PRELIMINARY DATA SHEET SKY5 -8091-11 SkyOne Low Band Tx-Rx … · 2019. 12. 11. · Human Body...

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 205267E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 5, 2019 1

PRELIMINARY DATA SHEET

SKY5®-8091-11 SkyOne® Low Band Tx-Rx Front-End Module for 3G/4G/5G Applications with Low Band / High Band 2G Applications

• Multi-band 2G 3G/4G/5G Mobile Devices • Handsets, Data Cards, M2M • LTE Advanced Carrier Aggregation (CA)

Features • MIPI® RFFE 2.0 control interfaces w/ 1.8 V nominal supply • Integrated switched duplexer filters for Bands 8, 12, 20 and 26 • Four auxiliary 3G/4G/5G Tx outputs for external filters • Four auxiliary 3G/4G/5G TRx ports to support additional bands • Tx filtering for harmonically-related LB-MB downlink CA • Integrated low band and high band 2G PAs • High band 2G works with companion MB/HB modules • Integrated bi-directional RF coupler with cascade support • Small, low profile package:

- 7.6 mm x 6.0 mm x 0.75 mm - 56-pad configuration

3G Features

- WCDMA, HSPA+ - CDMA2000 1x RC1, RC3, EVDO (Rev A)

4G Features

- FDD LTE - Uplink QPSK, 16QAM, 64QAM - Critical L+M, L+H Downlink CA Support

5G Features

- n5, n8, n12, n20, n28, n71

Description

The SKY58091-11 SkyOne® Multimode Multiband Tx-Rx Front-End Module (FEM) supports 2G/3G/4G/5G mobile devices and operates efficiently in 3G/4G/5G modes. The FEM consists of a low-band 3G/4G/5G PA block, low- and high-band 2G PA blocks, a silicon controller containing the MIPI RFFE interface, RF band switches, antenna switches, a bi-directional coupler, and integrated filters for Bands 8, 12, 20 and 26. Extremely low leakage current maximizes device standby time.

The IC die and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated in a 7.6 mm x 6.0 mm x 0.75 mm, 56-pad MCM, SMT plastic package which allows a highly manufacturable, low cost solution.

The SKY58091-11 FEM is optimized for LTE Advanced which utilizes Carrier Aggregation for higher data rates. The combined filtering, RF matching and TRx switching internal to the FEM optimizes performance for popular Downlink (DL) CA band combinations in a compact and low cost solution. The FEM contains the necessary components between the antenna and RFIC transceiver and is optimized to provide superior Rx sensitivity and Tx efficiency.

Selecting the linear-GMSK operation standard disables VRAMP input, so all PA biasing depends only on MIPI mode selection. The transmitted envelope is then a linear function of RF input.

Selecting VRAMP-enabled operation, the PA controller provides VRAMP control of the GMSK envelope and reduces sensitivity to input drive, temperature, power supply, and process variations. Skyworks’ Finger-Based Integrated Power Amplifier Control (FB-iPAC) minimizes output power variation into mismatch.

In EDGE linear mode, VRAMP voltage and MIPI-based bias settings jointly optimize PA linearity and efficiency.

Exceptional RF coexistence planning and system techniques are employed to minimize Rx de-sensitizing ("de-sense").

PRELIMINARY DATA SHEET SKY5®-8091-11 SkyOne® LOW-BAND TX-RX FRONT-END MODULE for 3G/4G/5G APPLICATIONS and LOW BAND / HIGH-BAND 2G

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 December 5, 2019 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 205267E

Figure 1. SKY58091-11 Functional Block Diagram

SKY5®-8091-11 SkyOne® LOW-BAND TX-RX FRONT-END MODULE PRELIMINARY DATA SHEET for 3G/4G/5G APPLICATIONS and LOW BAND / HIGH-BAND 2G


Electrical Specifications The following tables list the electrical characteristics of the SKY58091-11 Front-End Module. Table 1 lists the absolute maximum ratings and Table 2 shows the recommended operating

conditions. Electrical specifications for nominal operating conditions are listed in Tables 4 through 25.

The MIPI RFFE section contains information for mapping PA and ASM interfaces.

Table 1. SKY58091-11 Absolute Maximum Conditions1

Parameter Symbol Minimum Typical Maximum Unit

RF Input Power 3G/4G/5G Input PIN_3G4G5G 152 dBm

2G Input PIN_2G 153

TRx Input PIN_TRX 333

Supply Voltage No RF VCC_3G4G5G –0.5 6.0 V

VBATT / VCC_2G –0.5 6.0

RF VCC_3G4G5G –0.5 6.04

VBATT / VCC_2G –0.5 6.04

VIO –0.5 2.0

Temperature Ranges Storage TSTG –40 +150 °C

Operating TCASE –40 +25 +110

Electrostatic Discharge Sensitivity (ESD) IEC 61000-4-25 ESDIEC –1000 +1000 V

Human Body Model (HBM)6 Class 1C ESDHBM –1000 +1000

Human Body Model (HBM)6 RX Pads, Class 0 ESDHBM_Rx –250 +250

Charge Device Model (CDM)7, Class C2 ESDCDM –500 +500

1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value.

2 50 ohm load applied. CW duty cycle 100%, center channel of each band. 3 50 ohm load applied. CW duty cycle 2G 25% pulsed, 3G/4G 100%. 4 50 ohm load applied. 5 Applies to antenna ports only. 6 ANSI/ESDA/JEDEC Standard JS-001-2014 7 JEDEC Standard, JESD22-C101 Charge Device Model (CDM)



Table 2. SKY58091-11 Recommended Operating Conditions

Parameter Symbol Minimum Typical Maximum Unit

Supply Voltage 3G/4G/5G VCC_3G4G5G1 0.5 3.4 4.2 V

Battery VBATT 3.0 3.8 4.8

MIPI VIO 1.65 1.80 1.95

Nominal Test Condition (NTC) VBATT 3.8 V

2G EDGE VCC_2G2 3.6

2G GMSK VCC_2G 3.5

3G/4G VCC_3G4G 3.4

5G VCC_5G 4.2

2G GMSK PIN_2G 33 dBm

TA4 +25 °C

Extreme Test Conditions (ETC) VBATT 3.0 4.8 V

2G GMSK VCC_2G 3.0 4.8

3G/4G/5G VCC_3G4G5G 4.2

2G GMSK PIN_2G 03 6 dBm

TA4 –20 +75 °C

RF Input Power5 3G/4G/5G PIN_3G4G5G 6 dBm

2G Burst Duty Cycle6 GMSK/EDGE 1-4 slots DB 12.5 50 %

Digital Control Signals Low SCLK, SDATA

–0.5 0 0.2*VIO V

High 0.8*VIO 1.8 VIO

SCLK Frequency Write speed 52 MHz

Read speed 26

VIO Rise Time TVIO-R 450 μs

1 Refer to SKY58091-11 bias table. The bias table will contain all MIPI settings and Vcc voltages used to meet performance specifications. The bias table will not exceed the specified maximum for VCC_3G/4G/5G.

2 VBATT and VCC_2G are assumed common. Value shown allows for ohmic supply loss. 3 VRAMP-based operation 4 In all cases, Ambient Operating Temperature (TA) is specified relative to Case Temperature (TC) and assumes TA = (TC – 10 °C). 5 Unless otherwise specified, RF specifications in this datasheet assume 50 Ω input and output termination, 12.5% duty cycle with



Table 4. SKY58091-11 Electrical Specifications – Linear GMSK/EDGE Power Modes – Recommended Maximum Operating Power– Unless otherwise specified, values are used as each Power Mode's Test Condition

Band Waveform Power Mode PRATED Unit

LB GMSK High Power Mode (HPM) 34.81 dBm

Medium Power Mode (MPM) 29.0

Low Power Mode (LPM) 23.0

Ultra-Low Power Mode (ULPM) 15.0

EDGE Medium Power Mode (MPM) 28.5



HB GMSK High Power Mode (HPM) 33.7




EDGE High Power Mode (HPM) 29.1



Ultra-Low Power Mode (ULPM) 18.0 1 Vcc_2G =3.6V

Table 5. SKY58091-11 Electrical Specifications 4G/5G Prated – Recommended Maximum Operating Power Unless otherwise specified: LTE refers to MPR0

Band Modulation Power Mode Prated Unit

B8 LTE HPM 25.5 dBm

B26 LTE HPM 25.5

B20 LTE HPM 25.5

B12/17 LTE HPM 25.5

B28 LTE HPM 28.5

B13/14 LTE HPM 28.5

B71 LTE HPM 28.5

B5 WCDMA HPM 25.5

B8 WCDMA HPM 25.5

BC0 CDMA HPM 25.5

n5 NR APT, HPM 25.5

n8 NR APT, HPM 25.5

n12 NR APT, HPM 25.5






Table 6. NR Test Waveform

n5/n8/n20/n28/n71 Channel Bandwidth (MHz) SCS (kHz) Modulation RB Allocation MPR (dB)

Test waveform 1 20 15 DFT-S-OFDM QPSK 50 @ 25 0

Test waveform 2 20 15 CP-OFDM QPSK 106 @ 0 3

Test waveform 3 20 15 CP-OFDM 256QAM 106 @ 0 6.5

Test waveform 4 20 15 CP-OFDM QPSK 53 @ 26 1.5

n12 Channel Bandwidth (MHz) SCS (kHz) Modulation RB Allocation MPR (dB)

Test waveform 1 15 15 DFT-S-OFDM QPSK 37 @ 18 0

Test waveform 2 15 15 CP-OFDM QPSK 79 @ 0 3

Test waveform 3 15 15 CP-OFDM 256QAM 79 @ 0 6.5

Test waveform 4 15 15 CP-OFDM QPSK 40 @ 20 1.5

Table 7. SKY58091-11 Electrical Specifications – Low Band 2G GMSK Tx at LB_ANT Pad – (VRAMP-based Operation) Unless otherwise specified: PRATED = 34.8 dBm; ETC per Table 2.

Parameter Symbol Conditions Min Typ Max Unit

Operating Frequency GSM850 ƒo 824 849 MHz

GSM900 880 915 MHz

Output Power POUT_MAX_NTC NTC, VRAMP = 1.65 V, PIN = 0 dBm 34.8 35.4 dBm

POUT_MAX_ETC VRAMP = 1.65 V, PIN = 0 dBm, VCC_2G = 3.0 V 32.8

Supply Current I2G_VCC Stability mismatch test conditions 3.2 A

Power Added Efficiency PAE NTC 38 %

Input VSWR ΓIN POUT ≤ PRATED 2.5:1

Harmonics 2nd 2ƒo 5 dBm ≤ Cal–POUT ≤ PRATED, VRAMP = Cal–VRAMP1 –40 –33 dBm 3rd 3ƒo –40 –33

4th or higher 4ƒo–13ƒo –40 –33

Noise Power in Rx Band 869 MHz–894 MHz PNOISE_850 NTC, ƒo in GSM8502 –82 dBm/100kHz 1930 MHz–1990 MHz –86

734 MHz–757 MHz –82

925 MHz–935 MHz PNOISE_900 NTC, ƒo in GSM9002 –79

935 MHz–960 MHz –82

1805 MHz–1880 MHz –86

2400 MHz–2500 MHz PNOISE_ISM NTC, ƒo in GSM850 or GSM900 –106

Isolation ISO_PD Isolation Mode, PIN ≤ 6 dBm, VRAMP ≤ 0.1 V –60 –51 dBm

ISO_PE GMSK Tx Mode, NTC, PIN ≤ 6 dBm, VRAMP ≤ 0.1 V –15

Mode Switching Time TMODE_2G Time from EDGE to GMSK mode transition to application of GMSK input drive to meet ISO_PE

2 μs

Stability S 5 dBm ≤ POUT ≤ PRATED, Load VSWR = 12:1, all phase angles

No parasitic oscillation > –36 dBm

Ruggedness Load 5 dBm ≤ POUT –≤ PRATED, Load VSWR = 20:1, all phase angles

No module damage nor permanent degradation

1 Cal-VRAMP = VRAMP at POUT = Cal-POUT, NTC 2 Prated



Table 8. SKY58091-11 Electrical Specifications – Low Band 2G EDGE Tx at LB_ANT Pad – (VRAMP-based Operation) Unless otherwise specified: VRAMP = 1.45 V; POUT = 28.5 dBm; ETC per Table 2.


Operating Frequency GSM850 ƒo 824 849 MHz

GSM900 880 915 MHz

Maximum Output Power PRATED NTC, Gain / ACPR / EVM in specification 28.5 dBm

P_MAX_EX Gain / ACPR / EVM in specification 27.5

Gain G_NOM_850 NTC, POUT = PRATED 30.0 30.5 33.0 dB

G_NOM_900 30.0 30.5 33.0

G_EX_850 POUT = PMAX_EX 28.5 34.5

G_EX_900 28.5 34.5

Power Added Efficiency PAE_850 NTC 17.5 %

PAE_900 16.5


Harmonics 2nd 2ƒo 5 dBm ≤ Cal-POUT ≤ PRATED –40 –36 dBm

3rd 3ƒo –40 –36

4th or higher 4ƒo-6ƒo –40 –36

ACPR ACPR_200 RBW = 30 kHz, POUT = PRATED, PMAX_EX –37 –35.5 dBc

ACPR_400 –62 –60

ACPR_600 –75 –70

EVM (RMS) EVM_RMS POUT = PRATED, PMAX_EX 2.0 3.5 %

Bias Switching Time T_ON_EDGE Rx to Tx transition time from final MIPI command and 90% VRAMP to 0.5 dB settling.

1 μs



Table 9. SKY58091-11 Electrical Specifications – High Band 2G GMSK Tx at 2GHB_TX_OUT Pad – (VRAMP-based Operation) Unless otherwise specified: PRATED = 33.5 dBm; ETC per Table 2.


Operating Frequency DCS ƒo 1710 1785 MHz

PCS 1850 1910

Output Power POUT_MAX_NTC NTC, VRAMP = 1.65 V, PIN = 0 dBm 33.7 34.3 dBm

POUT_MAX_ETC VRAMP = 1.65 V, PIN = 0 dBm, VCC_2G = 3.0 V 31.5

Supply Current I2G_VCC Stability mismatch test conditions 2.5 A

Power Added Efficiency PAE NTC 45 %


Harmonics 2nd 2ƒo 0 dBm ≤ Cal-POUT ≤ PRATED, VRAMP = Cal-VRAMP1 –40 –33 dBm

3rd 3ƒo –30 –26

4th to 6th 4ƒo-6ƒo –38 –33

7 th 7ƒo –38 –28

Noise Power in Rx Band 1930 MHz–1990 MHz PNOISE_PCS NTC, POUT ≤ PRATED, ƒo in PCS –81 dBm/ 100 kHz

869 MHz–894 MHz –82

734 MHz–757 MHz –81

925 MHz–960 MHz PNOISE_DCS NTC, POUT ≤ PRATED, ƒo in DCS –80

1805 MHz–1880 MHz –79.5

2400 MHz–2500 MHz PNOISE_ISM NTC, POUT ≤ PRATED, ƒo in DCS or PCS –90

Isolation ISO_PD Isolation Mode, PIN ≤ 6 dBm, VRAMP ≤ 0.1 V –30 dBm

ISO_PE GMSK Tx Mode, NTC, PIN ≤ 6 dBm, VRAMP ≤ 0.1 V –15

Mode Switching Time TMODE_2G Time from EDGE to GMSK mode transition to application of GMSK input drive to meet ISO_PE

2 μs

Stability S 5 dBm ≤ P ≤ PRATED, Load VSWR = 8:1, all phase angles No parasitic oscillation > –36 dBm

Ruggedness Load 5 dBm ≤ POUT ≤ PRATED, Load VSWR = 10:1, all phase angles No module damage nor permanent degradation

1 Cal-VRAMP = VRAMP at POUT = Cal-POUT, NTC



Table 10. SKY58091-11 Electrical Specifications – High Band 2G EDGE Tx at 2GHB_TX_OUT Pad – (VRAMP-based Operation) Unless otherwise specified: VRAMP = 1.45 V, PRATED = 29.1 dBm; ETC per Table 2.


Operating Frequency DCS ƒo 1710 1785 MHz

PCS 1850 1910

Maximum Output Power PRATED NTC, Gain / ACPR / EVM in specification 29.1 dBm

P_MAX_EX Gain / ACPR / EVM in specification 28.1

Gain G_NOM_DCS NTC, POUT = PRATED 34.2 35.7 37.2 dB

G_NOM_PCS 33.8 35.3 36.8

G_EX_DCS POUT = PMAX_EX 32.0 38.2

G_EX_PCS 30.8 37.5

Power Added Efficiency PAE_DCS NTC 24.0 %

PAE_PCS 24.0



3rd 3ƒo –36 –33

4th or higher 4ƒo-7ƒo –40 –36

ACPR ACPR_200 RBW = 30 kHz, POUT = PRATED, PMAX_EX –37 –35.5 dBc

ACPR_400 –62 –59

ACPR_600 –75 –70

EVM (RMS) EVM_RMS POUT = PRATED, PMAX_EX 2.0 3.5 %

Bias Switching Time T_ON_EDGE Rx to Tx transition time from final MIPI command and 90% VRAMP to 0.5 dB settling.

1 μs



Table 11-1. SKY58091-11 Electrical Specifications – GMSK/EDGE Low Band (Linear GMSK Operation) Unless otherwise specified: Conditions NTC per Table 2; Duty Cycle 25%; POUT = PRATED per “Power Modes” Table 4 at NTC, then varies with gain

Parameter Symbol Waveform/ Bias Mode Condition Min Typ Max Units

Operating Frequency Range 824 915 MHz

PSAT PSAT_GMSK GMSK HPM PIN = 9 dBm, NTC 34.81 35.0 dBm

PSAT Degraded PSAT_GMSK_ETC GMSK HPM PIN = 9 dBm, ETC 32.5 dBm

Power Added Efficiency, saturated PAE_GMSK_SAT GMSK HPM POUT = PSAT, PIN = 9 dBm 40 %

Power Added Efficiency PAE_GMSK GMSK HPM 38

GMSK MPM 20

GMSK LPM 10

GMSK ULPM 4

Gain GAIN_GMSK GMSK HPM1 26.0 28.0 30.0 dB

GMSK MPM 28.0 29.5 31.0

GMSK LPM 17.5 19.0 20.5

GMSK ULPM 17.0 18.5 20.0

GAIN_EDGE EDGE MPM 30.0 31.5 33.0 dB

EDGE LPM 28.0 29.5 31.0

EDGE ULPM 16.5 18.0 19.5

Gain Change Over Temperature GMSK HPM1 ETC, except VBATT = Vcc_2G = 3.5 V –1.7 1.0 dB

GMSK MPM –1.7 1.1

GMSK LPM –1.3 1.0

GMSK ULPM –1.0 0.6

Gain Change Over Voltage GMSK HPM1 ETC, except T = 25 °C –1.2 1.1 dB

GMSK MPM –0.5 0.5

GMSK LPM –0.5 0.5


PAE PAE_EDGE EDGE MPM 17 %

Output Noise Power ALL NTC, Rx = 747 MHz to 757 MHz ---82 dBm/100 kHz

NTC, Rx = 757 MHz to 762 MHz ---82

NTC, Rx = 869 MHz to 894 MHz ---83

NTC, Rx = 925 MHz to 935 MHz ---80

NTC, Rx = 935 MHz to 960 MHz ---83

NTC, Rx = 1805 MHz to 1880 MHz ---90

NTC, Rx = 1930 MHz to 1990 MHz ---90

Harmonics 2nd 2ƒo GMSK ALL 5 dBm ≤ Cal–POUT ≤ PRATED –40 –33 dBm 3rd 3ƒo –40 –33

4th or higher 4ƒo–13ƒo –40 –33

Input Voltage Standing Wave Ratio VSWR_IN ALL 2.5:1

Stability S ALL VSWR



Table 11-2. SKY58091-11 Electrical Specifications – GMSK/EDGE Low Band (Linear GMSK Operation) Unless otherwise specified: Conditions NTC per Table 2; Duty Cycle 25%; POUT = PRATED per “Power Modes” Table 4 at NTC, then varies with gain


Switching Transients SWT_400 GMSK HPM 400 kHz offset ETC PIN adjusted for Temperature

–28 dBm/30kHz

GMSK MPM –28

GMSK LPM –28

GMSK ULPM –28

ACPR (M-ORFS, No Pre-distortion)

ACPR_200 EDGE MPM 200 kHz offset ETC except VBATT ≥ 3.2 V PIN adjusted for Temperature MPM ETC PRATED = 28 dBm

–35.5 dBc/30 kHz

EDGE LPM –35.5

EDGE ULPM –35.5


–58

EDGE LPM –58

EDGE ULPM –58


–65

EDGE LPM –65

EDGE ULPM –65

EVM (No Pre-distortion) EVM_rms EDGE MPM ETC except VBATT ≥ 3.2 V PIN adjusted for Temperature MPM ETC PRATED = 28 dBm

2 4 %

EDGE LPM 2 4

EDGE ULPM 2 4



Table 12-1. SKY58091-11 Electrical Specifications – High Band 2G GMSK/EDGE Tx at 2GHB_TX_OUT Pad (Linear GMSK Operation) Unless otherwise specified: Conditions NTC per Table 2; Duty Cycle 25%; POUT = PRATED per “Power Modes” Table at NTC, then varies with Gain


Operating Frequency Range 1710 1910 MHz

PSAT PSAT_GMSK GMSK HPM PIN = 6 dBm, NTC 33.7 34.2 dBm

PSAT Degraded PSAT_GMSK_ETC GMSK HPM PIN = 6 dBm, ETC 31.5 dBm

Power Added Efficiency, saturated PAE_GMSK_SAT GMSK HPM POUT = PSAT, PIN = 6 dBm 48 %

Power Added Efficiency PAE_GMSK GMSK HPM 45 %

GMSK MPM 30

GMSK LPM 19

GMSK ULPM 6

Gain GAIN_GMSK GMSK HPM 30.0 32.0 34.0 dB

GMSK MPM 31.2 32.9 34.7

GMSK LPM 25.0 26.5 28.0

GMSK ULPM 21.0 22.7 24.5

GAIN_EDGE EDGE HPM 34.0 35.5 37.0 dB

EDGE MPM 33.4 35.2 37.0

EDGE LPM 29.5 31.0 32.5

EDGE ULPM 26.5 28.0 29.5

Gain Change Over Temperature GMSK HPM ETC, except VBATT = VCC_2G = 3.5 V –2.0 1.0 dB

GMSK MPM –1.6 1.0

GMSK LPM –1.0 1.0


Gain Change Over Voltage GMSK HPM ETC, except T = 25 °C –1.3 1.3 dB

GMSK MPM –0.5 0.5

GMSK LPM –0.5 0.5


PAE PAE_EDGE EDGE MPM 24 %

Output Noise Power ALL NTC, Rx = 747 MHz to 757 MHz –85 dBm/100kHz

NTC, Rx = 757 MHz to 762 MHz –85




NTC, Rx = 1805 MHz to 1880 MHz –79.5

NTC, Rx = 1930 MHz to 1990 MHz –81


3rd 3ƒo –30 –26

4th to 6th 4ƒo-6ƒo –38 –33

7th 7ƒo –38 –28

Input Voltage Standing Wave Ratio VSWR_IN ALL 2.5:1

Stability S ALL VSWR



Table 12-2. SKY58091-11 Electrical Specifications – High Band 2G GMSK/EDGE Tx at 2GHB_TX_OUT Pad (Linear GMSK Operation) Unless otherwise specified: Conditions NTC per Table 2; Duty Cycle 25%; POUT = PRATED per “Power Modes” Table at NTC, then varies with Gain


Switching Transients SWT_400 GMSK HPM 400 kHz offset NTC per Table 2 ETC except VCC_2G ≥ 3.2 V PIN adjusted for Temperature

---28 dBm/30kHz

GMSK MPM ---28

GMSK LPM ---28

GMSK ULPM ---28

ACPR (M-ORFS, no pre-distortion)

ACPR_200 EDGE HPM 200 kHz offset NTC per Table 2 ETC except VCC_2G ≥ 3.2 V PIN adjusted for Temperature ETC PRATED = 28.1 dBm

–35.5 dBc/30kHz

EDGE MPM –35.5

EDGE LPM –35.5

EDGE ULPM –35.5


–58

EDGE MPM –58

EDGE LPM –58

EDGE ULPM –58


–65

EDGE MPM –65

EDGE LPM –65

EDGE ULPM –65

EVM (no pre–distortion) EVM_RMS EDGE MPM NTC per Table 2 ETC except VCC_2G ≥ 3.2 V PIN adjusted for Temperature ETC PRATED = 28.1 dBm

2 4 %

EDGE LPM 2 4

EDGE ULPM 2 4



Table 13-1. SKY58091-11 Electrical Specifications – Band 8 Tx Performance at LB_ANT Pad Unless otherwise specified: NTC per Table 2, POUT = POUT_MAX, LTE modulation = QPSK/10MHz/12RB; Average Power Tracking (APT) Mode


Operating Frequency ƒo 880 915 MHz

Maximum 3G Output Power POUT_MAX_3G_NTC R99 RMC 12.2 kbps 25.5 dBm

POUT_MAX_3G_ETC R99 RMC 12.2 kbps, ETC 24.5

Maximum LTE Output Power POUT_MAX_LTE_NTC 25.5 dBm POUT_MAX_LTE_ETC ETC 24.5

Maximum NR Output Power POUT_MAX_NR_NTC VCC_5G = 3.7 V 25.5 dBm

RF Input Power PIN_3G4G5G 100% duty cycle 3.5 dBm

Gain G_NTC VCC_3G4G = 3.4 V 25.0 26.8 28.5 dB

G_ETC ETC, VCC_3G4G = 3.4 V 23.0 29.0

WCDMA System DC Current Referred to VBATT1 I_TOTAL_R99 PMIC Efficiency = 95%, POUT = 25.5dBm, R99 RMC 12.2 kbps, VCC_3G4G = 3.4 V, ƒo = 900 MHz

539 576 mA

APT LTE System DC Current Referred to VBATT1 I_TOTAL_LTE PMIC Efficiency = 95%, POUT = 24.5 dBm, QPSK 10 MHz 50RB, VCC_3G4G = 3.2 V, ƒo = 900 MHz

435 470 mA

LPM LTE System DC Current Referred to VBATT1 I_TOTAL_LTE_LPM PMIC Efficiency = 75%, POUT = 1 dBm, QPSK 10 MHz 50RB

12 mA

Harmonic 2ƒo 2ƒo LTE 1RB, MBW = 1 MHz, ETC –70 –50 dBm

3ƒo 3ƒo –75 –55

4ƒo 4ƒo –70 –50

5ƒo and higher 5ƒo –40

Rx Band Noise Power3 NRx Measured at Rx port –183 –180 dBm/Hz

GPS and GLONASS Band Noise3 NGPS 1574–1577 MHz GPS, 1597–1607 MHz GLONASS –165 dBm/Hz

LB WiFi Band Noise3 NLB-WiFi 2.4 GHz WiFi, 2400–2495 MHz –165 dBm/Hz

HB WiFi Band Noise3 NHB-WiFi 5 GHz WiFi, 4900–5850 MHz –160 dBm/Hz

Tx Level at B8 Rx Port PTx-Rx 880–915 MHz, LTE 10 MHz 10M12RB (MPR = 0) –30 –28 dBm

Isolation Tx-Rx ISO_Tx-Rx 925–960 MHz, (s21 4GLB_IN to Rx port) – PA gain 55 dB





ACLR WCDMA ±5 MHz ACLR1_R99_NTC R99 RMC 12.2 kbps –42 –38 dBc

ACLR1_R99_ETC R99 RMC 12.2 kbps, ETC –36



E-UTRA ACLR E-UTRA_LTE_NTC –39 –36 dBc

E-UTRA_LTE_ETC –33

UTRA ACLR1 UTRA1_LTE_NTC –40 –38 dBc

UTRA1_LTE_ETC ETC –36



EVM, NR EVM_NR_NTC Test waveform 3 1.5 1.8 % rms

EVM_NR_ETC Test waveform 3, ETC 1.8

EVM, NR EVM_NR_NTC Test waveform 1,2,4 2.5 4

EVM_NR_ETC Test waveform 1,2,4, ETC 4

NR ACLR ACLR _NR_NTC Test waveform 2 –39 –37 dBc

ACLR _NR_ETC Test waveform 2, ETC –33

NR ACLR ACLR _NR_NTC Test waveform 1,3,4 –40 –38

ACLR _NR_ETC Test waveform 1,3,4, ETC –33

NR UTRA1 UTRA1_NR_NTC Test waveform 1/2/3/4 –42 –39 dBc

UTRA1_NR_ETC Test waveform 1/2/3/4, ETC –36



EVM, WCDMA EVM_R99_NTC RMS, R99 RMC 12.2 kbps 3.0 % rms

EVM_R99_ETC RMS, R99 RMC 12.2 kbps, ETC 3.0

EVM, LTE EVM_LTE_NTC RMS, modulation = QPSK, 16QAM, 64QAM 3.0 5 % rms

EVM_LTE_ETC RMS, modulation = QPSK, 16QAM, 64QAM, ETC 3.0 5

Input VSWR VSWR_IN 1.5:1 2.3:1

Stability, spurious emissions S ETC, POUT ≤ PRATED, Antenna port VSWR = 10:1, all phase angles

–36 dBm

Ruggedness Ru ETC, POUT ≤ PRATED, Antenna port VSWR = 10:1, all phase angles


1 VCC_3G4G voltage is optimized to meet the typical ("Typ") ACLR performance level. 2 Applies to Band 3 and Band 7 Rx frequencies 3 Measured at Rx port, QPSK 10 MHz 25RB, harmonics excluded.



Table 14. SKY58091-11 – Electrical Specifications – Band 8 Rx Performance Unless otherwise specified: Environmental Conditions = NTC per Table 2; CW, 50 ohm termination


Frequency Range ƒo 925 960 MHz

Insertion Loss RxIL_NTC Rx Band1 2.2 3.1 dB

Rx Port VSWR VSWR_Rx_ETC Rx Band 1.5:1 2.2:1

ANT Port VSWR VSWR_ANT_ETC Rx Band, ETC 2.0:1

Absolute Attenuation LB Antenna to Rx pad 1427 MHz–2200 MHz 40 dB

2300 MHz–2690 MHz 35

2400 MHz–2494 MHz 40

5150 MHz–5850 MHz 40

1 Duplexer Rx port mismatch removed per optimized LNA match




Maximum 3G Output Power POUT_MAX_3G_NTC R99 RMC 12.2 kbps / CDMA 1x RC1 25.5 dBm

POUT_MAX_3G_ETC R99 RMC 12.2 kbps / CDMA 1x RC1, ETC 24.5

Maximum LTE Output Power POUT_MAX_LTE_NTC 25.5 dBm

POUT_MAX_LTE_ETC ETC 24.5




G_ETC ETC, VCC_3G4G = 3.4 V 24.3 30.5

WCDMA System DC Current Referred to VBATT1 I_TOTAL_R99 PMIC Efficiency = 95%, POUT = 25.5dBm, R99 RMC 12.2 kbps, VCC_3G4G = 3.4 V, ƒo = 832 MHz

489 510 mA


410 434 mA


12 mA

Harmonic 2ƒo 2ƒo LTE 1RB, MBW = 1 MHz, ETC –40 dBm

3ƒo 3ƒo –65 –45

4ƒo and higher nƒo –40





Tx Level at B26 Rx Port PTx-Rx 814–849 MHz, LTE 10 MHz 10M12RB ( MPR = 0 ) –30 –28 dBm










ACLR CDMA ±885 kHz ACLR1_C2K_NTC CDMA 1x RC1 –50.0 –47 dBc

ACLR1_C2K_ETC CDMA 1x RC1, ETC –49.0 –45

ACLR CDMA ±1.98 MHz ACLR2_C2K_NTC CDMA 1x RC1 –60.0 –57 dBc

ACLR2_C2K_ETC CDMA 1x RC1, ETC –58.5 –55


E-UTRA_LTE_ETC ETC –33









NR ACLR ACLR_NR_NTC Test waveform 2 –39 –37 dBc

ACLR_NR_ETC Test waveform 2, ETC –33

NR ACLR ACLR_NR_NTC Test waveform 1,3,4 –40 –38

ACLR_NR_ETC Test waveform 1,3,4, ETC –33





EVM, WCDMA EVM_R99_NTC RMS, R99 RMC 12.2 kbps 3.0 % rms

EVM_R99_ETC RMS, R99 RMC 12.2 kbps, ETC 3.0



Input VSWR VSWR_IN 1.5:1 2:1


–36 dBm



1 VCC_3G4G voltage is optimized to meet the typical ("Typ") ACLR performance level. 2 Measured at Rx port, QPSK 10MHz 25RB, harmonics excluded.



Table 16. SKY58091-11 Electrical Specifications – Band 26 Rx Performance Unless otherwise specified: Environmental Conditions = NTC per Table 2; CW, 50 ohm termination


Rx Frequency Range ƒo 859 894 MHz


Rx Port VSWR VSWR_Rx_ETC Rx Band, ETC 1.5:1 2.2:1


Absolute Attenuation LB Antenna to Rx pad 1427MHz–2200 MHz 40 dB

2300 MHz–2690 MHz 35

2400 MHz–2494 MHz 40

5150 MHz–5850 MHz 40

1 Rx port mismatch removed per optimized LNA match.









G_ETC ETC, VCC_3G4G = 3.4 V 24.4 30.0


427 452 mA

LPM LTE System DC Current Referred to VBATT1 I_TOTAL_LTE_LPM PMIC Efficiency = 75%, APT Mode, POUT = 1 dBm, QPSK 10 MHz 50RB

12 mA


3ƒo 3ƒo –65 –45




LB Wi-Fi Band Noise2 NLB-WiFi 2.4 GHz WiFi, 2400–2495 MHz –165 dBm/Hz

HB Wi-Fi Band Noise2 NHB-WiFi 5 GHz WiFi, 4900–5850 MHz –160 dBm/Hz

Tx Level at B20 Rx Port PTx-Rx 832–862 MHz, LTE 10 MHz 10M12RB ( MPR = 0 ) –30 –28 dBm








Table 17-2. SKY58091-11 Electrical Specifications – Band 20 Tx Performance at LB_ANT Pad

Unless otherwise specified: NTC per Table 2, POUT = POUT_MAX, LTE modulation = QPSK/10MHz/12RB; Average Power Tracking (APT) Mode













ACLR_NR_ETC Test waveform 1,3,4 ETC –33







–36 dBm



1 VCC_3G4G voltage is optimized to meet the typical ("Typ") ACLR performance level. 2 Measured at Rx port, QPSK 20 MHz 20RB_16, QPSK 10 MHz 20RB_0, harmonics excluded.



Table 18. SKY58091-11 Electrical Specifications – Band 20 Rx Performance Unless otherwise specified: Environmental Conditions = NTC per Table 2; CW, 50 ohm termination







2300 MHz–2690 MHz 35

2400 MHz–2494 MHz 40

5150 MHz–5850 MHz 38 1 Rx port mismatch removed per optimized LNA match.

Table 19-1. SKY58091-11 Electrical Specifications – Band 12/17 Tx Performance at LB_ANT Pad Unless otherwise specified: NTC per Table 2, POUT = POUT_MAX, LTE modulation = QPSK/10MHz/12RB; Average Power Tracking (APT) Mode






G_ETC ETC, VCC_3G4G = 3.4 V 25.0 32.0

APT LTE System DC Current Referred to VBATT1 I_TOTAL_LTE PMIC Efficiency = 95%, POUT = 24 .5 dBm, QPSK 10 MHz 50RB, VCC_3G4G = 3.2 V, ƒo = 708 MHz

433 460 mA


12 mA


3ƒo2 3ƒo –80 –60

4ƒo and higher 4ƒo–nƒo –40





Tx Level at B12 Rx Port PTx-Rx LTE 10 MHz/12RB (MPR = 0) –30 –28 dBm

Isolation Tx-Rx ISO_Tx-Rx (s21 4GLB_IN to Rx port) – PA gain 55 dB





Table 19-2. SKY58091-11 Electrical Specifications – Band 12/17 Tx Performance at LB_ANT Pad Unless otherwise specified: NTC per Table 2, POUT = POUT_MAX, LTE modulation = QPSK/10MHz/12RB; Average Power Tracking (APT) Mode








EVM, NR EVM_NR_NTC Test waveform 3 1.5 1.8 %rms


EVM, NR ACLR_NR_NTC Test waveform 1,2,4 2.5 4

ACLR_NR_ETC Test waveform 1,2,4, ETC 4

NR ACLR ACLR_NR_NTC Test waveform 1,2,3,4 -40 -38 dBc

ACLR_NR_ETC Test waveform 1,2,3,4, ETC -33

NR UTRA1 UTRA1_NR_NTC Test waveform 1,2,3,4 -42 -39 dBc

UTRA1_NR_ETC Test waveform 1,2,3,4, ETC -36

NR UTRA2 UTRA2_NR_NTC Test waveform 1,2,3,4 -42 -41 dBc

UTRA2_NR_ETC Test waveform 1,2,3,4, ETC -39



–36 dBm



1 VCC_3G4G voltage is optimized to meet the typical ("Typ") ACLR performance level. 2 Applies to Band 4 Rx frequencies 3 Measured at Rx port, QPSK 10 MHz 20RB_30, harmonics excluded.

Table 20. SKY58091-11 Electrical Specifications – Band 12/17 Rx Performance Unless otherwise specified: Environmental Conditions = NTC per Table 2; CW, 50 ohm termination



Insertion Loss RxIL_NTC Rx Band 2.1 2.9 dB




2300 MHz–2690 MHz 35

2400 MHz–2494 MHz 40

5150 MHz–5850 MHz 40



Table 21. SKY58091-11 Electrical Specifications – Band 28 Tx Performance at Auxiliary TX_OUT Pads Unless otherwise specified: NTC per Table 2, POUT = POUT_MAX, LTE modulation = QPSK/10MHz/12RB; Average Power Tracking (APT) Mode





Maximum NR Output Power POUT_MAX_NR_NTC VCC_5G = 4 V 28.5


G_ETC ETC, VCC_3G4G = 3.4 V 26.0 33.0


510 532 mA


12 mA


3ƒo 3ƒo –30


Rx Band Noise Power2 NRx –127 dBm/Hz




EVM, RMS EVM_LTE_NTC 3.0 5.0 % rms EVM_LTE_ETC ETC 3.0 5.0

EUTRA ACLR E-UTRA_LTE_NTC –39 –36 dBc


UTRA ACLR1 UTRA1_LTE_NTC –40 –38 dBc UTRA1_LTE_ETC ETC –36









ACLR_NR_ETC Test waveform 1,3,4, ETC –33





Input VSWR VSWR_IN 1.5:1 2:1 Stability, spurious emissions S ETC, POUT ≤ PRATED,

TX_OUT port VSWR = 6:1, all phase angles –36 dBm

Ruggedness Ru ETC, POUT ≤ PRATED, TX_OUT port VSWR = 10:1, all phase angles


1 VCC_3G4G voltage is optimized to meet the typical ("Typ") ACLR performance level. 2 Measured at Aux port, QPSK 10MHz 25RB, harmonics excluded.



Table 22. SKY58091-11 Electrical Specifications – Band 13/14 Tx Performance at Auxiliary TX_OUT Pads Unless otherwise specified: NTC per Table 2, POUT = POUT_MAX, LTE modulation = QPSK/10MHz/12RB; Average Power Tracking (APT) Mode





G_ETC ETC, VCC_3G4G = 3.4 V 27.0 33.0


500 526 mA


12 mA


3ƒo 3ƒo –30


Rx Band Noise Power2 NRx –122 –121 dBm/Hz GPS and GLONASS Band Noise2 NGPS 1574–1577 MHz GPS, 1597–1607 MHz GLONASS –140 dBm/Hz



EVM, RMS EVM_LTE_NTC 3.0 5.0 % rms

EVM_LTE_ETC ETC 3.0 5.0








Stability, spurious emissions S ETC, POUT ≤ PRATED, TX_OUT port VSWR = 6:1, all phase angles

–36 dBm



1 VCC_3G4G voltage is optimized to meet the typical ("Typ") ACLR performance level. 2 Measured at Aux port, QPSK 10MHz 20RB_0 for B13, QPSK 10MHz 15RB_0 for B14.



Table 23 SKY58091-11 Electrical Specifications – Band 71 Tx Performance at Auxiliary TX_OUT Pads Unless otherwise specified: NTC per Table 2, POUT = POUT_MAX, LTE modulation = QPSK/10MHz/12RB; Average Power Tracking (APT) Mode





Maximum NR Output Power POUT_MAX_NR_NTC VCC_5G = 4.1 V 28.0


G_ETC ETC, VCC_3G4G = 3.4 V 26.0 32.5

APT LTE System DC Current Referred to VBATT1 I_TOTAL_LTE PMIC Efficiency = 95%, POUT = 27 .5 dBm, QPSK 10 MHz 50RB, VCC_3G4G = 3.4 V, ƒo = 681 MHz

554 574 mA


12 mA


3ƒo 3ƒo –20


Rx Band Noise Power2 NRx –127 dBm/Hz




EVM, RMS EVM_LTE_NTC 3.0 5.0 % rms

EVM_LTE_ETC ETC 3.0 5.0




UTRA1_LTE_ETC ETC –39 –36








NR ACLR ACLR_NR_NTC Test waveform 1/3/4 –40 –38

ACLR_NR_ETC Test waveform 1/3/4, ETC –33






Stability, spurious emissions S ETC, POUT ≤ PRATED, TX_OUT port VSWR = 6:1, all phase angles

–36 dBm


no module damage nor permanent degradation

1 Vcc_3G4G voltage is optimized to meet the typical ("Typ") ACLR performance level. 2 Measured at Aux port, QPSK 10 MHz 20RB_0.



Table 24. SKY58091-11 Electrical Specifications – Auxiliary LB_TRX Input Performance (LB_TRX1–4 Pads) Unless otherwise specified: NTC per Table 2; LB_TRX1–4; CW



RF Peak Input Power Handling PIN_TRX_PEAK 36 dBm

Insertion Loss TRx to ANT IL_TRX 0.7 0.91 dB

Harmonics (2ƒo to 3ƒo) 2ƒo to 3ƒo PIN_TRX = 27 dBm –75 dBm

Harmonics (4ƒo to 7ƒo) 4ƒo to 7ƒo PIN_TRX = 27 dBm –75 dBm

Input VSWR VSWR_TRX 1.2:1 1.5:12

Isolation (selected TRX to adjacent TRX ) ISO_ADJACENT 30 dB

Isolation (selected TRX to non-adjacent TRX ) ISO_NON_ADJACENT 353 dB

1 Max. IL @ B8 ƒ = 1.0 dB 2 Max. input VSWR @ B8 ƒ = 1.8:1 3 Min. isolation between TRX1–TRX3 = 32 dB

Table 25. SKY58091-11 – Low-Band Directional Coupler Performance Unless otherwise specified: NTC per Table 2; Internal Coupler Forward Operation; CW



Coupler Switch Insertion Loss CPL_LOSS Daisy chain operation, Freq = 600 MHz to 2700 MHz 0.7 1.3 dB

Coupler In-Out Switch Isolation CPL_IN_OUT_ISO Daisy Chain operation, Freq = 600 MHz to 2700 MHz 25 dB

Forward Coupling Factor CPL_FACTOR_FWD 21.5 26.5 dB

Forward Coupler Directivity1 CPL_DIR_FWD 20 22 dB

Reverse Coupling Factor CPL_FACTOR_REV 21.5 26.5 dB

Reverse Coupling Directivity1 CPL_DIR_REV 15 18 dB

1 Directivity = Isolation – Coupling Factor



MIPI RFFE Information Table 26-1. SKY58091-11 MIPI RFFE Register Map (VRAMP-based Operation)

Regi

ster

Add

ress

(H

ex)

Register Name Fiel

d Bi

ts

Field Name Description Defa

ult V

alue

BSID

/GSI

D Su

ppor

t

Trig

ger S

uppo

rt

Ext R

eg R

/W

R/W

0x00 PA_CTRL [7] Register Map & Power Control Selector

set to 1 to select this VRAMP GMSK Power Control register map 0 N Trigger 1 Y RW

[6:3] PA_MODE_CTRL PA Mode and Band Switch Control 0x0

0x0: PA OFF 0xA: 4G B20

0x1: 2G LB GMSK 0xB: 4G LB_Tx2_OUT

0x2: 2G HB GMSK 0xC: 4G B8

0x3: 2G LB EDGE 0xD: 4G LB_Tx3_OUT

0x4: 2G HB EDGE 0xE: 4G B26

0x7: PA OFF 0xF: 4G B12

0x8: 4G LB_TX4_OUT All other: reserved

0x9: 4G LB_TX1_OUT

[2] PA_EN PA Enable 0: OFF 0

1: ON

[1:0] PA_GAIN_CTRL 2G Gain Reduction 0X = Nominal Gain 00

1X = Reduced Gain

3G/4G/5G Bias Select

0x01 PA_BIAS0 [7:4] Iref2 2G Iref3 3G/4G/5G Iref2 0x0 N Trigger 1 Y RW

0x0: 250μA 0x0: 0μA

0x1: 500μA 0x1: 125μA

0x2: 750μA 0x2: 250μA

…. ….

1xE: 3750μA 1xE: 1750μA

1xF: 4000 μA 1xF: 1875 μA

[3:0] Iref1 2G Iref12 3G/4G/5G Iref1 0x0

0x0: 250 μA 0x00: 0 μA

0x1: 500 μA 0x1: 150 μA

0x2: 750 μA 0x2: 300 μA

…. ….

1xE: 3750\μA 1xE: 2100 μA

1xF: 4000 μA 1xF: 2250 μA

0x05 ASM_CTRL [7:5] (Reserved) Reserved, set to zero 000 N Trigger 0 Y RW

[4] MBShuntARM 0x00:MB shunt ARM OFF 0

0x01:MB shunt ARM ON

[3:0] ASM_SW_CTRL Antenna switch state 0x0

0x0: Isolation/Stand-by 0x7: B8

0x1: TRx1 0x8: B26

0x2: TRx2 0xC: Isolation

0x3: TRx3 0xD: Isolation

0x4: TRx4 0xE:LB_ANT terminated

0x5: B20 0xF: LB_2G_TX

0x6: B12 All others reserved



Table 26-2. SKY58091-11 MIPI RFFE Register Map (Linear GMSK Power Control Only)

Regi

ster

Add

ress

(H

ex)

Register Name Fiel

d Bi

ts


ult V

alue

BSID

/GSI

D Su

ppor

t

Trig

ger S

uppo

rt

Ext R

eg R

/W

R/W

0x00 PA_CTRL [7] Register Map & Power Control Selector

set to 0 to select this Linear GMSK Power Control register map 0 N Trigger 1 Y RW

[6:3] PA_MODE_CTRL PA Mode and Band Switch Control 0x0

0x0: PA OFF 0xA: 4G B20

0x1: 2G LB GMSK 0xB: 4G LB_Tx2_OUT

0x2: 2G HB GMSK 0xC: 4G B8

0x3: 2G LB EDGE 0xD: 4G LB_Tx3_OUT

0x4: 2G HB EDGE 0xE: 4G B26

0x7: PA OFF 0xF: 4G B12

0x8: 4G LB_Tx4_OUT All other: reserved

0x9: 4G LB_Tx1_OUT 3G/4G/5G Bias Select

[2] PA_EN PA Enable 0: OFF 0

1: ON

[1:0] PA_GAIN_CTRL 2G Power Mode 00 = HPM 10 = LPM 00

01 = MPM 11 = ULPM

3G/4G/5G Bias Select

0x01 PA_BIAS [7:4] Iref2 2G Iref3 3G/4G/5G Iref2 0x0 N Trigger 1 Y RW

0x0: 250 μA 0x0: 0 μA

0x1: 500 μA 0x1: 125 μA

0x2: 750 μA 0x2: 250 μA

…. ….

1xE: 3750 μA 1xE: 1750 μA

1xF: 4000 μA 1xF: 1875 μA

[3:0] Iref1 2G Iref12 3G/4G/5G Iref1 0x0

0x0: 250 μA 0x00: 0 μA

0x1: 500 μA 0x1: 150 μA

0x2: 750 μA 0x2: 300 μA

…. ….

1xE: 3750 μA 1xE: 2100 μA

1xF: 4000 μA 1xF: 2250 μA

0x05 ASM_CTRL [7:5] (Reserved) Reserved, set to zero 000 N Trigger 0 Y RW

[4] MBShuntARM 0X00: MB shunt ARM OFF 0

0x01: MB shunt ARM ON

[3:0] Antenna switch state 0x0

0x0: Isolation/Stand-by 0x7: B8

0x1: TRx1 0x8: B26

0x2: TRx2 0xC: Isolation

0x3: TRx3 0xD: Isolation

0x4: TRx4 0xE:LB_ANT terminated

0x5: B20 0xF: LB_2G_TX

0x6: B12 All others reserved

0x0C PA_BIAS2 [7] EnDACOverWrite 0x00: Default 2G_Bias_CTRL[3.0] = 0xF 0 N Trigger1 Y RW

0x01: Enable overwrite 2G_Bias_CTRL[3.0]

[6:4] Reserved Reserved 000

[3:0] 2G_Bias_CTRL 2G PA bias range control 1111



Table 26-3. SKY58091-11 MIPI RFFE Register Map (Common Registers)

Regi

ster

Add

ress

(H

ex)

Register Name Fiel

d Bi

ts


ult V

alue

BSID

/GSI

D Su

ppor

t

Trig

ger S

uppo

rt

Ext R

eg R

/W

R/W

0x02 Reserved Reserved 0x00 0x03 PA_BIAS1 [7] LTD Limited Bias Mode 0 N Yes

Trigger 1 Y RW

[6:4] (Reserved) Reserved 000 [3:0] Iref1_PB 2G 3G/4G/5G Iref1_PB

Reserved 0x00: 0μA 0x1: 200μA 0x2: 275μA …. 0xE: 1175A 0xF: 1250 μA

0x04 Reserved Reserved 0x00 0x07 CPL_CTRL [7:5] (Reserved) Reserved, set to zero 000 N Yes Y RW

[4:2] CPL_STATE Coupler source and internal direction Trigger 0 000: CPL_OUT disabled 101: Internal coupler Reverse direction 100: Internal coupler Forward

direction 110: External coupler (CPL_OUT from CPL_IN)

All others: Reserved, do not use [1:0] CPL_TERM Internal coupler termination 00 00: Termination A 10: Termination C 01: Termination B 11: Termination D

0x1C PM_TRIG [7] PWR_MODE[1] Note1

Operation Mode 1 Y N

Optio

nal

RW 0: Normal operation (ACTIVE) 1: Low Power Mode (LOW POWER)

[6] PWR_MODE[0] Note2

State bit vector single-bit Powered Reset 0 Y 0: No action (ACTIVE) 1: Powered Reset (STARTUP to ACTIVE to LOW POWER) [5] TRIGGER_MASK_2 Note 3 Mask for TRIGGER_2 0 N [4] TRIGGER_MASK_1 Note 3 Mask for TRIGGER_1 0 [3] TRIGGER_MASK_0 Note 3 Mask for TRIGGER_0 0 [2] TRIGGER_2 Note 4 Transfer data from shadow registers to active registers tied to TRIGGER_2 0 Y [1] TRIGGER_1 Note 4 Transfer data from shadow registers to active registers tied to TRIGGER_1 0 [0] TRIGGER_0 Note 4 Transfer data from shadow registers to active registers tied to TRIGGER_0 0

0x1D PRODUCT_ID Note5

[7:0] PRODUCT_ID 0xED 1110 1101 N N NA R

0x1E MANμFACTURER_ID Note6

[7:0] MANUFACTURER_ID[7:0] Manufacturer ID least-significant bits = 0xA5 1010 0101 N N NA R

0x1F MAN_USID [7:6] Reserved Reserved for future use. Set to all 0. 00 N N Y R [5:4] MANUFACTURER_ID[9:8]

Note7 Manufacturer ID most-significant bits = 01 01 R

[3:0] USID Note8 USID 1101 RW



Table 26-4. SKY58091-11 MIPI RFFE Register Map (Common Registers)

Regi

ster

Add

ress

(H

ex)

Register Name Fiel

d Bi

ts


ult V

alue

BSID

/GSI

D Su

ppor

t

Trig

ger S

uppo

rt

Ext R

eg R

/W

R/W

0x20 EXT_PRODUCT_ID Notes5,9

[7:0] EXT_PRODUCT_ID 0x04 0000 0100 N N NA R

0x23 UDR_RST [7] UDR_RST Reset all configurable non-RFFE Reserved registers to default values. The UDR_RST bit shall revert to default value of 0 after software reset is enabled.

0 Y N Y RW

0: Normal Operation 1: Software Reset [6:0] Reserved Reserved for future use. Set to all 0. 000 0000

0x24 ERR_SUM Note10

[7] Reserved Reserved for future error codes 0 N N NA R [6] COMMAND_FRAME_ PARITY_ERR Command Sequence received with parity error – discard command [5] COMMAND_LENGTH_ERR Command length error [4] ADDRESS_FRAME_PARITY_ERR Address frame with parity error [3] DATA_FRAME_PARITY_ERR Data frame with parity error [2] READ_UNUSED_REG Read command to an invalid address [1] WRITE_UNUSED_REG Write command to an invalid address [0] BID_GID_ERR Read command with a BROADCAST_ID or GROUP_ID

Notes for Table 26 Note 1 PWR_MODE[1] defines normal ACTIVE operation and LOW POWER mode. When an RFFE slave is initially powered up and comes out of reset it will go in to ACTIVE but immediately

transition to LOW POWER to avoid requiring a write on the bus to configure devices explicitly to LOW POWER. When the slave is in LOW POWER, charge pumps shall be disabled and the slave shall be listening to the RFFE bus.

Note 2 Writing a 1 to PWR_MODE[0] resets all slave registers to their default settings including the Operation Mode bit in PWR_MODE[1]. Always reads back 0. Note 3 When TRIGGER_MASK_N is set to 1, writes go directly to the active registers. When 0, data is held in shadow registers until the TRIGGER_N bit is set to 1. Note 4 TRIGGER_N has no effect if corresponding TRIGGER_MASK_N is 1. When the part is in LOW POWER and a trigger request is sent in the same command sequence that still keeps the part

in LOW POWER, the trigger request is ignored. This applies to Triggers only, not to Trigger Masks. When the part is in ACTIVE and sent to LOW POWER, or when the part is in LOW POWER and sent to ACTIVE, trigger requests in the same command sequence are NOT ignored.

Note 5 PRODUCT_ID and EXT_PRODUCT_ID are read-only registers. However, during the programming of the USID a write command sequence is performed on these registers, even though the write does not change their value.

Note 6 (same footnote as MANUFACTURER_ID[9:8]) Note 7 Manufacturer ID is read-only. However, during the programming of the USID, a write command sequence is performed on this register even though the write does not change its value.

See http://mid.mipi.org.

Note 8 These bits store the USID of the device. Performing a write to this register using the described programming sequences will re-program the USID. Note 9 (first footnote) Extension to PRODUCT_ID in register 0x1D.

(second footnote is same as PRODUCT_ID) Note 10 The ERR_SUM register reports error codes until read. The ERR_SUM register shall reset after it is read.



Evaluation Board DescriptionThe evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY58091-11, the evaluation board schematic and assembly

diagrams are included for analysis and design. The basic schematic is shown in Figure 2 for the board assembly in Figure 3.

Figure 2. Evaluation Board Schematic Diagram – SKY58091-11



Figure 3. Evaluation Board Assembly Diagram – SKY58091-11



Table 27. SKY58091-11 Evaluation Board Bill of Material

ITEM QTY REFERENCE DESIGNATORS PART DESCRIPTION

1 REF — SKY58091-11 7.6 x 6.0 MODULE TEST FIXTURE

2 REF — SKY58091-11 7.6 x 6.0 MODULE TEST FIXTURE

3 1 — CONNECTOR, HEADER

4 1 — SKY58091-11 7.6 x 6.0 MODULE TEST FIXTURE

5 21 — CONN SMA END LAUNCH JACK

6 1 C36 CAPACITOR, CERAMIC, 270 pF, 10%, X 7R, 50 V, 0402

7 2 C41,C43 CAPACITOR, TANTALUM MOLDED 220 μF 10 V ±10%

8 3 C7,C2,C39 CAPACITOR, TANTALUM MOLDED 10 μF 16 V ±10% 1206

9 11 R3,R8,C15,C17,C18,C20.C21,C23,C25,C45,C47 RESISTOR, 0 OHM, JUMPER, 0.05 W, 0201

10 5 R4,R5,R6,R7,R10 RES,0 OHM, JUMPER, 0.063 W, 0402

11 1 C12 CAPACITOR,CERAMIC,0.1 UF,10%,X7R,16V,0402

12 1 C8 CAPACITOR, CERAMIC,2.2 UF,10%,X5R,16V,0603

13 1 C9 CAPACITOR, CERAMIC,10 UF,20%,X5R,6.3V,0603

14 1 C6 CAPACITOR, CERAMIC,22000 PF,10%,X7R,16V,0402

15 1 C5 CAPACITOR, CERAMIC,1000 PF,10%,X7R,50V,0402

16 1 C4 CAPACITOR, CERAMIC,0.1 UF,10%,X7R,16V,0402

17 1 C13 CAPACITOR, CERAMIC,1 UF,10%,X5R,10V,0402

18 1 C22 CAPACITOR,CERAMIC,1 PF,±0.1PF,C0G,25 V,MID-Q,0201

19 1 C26 IND,ML-VC,22 NH,3%,MHQ,0201WB

20 1 C27 CAP,CER,22 PF,2%,C0G,50V,0201

21 1 C28 IND,ML-VC,18 NH,3%,HI-Q,0201

22 1 C44 IND,ML-VC,7.5 NH,3%,MHQ,0201WB

23 1 C46 CAP,CER,3 PF,+/-0.1PF,C0G,50V,0201

DO NOT PLACE C10,C11,C14,C16,C19,C24,C29,C30,C31,C32,C33,C34,C35,C37,C38,C40,C42,R1,R2,R9,R11



Package Dimensions Figure 4 is a mechanical drawing of the layout for the 56-pad SKY58091-11 module. Figure 5 provides a recommended PCB layout footprint for the FEM to help the designer attain optimum

thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals.

Figure 4. Dimensional Diagram for 7.6 mm x 6.0 mm x 0.75 mm, 56-Pad MCM Package – SKY58091-11



Figure 5. PCB Layout Footprint for 7.6 mm x 6.0 mm, 56-Pad Package – SKY58091-11



Package Description Figure 6 shows the device pad configuration and the pad numbering convention, which starts with pad 1 in the lower left and increments counter-clockwise around the package. Table 27 lists the pad labels and signal descriptions. Typical case Markings are shown in Figure 7.

Figure 6. SKY58091-11 Pad Configuration – 56-pad MCM (Top View)

Figure 7. Typical Case Markings

Table 28. SKY58091-11 Signal Descriptions Pad No.1 Name Description

2 LB_ANT RF Switch Port to/from Antenna 4 LB_CPL_OUT Built-in or Alternate Coupler Output 5 NC No Connect 6 LB_CPL_IN Input from M/HB Coupler 8 2GHB_TX_OUT High Band 2G PA Tx Output

13 VRAMP 2G PA Analog Power Control Input 14 VBATT Battery Supply

15 & 16 2G_VCC 2G PA Supply 18 SCLK MIPI Clock Input 19 SDATA MIPI Serial Data I/O 20 VIO MIPI Supply 22 2GHB_IN 2G PA High Band RF Input 24 2GLB_IN 2G PA Low Band RF Input 25 NC No Connect 26 4GLB_IN 4G PA RF Input 30 NC No Connect 32 4GLB_VCC 4G LB PA Supply 36 LB_TX4_OUT PA Switch Auxiliary Output 4 37 LB_TX3_OUT PA Switch Auxiliary Output 3 38 LB_TX2_OUT PA Switch Auxiliary Output 2 39 LB_TX1_OUT PA Switch Auxiliary Output 1 44 B8_RX Band 8 Duplexer Rx Output 47 B12_RX Band 12 Duplexer Rx Output 49 B26_RX Band 26 Duplexer Rx Output 51 B20_RX Band 20 Duplexer Rx Output 53 LB_TRX4 Auxiliary Antenna Switch Port TRx4 54 LB_TRX3 Auxiliary Antenna Switch Port TRx3 55 LB_TRX2 Auxiliary Antenna Switch Port TRx2 56 LB_TRX1 Auxiliary Antenna Switch Port TRx1

1 Pads 1, 3, 7, 9-12, 17, 21, 23, 27-29, 31, 33-35, 40-43, 45, 46, 48, 50, 52 are Ground pads

Electrostatic Discharge Sensitivity

To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the ESD handling precautions listed below. • Personnel Grounding

- Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges

• Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors

• Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 1,000 MΩ to GND)

• Protective packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders



Package Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.

The SKY58091-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 260 °C. It can be used for lead or lead-free soldering. For additional information, refer to Skyworks Application Note, PCB Design and SMT Assembly/ Rework Guidelines for MCM–L packages, Document Number 101752.

Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format (Figure 8)

Figure 8. Carrier Tape Dimensional Diagram for Body Size 6.0 mm x 7.6 mm – Overmold MCM



Ordering Information

Part Number Part Description Evaluation Board Part Number

SKY58091-11 SkyOne® Low-Band Tx-Rx Front-End Module SKY58091-11EK1

Revision History

Revision Date Description

A January 28, 2019 Initial Release – Preliminary Information CN 28932

B May 11, 2019 Revise: Features list, Description (p1); Tables 3, 5, 6, 11, 13, 14, 16, 18, 21, 23, 26, 27; Figures 2, 3 CN 32962

C July 26, 2019 Revise: 4G Features (p1); Description (p1);.Tables 3, 4, 6, 8–23, 25, 26; Figure 2 CN 35847

D October 31, 2019 Revise: Removed “and Confidential” from running footer. Publishing to external web site CN 40458

E December 5, 2019 Revise: Spec updates; Tables 2, 5, 13, 15–17, 19, 21–23, 26, 27; Figure 7 CN 40500

References Skyworks Application Note: PCB Design and SMT Assembly/Rework Guidelines for MCM–L Packages; Document Number 101752

Standard SMT Reflow Profiles: JEDEC Standard J-STD-020

Testing & Measurement Techniques-Electrostatic Discharge Immunity Test, IEC 61000-4-2

Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A114 Human Body Model (HBM)

Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A115 Machine Model (MM)

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PRELIMINARY DATA SHEET SKY5 -8091-11 SkyOne Low Band Tx-Rx … · 2019. 12. 11. · Human Body...

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Transcript of PRELIMINARY DATA SHEET SKY5 -8091-11 SkyOne Low Band Tx-Rx … · 2019. 12. 11. · Human Body...