Power Electronics and Electric Machines - Center for High ... · Department of Electrical and...
Transcript of Power Electronics and Electric Machines - Center for High ... · Department of Electrical and...
Department of Electrical and Computer Engineering
Center for High Performance Power Electronics
Power Electronics and Electric Machines
Sept 19th , 2014
Dr. Jin Wang
Leading Faculties
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Dr. Longya Xu
Professor
Electric Machine/Power Electronics
Dr. Jin Wang
Associate Professor
Power Electronics/High Voltage
Dr. Fang Luo
Research Assistant Professor
Power Electronics/Device
Packaging/EMI
Dr. Mahesh Illindala
Assistant Professor
Power Electronics/Microgrid
Evolution of Power Devices
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Dr. kamel Madjour, Silicon Carbide Market Updates, PCIM May 2014
Application of SiC
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Dr. kamel Madjour, Silicon Carbide Market Updates, PCIM May 2014
GaN Application Outlook
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Facility Overiew
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High Performance Power Electronics Lab an Air
Force, the State of Ohio, and industry sponsored
research center with a single focus of development
and implementation of wide bandgap based power
devices; the center has a vertically integrated team
with expertise spans from material growth to system
integration and 6 million dollar worth new
equipment and facility;
High Voltage Laboratory a 3600 square feet
facility that hosts the biggest arcs and sparks in the
U.S. universities;
Distributed Real Time Simulation Platform a
DoE sponsored real time simulation platform for
power electronics applications, featured in the New
York Times on Dec. 30 2010.
Facilities: High Speed Dynamometer
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• 30,000 RPM
• 350 kVA
• Vehicle and aerospace applications
High Voltage Facility
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The 3600 Square Foot Facility for Spark and Arc
DC sources up to 150,000
volts
AC sources up to 250,000
Vrms,
Surge voltage up to 1,000,000
volts, and
a Tesla transformer up to 3
million volts.
Test capabilities include withstand, partial discharge and breakdown tests on
gases, liquids and solids, electric and magnetic field tests, reduced-scale model
tests and shielding and attenuation experiments.
Facilities: Power Circuit and System Labs (Cont.)
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High Power Test Area (Up to 20 kV, 360 kVA)
Student Lounge
One of the Low Power Test Benches
Device Evaluation Bench
Real-time Teaching/Research Facility
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The Fully Equipped Teaching/Research Platform
One Simulation Tower with Surrounding
Benches.
Real Time Simulation: Executing a computer
model of a physical system at the same rate as
actual "wall clock" time. For example, if a
process takes 100 microsecond to finish in the
real-world, the simulation would take less or
equal to 100 microsecond.
System Introduction
4 Real Time Simulators;
8 CPUs with Totally 48 Cores: Intel Xeon Six-
Core, 3.33 GHz;
1 Hardware-in-the-Loop Box;
5 User Programmable FPGAs : 4 Spartan-3
and 1Virtex-6 ;
512 Digital IO and 256 Analog IO;
Dolphin Real Time Communication Link:
Latency as low as 0.2 us.
Project Examples: Quasi-Switched Capacitor
Resonant Converter
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Specifications:
Features:
Full soft switching with both types of
resonance achieved;
An 8-layer PCB with the planar transformer
integrated (designed with FEA tools)
100 V eGaN FETs (EPC2016) for all
switches;
A flat efficiency curve with a peak value of
96% at 0.7 MHz.
A 90-W, 88 V/19 V, 700-kHz QSC resonant
dc/dc converter
Item Descriptions
Rating Vin=88 V, Vout =19 V, Pout=90 W, fs =700 kHz
Transformer N=3:2:2, Lm=16 µH, Ls=25 nH
Capacitors C2=C3=C4=2 µF
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Two Recent WBG based Circuit Prototypes
Modular Switched Capacitor
Circuit
A Quasi-Switched Capacitor based
Isolated DC/DC Converter for EV/HEV
A 500 W GaN based Module.
290 mm
120 m
m
Secondary-side
Circuit
Primary-side
Circuit
Total Height:
38 mm
Planar Inductors &
Planar Transformer
Bidirectional
Power Flow
14 V power net
(9 ~ 16V)
HV dc bus
(200 ~ 450 V)Isolated DC/DC
converter
500 kHz
893 kHz
1 kW with
natural
convection
High Voltage and High Power Converters
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Coupled Inductor
Film capacitors Six Pack IGBT & Gate Drive
Single IGBT & Gate Drive
Heatsink, 10" by 10"
Bus Bars
3D Layout Design
85 kVA quasi Z-Source traction drive
300 kW Inverter for
the Integration of
Renewable Energy
30 kW SiC JFET based
Inverter
Electric Machines
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Strength:
Advanced electric machine design and control
Full test capability for control strategies
Selected ongoing projects and activities:
High speed machine for integrated starter and generator;
Two mechanical port machine for hybrid electric vehicle
powertrain;
Dual Excitation Brushless Reluctance Generator for Wind
Power.
Integrated starter and
generator
Double-fed machine for wind power without
permanent magnets and brushes/slip rings Dual Mechanic port machine
for hybrid electric vehicles
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The Vertical Integrated Diode Module
Capacitor
DC -
Heat Spreader
Heat Spreader
Diode
DC +
Capacitor
Diode
Diode Diode
TIM
TIM
Vertical diode module: packaging structure
Front view
Side view
Isotropic view
Input: A
Input: BDC +
DC -
Wireless connection
Improved EMI performance
Optimized parasitic
Potential for improved thermal
management
Research Directions: Circuit Topology
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Si-WBG Hybrid Circuit
Topologies
Inductorless or
capacitorless circuits
High voltage and high
power circuits
1. Modular
2. Multifunction
3. Multi-input and multi-output
Identifying brand new circuit topologies is becoming
more and more challenging;
but with WBG devices and new circuit techniques,
traditionally less popular circuit topologies could
outperform dominant circuit topologies;
also, brand new circuit topologies can be once again
expected.
Fact: Thousands of papers are presented each year in power electronics conferences, e.g. 534 papers
were presented in APEC 2014; But in the last two decades, only a handful new circuit topologies have
been widely accepted by academia; even fewer have been implemented by industry, e.g., LLC and
MMC.
Research Direction: Packaging and Integration
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• Packaging become the bottle-neck for the new WBG devices
• EMI and passive components build the barrier for higher performance and high-
density converter
• Reliability and packaging material system is also important for PE researchers
High-
Temperature
Packaging
High-
Frequency
Packaging
Passive
Packaging and
Integration
Improved Wirebond
Structure for EMI
and Hi-Rel
Wireless Structure
Integrated Filters
EMI-Less HDP
Converter
Module
Hi-Rel Converter
Module
Multi-Physcis
Modeling of HPD
Module
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Research Direction: Packaging and Integration
• Packaging Facilities
• Basic Packaging-Shop
• Manual Equipment
• Fits better for wirebond
structure
• Void-free process
• Semi-auto process
capability
• Wireless interconnection
• Reliability Testing and
Modeling
• Fine pitch process
• In-module passive
integration
• Advanced Thermal
Management
Facility/Equipment Development
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Existing
Voltage
Power
600 V 1200 V 1000 kV
100 VA
1000 VA
100 kVA
1 MVA
100 V 15 kV
Device Evaluation, HIL, Circuit Prototyping and testbed
Capability
300 kVA
Under Development
Future Development (CHIL
for MMC, MVA testing, etc.)
Needed Equipment:
30 kV device test platform
30 kV, 1 MW high power cycler
FPGA based large scale real-time simulation for Modular
Multilevel Converter and Multi-terminal DC (MTDC)
network
Department of Electrical and Computer Engineering
Center for High Performance Power Electronics
Questions
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