Preparation of Novel PZTN Thin Film Co-doped Si for High ......First-principles calc. : Density...

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Preparation of Preparation of Novel PZTN Thin Film Co-doped Novel PZTN Thin Film Co-doped Si for High-Density FeRAM Si for High-Density FeRAM 7 Oct. 2004 Seiko Epson Corporation T. Kijima, Y. Hamada, K. Ohashi, H. Miyazawa , T. Aoyama, E. Natori and T. Shimoda

Transcript of Preparation of Novel PZTN Thin Film Co-doped Si for High ......First-principles calc. : Density...

  • Preparation of Preparation of Novel PZTN Thin Film Co-doped Novel PZTN Thin Film Co-doped

    Si for High-Density FeRAMSi for High-Density FeRAM

    7 Oct. 2004

    Seiko Epson Corporation

    T. Kijima, Y. Hamada, K. Ohashi, H. Miyazawa, T. Aoyama, E. Natori and T. Shimoda

  • OutlineOutline

    ● Objectives   ■ Development of novel ferroelectric material for high integrated FeRAM● Experimental

    ■    Nb 20% substitution to PZT with Si 1 mol%  : PZTN● Discussion

    ■    First-principles calc. of PZTN● Summary

  • Present condition of FeRAM Present condition of FeRAM   

    Ferro. S tructure Des ignrule(um)Accumulation

    (bit)Drive voltage

    (V)

    Fujitsu P ZT 1T1C 0.18 4M~ 3V

    Matsushita S BT 2T2C 0.18 1M~ 3V~

    TI P ZT 1T1C 0.13 64M~ 1.5V

    Samsung P ZT 1T1C 0.25 32M~ 3V

    Toshiba P ZT 1T1C 0.2 32M 3V,2.5V

    NEC P ZT 2T2C 0.25 0.35~ 3V

    OKI S BT 2T2C1T1C 0.25 16M~ 3V

    Hynix S BTBLT2T2C1T1C 0.35 4M~ 1.8 3V~

    5V16k0.82T2CPZTRohm3-5 V64k0.62T2CSBTMatsushita3 V256k0.52T2CPZTFujitsu

    Mass production level

    Research level

  • Key points and Key points and What we have achievedWhat we have achieved

    There are many subjects in reliability for FeRAM.

    Material is the key. We have invented a new ferro-electric

    material, named PZTN. A big step to High-density FeRAM.

  • Problems of PZTProblems of PZT

    Poor reliabilityLarge leakage current

    52/4840/60

    30/7020/80

    : Initial: Final ; R.T., 25Hrs.

    1.E-11

    1.E-10

    1.E-09

    1.E-08

    1.E-07

    1.E-06

    1.E-05

    1.E-04

    1.E-03

    1.E-02

    1.E-01

    1.E+00

    -10 -8 -6 -4 -2 0 2 4 6 8 10Voltage (V)

    Leak

    age

    Curr

    ent (

    A/cm

    2)

    52/4840/60

    30/70

    Leakage

    0

    10

    20

    30

    40

    50

    60

    1.E+00 1.E+02 1.E+04 1.E+06 1.E+08Cycles

    2Pr(

    uC/c

    m2)

    @ 1.8V,50kHz

    Fatigue Loss

    -100

    -80

    -60

    -40

    -20

    0

    20

    40

    60

    80

    -2.4 -1.6 -0.8 0 0.8 1.6 2.4Voltage (V)

    Pola

    rizat

    ion

    (uC/

    cm2)

    Imprint Problem

    20/8020/80

    Zr/Ti Zr/Ti

  • Various properties of the Various properties of the element which constitutes PZTelement which constitutes PZT

    Valence Value  Atomic Radius B inding Energy Ionization Potential(Ionic radius ( ))Å ( )Å M- O(kcal/ mol) (eV)

    Pb 207.2 +2(1.08),+4(0.78) 1.33 38.8 7.416

    Zr 91.224 +4(0.72) 1.6 185 6.84

    T i 47.88 +2(0.86),+3,+4(0.61) 1.47 73 6.82

    Nb 92.906 +3,+4,+5(0.64) 1.47 177- 189 6.88

    O 54.36 - 1,- 2(1.4) 0.61 - 13.618

    Name Atomic Weight

  • Oxygen vacancy takes place!Oxygen vacancy takes place!

    Pb: Binding energy of Pb-O is small and easy to evaporate.⇒If Pb falls out, O will escape from the system due to the principle of electric charge neutrality.

    PZT forms a Shottkey defects easily.

    Band gap narrowing Oxygen ionic conduction

    ↓Low reliability for FeRAM

    Oxygen vacancy

  • Nb doping to PZTNb doping to PZTNb Ion size is almost same as Ti. Nb5+ may compensate the hole of Pb vacancy with preventing oxygen loss. Strong covalent-bond between Nb and O. good for ferroelectricity⇒

    It is difficult to substitute B site in PZT by Nb because of high crystallization temperature.

    ⇒Nb is only 2.3at% added to PT tetragonal composition. (T.Matsuzaki and H.Funakubo, J. Appl. Phys,86(1999)4559)

    Addition of 1%-Si into the PZT+Nbto reduce the crystallization temperature.

  • OutlineOutline

    ● Objectives■    Development of novel

    ferroelectric material for high integrated FeRAM

    ● Experimental ■Nb 20% substitution to PZT with Si 1 mol%  : PZTN● Discussion

    ■    First-principles calc. of PZTN● Summary

  • PZT and PZTNPZT and PZTN

    Top Electrode :  PtBottom Electrode :  PtProcess Temperature :  650℃Thickness :  150nmCrystal Orientation : (111) pseudo cubicCrystal Structure : Tetragonal

    Zr Ti Nb Si

    40 60

    20 60 20 1 mol%

    PZT(40/60)

    PZTN(20/60/20)

    Sol-Gel MethodSol-Gel Method

  • 0

    10000

    20000

    30000

    40000

    50000

    20 30 40 502θ (deg)

    Inten

    sity(c

    ps)

    0

    1000

    2000

    3000

    20 30 40 502θ (deg)

    Inte

    nsity

    (cps)

    0

    1000

    2000

    3000

    20 30 40 502θ (deg)

    Intensit

    y(cps)

    Si = 0% Si = 0.5% Si = 1%

    800℃

    Pyr

    o Pt(1

    11)

    Pt(1

    11)

    Pt(1

    11)

    PZT

    (100

    )

    PZT

    (111

    )

    Pyr

    o650℃650℃

    Effect of Si Effect of Si on PZTN(110/20/60/20)on PZTN(110/20/60/20)

    Without Si, PZTN contains pyrochlore phase, but with 1% of Si, PZTN has perovskite phase only.

  • P-V hysteresis curvesP-V hysteresis curves

    of PZTN capacitorsof PZTN capacitors

    - 60

    - 40

    - 20

    0

    20

    40

    60

    - 10 - 5 0 5 10Voltage (V)

    Pola

    rizat

    ion

    (uC

    /cm

    2)

    - 5 0- 4 0- 3 0- 2 0- 1 0

    01 02 03 04 05 0

    - 2 - 1 0 1 2V o l t a g e ( V )

    Polar

    izatio

    n (u

    C/cm

    2)

  • Leakage current propertyLeakage current property

    PZT

    PZTN

    -10 -8 -6 -4

    ク 電 流 密 度

    10-3

    10-4

    10-5

    10-6

    10-7

    10-8

    10-9

    Leak

    age

    curr

    ent d

    ensi

    ty (A

    /cm

    2)

    Applied voltage (V)

    -2 0 10 8 64 2

    Shottky emission mode

    F-N mode

  • 0

    0.2

    0.4

    0.6

    0.8

    1

    1.2

    1.E+00 1.E+02 1.E+04 1.E+06 1.E+08 1.E+10

    Cycles

    Pr (N

    orm

    alize

    d)

    PZT PZTN

    Fatigue PropertyFatigue Property

    - 60

    - 40

    - 20

    0

    20

    40

    60

    - 3 - 2 - 1 0 1 2 3Vol t age ( V)

    Polar

    izatio

    n (u

    C/cm

    2)

    - 60

    - 40

    - 20

    0

    20

    40

    60

    - 3. 3 - 2. 2 - 1. 1 0 1. 1 2. 2 3. 3Vol t age ( V)

    Polar

    izatio

    n (u

    C/cm

    2)

    PZTN

    PZTE(Fatigue Pulse) = 150kV/cm

    PZTN shows better fatigue propertyeven on Pt electrode.

    PZTN

    PZT

  • -3-2-10123

    0 10 20 30 40 50 60

    Imprinting time (hrs)

    Voltag

    e (V)

    Dynamic Imprint

      : positive

      : negative

    -100

    -50

    0

    50

    100

    -4 -3 -2 -1 0 1 2 3 4

    Voltage (V)

    Pola

    rizat

    ion

    (uC

    /cm

    2)

    Static Imprint

    positive

    negative-40

    -20

    0

    20

    40

    0 10 20 30 40 50 60

    Retention time (hrs)

    Polar

    izatio

    n (uC

    /cm2)

    Retention

      : positive

      : negative

    ReliabilityReliabilityof PZTNof PZTN

    125℃

    109 cycles R.T. 125℃

    initial

    final

    PZTN realizes lower domain pining.

  • Nb truly makes a Solid-Solution Nb truly makes a Solid-Solution in PZT even at the amount of 20 in PZT even at the amount of 20 at.% ?at.% ?

  • 24.3atom.%OTiPb Zr+NbUnit

    56.411.821.7 10.0atom.% 50.618.17.0

    Total

    100100

    RBS, NRAPZT

    PZTN

    Unit Pb-4f Nb-3dTi-2pZr-3d Si-2pO-1s TotalXPS

    PZTPZTN

    atom.%atom.%

    100100

    21.124.8 5.75.715.324.4 5.7 0.1

    48.448.8

    The film composition of PZT The film composition of PZT and PZTN Zr:Ti:Nb=and PZTN Zr:Ti:Nb=20:60:2020:60:20

    NbTiPb ZrUnit TotalICP53.0atom.%

    9.630.350.3 9.8atom.% 38.18.9

    100100PZT

    PZTN

    26.72.3

    26.82.0

  • 3-D reciprocal space

    Q(φ)

    Q(ψ)

    Q(2θ)

    All reciprocal points are projected on to the single mapby rotating the sample.

    ~ 1,000 rpm

    XRD reciprocal space mapsXRD reciprocal space maps

  • PZT(20/80) PZTN(Nb:20%)

    SiPZT(N)PZT(N)

    Pt

    0

    60

    20

    40

    ψ / d

    egre

    e

    10 20 30 40 50 60

    Cu Kα 2θ / degree

    10 20 30 40 50 60

    Cu Kα 2θ / degree

    60

    PZTPt

    Si-sub.

    PZT(N)

    XRD reciprocal space mapsXRD reciprocal space maps

  • J

    JJ

    J

    300

    310

    320

    330

    340

    0 10 20 30 40

    Raman shift / cm-1

    Ram

    an sh

    ift /

    cm-1

    Inte

    nsity

    Nb doped / mol%

    A1(2TO)

    0%

    20%

    30%

    Raman spectra Raman spectra ofof A1(2TO) A1(2TO) frequency frequency atat PZTN systems PZTN systems

    5%

    A1(2TO)

  • 16OH

    16O

    206Pb207Pb

    208Pb 48Ti

    Mass spectra using SIMS Mass spectra using SIMS

    for PZTN and PZTfor PZTN and PZT

    PZTN

    PZT

  • Depth profile by RBS/NRA Depth profile by RBS/NRA and AES measurementsand AES measurements

    PZTN

    PZT

    Pt

    SiO

    O

    Ti

    Zr+NbPbTi

    Pt

    SiO

    O

    TiZr

    Pb Ti

    0

    20

    40

    60

    80

    100

    0.0 20.0 40.0 60.0 80.0

    O

    PtO

    Pb SiTi

    Zr+Nb

    Ti

    0

    20

    40

    60

    80

    100

    0.0 20.0 40.0 60.0 80.0

    Pt O

    Pb SiO

    Ti

    Zr Ti

    Atom

    ic C

    once

    ntra

    tion

    / ato

    mic

    %

    Sputtering Time / min.

    RBS/NRA AES

  • Summary: ExperimentSummary: Experiment

    ● Novel material PZTN for FeRAM■    Sol-Gel method at 650 ℃

    ■Nb 20 % with Si 1 mol% ● High reliability     ■ Good squareness of hysteresis

    loop    ■ Very low leakage current ■Good fatigue, retention and imprint properties ● Nb is located at B site in ABO3● Sharp depth profile

  • OutlineOutline

    ● Objectives■    Development of novel

    ferroelectric material for high integrated FeRAM

    ● Experimental■    Nb 20% substitution to PZT with

    Si 1 mol%  : PZTN ● Discussion   ■ First-principles calc. of PZTN● Summary

  • Electronic structure of PZTN systems

    Focus on the oxygen vacancy of conventional PZT systems

    2. Defect formation energy1. Density of states (DOS)

    Aim :Analyze the PZTN systems using the first-principles calculation.

    Nb 20~ 25%

    High reliability ( 10-3 lower leakage current → Good Imprint, Retention and Fatigue)

    Pb defectO defect

    PZTN: Pb (ZrTiNb)O3 Zr, Ti=4+, Nb=5+

    Why does PZTN have excellent leakage current?

  • b

    c

    a

    Method : Super Cell

    super cellABO3 (2x2x2)

    Treat defect and atom displacement

    A site

    First-principles calc. : Density Functional Theory, Local Density Approx. FLAPW method

    Assume cubic and paraelectic stateslattice constant : optimized

    Ecut=15Ryk-mesh=(1x1x1), (2x2x2) for Eg

    O deficit : nearest to Pb defect and nearest to Zrby Miyazawa (2003)

    Nb is located at B site from Raman analysis. by Aoyama (2003)

    PZTN: Pb1-1/8(Zr0.25Ti0.50Nb0.25)O3

  • Electronic structure of PZT: Density of States (DOS)

    PZT: Pb (Zr0.25Ti0.75)O3

    Total

    Ti site

    Zr site

    40

    30

    20

    10

    0

    Tota

    l DO

    S /e

    V s

    pin

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    Total

    1.5

    1.0

    0.5

    0.0

    Par

    tial D

    OS

    /eV

    spi

    n at

    om-20 -15 -10 -5 0 5 10 15

    Energy (eV)

    Ti

    1.5

    1.0

    0.5

    0.0

    Par

    tial D

    OS

    /eV

    spi

    n at

    om

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    Zr

    Pb 5dO 2s

    Pb 6s

    O 2p TM d

    Valence band top : O 2p orbitals

    Conduction band bottom :

    Ti 3d orbitals

  • DOS of PZT

    PZT: Pb (Zr0.25Ti0.75)O3

    Pb deficit hole dope

    O deficit electron dope

    Pb-O deficit Insulator

    Ti 3d orbitals

    O 2p orbitals

    Shottkey defect

    =1/8=0.125Pb 1- (Zr0.25Ti0.75)O3-

    Impurity states : Zr d orbitals

    TM atom which is N.N. to O defect site

    O can act as 2- ion.

    Pb can act as 2+ ion.

    40

    30

    20

    10

    0

    Tota

    l DO

    S /e

    V s

    pin

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    TotalPb 5dO 2s

    Pb 6s

    O 2p TM dTi d

    PZT-O

    PZT-Pb

    PZT

    40

    30

    20

    10

    0

    Tota

    l DO

    S /e

    V s

    pin

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    PZT-O

    40

    30

    20

    10

    0

    Tota

    l DO

    S /e

    V s

    pin

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    PZT-Pb

    insulator

    electron

    hole

    40

    30

    20

    10

    0

    Tota

    l DO

    S /e

    V s

    pin

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    PZT-PbOZr d

    insulator

    PZT-PbO

  • PZTN: Pb1-(Zr0.25Ti0.50Nb2)O3

    DOS of PZTN

    Insulator

    Subtract Pb 0.125

    Substitute B site Ti 0.25 to Nbelectron dope

    Nb can be seen as 5+ ion.Ti 3d, Nb 4d orbitals

    O 2p orbitals

    Start at PZT: Pb (Zr0.25Ti0.75)O3

    =1/8=0.125

    insulator

    PZT+Nb

    PZT- Pbhole

    40

    30

    20

    10

    0

    Tota

    l DO

    S /e

    V s

    pin

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    PZT-Pb

    PZT

    40

    30

    20

    10

    0

    Tota

    l DO

    S /e

    V s

    pin

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    TotalPb 5dO 2s

    Pb 6s

    O 2p TM d

    40

    30

    20

    10

    0

    Tota

    l DO

    S /e

    V s

    pin

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    PZT+Nb

    40

    30

    20

    10

    0

    Tota

    l DO

    S (

    /eV

    spi

    n)

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    Total

    PZT+Nb-Pb

    Pb 5dO 2s

    Pb 6s

    O 2p TM d

    insulator

    electron

    No impurity states

    hole dope

    Pb can be seen as 2- ion.

  • PZTN: Pb1-(Zr0.25Ti0.50Nb2)O3

    DOS of PZTN

    1.5

    1.0

    0.5

    0.0

    Par

    tial D

    OS

    /eV

    spi

    n at

    om

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    Zr1

    40

    30

    20

    10

    0

    Tota

    l DO

    S (

    /eV

    spi

    n)

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    Total

    1.5

    1.0

    0.5

    0.0

    Par

    tial D

    OS

    /eV

    spi

    n at

    om

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    Nb1

    1.5

    1.0

    0.5

    0.0

    Par

    tial D

    OS

    /eV

    spi

    n at

    om

    -20 -15 -10 -5 0 5 10 15

    Energy (eV)

    Ti3

    Total

    Ti site

    Nb site

    Zr site

    Pb 5dO 2s

    Pb 6s

    O 2p

    TM d

    =1/8=0.125

    Conduction band bottom

    Ti 3d and Nb 4d orbitals

  • J

    J

    B

    - 1 . 6

    - 1 . 4

    - 1 . 2

    - 1

    - 0 . 8

    - 0 . 6

    - 0 . 4

    - 0 . 2

    0

    0 2 4 6 8 1 01 2 1 41 6 1 8 2 0

    Ba

    nd

    g

    ap

    (

    eV

    )

    ;

    di

    ff

    er

    en

    ce

    P b d e f i c i t ( % )

    Pb-O deficit and bandgap

    PZT-PbO

    PZTN

    In the case of PZTN, the bandgap is maintained the almost same width as PZT without atom deficit.

    In the case of PZT with Pb-O defect, the bandgap is reduced drastically.

    Pb (Zr0.25Ti0.75 )O3

    =1/8

    Change of bandgap

    Oxygen vacancy lowers the Madelung potential of the nearest neighbor Zr d orbitals.

  • Electronic states

    Substituting B-site 4+ ion by Nb 5+ ion induces electrons at the conduction band bottom, which consists of Nb 4d and Ti 3d orbitals.

    PZTN systems : Substitute Ti 2 to Nb and subtract Pb .

    Subtracting A-site Pb creates holes at the conduction band maximum.

    No need of oxygen vacancy to maintain insulator states.

    Keep bandgap wide enough.

    In PZTN case, the doped electrons and holes cancel out each other, and the system recovers an insulator states.

    Pb-O defect creates impurity states at the conduction band bottom. These states consists of Zr d orbital which is nearest neighbor to the oxygen-defect site.

    PZT systems with Pb-O deficit

    Narrow the bandgap drastically.

    Oxygen vacancy lowers the Madelung potential of Zr d orbitals.

  • 1.E- 10

    1.E- 09

    1.E- 08

    1.E- 07

    1.E- 06

    1.E- 05

    1.E- 04

    1.E- 03

    - 10 - 5 0 5 10Votlage (V)

    Leak

    age

    Curr

    ent (

    A/c

    m2) PZT

    PZTN

    Pt PZT- PbO

    Band Diagram at Interface

    Pt PZTN

    by Hamada (2003)z

    Energy

    F-N tunnelingShottkey emission (@ large Eg)

    Space charge limited current (@ large J)

    =0.27eV

    = 0.19eVExperiment

  • Formation energy of Pb deficit in PZTN

    Pb (Zr0.25Ti0.50Nb0.25)O3Pb1-0.125(Zr0.25Ti0.50Nb0.25)O3 fcc-Pb+

    H = - 0.55eV/ABO3TSHG S ; Entropy due to defects

    PZTN with Pb deficit has 0.55eV lower energy than PZTN with no Pb deficit.

    Corresponding to amount of Nb addition, the system turns to insulator by losing Pb atom automatically without losing oxygen. (@ thin film fabrication process)

    Hypothesis

    We need 0.15eV/ ABO3 more to subtract oxygen in order to form Shottky defects.Nb addition has the ability to prevent oxygen deficit even it induces Pb deficit.

  • Defect formation energy :PZT

    [eV / super cell]

    Stoichiometric PZT with no deficit is the most stable states in the ground state.However, due to the high vapor pressure of Pb, we should start the reaction at the states with Pb deficit.

    Pb (Zr0.50Ti0.50)O3

    Pb (Zr0.50Ti0.50)O 3-1/8

    Pb 1-1/8 (Zr0.50Ti0.50)O3-1/8

    Pb 1-1/8(Zr0.50Ti0.50)O3-3.77

    -0.59

    -2.81

    -2.22

    -0.96Pb-O deficit( Shottkey deficit)

    O deficit

    Pb deficit

    Cubic、 Paraelectric states

    Lattice constant is optimized. metal

    insulator

    metal

    insulator

    Under this condition, system may finally wants to go to Pb-O deficit(Shottkey deficit).

  • Defect formation energy : PZTN

    [eV / super cell]

    Cubic, Paraelectric states

    Lattice constant is optimized.

    The most stable state is the insulator state with Pb defect and without oxygen defect.

    -4.41 -1.22

    -3.08-3.88Pb1-1/8(Zr0.25Ti0.50Nb0.25)O3

    Pb1-2/8(Zr0.25Ti0.50Nb0.25)O3

    Pb (Zr0.25Ti0.50Nb0.25)O3 Pb1-1/8(Zr0.25Ti0.50Nb0.25)O3-1/8

    Pb1-2/8(Zr0.25Ti0.50Nb0.25)O3-1/8

    metal

    metal

    metal

    insulator

    insulator

    Pb deficit

    2Pb deficit Pb and Pb-O deficit

    Pb-O deficit

    We suppose that this is the state of PZTN which realizes very low leakage current.

  • System seems to automatically recovers charge neutrality

    Pb(TiZrNb)O3

    Hypothesis: According to Nb addition,

    system automatically recovers charge neutrality by inducing Pb evaporation in order that charge-

    neutrality condition maintains.

    Pb Zr/Ti Nb O

    PbZrTiO3Pb-O deficit : Shottky deficit

    Pb ev

    apora

    tion

    Pb Zr/Ti O

    Pb ev

    apora

    tion

    O evapolation

    bandgap lowering

    Nb suppresses oxygen vacancy keep bandgap

    Why is Ti rich leaky ?It is still mystery.

    band offset lowering leaky

    F-N mode

    keep band offset low leakage

    Shottky mode

  • Summary: First-principles calc. Why PZTN has excellent leakage current?

    Adding Nb(2) with Pb() deficit makes system insulator states.

    The study of defect-formation energy indicates that adding Nb (2) with Pb () deficit and without oxygen deficit realizes the most stable states.

    In conventional PZT, the Pb-O deficit narrows the bandgap due to the impurity states at the conduction band bottom. This is because that the oxygen deficit lowers the Madelung potential of the nearest-neighbor TM-d orbitals. This reduces the band offset with electrodes and makes the system leaky.

    In PZTN systems, adding Nb suppresses the oxygen deficit and it sustains the bandgap wide enough to keep Shottkey leakage mode.

    ↓ very low leakage current

    Why does PZTN have excellent leakage current?

    Corresponding to the amount of Nb addition, the system turns to insulator by losing Pb atom automatically without losing oxygen. ( Hypothesis)

  • b

    c

    a

    Oxygen vacancy and the reliability: Imprint, retention and fatigue

    Mobile oxygen ion may also cause the imprint, retention and fatigue.

    Injected electrons caused by narrow band offset may induce the fixed charge at oxygen vacancy site in the film and this charge acts as domain pinning sites which cause the imprint.

    Oxygen vacancy

    Create large space

    Oxygen easily move through this path.

    Driving force of mobile oxygen ion : Oxygen and Pb vacancy

  • MD simulation of BaTiO3 : Trajectory of Ion diffusion

    BaTiO

    4% at O site12% at A site

    vacancyBorn-Mayer-Huggins potential

    (4x4x4)

  • Oxygen is the most mobile ion in ABO3 perovskite-type structure.

    Plus and minus ion vacancy attracts each other.

    MD simulation of BaTiO3 : Ion diffusion trajectory

    Oxygen ion diffuses along octahedron network.Oxygen →  Oxygen siteBa, Ti →  A and B site

    O >> Ba, TiWide space of diffusion path for O in ABO3 system

    These defects may tend to accumulate at electrode interfaces.

    Imprint, Retention, Fatigue

    Because the interface layer has low Pb density.

    Become domain pinning site

  • SummarySummary

    We tried to produce the new material for FeRAM.

    We substituted 20 at.% Nb at PZT and produced perovskite-type structure of Pb(Zr,Ti,Nb)O3(PZTN) films.

    We achieved : ・ Large switching charge and good squareness of hysteresis loop. ・ High reliability with low leakage current.

    1% of Si are necessary for single perovskite-type PZTN.

    First-principles calculation study

    ・ Conventional PZT with Pb-O defects has narrow bandwidth.・ Our PZTN, which is supposed to have low O defects due to Nb doping, can maintain bandgap wide enough to suppress the leakage current.