High Speed PCB DesignHigh Speed PCB Design

Ride the Wave Workshop

Post Route Analysis of a High Post Route Analysis of a High Speed PCB DesignSpeed PCB Design

Design/Analysis forPower Delivery System (PDS)

Post Route Analysis of a High Post Route Analysis of a High Speed PCB DesignSpeed PCB Design

• In today’s world, the demand for ultra-high-speed PCB design is on the rise

• Engineers are assigned the task of design mixed analog and fast rise-time digital boards, and have all signals arrive at their destination cleanly

• With the advance of highly specialized design and layout software, the design of these boards has become increasingly ‘easy’ (automated)

• These physical design and layout tools can be provided with design constraints and auto-routed easily, resulting in increased productivity of the layout engineer and contributions to signal integrity problems

Designing for the Future

• The advancement of design and layout software needs to be matched by the accompanying advancement in powerful ANALYSIS tools used to solve timing delays, mismatched line impedances, crosstalk, and dielectric loss on high speed lines

• Just as an auto-layout program cannot layout 100 percent of the nets on a complex, high-speed board, an analysis tool cannot default to 2-dimensional field solvers and behavioral models on 100 percent of the nets on a PCB.

• Many nets on a board may be analyzed accurately using 2-d solvers. However, critical signals will require a full 3-d solver that does not default to an ‘ideal’ case for the current return path. The full 3-d solver will take into account ground planes with holes, cutouts or that are split. Changes in reference planes, cutouts, and coupling to power/ground planes are other situations that require a full 3-d solver

Designing for the Future

• Show the integration between Allegro and PCB/MCM

• Show mixed 2D and 3D extractions

• Show single net and multiple net simulations

• Show how to investigate signal integrity issues caused by meandering traces used for timing delays

• Show Crosstalk simulations on a victim net in the design

• Show how to setup up differential pair simulations

• Show comparison between full 3D PEEC solutions and mixed 2D/3D subcircuits

Goals for this Presentation

INTEGRATION

Automatic Translation

Net Name MAA4

2D Cross-section of every net in board

3D Via parasitics calculated for every

via in board

3D Via Parasitics

A 3D model is used to calculate all via parasitics.

Single Net-by-Net Simulations

Risetime of 500 ps.

Near End Far End

Source

Single Net-by-Net Signal Integrity Violations

• Quickly screen information for every net on the board for violations such as Propagation Delay and Settling times

Risetime of 200 ps.Near End Far End

Source

Single Net-by-Net Simulations

Single Net-by-Net SimulationsRisetime of 200 ps. with coupling Source

Near End Far End

Coupled traces

Crosstalk Simulation – The Setup

B

Victim Net – MAB9

Aggressor Nets – MAA4, MAA5

Aggressor Nets – MAA9, MAB10

! Create 2D cross-sections of single line and mutual parasitics for all 5 nets

! Apply 3.3V pulse to one terminal of MAA4, MAA5, MAA9 and MAB10, and put 75 ohm terminators on the other terminals

! Terminate net MAB9 with 75 ohm terminators at each end

The above 3 steps are done by the program automatically.

! First run simulation with 0.5 ns rise/fall time, then run again with 0.2 ns rise/fall time

Crosstalk Simulation – The Setup

Near End

Far End

Risetime of 500 ps.

Crosstalk Simulations

Near End

Far End

Risetime of 200 ps.

Crosstalk Simulations

MD32

MD33

Differential Pair

Differential Signaling with Linear Source

Source Near End

First ViaSecond Via

Risetime of 200 ps.

Vcc Plane

GND Plane

When to Analyze in 3D?

Top View

Bottom View

• Split/partial Plane

• Via Coupling

• Change in Reference Plane

• Ground Discontinuity

• Correctly Model Return Path

• Power/ground Bounce

+-

+-

Comparison of Mixed 2D/3D with IBIS Driver/Receiver

Mixed 2D/3D Parasitic Extraction

PEEC Parasitic Extraction

IBIS Driver

IBIS Driver

IBIS Receiver

IBIS Receiver

IBIS Driver/Receiver with Mixed 2D/3D model

Source

Near End

First ViaSecond Via

IBIS Driver/Receiver with 3D model

Source

Near End

First ViaSecond Via

t (seconds)

Vol

ts

IBIS Waveforms

3D Model

What did we learn?

• How PCB/MCM is tightly integrated with Allegro

• How automatically mixed 2D and 3D extractions are performed

• How single net and multiple net simulations are performed

• How Crosstalk simulations on a victim net can be seen

• How differential signaling can be performed

• How the 3D PEEC model compared with the mixed 2D/3D simulations using an IBIS model

Design/Analysis for

Power Delivery System (PDS)

High-Speed

Digital Device

Power

Delivery System

I

V

IVZ =

The Impedance see into PDS at the device should keep low from DC to several harmonics of clock frequency!

f

|Z|

Mag. of Z

targetZ

The Impedance of PDS

Target Impedance Calculation

3.3v""""1.8vConverter

3.3vVRM

4A

2A

2A 1.8v small plane

3.3v plane

( ) ( )Current

RippleAllowedVoltageSupplyPowerZ Target

×=

( ) ( ) Ω=×= mA

vZ 452

%58.1v)Target(1.8

( ) ( ) Ω=×= mA

vZ 5.822

%53.3v)Target(3.3

Hardware Example

PDS Components

Linear model for VRM.

Voltage Regulator Module (VRM)

R0: the value of the resistor between the VRM sense point and the actual load and is usually only a few mOhms

L_out: the output inductance of the VRM

R_flat: the ESR of the capacitor associated with the VRM

Ideal voltage source has the value of the power supply voltage

L_slew is chosen so that current will be ramped up in the linear model in about the same time that it is ramped up in a real VRM.

Linear model for VRM.

Voltage Regulator Module (VRM)

! V = L*di/dt! For a VRM to ramp this 20 A

transient current either up or down in 15 us

R0 = 1mohmL_out = 4nHR_flat = 30mohmL_slew = 67.5nH

nHAVdtdiVslewL 5.6720

sec15 1.8 0.05 _ =⋅⋅== µ

Simulation for VRM

Simulation for VRM (cont’d)

Bulk Capacitor• I = C*dv/dt

• Suppose there is a 20 A current transient, the VRM responds in 15us, and the PDS must remain within 5% of a 1.8V power supply

uFVAdtdVIC 333305.0 8.1

sec15 20 =⋅⋅== µ

Simulation for VRM + Bulk Cap

Simulation for VRM + Bulk Cap (cont’d)

ESR of the Bulk Cap = 1ESR of the Bulk Cap = 0.1ESR of the Bulk Cap = 0.01ESR of the Bulk Cap = 0.001

ESR of the Bulk Cap = 1ESR of the Bulk Cap = 0.1ESR of the Bulk Cap = 0.01ESR of the Bulk Cap = 0.001

Simulation Impedance using Serenade Tune Mode

High Frequency Ceramic Capacitor

• NPO capacitors have the lowest ESR and best temperature and voltage properties, but are only available up to a few nF.

• X7R capacitors have reasonable voltage and temperature coefficients and are available from several nF to several uF.

• X5R is similar to X7R, but with reduced reliabilityand are being extended to 100uF.

• Y5V dielectric is used to achieve high capacitance values, but has very poor voltage and temperature characteristics.

High Frequency Capacitor

0. 5 nH5 nH5 nH

100 mohm100 mohm100 mohm

1 nF1 nF10 nF

Cap 3Cap 2Cap 1

0.5nH2nH5nH

100m Ohm

100m Ohm

100m Ohm

10nF10nF10nFCap3Cap2Cap1

High Frequency Capacitor

Reducing the Parasitic Inductance for HF Cap

1. Reduce the length of via for decoupling capacitors (i.e.reduce the loop inductance)

2. Change the layout of decoupling capacitors3. The thickness of high frequency capacitors4. Parallel the decoupling capacitors with same value

or multiple skew values

(1) (2)

(3)

Simulation for Impedance of Parallel Capacitors

Both ESR and Inductance improved performance, but part count increased

Simulation for Impedance of Parallel Capacitors with Skewed Capacitance

Simulation for VRM+Bulk_cap+HF_cap

Bulk capacitorVRM

HF capacitor

Simulation for VRM+Bulk_cap+HF_cap (cont’d)

Ω= mZ 45v)Target(1.8

Ω= mZ 5.82v)Target(3.3

DC

TPA/PCB/MCM (PEEC)

Problem Scaleλλλλ////10101010

SpiceLink (Quasi-Static/TEM)

HFSS (Full-Wave)

λλλλ/4/4/4/4

frequency

Plane Modeling

3D DistributedPEEC

FULL WAVEHFSS+Full Wave Spice

SI_wave

Physical Design

Using

Full Wave Spice

Model from HFSS

12 Layers PCB

S1

AGND

S2

S3

AVCC_3.3v

S4

S5

DVCC_3.3v

S6

S7

DGND

S8

(1,1)(1,1)(1,1)(1,1)

(1,5)(1,5)(1,5)(1,5)(7,5)(7,5)(7,5)(7,5)

(4,3)(4,3)(4,3)(4,3)

(7,1)(7,1)(7,1)(7,1)

11*0.1uF2*1nF

21*0.1uF

21*10nF

21*1nF

100uF 2.7uF

0.1uF

10nF

1nF

(5,4)(5,4)(5,4)(5,4) (6,4)(6,4)(6,4)(6,4)

V

V V

VV

V

V V

2ACurrent

Sink

22mACurrent

Sink

33mACurrent

Sink

Plane Impedance w/ & w/o De-cap

Decoupling capacitors added

Voltage Transient w/ & w/o De-cap

0.2ns 0.2ns

Simulation for Extra AGND Plane Inserted

(1,1)(1,1)(1,1)(1,1)

(1,5)(1,5)(1,5)(1,5)(7,5)(7,5)(7,5)(7,5)

(4,3)(4,3)(4,3)(4,3)

(7,1)(7,1)(7,1)(7,1)

11*0.1uF2*1nF

21*0.1uF

21*10nF

21*1nF

100uF 2.7uF

0.1uF

10nF

1nF

(5,4)(5,4)(5,4)(5,4) (6,4)(6,4)(6,4)(6,4)

V

V V

VV

V

V V

2ACurrent

Sink

22mACurrent

Sink

33mACurrent

Sink

S1

AGND

S2

S3

AVCC_3.3v

S4

S5

DVCC_3.3v

S6

S7

DGND

S8

AGND

Plane Impedance with Extra AGND Plane Inserted

After extra plane inserted

Voltage w/ & w/o Extra AGND Plane Inserted

After extra plane inserted

De-cap Enhancement for HF Range

Enhanced de-cap:100nF*2, 50nF*225nF*2, 10nF*22.5nF*2, 1nF*10100pF*2 are inparallel!!

Plane Impedance w/ & w/o Enhanced De-cap

With Enhanced De-cap

Voltage Transient w/ & w/o Enhanced De-cap

0.2ns 0.2ns

With Enhanced De-cap

Impedance Simulation using PEEC

Summary! Impedance control from DC to GHz:

! Voltage Regulator Module (VRM)! Bulk Capacitor! High Frequency Ceramic Capacitor! PCB Planes

! Tools used for simulation:! Schematic Capture ! Serenade! HFSS! PCB/MCM

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