Presentation Material for Assembly Manufacturing …...1 Presentation Material for Assembly...

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Presentation Material for

Assembly Manufacturing Site Change

Issue Date ：July 27 , 2015 Toshiba Corporation Semiconductor & Storage Company Quality Promotion Center

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Change Reason J–Devices Corporation Kitakami Center (Former name : Amkor Iwate Company, Ltd.)

who is the outsource of our assembly process, has merged to J-Devices Corporation

on Dec. 31, 2014. And beginning their business as J-Devices Corporation Kitakami

Center.

Kitakami Center and Kyushuu sites in J-Devices Corporation have same type

package lines in each manufacturing site.

As Kyushuu district is main manufacturing sites in J-Devices Corporation,

Therefore same type packages would be integrated into Kyushuu sites.

Change Effect Manufacturing is enhanced with site integration.

(1) Delivery :

Flexibility improvement in order to meet to stable supply & TAT

requirement.

(2) Engineering/Quality:

It aims to improve of engineering & quality level that gathering

product engineers & QA engineers into Kyushuu district, and

production with higher level manufacturing equipment,

1. Change Reason

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【Current Site】【Transferred Sites】

Former Amkor Iwate Company J-Devices Corporation

QFP（LQFP,TQFP,FP） => Usuki Center

DIPN42 => Fukuoka Center

BGA（CABGA,CTBGA,CVBGA） => Kitsuki Center

Transferred site

(J-Devices Corporation)

J-Devices Corporation

Kitakami Center (Former Amkor Iwate Company, Ltd.)

Usuki Center

(1) QFP（Logic）

Fukuoka Center

(2) DIPN42（Logic）

Kitsuki Center

(3) BGA（Memory/Logic）

2. Applicable Products

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3. Sites Introduction (Current/Transfer)

【Location】

Manufacturing sites Domestic 10 sites

Usuki, Kitsuki, Fukuoka, Oita,

Miyagi, Aizu, Kitakami

JS Hakodate, JS Fukui, JS Kumamoto

Domestic Sales Office

Yokohama-shi, Kanagawa Pref.,

Yokkaichi-shi, Mie Pref.

Development Center

Yokohama HQ (Yokohama-shi),

Neagari (Nomi-shi, Ishikawa Pref.)

Company Outline

Company Name : J-Devices Corporation

CEO ：Yoshifumi Nakaya

Registered HQ : 1913-2 Fukura Usuki-shi Oita

HQ functions : 1-1-32 shinurashima-cho, Kanagawa-ku,

Yokohama-shi, Kanagawa Pref.

Business Activities :

Semiconductor Assembly Process

（Wafer test, Assembly, Final test）

Establishment : 1970

Capital : 5.1 billion JPY

Stockholders :

Amkor Technology 65.7%

Former Nakaya Micro Device (NMD) 34.3%

Sales : Approximately 100 billion JPY (as of 2014/group total)

# of employees : Approximately 4,700

(as of 2015 Jan./ group employees total )

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3-1. Site Introduction (Transferred site)

Usuki Center Outline

北上センター

宮城センター

会津センター

根上センター

杵築センター福岡センター

臼杵センター臼杵センター

(大分地区)

Address : 1913-2 Fukura, Usuki-shi, Oita Pref.

Business Activities : Semiconductor Assembly & Test

Product : QFP

Certification : ISO9001, TS16949 & ISO14001

Usuki Center

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北上センター

宮城センター

会津センター

根上センター



(大分地区)

Address : 476-1 Kamiokuma, Miyawaka-shi, Fukuoka Pref.


Product : SIP/DIP/SOP/QFP/QFN


Fukuoka Center Outline


Fukuoka Center

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北上センター

宮城センター

会津センター

根上センター



(大分地区)

Address : 2820-2 Minami-kitsuki, Kitsuki-shi, Oita Pref.


Product : BGA products


Kitsuki Center Outline


Kitsuki Center

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Plating outsource “Mihara Kinzoku Kougyo” outline

Company Name : Mihara Kinzoku Kougyo

CEO : Mitsuhiro Mihara

Address : 3-3 Yuubaru-cho, Yahatanishi-ku,

Kitakyushu-shi, Fukuoka Pref.

Business activities :

- Semiconductor Assembly process/Outer plating,

- Various electrolytic plating,

- Semiconductor lead frame plating

Establishment : 1949

Capital : 49.5 million JPY

# of Employees : 278（as of Jan. 2015）

Outer plating production volume :

（For J-Devices assembly products as of 2014）

- SnBi plating : 10Mp and over/month

- SnAg plating : 30Mp and over/month

Quality Management System Certification :

ISO9001, ISO/TS16949 & ISO14001

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5M1E Change Point

Man （AIC）Operator => （JD）Operator Operator with same education will engage.

Machine Machine with same level will be used.

Measurement Measurement Equipment with same level will be used.

Method Same manufacturing flow and control will be applied.

Material Same material will be applied.

Environment （AIC）Manufacturing line => （JD）Manufacturing line JD line has activity for other semiconductor manufacturing.

(AIC) : Amkor Iwate (JD) : J-Devices

Change Plan

4. Change Plan

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Subject Current After change

Site

Assembly Former Amkor Iwate J devices

Test Former Amkor Iwate J devices

Plating Mizusawa semiconductor, KEDC Mihara Kinzoku Kougyo

Machine

Assembly Existing machine in former

Amkor Iwate

Existing machine in

J-Devices and transferred

machine from former

Amkor Iwate

Plating Mizusawa semiconductor

(Machine : Fuji Seiki)

Mihara Kinzoku Kougyo

(Machine : Fuji Seiki)

Product visual No change

Product dimension No change

Material

Lead frame No change

Die bond paste No change

Bonding wire No change

Mold compound No change

Plating SnBi Plating with same composition ratio

Process Flow No change

4.1 Change plan

Change plan detail

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Please confirm next page for evaluation plan

5. Risk Analysis to Change

Process Function (Purpose) Failure Mode Root cause

Factor

Effectiveness to customer line or

market

Design for removing risk

Recommended action（DRBFM Result）

Evaluation item based on DRBFM

Process control item based on DRBFM

BSG Wafer Grinding

Wafer Crack/Chipping

Improper MFG parameter Function failure To apply proven parameter Visual inspection Visual inspection

Thickness abnormality

Improper MFG parameter Function failure To apply proven parameter Thickness check Thickness check

Dicing Wafer cutting

Chipping Improper dicing parameter Function failure To apply proven parameter Visual inspection

Chipping measurement

Visual inspection Kerf check/Blade Life control

Cut position off set Improper dicing parameter Function failure To apply proven parameter Visual inspection

Off set check

Blade Life control Table parallelism check /Flange accuracy check

Die Attach Fixing chip

Paste thickness abnormality

Parameter set up miss

Thermal resistance failure Set up parameter check Paste thickness check IQC control

Insufficient die shear strength

Parameter set up miss Electrical failure Set up parameter check Die shear strength check IQC control

Paste wettability abnormality

Parameter set up miss Electrical failure Set up parameter check Paste wettability check IQC control

Wire Bonding Connecting bonding pad to lead

Wire connecting failure

Improper bonding parameter Function failure To apply proven parameter Ball shear/Wire pull strength

check Ball shear/Wire pull control

Mold Injecting mold compound

Wire deformation

Improper die set temperature Function failure To apply proven

temperature Wire sweep rate measurement

Wire sweep measurement Die set temp check

Improper mold parameter Function failure To apply proven mold

parameter Wire sweep rate measurement

Wire sweep rate measurement

Incomplete mold failure

Improper die set temperature

Visual failure Function failure

To apply proven temperature Visual inspection Visual inspection

Die set temp check Improper mold parameter

Visual failure Function failure To apply proven parameter Visual inspection Visual inspection

PKG dimension failure

Improper die set design PKG mounting failure Design based on PKG and

substrate drawing PKG dimension measurement Dimension measurement

Ball attach Placing ball on the land

Insufficient ball shear strength Flux shortage PKG mounting failure Pin design optimization

Squeegee Gap optimization Ball shear strength measurement

Ball shear strength measurement

Mark Identification Visibility deterioration Improper parameter Visual failure To apply existing parameter Visibility check Visual inspection

Trim / Form Processing outer lead

Lead deformation Incorrect PKG position in die set PKG mounting failure To apply proven machine Co-planarity

Skew Visual inspection

Bent width abnormality Die set malfunction PKG mounting failure To apply existing parameter Dimension measurement Visual inspection

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Process Item Sample Size QFP DIP BGA Unit Back Grind Back Grind thickness 3Wafer ● ● ●

Evaluation Back Grind visual 3Wafer ● ● ● Dicing Visual 3Wafer ● ● ●

Kerf width 15p x 3Wafer ● ● ● Chipping 22p x 3Wafer ● ● ●

Die Attach Wettability/Fillet height 32p x 3Lot ● ● ● Paste Thickness 32p x 3Lot ● ● ● Die shear strength/Mode 32p x 3Lot ● ● ● Wire Bonding Ball shear strength 32p x 3Lot ● ● ● Wire pull strength 32p x 3Lot ● ● ● Mold Wire Sweep 32p x 3Lot ● ● ● Package size 32p x 3Lot ● ● ● Mold Visual 32p x 3Lot ● ● ● Plating Plating composition 32p x 3Lot ● ● ●

Plating thickness 32p x 3Lot ● ● ●

Solderability 32p x 3Lot ● ● - Ball mount Ball shear strength 32p x 3Lot - - ● Mark Mark visibility 32p x 3Lot ● ● ● Trim/Form Total length 32p x 3Lot ● ● -

Lead length 32p x 3Lot ● - - Package size (X/Y) 32p x 3Lot ● ● ●

Bent width/Angle 32p x 3Lot - ● - Co-planarity 32p x 3Lot ● - ●

Skew 32p x 3Lot ● - -

Above evaluation items will be applied for unit evaluation.

6. Evaluation Plan

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Process Item Sample Size LQFP DIP BGA

Reliability Evaluation MRT(PKG Heat resistance) 32p x 3Lot ● ● ●

Item TCT 32p x 3Lot ● ● ●

PCT 32p x 3Lot ● ● ●

7. Reliability Evaluation Plan

Above evaluation items will be applied for reliability evaluation.

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Category Item Spec Judgment

Environment Temperature

CR :20~28℃ Normal room:15~30℃

Significant difference

comparison

Humidity 30～70% Significant difference

comparison

Particle count φ 0.5um

Less than1000pcs Significant difference

comparison

Deionized water

More than 12MΩ Significant difference

comparison

Floor resistance

0.1～1000MΩ Significant difference

comparison

Operator certification All process

(All operators) -

To Meet certification spec

Spec judgment and significant difference comparison will be applied for environment

evaluation

8. Environment Evaluation Plan

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9-1. identification･･･（Oita）product（example）

Correspondence according to customer

current After change

Custom product general-purpose product

Product Name 86CS49FG-7GD6(OA 86CS49FG-7GD6(OA 86CS49FG-7GD6(OA

Logistic Center 58W 580 580

Product Code 361D2739 361D2739 3XXXXXXX

Label Type 86CS49FG-7GD6 86CS49FG-7GD6 86CS49FG-7GD6

Label Add (OA (OA (OA

Weekly Code □□□□H□L □□□□I□L □□□□I□L

Label indication

Product marking

①Product Name add：(OA ②Logistic Center：change 58W ⇒ 580 ③Product Code：36D2739 ④Weekly Code：change H□L ⇒ Ｉ□L

①Product Name add：(OA ②Logistic Center：change 58W ⇒ 580

③Product Code：change to 3XXXXXXX ④Weekly Code：change H□L ⇒ Ｉ□L

① ①

② ②

③

④ ④

③

・Identification control is carried out by “Weekly Code”.（Identification before or after change is possible by checking product marking and bar-code label.) ・Regarding the “general-purpose product”, it is delivered to many customers. Therefore, product name is different before and after the change, from a viewpoint of Toshiba shipment control.

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9-2. identification･･･（Iwate）product（example）

Correspondence according to customer

current After change

Custom product general-purpose product

Product Name TMP93PW40EFG(Z) TMP93PW40EFG(Z) TMP93PW40EFG(Z)

Logistic Center 46X 46Y/46Z 46Y/46Z

Product Code 36138341 36138341 3XXXXXXX

Label Type TMP93PW40EFG TMP93PW40EFG TMP93PW40EFG

Label Add (Z) (Z) (Z)

Weekly Code □□□□E□I □□□□F□I □□□□F□I

Label indication

Product marking

TOSHIBA

TMP93PW40EFG

JAPAN □□□□E□I

xxxxxxxx

TOSHIBA

TMP93PW40EFG

JAPAN □□□□F□I

xxxxxxxx

TOSHIBA

TMP93PW40EFG

JAPAN □□□□F□I

xxxxxxxx

46X XXXXXXX

36138341

(Z)

EAI 46Y XXXXXXX

36138341

(Z)

FAI

① ②

③

④

①Product Name add：(Z) ②Logistic Center：change 46X ⇒ 46Y/Z

③Product Code：36138341 ④Weekly Code：change E□I ⇒ F□I

46Y XXXXXXX

3XXXXXXX

FAI ②

④ ③

①Product Name add：(Z) ②Logistic Center：change 46X ⇒ 46Y/Z ③Product Code：change 36138341 ⇒ 3XXXXXXX

④Weekly Code：change E□I ⇒ F□I

①

・Identification control is carried out by “Weekly Code”.（Identification before or after change is possible by checking product marking and bar-code label.) ・Regarding the “general-purpose product”, it is delivered to many customers. Therefore, product name is different before and after the change, from a viewpoint of Toshiba shipment control.

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2015/

Feb. Mar. Apr. May Jun. Jul. Aug. Sep. Oct. Nov.

PCN Notification

Equipment set up

Evaluation

Evaluation result announcement

Customer Approval (We will proceed the change after the approval.）

10. General Schedule

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Regarding this line transfer, J-Devices will manufacture with same process flows & materials, which is used in current site (= former Amkor Iwate). This transfer is carried out based on our schedule, after that, the evaluation result will be reported to you. If you have any questions or requests, please contact to us. Until customer approval is completed, production would be operated at current site (= former Amkor Iwate). However we hope your early approval.

11. Summary

Presentation Material for Assembly Manufacturing …...1 Presentation Material for Assembly...

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