techniqueSometimes referred to as 2.5D

    It does NOT include:

    Arbitrary 3D structures

    Horn Antennas

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    Momentum Seminar

    Why are Planar EM Simulators used ?

    No simple analytical model exists

    Coupling between conductors or layers is significant

    Arbitrary planar geometry

    Narrow frequency response not captured by analytical mo

    Radiation patterns of planar antennas

    CPW transmission lines

    When full 3D analysis would take too long

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    Momentum Seminar

    How are Planar EM Simulators used ?

    Layout driven

    Created entirely within layout,

    Schematic-to-Layout translation, OR

    Import (DXF, GDSII, etc.)

    Momentum interface within ADS Layout

    Mode > Substrate/Metallization > Port > Mesh Simulation > Component > Optimization

    Outputs

    S-parameters

    Current visualization

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    Momentum Seminar

    Creating/importing artwork in LayoutCreate

    Schem

    Import

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    Momentum Seminar

    Create

    Schem

    Import

    Everything is placed on a layer

    There are 39 default layers

    User may add new layers, remomodify layer names and propert

    User may define name, color, p

    (outlined/filled), and line style a Layers may be set to be visible/

    selectable/unselectable, and ins

    Items on unselected layersedited / moved / deleted

    Only one layer is insertab

    Objects can only be cTO the insertable (moved FROM any se

    Creating/importing artwork in Layout

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    Momentum Seminar

    Create

    Schem

    Import

    Preferences which apply to things not yet placed:

    Trace, Placement, Entry/Edit, Units/Scale,Component Text, Text

    Preferences which apply to things already placed:

    Select, Grid/Snap, Pin/Tee, Display, Layoutunits

    Preferences for schemaseparately

    Preferences Setting are

    layout.prf and schemat

    Preferences files from Options > Preferences

    Creating/importing artwork in Layout

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    Momentum Seminar

    Create

    Schem

    Import

    Creating/importing artwork in Layout

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    Momentum Seminar

    Create

    Schem

    Import

    Creating/importing artwork in Layout

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    Momentum Seminar

    Create

    Schem

    Import

    Creating/importing artwork in Layout

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    Momentum Seminar

    Create

    Schem

    Import

    Creating/importing artwork in Layout

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    Momentum Seminar

    Create

    Schem

    Import

    Creating/importing artwork in Layout

    Simplify

    using

    (flattens

    m

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    Momentum Seminar

    How are Planar EM Simulators used ?

    Layout driven

    Created entirely within layout,

    Schematic-to-Layout translation, OR

    Import (DXF, GDSII, etc.)

    Momentum interface within ADS Layout

    Mode > Substrate/Metallization > Port > Mesh Simulation > Component > Optimization

    Outputs

    S-parameters

    Current visualization

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    This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or

    inaccurate references. We regret any inconvenience this may cause. For the latest information on Agilents

    line of EEsof electronic design automation (EDA) products and services, please go to:

    www.agilent.com/find/eesof

    Agilent EEsof EDA

    eta e resentaton on omentum - art o

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    Momentum Seminar

    Using Momentum

    Enable regular Momentum or Momentum RF

    Define Substrate and Metallization (pre-comput

    Modify the type and impedance of ports

    Describe a possible Substrate enclosure

    Create/modify Momentum Component to be use

    or co-optimization

    Define Mesh parameters (pre-compute option)

    Setup and Perform a Momentum simulation (pla

    Setup and Perform a Momentum optimization (g

    Display Visualization (S-parameters, current de

    parameters) and Radiation patternsExport 3D files for HFSS

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    Momentum Seminar

    Using Momentum: Selecting the Analysis

    Solution process

    Select Mode

    Substrate definition

    Port Setup

    Mesh Generation

    Planar Solve

    Display Results

    Click this submenu to Momentum

    MomentumR

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    Momentum Seminar

    Momentum versus MomentumRF: A Snap

    Momentum features:

    Full-Wave EM Simulation

    Rooftop Basis Function

    Rectangular and Triangular Cells

    For most passive geometry

    Full accuracy for all circuit sizes

    No inherent upper frequency limit

    Potential instability at f

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    Momentum Seminar

    Status window provides rule of thumb frequency

    for which the structure is electrically small

    How do I know?

    Momentum versus MomentumRFElectrically Small condition for Momentum RF

    D

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    Momentum Seminar

    Momentum versus MomentumRFPlanar EM Simulation Basics

    Physical Design

    Substrate

    Metallization

    Ports

    Method of Moments

    Meshing

    Rooftop functions

    B1(r) B2(r)

    I1 I2

    /10J(r) = I1B1(r) + I2B2(r)Heywhere did

    this equation

    come from?

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    Momentum Seminar

    If one then transforms these equations to the integral form, the mixed potential integral e

    form as a linear integral operator equation follows:

    Here, J(r) represents the unknown surface currents and E(r) the known excitation of the proble

    layered medium acts as the integral kernel. The unknown surface currents are discretized by m

    metallization patterns and applying an expansion in a finite number of subsectional basis functio

    Maxwells Equations

    E= -B/t Faradays LawH= J+ D/t Amperes LawD= Gausss LawB= 0 No Name (Gausss Law for Magnetism)

    where

    E= Electric Field Intensity Vector

    H= Magnetic Field Intensity Vector

    D= Electric Flux Density (Electric Displacement Vector)

    B= Magnetic Flux Density Vector

    Ohhhhsorry I

    asked.

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    Momentum Seminar

    Momentum versus MomentumRFPlanar EM Simulation Basics

    B1(r) B

    I1 I2

    I1 I2

    C11

    C12

    L11 L2

    L13L12

    R22

    /10

    Method of Moments

    Maxwells Equations

    Matrix Equation

    Equivalent Circuit

    [Z].[I]=[V]

    [Z] = [R] + j[L] + 1/j[C]-1

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    Momentum Seminar

    Momentum versus MomentumRFFullwave versus Quasi-Static: Fullwave

    Fullwave electric & magnet

    Includes space and surface

    [L(w)] & [C(w)] are complex

    [Z(w)] matrix reload CPU in

    jkRR

    e1Fullwave EM

    Maxwells Equations

    Matrix Equation

    Equivalent Circuit

    [Z].[I]=[V]

    [Z] = [R] + j[L()] + 1/j[C()]-1

    [S]

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    Momentum Seminar

    Momentum versus MomentumRFFullwave versus Quasi-Static: Quasi-Static

    Electro- and magneto-st

    Near field / low freq ap

    L(w) = L0+ L1wR + L2(

    C(w) = C0+ C1wR + C

    Neglects far field radia

    [L0] & [C0] are real and

    [Z0] matrix reload very

    1 e jkRRQuasi-Static EM

    Maxwells Equations

    Matrix Equation

    Equivalent Circuit

    [Zo].[I]=[V]

    [Zo] = [R] + j[Lo] + 1/j[Co]-1

    [S]

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    Momentum Seminar

    Momentum versus MomentumRFA Summary of Effects Included

    quasi-static inductance . . . . . .

    quasi-static capacitance . . . . .

    DC conductor loss (s) . . . . . . . .

    DC substrate loss (s) . . . . . . . .

    dielectric loss (tan d) . . . . . . . . . . . . . . . . . . . . . . . . . . .

    skin effect loss . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    substrate wave radiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    space wave radiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    Layout

    S parameters

    RF

    Spice model S p

    Spice Momentum RF MomentumDC

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    Momentum Seminar

    Using Momentum: Creating Substrate Sta

    Mapping Layout Layers as Metallization L

    Solution process

    Select Mode

    Substrate definition

    Port Setup

    Mesh Generation

    Planar Solve

    Display Results

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    Momentum Seminar

    Using Momentum: Creating Substrate Sta

    Mapping Layout Layers as Metallization L

    Once you have created or imported your artwork

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    Momentum Seminar

    Using Momentum: Creating Substrate Sta

    Mapping Layout Layers as Metallization L

    be sure to define (or open) your substrate stack-up and map t

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    Momentum Seminar

    Using Momentum: Creating Substrate Sta

    Mapping Layout Layers as Metallization L

    Greens Function Substrate Calculation Time

    Students Guide A-36

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    Momentum Seminar

    Using Momentum: Creating Substrate Sta

    Mapping Layout Layers as Metallization L

    A note on layout layer conductivity

    Conductivity defi

    Perfe

    (Rea

    (Rea

    Imped

    The parameters s

    toward a conduc

    does NOT affect

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    Momentum Seminar

    Momentum treats all conductors as having zero thickness. However, the conductivity and thickness c

    frequency dependent losses in the metallization patterns.

    Momentum uses a complex surface impedance for all metals that is a function of conductor thickness

    At low frequencies, current flow will be approximately uniformly distributed across the thicknes

    this minimum resistance and an appropriate internal inductance to form the complex surface imp

    At high frequencies, the current flow is dominantly on the outside of the conductor and Moment

    impedance that closely approximates this skin effect.

    At intermediate frequencies, where metal thickness is between approximately two and ten skin

    transitions between those two limiting behaviors.

    This surface impedance

    is added to the Method of Moments approach that is used for

    Momentum in g

    The formula used is a combination of a high-frequency conductivity and a low-frequency bulk resistivi

    approaches (LF bulk behaviorHF surface impedance) transition seamlessly.

    The formula is:

    Z = coth() * Zcwhere Zc = the HF impedance and coth() is the correction for finite thickness

    Zc = 0.5 * sqrt(j * 0 * /(+ j * 0* ))

    = 0.5 * thickness * sqrt(j * 0 * * (+ j * 0* ))where = 2 * * fand = conductivity = 1/resistivity [in Siemens/meter]

    The meshing density can affect the simulated behavior of a structure. A more dense mesh allows curr

    and can slightly increase the loss. This is because a more uniform distribution of current for a low den

    resistance

    Using Momentum: Creating Substrate Stack-ups

    Layout Layers as Metallization Layers:Loss Model u

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    Momentum Seminar

    Using Momentum

    Solution process

    Select Mode

    Substrate definition

    Port Setup

    Mesh Generation

    Planar Solve

    Display Results

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    Momentum Seminar

    Placing and Defining PortsConsiderations

    Keep the following points in mind when adding ports to circuits to be simulated

    The components or shapes that ports are connected to must be on layout laymetallization layers that are defined as strips or slots. Ports cannot be direct

    Make sure that ports on edges are positioned so that the arrow is outside of inwards, and at a straight angle.

    Make sure that the port and the object you are connecting it to are on the saconvenience, you can set the entry layer to this layer; the Entry Layer listbobar.

    A port must be applied to an object. If a port is applied in open space so thaobject, Momentum will automatically snap the port to the edge of the closes

    apparent from the layout, however, because the position of the port will not If the Layout resolution is changed afteradding ports that are snapped to ed

    the ports and add them again. The resolution change makes it unclear to whsnapped, causing errors in mesh calculations.

    Note Do not use the ground port component (Component > Ground) in circusimulated using Momentum. Either add ground planes to the substrate or use

    ports.

    (Ground port component toolbar button: )

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    Momentum Seminar

    Port Type

    Single

    (default)

    Internal

    Differential

    Coplanar

    Common Mode

    Ground Ref.

    General Description

    Calibrated to remove mismatch at port

    boundary (might also call this a

    transmission line port)

    Not calibrated (might also call this a

    direct excitation port)

    Two ports with opposite polarity

    Two ports with opposite polarity

    Two ports with the same polarity

    An explicit ground reference for aSingle or Internal port.

    Place

    Ed

    Edg

    Sur

    Ed

    Ed

    Ed

    EdgSur

    CPW NOTE: For finite ground planes, use Ground Reference ports and Interna

    Placing and Defining PortsDescription of Momentum Port Types

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    Momentum Seminar

    It is connected to an object that is on either a strip or slot metallization laye It can be applied only to the edge of an object. The port is external and calibrated. The port is excited using a calibration p

    removes any undesired reactive effects of the port excitations (mode mismaboundary. This is performed by extending the port boundary with a half-wavcalibration (transmission) line. The frequency wavelength selected during thsimulation process is used to calculate the length of the calibration line. Forabout the calibration process, refer to "Calibration and De-embedding of theon page A-7in the Momentum manual.

    The port boundary can be moved into or away from the geometry by specif

    offset. S-parameters will be calculated as if the port were at this position. When two or more single ports are on the same reference plane, coupling eparasitics affects the S-parameters. The calibration process groups the portcoupling in the calibration arms is included in the S-parameter solution.

    If the port is connected to an object on a strip layer, the substrate definitionleast one infinite metal layer: a top cover, ground plane, or a slot layer, or areference must be used in addition to the port.

    If the port is connected to an object that is on a slot layer, the port has pola

    Tip It is not necessary to open the Port Editor dialog box to assign this portwithout a port type specified is assumed to be a single port.

    Placing and Defining PortsSingle Port Properties

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    Momentum Seminar

    Placing and Defining PortsDefining a Single Port

    Choose Momentum > Port Editor.

    Select the port that you want to assign this type to.

    In the Port Editor dialog box, under Port Type, select Single.

    Enter the components of the port impedance in the Real and Iand specify the units.

    You can shift the port boundary, also referred to as the port reShifting the boundary enables a type of de-embedding procesadds or subtracts electrical length from the circuit, based on thimpedance and propagation characteristic of the port. Enter thReference Offset field, and select the units. A positive value mboundary into the circuit, a negative value moves the port bouthe circuit.

    Click Applyto add the definition to the port.

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    Momentum Seminar

    Placing and Defining PortsSingle Port: Avoiding Overlap (of calibration arm)

    Be aware that when using single ports, the calibration arm applied tlong enough to overlap another element in the circuit. In this case, changed to an internal port type, and no calibration will be performeoccurs, a message will be displayed during simulation in the Status the change.

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    Momentum Seminar

    Placing and Defining PortsSingle Port: Applying Reference Offsets

    Reference offsets enable you to reposition single port types in a layout and thereby adjust electrical

    changing the actual drawing. S-parameters are returned as if the ports were placed at the position o

    Why Use Reference Offsets?The need to adjust the position of ports in a layout is analogous to the need to eliminate the effect ohardware prototypes. When hardware prototypes are measured, probes are connected to the input Under Test (DUT). These probes feed energy to the DUT, and measure the response of the circuit. Uresponse characterizes the entiresetup, that is, the DUT plus the probes. This is an unwanted effectreflect the characteristics of the DUT alone. The characteristics of the probes are well known, so me

    mathematically eliminate the effects of the probes, and present the correct measurements of the DUThere are significant resemblances between this hardware measurement process and the way MomeMomentum, the probes are replaced by ports, which, during simulation, will feed energy to the circuMomentum port feeding scheme also has its own, unwanted effect: low-order mode mismatch at theeliminated by the calibration process. However, in order for this calibration process to work well, it imode is characterized accurately. This can only be accomplished when the distance between the pordiscontinuity is sufficiently large, that is, there exists a feedline that is long enough to provide this d

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    Momentum Seminar

    Placing and Defining PortsSingle Port: Allowing for Coupling Effects

    If you have two or more single ports that lie on the same reference plane, the catake into account the coupling caused by parasitics that naturally occurs betweenyields simulation results that more accurately reflect the behavior of an actual cirThe figure below helps illustrate which ports will be grouped in order for the calibaccount for coupling among the ports. In this setup, only the first two ports will bthird port is an internal port type and the fourth port is on a different reference pthough the second port has a reference offset assigned to it, for this process theyon the same plane and their reference offsets will be made equal.If you do not want the ports to be grouped, you must add a small thickness of mobject that one of the ports is connected to. The ports will no longer be on the sa

    be considered part of the same group.

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    Momentum Seminar

    Placing and Defining PortsInternal Port Properties

    Internal ports enable you to apply a port to the surface of an object in your desports, all of the physical connections in a circuit can be represented, so your simaccount all of the EM coupling effects that will occur among ports in the circuit.caused by parasitics are included in your simulation results because internal po

    You should avoid geometries that allow coupling between single and internal poparameters.

    An example of where an internal port is useful is to simulate a bond wire on theAnother example of where an internal port is necessary is a circuit that consistsconnect to a device, such as a transistor or a chip capacitor, but this device is nyou are simulating. An internal port can be placed at the connection point, so enot part of the circuit you are simulating, the coupling effects that occur amongdevice will be included in your simulation.

    Internal ports are often used in conjunction with ground references.

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    Momentum Seminar

    Placing and Defining PortsInternal Port Properties

    It can be applied to the interior of a circuit by applying it to the s It can be applied to the edge of an object. It can be applied to objects that are on strip layers only. The orientation of the port is not considered if it is on the surface

    description of port orientation, refer to "Adding a Port to a Layoutthe Momentum manual.)

    No calibration is performed on the port. Because no calibration is port, the results will not be as accurate as with a single port. How

    difference in accuracy is small.

    Choose Momentum > Port Editor.

    Select the port that you want to assign this type to.

    Click Apply.

    Defining an Internal Port

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    Momentum Seminar

    Placing and Defining PortsIllustration of Internal Port Excitation: Direct Point Fee

    direct excitation point feed

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    Momentum Seminar

    direct excitation

    line feed

    Placing and Defining PortsIllustration of Internal Port Excitation: Direct Line/Edge

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    Momentum Seminar

    Placing and Defining PortsDifferential Port Properties

    Differential ports should be used in situations where an electric field between two ports (odd modes propagate). This can occur when: The two ports are close together There is no ground plane in the circuit or the ground plane is relati One port behaves (to a degree) like a ground to the other port, an

    ports is developed. The ports are connected to objects that are on strip metallization la The electric field that builds up between the two ports will have an

    that should be taken into account during a simulation. To do this, u

    Differential ports have the following properties: They can be applied to objects on strip layers only. They are assigned in pairs, and each pair is assigned a single port Each of the two ports is excited with the same absolute potential, b

    polarity. The voltages are opposite (180 degrees out of phase). Theopposite in direction when the ports are on two symmetrical lines, direction is approximated for other configurations.

    The two ports must be on the same reference plane.

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    Momentum Seminar

    Placing and Defining PortsDifferential Port Numbering

    Note: Port numbers for differential ports are treated in the following manner: on thto see the port numbers (instance names) that were assigned to each port when thlayout. Use the Momentum Port Editor dialog box to identify which pair of ports willport.

    When Momentum simulates designs containing non-consecutive port numbers, the consecutive numbers in the resulting data file. The lowest port number is remappednumbers are remapped in consecutive order. The port numbers are not changed inmessage in the Status window announces the change, and lists the mappings.

    For example, if you are simulating a design with ports numbered 1 and 3, the followinforms you of the changes:

    Layout has non-consecutive port numbers.

    Output files will have consecutive port numbers.

    layout port -> output port1 -> 1

    3 -> 2

    Also, when you view results, you will see S-parameters for the differential port numabove, the layout would show p1, p2, p3, p4. The S-parameter results will be for coP1 and P3 only.

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    Momentum Seminar

    Placing and Defining PortsDefining a Differential Port

    Choose Momentum > Port Editor. Select the port that you want to assign this type

    to. Note the port number. In the Port Editor dialog box, under Port Type,

    select Differential. Under Polarity, make sure that Normalis

    selected. Click Apply. Select the second port. In the Port Editor dialog box, under Port Type,

    select Differential. Under Polarity, select Reversed. Under Associate with port number, enter the

    number of the previously-selected port.

    Click Apply. Repeat these steps for other differential port pairs

    in the circuit. Click OKto dismiss the dialog box.

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    Momentum Seminar

    direct excitationn

    line feed

    line feed

    ground reference

    1.i

    -1.i

    Students Guide A-32

    Placing and Defining PortsIllustration of Differential Port Excitation: Direct Point

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    Placing and Defining PortsCoplanar Port Properties

    This type of port is used specifically for coplanar waveguide (CPW) cito a differential port, but coplanar ports are applied to objects on slowhere slots are used in the design). Coplanar ports should be used inan electric field is likely to build up between two ports. This can occu The two ports are close together Polarity between the ports develops The ports are connected to objects that are on slot metallization la The electric field that builds up between the two ports will have an

    circuit that should be taken into account during a simulation. To dcoplanar ports.

    Coplanar ports have the following properties: They can be applied to objects on slot layers only. They are assigned in pairs. Each of the two ports is excited with the same absolute potential,

    opposite polarity. The voltages are opposite (180 degrees out of pcurrents are equal but opposite in direction when the ports are on

    lines, and the current direction is approximated for other configura The two ports must be on the same reference plane.

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    Placing and Defining PortsCoplanar Port Polarity

    Note: Poare treatewhich diff

    Be careful when assigning polarity to coplanar ports.

    An incorrect choice of polarity can change the phase oftransmission type S-parameters by 180 degrees.

    To verify polarity, zoom in on a coplanar port. You willnotice two sets of arrows applied to the port. Oneappears when you add the port component to thecircuit. The second will appear after the mesh iscomputed. It indicates the direction of the voltage overthe slot.

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    Placing and Defining PortsDefining a Coplanar Port

    Note Coplanar ports can be applied to objects on slot l

    Choose Momentum > Port Editor. Select the port that you want to assign this type to. N

    number. In the Port Editor dialog box, under Port Type, select

    Under Polarity, make sure that Normalis selected. Click Apply. Select the second port. In the Port Editor dialog box, under Port Type, select Under Polarity, select Reversed. Under Associate with port number, enter the number

    previously-selected port. Click Apply.

    Repeat these steps for other differential port pairs in Click OKto dismiss the dialog box.

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    Placing and Defining PortsCoplanar Port Example: examples/Momentum/Microwav

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    Placing and Defining PortsCoplanar Port Example: examples/Momentum/Microwave

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    Placing and Defining PortsCoplanar Port Example

    Note

    displ

    curre

    elect

    slot m

    Ther

    visua

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    Placing and Defining PortsCommon Mode Port Properties

    Use common mode ports in designs where the polarity of fields is thor more ports (even modes propagate). The associated ports are exabsolute potential and are given the same port number.

    Common mode ports have the following properties: They can be applied to objects on strip layers only A ground plane or other infinite metal (such as a cover) is require

    design

    Two or more ports can be associated Associated ports are excited with the same absolute potential (an The ports must be on the same reference plane

    Note Port numbers for common ports amanner: on the layout, you will continue (instance names) that were assigned to eadded to the layout. Use the Momentum identify which group of ports will be treat

    Also, when you view results, you will see port numbers. In the example above, theThe S-parameter results will be for comb

    Note: C

    thick c

    (more o

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    Placing and Defining PortsDefining a Common Mode Port

    Choose Momentum > Port Editor. Select the port that you want to assign this type to. N

    number. In the Port Editor dialog box, under Port Type, select C

    Mode. Click Apply. Select the second port. In the Port Editor dialog box, under Port Type, select C

    Mode. Under Associate with port number, enter the number

    that you selected first. Make sure that the value in thwith port number field is the same for additional portsexample, if you were associating three ports and the fassigned as port 1, for the second and third port, the entered into the Associate with port number field wouthe first port you choose, no value is entered in this fi

    Click Apply. Repeat these steps for other common mode ports in t Click OKto dismiss the dialog box.

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    Placing and Defining PortsGround Reference Port

    Ground references enable you to add explicit ground references to a cibe necessary if implicit grounds are in your design.Implicit ground is the potential at infinity, and it is made available to ththe closest infinite metal layer of the substrate. Implicit grounds are usports and with single ports that are connected to objects on strip metaThere are instances where the distance between a port and its implicit large electrically, or there are no infinite metal layers defined in the sucases, you need to add explicit ground references to ensure accurate sFor more information on using ground references, refer to "Simulating Ports and Ground References" on page A-10in the Momentum manual

    You can apply ground references to the surfaces of object. The object mmetallization layers.

    Note: Multiple ground reference ports can be associated with the samassociated with a single port, the ground reference port should be a poedge of an object in the same reference plane as the single port.

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    Placing and Defining PortsDefining a Ground Reference Port

    Choose Momentum > Port Editor.

    Select the port that you want to assign as the ground re

    In the Port Editor dialog box, under Port Type, select Gr

    Under Associate with port number, enter the numbeinternal port that you want to associate with this groundsure that the distance between the port and ground refesmall.

    Click Apply.

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    Placing and Defining PortsCPW with Finite Ground Planes using INTERNAL and G

    Ports 1 and 2 are internal.

    Ports 3, 4, 5, and 6 are ground reference . The groun

    associated with the internal port using the editor.

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    Placing and Defining PortsRemapping Port Numbers

    Some designs contain non-consecutive port numbers. This results in sare difficult to use. When Momentum simulates designs containing nonumbers, the ports are remapped to consecutive numbers in the resulowest port number is remapped to 1, and remaining numbers are remorder. The port numbers are not changed in the design itself. A messawindow announces the change, and lists the mappings.For example, if you are simulating a design with ports numbered 37 astatus message informs you of the changes:

    Layout has non-consecutive port numbers.

    Output files will have consecutive port numbers.

    layout port -> output port

    37 -> 1

    101 -> 2

    Port number remapping is done only for sampled and AFS CITIfiles anS-parameter datasets. It is not done for Visualization and far field filedone at the CITIfile level, and propagates to the dataset file. After remare in sync with the new port numbering.

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    contact your local Agilent office. The

    complete list is available at:

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    Australia 1 800 629 485

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    India 1 800 112 929

    Japan 0120 (421) 345

    Korea 080 769 0800

    Malaysia 1 800 888 848

    Singapore 1 800 375 8100Taiwan 0800 047 866

    Thailand 1 800 226 008

    Europe & Middle East

    Austria 0820 87 44 11

    Belgium 32 (0) 2 404 93 40

    Denmark 45 70 13 15 15

    Finland 358 (0) 10 855 2100

    France 0825 010 700*

    *0.125 /minute

    Germany 01805 24 6333**

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    Other European Countries:

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    Revised: March 27, 2008

    Product specifications and descriptions

    in this document subject to change

    without notice.

    Agilent Technologies, Inc. 2008

    For more information about

    Agilent EEsof EDA, visit:

    www.agilent.com/find/eesof

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    This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or

    inaccurate references. We regret any inconvenience this may cause. For the latest information on Agilents

    line of EEsof electronic design automation (EDA) products and services, please go to:

    www.agilent.com/find/eesof

    Agilent EEsof EDA

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    Details of Momentum

    Solution process

    Select Mode

    Substrate definition

    Port SetupMesh Generation

    Planar Solve

    Display Results

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    Defining Mesh ParametersMesh Setup Control

    Global mesh is the default.But you have choices.

    In general, small

    patterns are more

    accurate but take

    more time to solve.

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    Defining Mesh ParametersGlobal Mesh example with Edge Mesh

    1 - Port2 - Calibration Line

    3 - Mesh

    4 - Edge Mesh

    1

    4

    3

    2

    NOTE: You can view the mesh, ports, an

    before simulating and make adjustments

    Here, the cell size is the sall parts of the geometry,

    the edges around each p

    The calibration line

    is automatically

    drawn when the

    port is defined -

    more on this later.

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    Defining Mesh ParametersPrimitive Mesh example

    The centerprimitiveof this geometry has a

    different mesh (50 cells/wavelength) than th

    outside geometries (20 cells/wavelength).

    1

    2

    You can combine primitive m

    layer mesh, and global mesh.

    Next

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    Discretion Error - Longitudinal

    Number of cells/wavelength

    determines samples used forapproximation of true currents

    Typical cells/wavelength is 20

    30 or more is fine, but will slow down

    the simulation

    Minimum required to retain high-frequency accuracy is 10

    Can retain accuracy AND speed with

    10 cells/wavelength AND edge mesh

    Remember, can also have layer-specific

    meshes (or even object-specific

    meshes) which allows finer mesheswhere needed and coarser meshes

    where current density is not as high

    (such as a finite ground plane)

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    Edge Mesh Accuracy

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    Mesh: Momentum versus MomentumRFMomentum RF & Polygon Mesh

    Meshing complex geometries with POLYGONAL cells

    Eliminates slivery triangles

    Eliminates redundant R,L,C elements

    Uncompromised accuracy for RF frequencies

    Strongly reduced computer memoryStrongly reduced computation time

    me

    reduction

    reduction

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    Using Momentum

    Solution process

    Select Mode

    Substrate definition

    Port SetupMesh Generation

    Planar Solve

    Display Results

    I1

    I1

    L1

    Method of Moments

    Maxwells Equations

    Matrix Equation

    Equivalent Circuit

    [Z].[I]=[V]

    [Z] = [R] + j[L] + 1/j[C]-1

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    The Low-frequency Breakdown Problem

    This problem is essentially one of mathematical aspect ratios. Whenfunctions are used, the interaction matrix contains all of the reactan

    matrix. As frequency approaches zero, the inductive reactances app

    capacitive reactances approach infinity. This results in an ill-conditio

    Any tool that uses rooftop functions as the sub-sectional basis funct

    problem.

    Momentum (not Momentum RF) experiences this low-frequency limitaccount for this, interpolation is used for three frequencies (in additi

    sweeps): DC, f0, and 2f0. The low-frequency limit (f0, typically in k

    selected in an empirical way and is a function of cell edge lengths an

    increases as cell sizes decrease (resulting in shorter edges).

    Momentum RF alleviates this problem by breaking the rooftop

    star and loop basis functions.

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    MomentumRF & Star-Loop Basis Function

    star basis functionloop basis function

    Loop basis functions are solenoidalStar basis functions are irrotational Rooftop ba

    Star-loop ba

    db(S11)

    db(S11)

    1

    - give well-conditioned interaction

    matrix at low frequencies

    - eliminate LF breakdown of

    numerical solution

    - give stable, accurate solutionsdown to DC (both magnitude and

    phase)

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    Using Momentum

    Solution process

    Select Mode

    Substrate definition

    Port SetupMesh Generation

    Planar Solve

    Display Results

    More on this in the

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    Momentum Accuracy: A couple of absolu

    Directly simulated frequency points have 60 dB accuracy. (Thcharacterized on through-lines. In other words, the observed n

    those structures is ~ -60 dB. This does not mean that valid re

    can not be obtained for designs with an isolation or other figur

    -60 dB.)

    For an AFS sweep, the simulated frequency points have 60 dBAFS calculated frequency points have ~ 50 to 60 dB accura

    The rest depends on how accurately you can define your proble

    Here are a few benchmarks

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    Momentum

    Mesh: 20 cells/wavelength, 3 GHz

    Frequencies: 14

    Matrix size : 218

    Process size : 14.13MB User time : 5 m 14 s

    Momentum RF

    Mesh: 20 cells/wavelength, 3 GHz

    Frequencies: 10

    Matrix size : 56

    Process size : 7.59 MB User time : 45 s

    (*) Example from National Semiconductor

    LTCC Filter Design

    7.29

    mm

    [1] 25.2 mil LTCC

    GND

    AIR

    [2] 3.6 mil[3] 7.2 mil

    d

    pha

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    RFIC/MMIC Applications

    Momentum

    Mesh: 20 cells/wavelength, 5 GHz

    Frequencies: 7

    Matrix size : 274 Process size : 10.29 MB

    User time : 11m 09s

    Momentum RF

    Mesh: 20 cells/wavelength, 5 GHz

    Frequencies: 7

    Matrix size : 35 Process size : 3.33 MB

    User time : 1m 39s

    0.30

    mm 0.80

    mm

    [1] 600 um Silicon =12.5

    GND

    AIR

    [2] 1.7 um

    [3] 1.55 um

    r=3.9

    r=3.9

    PC-NT Pentium II workstation (330 MHz)

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    RFIC / MMIC Applications

    Momentum

    Mesh: 20 cells/wavelength, 50 GHz

    Frequencies: 12

    Matrix size : 221 Process size : 6.32MB

    User time : 2 m 03 s

    Momentum RF

    Mesh: 20 cells/wavelength, 50 GHz

    Frequencies: 10

    Matrix size : 203 Process size : 4.50 MB

    User time : 0 m 26 s

    [1] 100 um GaAs

    GND

    AIR

    0.76

    mm1.65

    mm

    RPC-NT Pentium II workstation (330 MHz)

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    Microwave Lowpass Filter (Stripline)

    Momentum

    Mesh: 20 cells/wavelength, 15 GHz

    Frequencies: 20

    Process size : 18.07MB

    User time : 36 m 07 s

    Momentum RF

    Mesh: 20 cells/wavelength, 15 GHz

    Frequencies: 15

    Process size : 12.29 MB User time : 2 m 21 s

    6.0 mm

    25.4

    mm

    Rule of thum

    [1] 31 mil Duroid

    GND

    [2] 31 mil Duroid

    GND

    PC-NT Pentium II workstation (330 MHz)

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    RF Board Power/Ground

    Momentum Momentum RF

    Measurements

    [1] 59 mil

    AIR

    GND

    FR4

    50.8

    mm

    76.2

    mm

    P1 P2

    50.8

    mm

    76.2

    mm

    P1 P2

    Rule of thumb: freq < 1.63 GHz

    PC-NT

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    RF Board Application

    Mo

    Me

    Po

    Fre

    Ma

    Pr

    Us

    reduced polygonal mesh

    rectangular & triangular mesh

    Momentum RF

    Mesh: 20 cells/wavelength, 1 GHz

    Ports: 60

    Frequencies: 6

    Matrix size : 733

    Process size : 59.35 MB User time : 48m 24s

    S

    35.60 mm

    43.67 mm

    [1] 30 mil

    AIR

    GND

    FR4

    PC-NT Pentium II workstation (330 MHz)

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    Packaging Application

    S(1,3)

    S(1,1)

    Momentum

    Mesh: 20 cells/wavelength, 5 GHz

    Matrix size : 8244

    Process size : > 1 GB

    User time : > 2 days

    Momentum RF

    Mesh: 20 cells/wavelength, 5 GHz

    Matrix size : 1354

    Process size : 106.57MB

    User time : 5h 17m 53s

    port 1

    port 2

    port 3

    7.6 mm

    7.6 mm

    port 4

    ref 3

    ref 4

    1 2

    4 3

    ref 3ref 4

    GNDVboard

    Vchip

    PC-NT Pentium II workstation (330 MHz)

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    Microwave Applications

    Momentum

    Mesh: 10 cells/wavelength, 20 GHz

    Frequencies: 18

    Matrix size : 181

    Process size : 2.92MB

    User time : 1 m 02 s

    Momentum RF

    Mesh: 10 cells/wavelength, 20 GHz

    Frequencies: 14

    Matrix size : 122

    Process size : 2.13 MB

    User time : 0 m 09 s

    radia

    pow

    mag(S21)

    mag(S11)[1] 25 mil Alumina

    GND

    AIR

    6.65

    mm

    9.90

    mm

    Rule oPC-NT Pentium II workstation (330 MHz)

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    Microwave Applications

    Momentum

    Mesh: 20 cells/wavelength, 7 GHz

    Frequencies: 27

    Process size : 8.26MB

    User time : 7 m 53 s

    Momentum RF

    Mesh: 20 cells/wavelength, 7 GHz

    Frequencies: 25

    Process size : 4.75 MB

    User time : 0 m 29 s

    5.21

    mm

    24.82 mm

    mag(S2

    mag(S11

    Rule o

    [1] 25 mil Alumina

    GND

    [2] 185 mil AIR

    PC-NT Pentium II workstation (330 MHz)

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    Digital Application

    full boardisolated trace

    port 1

    port 2

    port 1

    port 2

    S(1,1)

    isolated trace

    S(1,2)

    isolated trace

    Momentum

    Momentum RF

    S(1,1)

    full board

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    Digital Application

    isolated trace

    port 1

    port 2

    0.4 GHz

    output

    S(1,1)

    isolated trace

    S(1,2)

    isolated trace

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    Digital Application

    isolated trace

    port 1

    port 2

    harmonic signal

    2.33 GHz

    no output

    S(1,1)

    isolated trace

    S(1,2)

    isolated trace

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    Digital Application

    harmonic signal

    2.33 GHz

    harmonic signal is coupled to neighbor

    and spread around the board

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    complete list is available at:

    www.agilent.com/find/contactus

    Americas

    Canada (877) 894-4414

    Latin America 305 269 7500

    United States (800) 829-4444

    Asia Pacific

    Australia 1 800 629 485

    China 800 810 0189

    Hong Kong 800 938 693

    India 1 800 112 929

    Japan 0120 (421) 345

    Korea 080 769 0800

    Malaysia 1 800 888 848

    Singapore 1 800 375 8100Taiwan 0800 047 866

    Thailand 1 800 226 008

    Europe & Middle East

    Austria 0820 87 44 11

    Belgium 32 (0) 2 404 93 40

    Denmark 45 70 13 15 15

    Finland 358 (0) 10 855 2100

    France 0825 010 700*

    *0.125 /minute

    Germany 01805 24 6333**

    **0.14 /minute

    Ireland 1890 924 204Israel 972-3-9288-504/544

    Italy 39 02 92 60 8484

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    Spain 34 (91) 631 3300

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    United Kingdom 44 (0) 118 9276201

    Other European Countries:

    www.agilent.com/find/contactus

    Revised: March 27, 2008

    Product specifications and descriptions

    in this document subject to change

    without notice.

    Agilent Technologies, Inc. 2008

    For more information about

    Agilent EEsof EDA, visit:

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    Printed in USA, May 19, 20035989-9598EN

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    This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or

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    line of EEsof electronic design automation (EDA) products and services, please go to:

    www.agilent.com/find/eesof

    Agilent EEsof EDA

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    Agenda for Half-day Momentum Seminar

    30 minutes Brief overview of Getting Started with Momentum Creating/importing artwork in ADS Layout

    Momentum versus Momentum RF Creating substrate stack-ups and mapping layout layers as metallization laye Placing and defining ports Defining mesh parameters

    30 minutes Overview of Viewing and Using Momentum Results Momentum Datasets Momentum Visualization: currents, fields, s-parameters, gamma, Z0 ADS Data Display: s-, y-, and z-parameters, reactance (L/C), Q, etc.

    60 minutes Advanced Topics [Part 1] Momentum Co-simulation (EM/circuit co-simulation) using Layout Component Momentum Co-optimization (EM/circuit co-optimization) using Layout Compon Thick conductor simulations {LAB} Spiral Inductor simulations {LAB}

    15 minutes Break

    105 minutes Advanced Topics [Part 2] Advanced Model Composer (AMC) Advanced Model Composer (AMC) {LAB}

    15 minutes Final Q&A Session

    4 hours 15 minutes

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    freq Independent frequency variable GAMMAn Modal propagation constant of portn(calculated

    differential, and coplanar ports only)

    PORTZn Impedance of Portn

    S S-matrix, normalized to PORTZn

    S(i,j) S-parameters for each port pairing, normalized t

    S_50 S-matrix, normalized to 50 ohms

    S_50(i,j) S-parameters for each port pairing, normalized t

    S_Z0 S-matrix, normalized to Z0

    S_Z0(i,j) S-parameters for each port pairing, normalized t

    Z0n Characteristic impedance of Port n (calculated fdifferential, and coplanar ports only, others are

    Momentum DatasetsVariables Available in the Standard Dataset

    (Note that these are included in the datasets for Momentum simulations bu

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    All standard dataset variables, plus

    S_CONV Boolean results for AFS convergence (succof the entire S-matrix at a given frequency

    S_CONV(i,j) Boolean results for AFS convergence (succ

    of S(i,j) at a given frequency

    S_ERROR Estimated error of the entire S-matrix at a (< -60 dB for converged frequency points)

    S_ERROR(i,j) Estimated error of S(i,j) at a given frequenc(< -60 dB for converged frequency points)

    Momentum DatasetsVariables Available in the AFS Dataset

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    Adaptive Frequency Sampling

    Simple Answer to Convergence

    AFS has converged unless it tells you that it hasn't converged (e.g., when the mathat you specified was too low)

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    AFS Convergence Illustration

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    Momentum Seminar

    AFS Convergence

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    THETA Swept parameter of planar cut

    PHI Swept parameter of conical cut

    Etheta & Ephi Absolute E field strength (V) of theta and phi fa

    Htheta & Hphi Absolute H field strength (A) of theta and phi fa

    Elhp & Erhp Normalized E field strength of LHCP and RHCP

    ARcp Axial ratio, derived from LHCP and RHCP far-fi Eco & Ecross Normalized E field strength of co and cross pol

    ARlp Linear polarization axial ratio, derived from co far-field components

    Gain, Directivity Gain, Directivity, Efficiency (in %), and Effectiv

    Efficiency,Effective Area

    Power Radiation intensity (in watts/steradian)

    Momentum DatasetsVariables Available in the Far-field Dataset

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    Momentum Seminar

    Currents (surface currents)

    S-parameters (mag, re, im, phase, and dB of S(i,j))

    Transmission line data (propagation constant, characteri

    Far-fields (radiation patterns & axial ratio in 3D and 2D)

    Antenna parameters (gain, directivity, pointing angle, etc

    Momentum VisualizationMomentum Visualization Enables You to View and Ana

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    Momentum Seminar

    Momentum Visualization: Surface Currents

    When you scroll from 0-360,

    you are actually varying thephase which illustrates thee^jwt time dependency ofthe surface currents

    The lower and upper values inputinto these fields represents thelowest and highest values of the

    surface current density (A/m)which will be viewedNoteffecurreffe

    You also have theoption to look at theanimated currentswhen click on the

    Display Propertiesbutton

    Note: when you are viewing the results for a slot metallization layer, the MAGNETIC currenELECTRIC currents. You will also be viewing the mesh in the slots instead of a mesh on themesh for a slot layer.

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    Momentum Visualization: Surface Currents

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    Momentum Seminar

    Momentum Visualization:Far-field Radiation Patterns and S-parameters

    R

    M

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    ADS Data Display: S-parameters, L, and Q of an InduPowerful post processing data advantage of countless built-in

    flexibility to wrote your own (thequations in a schematic or equat

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    www.agilent.com/find/emailupdates

    Get the latest information on the

    products and applications you select.

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    contact your local Agilent office. The

    complete list is available at:

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    Asia Pacific

    Australia 1 800 629 485

    China 800 810 0189

    Hong Kong 800 938 693

    India 1 800 112 929

    Japan 0120 (421) 345

    Korea 080 769 0800

    Malaysia 1 800 888 848

    Singapore 1 800 375 8100Taiwan 0800 047 866

    Thailand 1 800 226 008

    Europe & Middle East

    Austria 0820 87 44 11

    Belgium 32 (0) 2 404 93 40

    Denmark 45 70 13 15 15

    Finland 358 (0) 10 855 2100

    France 0825 010 700*

    *0.125 /minute

    Germany 01805 24 6333**

    **0.14 /minute

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    Italy 39 02 92 60 8484

    Netherlands 31 (0) 20 547 2111

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    www.agilent.com/find/contactus

    Revised: March 27, 2008

    Product specifications and descriptions

    in this document subject to change

    without notice.

    Agilent Technologies, Inc. 2008

    For more information about

    Agilent EEsof EDA, visit:

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    Printed in USA, May 19, 20035989-9599EN

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    This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or

    inaccurate references. We regret any inconvenience this may cause. For the latest information on Agilents

    line of EEsof electronic design automation (EDA) products and services, please go to:

    www.agilent.com/find/eesof

    Agilent EEsof EDA

    eta e resentaton on omentum

    vanceTopics - (Part 1 of 5)

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    Momentum Seminar

    Agenda for Half-day Momentum Seminar

    30 minutes Brief overview of Getting Started with Momentum

    Creating/importing artwork in ADS Layout

    Momentum versus Momentum RF Creating substrate stack-ups and mapping layout layers as metallization laye Placing and defining ports Defining mesh parameters

    30 minutes Overview of Viewing and Using Momentum Results

    Momentum Datasets Momentum Visualization: currents, fields, s-parameters, gamma, Z0 ADS Data Display: s-, y-, and z-parameters, reactance (L/C), Q, etc.

    60 minutes Advanced Topics [Part 1] Momentum Co-simulation (EM/circuit co-simulation) using Layout Component Momentum Co-optimization (EM/circuit co-optimization) using Layout Compon Thick conductor simulations {LAB} Spiral Inductor simulations {LAB}

    15 minutes Break

    105 minutes Advanced Topics [Part 2]

    Advanced Model Composer (AMC) Advanced Model Composer (AMC) {LAB}

    15 minutes Final Q&A Session

    4 hours 15 minutes

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    Momentum Component (EM/circuit co-simulation

    ADS circuit simulation

    Layout setup

    Momentum C

    EM/Circuit co-simulation from theschematic environment

    Transparent integration of electromagneticsimulators at the schematic design level

    Include physical layout parasitics in

    schematic Momentum simulation options accessible

    from schematic

    Compiled Layout Components listed inprojects hierarchy

    Model database for reuse option ADS 2002C: EM/Circuit co-

    optimization

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    Momentum Component (EM/circuit co-simulationExample included in ADS 2002 & higher

    EM/Circuit co-simulation from theschematic environment

    C:\ADS2002\Examples\Momentum\emcktcosim\LTCC_prj

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    Momentum Component (EM/circuit co-simulationExample included in ADS 2002 & higher

    EM/Circuit co-simulation from theschematic environment

    C:\ADS2002\Examples\Momentum\emcktcosim\LNAEmCktCosim_prj

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    Momentum Seminar

    Momentum Component (EM/circuit co-simulationExample included in ADS 2002 & higher

    Example begins wand uses Layout>Layout to create

    2. Note that vendor component libraries

    were utilized for lumped element andactive device artwork. Also note thata ground plane has been added withuniform clearance aroundtraces/components.

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    Momentum Component (EM/circuit co-simulationExample included in ADS 2002 & higher

    3. A symbol is defined for the schematicsubcircuit and then it is placed in a toplevel design for simulation using the

    component library browser. (Theresults of this simulation will becompared to the results of the nextsimulation, which will include thephysical effects.)

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    Momentum Component (EM/circuit co-simulationExample included in ADS 2002 & higher 4. The artwor

    include the poured grground planall connectbias, and onelements)

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    Momentum Seminar

    Momentum Component (EM/circuit co-simulation)Example included in ADS 2002 & higher (slightly modified

    5. The standard example is then slightlymodified to include layout componentparameters (new in ADS 2002C).These parameters will be used to seethe effects of a via location on gain.

    Modified version provided:

    (LNAEmCktCosim_prj.zap)

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    Momentum Component (EM/circuit co-simulation)Example included in ADS 2002 & higher (slightly modified

    6. The Layout/Momentum component isthen created

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    Momentum Component (EM/circuit co-simulation)Example included in ADS 2002 & higher (slightly modified

    7. Next, the Layout/Momentum component is placed in a schematic using the compolike any other subcircuit/component). All of the lumped elements and the active the pins (ports in layout are replaced with pins in the Momentum Component sym

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    Momentum Component (EM/circuit co-simulation)Example included in ADS 2002 & higher (slightly modified

    8. Once the model details are selected (Mode MomMW, MomRF, or data file; Frequproperties), the parameters of the Layout/Momentum component are then definedbe passed down from the top design. This is made possible by the next step, whParameters submenu.

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    Momentum Component (EM/circuit co-simulation)Example included in ADS 2002 & higher (slightly modified

    9. The variables are now defined for this subcircuit. Note that we could have just pcomponent directly into the top level schematic, but this illustrates two methodsschematic.

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    Momentum Component (EM/circuit co-simulation)Example included in ADS 2002 & higher (slightly modified

    10. The subcircuit that includes theLayout/Momentum component is thenplaced in a top level design for

    simulation using the componentlibrary browser. (The results of thissimulation will be compared to theresults of the original simulation,which did not include the physicaleffects.)

    11. Note the use of vswept using the component.

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    Momentum Component (EM/circuit co-simulation)Example included in ADS 2002 & higher (slightly modified

    12. When each iteration osimulation encounterLayout/Momentum co

    new values for paramMomentum simulatioautomatically invokedbackground (for each not previously solved

    Modified version provided:

    (LNAEmCktCosim_prj.zap)

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    Momentum Component (EM/circuit co-simulation)Example included in ADS 2002 & higher (slightly modified

    13. Finally, the reare comparedthe Momentu

    also be studieInitial s

    Momen

    Momen

    with swModified version provided:

    (LNAEmCktCosim_prj.zap)

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    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Adding Layout Parameters

    Enables to sweep, tune or optimize geometrical va

    layout

    - typical dimensions (length, width, gaps, spacing,)

    - interdependent layout modifications (e.g. length and width va

    - port locations

    Two ways to create a parameterized layout compon

    1. Using nominal/perturbed layout artwork (Momentum Optimiz

    2. Using existing (built-in or GCC defined) layout artwork macro

    Nominal/Perturbed layout p

    Subnetwork layout parame

    NEW

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    Adding Layout Parameters

    Momentum > Component > Parameters

    Opens the Layout Component Parameters dialog

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    Adding Layout Parameters

    Defining a Nominal/Perturbed Layout Parameter

    Define the name

    Define the type o

    Enter the nomin Enter the pertur

    Edit the perturba

    if no AEL artwork macro available

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    Adding Layout Parameters

    Steps

    1. Select points in layout

    2. Select perturbation type3. Insert perturbation values4. Apply the perturbation

    Repeat these stepsClick OK to terminate

    AEL artwork macro is created

    primitive layout component

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    Adding Layout Parameters to a Subnetwork

    Defining a Subnetwork Layout Parameter

    Define the name

    Define the type o Enter the defaul

    Associate the pa

    subnetwork pa

    If artwork macro IS available

    hierarchical layout component

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    Adding Layout Parameters to a Subnetwork

    Use the subnetwork layout parameter to set the parameter v

    more subnetwork parameters in the design

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    Creating a Component

    Momentum > Component > Create/Update

    Opens the Create Momentum Component dialog

    Dialog Entries: Symbol, Model Parameters and Model Data

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    EM Model Database

    The simulated S-parameter models are

    stored in an EM Model Database for later

    reuse

    During the Component Create/Update, the

    user has the option to:

    - delete all previous entries in the model

    database

    - add the last simulation results obtained

    from Momentum simulation in Layout to

    the model database

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    Instance Parameter Dialog

    Double clicking on the Layout Component Instances in the Sch

    Environment opens the Instance Parameter Dialog

    In the Model Page, the user can specify the

    - Model Type selection

    - Model Parameter values

    - Model Database Reuse option

    In the Display Page, the user can specify

    which model parameters are visible in theschematic design

    In the Parameters Page, the user can

    specify the layout parameter values and

    the optimization setup (optional)

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    Model Interpolation

    Pushing the Options.. button brings up

    the Set Interpolation Options dialog

    Allows to specify the interpolation delta

    values for each layout parameter

    Default values for the interpolation deltas are

    provided (derived from the model parameters)

    The EM model database can use

    interpolation to significantly enhance

    the efficiency of the co-simulation

    The Layout Parameters are treated ascontinuous parameters

    Instance Dialog box

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

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    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Seminar

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Seminar

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Seminar

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Seminar

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Seminar

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Seminar

    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_pr

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    Momentum Co-OptimizationEM/circuit co-optimization (layout/Momentum component

    Electronic

    notebook for

    LTCCEM/circuit co-

    optimization

    example

    (shipped withADS 2002C and

    higher) examples/Momentum/emcktcosim/LTCC_prj

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    www.agilent.com/find/emailupdates

    Get the latest information on the

    products and applications you select.

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    Quickly choose and use your test

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    Agilent Email Updates

    Agilent Direct

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    complete list is available at:

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    Japan 0120 (421) 345

    Korea 080 769 0800

    Malaysia 1 800 888 848

    Singapore 1 800 375 8100Taiwan 0800 047 866

    Thailand 1 800 226 008

    Europe & Middle East

    Austria 0820 87 44 11

    Belgium 32 (0) 2 404 93 40

    Denmark 45 70 13 15 15

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    France 0825 010 700*

    *0.125 /minute

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    Other European Countries:

    www.agilent.com/find/contactus

    Revised: March 27, 2008

    Product specifications and descriptions

    in this document subject to change

    without notice.

    Agilent Technologies, Inc. 2008

    For more information about

    Agilent EEsof EDA, visit:

    www.agilent.com/find/eesof

    Printed in USA, May 19, 20035989-9600EN

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    This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or

    inaccurate references. We regret any inconvenience this may cause. For the latest information on Agilents

    line of EEsof electronic design automation (EDA) products and services, please go to:

    www.agilent.com/find/eesof

    Agilent EEsof EDA

    eta e resentaton on omentum

    vanceTopics - (Part 2 of 5)

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    Momentum Seminar

    Agenda for Half-day Momentum Seminar

    30 minutes Brief overview of Getting Started with Momentum

    Creating/importing artwork in ADS Layout Momentum versus Momentum RF Creating substrate stack-ups and mapping layout layers as metallization laye Placing and defining ports Defining mesh parameters

    30 minutes Overview of Viewing and Using Momentum Results

    Momentum Datasets Momentum Visualization: currents, fields, s-parameters, gamma, Z0 ADS Data Display: s-, y-, and z-parameters, reactance (L/C), Q, etc.

    60 minutes Advanced Topics [Part 1] Momentum Co-simulation (EM/circuit co-simulation) using Layout Component Momentum Co-optimization (EM/circuit co-optimization) using Layout Compon Thick conductor simulations {LAB} Spiral Inductor simulations {LAB}

    15 minutes Break

    105 minutes Advanced Topics [Part 2]

    Advanced Model Composer (AMC) Advanced Model Composer (AMC) {LAB}

    15 minutes Final Q&A Session

    4 hours 15 minutes

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    Momentum Seminar

    1. Polygon

    2. Rectangle or square

    3. Polyline

    Vias must

    through ea

    substrate l

    through

    An Aside: Vias in Momentum

    For vias, only vertical currents and surface impedances are taken into accoumind that the horizontal and rotational currents are not included. One possi

    be used to obtain more complete current calculations is to break up the via sshape, even that of a transmission line or spiral inductor) into a few thinner geometry on horizontal metallization layers as well. Make sure that providethickness parameters for only one of the horizontal metallization layers; othewill be calculated.

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    An Aside: Vias in Momentum

    Vias are treated as one cell (in the vertical axis);therefore, the thickness of substrates whichcontain vias is limited to ~ 1/10th to 1/20th ofa wavelength (at the highest simulationfrequency). Vias passing through thickersubstrates can be accurately represented bysplitting these thick substrates into multiple

    layers.

    Please note that you can view both the meshand the surface current density (A/m) of viastructures using Momentum Visualization

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    Thick Conductor SimulationsMomentum model Finite Thickness Conductors

    Zero thickness approach

    loss formulation

    Finite thickness approach

    loss formulation

    current modeling

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    Momentum Seminar

    Thick Conductor SimulationsConductor Loss in Momentum: Zero Thickness Approach

    The Surface Impedance Concept is used to modelconductor losses in metallizations

    t

    Zs(t,

    3D conductor Sheet conductor

    The Surface Impedance Model Zs(t,,) takes the fthickness and frequency dependency (skin effect) of thconductor loss into account

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    Thick Conductor SimulationsConductor Loss in Momentum: Zero Thickness Approach

    ( )tj

    jZ

    cs

    coth

    +=

    )( jjc

    +=

    +=

    s

    s

    jZ

    coth

    )1(

    2

    =s

    >>

    tZ

    s

    1=

    s

    s

    jZ

    )1( +=

    LF :

    HF :

    t

    s

    LF currentsection of

    HF currendepth sur

    The Surface Impedance formula:

    =4.5e7 S/m

    1 MHz 7510MHz 23100MHz 7.1 GHz 2.

    Skin depth

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    Momentum Seminar

    Thick Conductor SimulationsConductor Loss in Momentum: Finite Thickness Approa

    3D conductors:

    drawn on 2 layers (, t/2) connected with vi

    LF currents run in entire crosssection of the metalization

    t/2

    LF :

    HF currents run in DOUBLE

    skin depth surface layer

    sHF :

    Better loss modelingBetter current modeling (inductive)

    Zs(t/2,,bottom me

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    Momentum Seminar

    Thick Conductor SimulationsCurrent Modeling in Momentum for 3D Conductors

    x,y surface currents on top and bottom of finitez-surface currents on vias (side walls of finite t

    x

    yz

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    Thick Conductor SimulationsConductor Loss in Momentum - what to use?

    Rule of thumb: w

    t

    w/t > 5h/w > 10

    h

    Use 1 zero thickness conductor with correct loss specific

    other cases

    2 metallization layers + vias

    groun

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    Thick-conductor Approach: Two Approaches

    , t/2

    , t/2 stripviastrip

    2 metallization layers + viaslayer3: p

    Air (E

    Subst

    thick conductor

    Port 1

    Port 2

    For Single Trace Stimulus: Common-mode ports

    Port 1

    Port 2

    For Two or More Coupled Traces: Single ports in layout, recombin

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    Thick-conductor Approach: For Single Trace

    Port 3

    Port 1

    For Single Trace Stimulus:

    Common-mode ports in Layout/Momentum are

    Port 2

    Port 4

    Example:

    Ports 1&3 are associated ascommon-mode ports, as are

    ports 2&4

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    Momentum Seminar

    Agenda for Half-day Momentum Seminar

    30 minutes Brief overview of Getting Started with Momentum

    Creating/importing artwork in ADS Layout Momentum versus Momentum RF Creating substrate stack-ups and mapping layout layers as metallization laye Placing and defining ports Defining mesh parameters

    30 minutes Overview of Viewing and Using Momentum Results

    Momentum Datasets Momentum Visualization: currents, fields, s-parameters, gamma, Z0 ADS Data Display: s-, y-, and z-parameters, reactance (L/C), Q, etc.

    60 minutes Advanced Topics [Part 1] Momentum Co-simulation (EM/circuit co-simulation) using Layout Component Momentum Co-optimization (EM/circuit co-optimization) using Layout Compon Thick conductor simulations {LAB} Spiral Inductor simulations {LAB}

    15 minutes Break

    105 minutes Advanced Topics [Part 2]

    Advanced Model Composer (AMC) Advanced Model Composer (AMC) {LAB}

    15 minutes Final Q&A Session

    4 hours 15 minutes

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    Momentum Seminar

    Thick-conductor Approach: For Single TraceMicrostrip Coupled-line Filter Example: initial layout for

    from schematic (substrate definition also updated from

    filter_thick_metal_prj/DA_CLFilter1_untitled1.dsn

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    Momentum Seminar

    Thick-conductor Approach: For Single TraceMicrostrip Coupled-line Filter Example: verify substrate

    metallization definitions

    filter_thick_metal_prj/DA_CLFilter1_untitled1.dsn

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    Momentum Seminar

    Thick-conductor Approach: For Single TraceMicrostrip Coupled-line Filter Example: initial Momentu

    filter_thick_metal_prj/DA_CLFilter1_untitled1.dsn

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    Momentum Seminar

    Thick-conductor Approach: For Single TraceMicrostrip Coupled-line Filter Example: save as new des

    components to enable copy-to-layer for the thick-conduc

    filter_thick_metal_prj/DA_CLFilter1_untitled1_thick.dsn

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    Momentum Seminar

    Thick-conductor Approach: For Single TraceMicrostrip Coupled-line Filter Example: now begin copy

    to the first two additional layers

    filter_thick_metal_prj/DA_CLFilter1_untitled1_thick.dsn

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    Momentum Seminar

    Thick-conductor Approach: For Single TraceMicrostrip Coupled-line Filter Example: now copy