Power Distribution Studies at Fermilab
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Transcript of Power Distribution Studies at Fermilab
Power Distribution Studies at Fermilab
Aida Todri, FNAL
ATLAS/CMS Power WG Meeting
March 31st , 2010
Outline
Panel test stand. System setup.
DC-DC conversion powering scheme tests: Efficiency measurements. Cooling impact on converter. Pixel performance measurements.
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Panel Test Stand
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CAPTAN DAQ system, 12bit ADC, 65MHz
Panel 21 ROCs, TBM, 40MHz, Ianalog~1.35A, Idigital~1.5A with external load
Converters AMIS2 DC-DC converters for VA and VD.
Pixel Calibration
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Analog signal in ADC counts from all the readout chips in a panel sampled by the front-end digitizer. Decoding of analog signal.
DC-DC Converters
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Chip: AMIS2 by CERN Vin=6-12V Iout<3A Vout=3.3V fs=600kHz..3MHz
PCB: Aachen 2 copper layers External air-core
inductor L=550nH, R=80mΩ
AMIS2
Efficiency Measurements (w/o cooling)
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DIGITALTemp Vin In Vout Iout Eff
room = 28˚C
8 0.798 3.327 1.492 77.76%8.5 0.755 3.327 1.492 77.35%
9 0.716 3.331 1.494 77.23%9.5 0.685 3.341 1.488 76.40%10 0.656 3.347 1.5 76.53%
10.5 0.632 3.355 1.503 75.99%11 0.608 3.362 1.505 75.66%
11.5 0.59 3.372 1.513 75.19%12 0.571 3.38 1.507 74.34%
ANALOGTemp Vin In Vout Iout Eff
room = 28˚C
8 0.725 3.35 1.37 79.13%8.5 0.69 3.36 1.37 78.49%
9 0.657 3.36 1.37 77.85%9.5 0.63 3.37 1.38 77.70%10 0.608 3.38 1.38 76.72%
10.5 0.583 3.38 1.38 76.20%11 0.569 3.4 1.4 76.05%
11.5 0.549 3.4 1.4 75.39%12 0.533 3.41 1.4 74.64%
8 8.5 9 9.5 10 10.5 11 11.5 1272.00%
73.00%
74.00%
75.00%
76.00%
77.00%
78.00%
79.00%
Converter Input Voltage (V)
Effi
cie
ncy
8 8.5 9 9.5 10 10.5 11 11.5 1272.00%
73.00%
74.00%
75.00%
76.00%
77.00%
78.00%
79.00%
80.00%
Converter Inputer Voltage (V)
Effi
cie
ncy
Impact of Chip Cooling
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Observation : Cooling the converter chip ~20˚C impacts the regulator and decreases the voltage level being supplied to the panel. Cause degradation in the signal pulse.
w/ cooling
no cooling
Temperature Measurement
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Ton_chip=70˚C
Ton_ind=88˚C
Ton_chip=69˚C
Ton_ind=106.8˚C
no cooling with air fan cooling
Efficiency w/ Cooling
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8 8.5 9 9.5 10 10.5 11 11.5 1266.00%
68.00%
70.00%
72.00%
74.00%
76.00%
78.00%
80.00%
Analog
with_coolingno_cooling
Converter Input Voltage (V)
Effi
cie
ncy
8 8.5 9 9.5 10 10.5 11 11.5 1271.00%
72.00%
73.00%
74.00%
75.00%
76.00%
77.00%
78.00%
79.00%
80.00%
Digital
with_coolingno_cooling
Converter Inputer Voltage (V)
Effi
cie
ncy
Power Supply Noise
No converter w/ DC-DC converters
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Vout=3.26V, Vin=9VTemp=62.8˚C
Vout=2.42V
∆=278mV
Performance Measurements
S-Curve Test:
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To measure the signal threshold and noise level of each pixel.
Efficiency of the pixel is derived as a function of the amplitude of the calibration signal.
Each pixel response is obtained by injecting calibration pulses with different Vcal DAC values (1Vcal=65e).
S-Curve calibration is run with and without DC-DC converters.
Noise and Threshold Dispersion
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Pixel Noise Maps
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Threshold Dispersion Maps
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Serial Powering Test Stand
SPi Chip: FNAL Vshunt=1.2 to 3V Iseries=0 to 4A
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CAPTAN sending data packets to program the SPi chip to operate at different modes.
SPi powered through a power supply source by limiting current.
Limited current output to drive a plaquette or panelUsed ~ 250mA
Next Test Setup
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CAEN A4603
DC-DC Conversion
Panel
Setup modified CAEN A4603 module to power up the chips Perform test a lower temperatures (chiller box) Perform test with a magnet 1.5T.
Conclusions Currently:
Performing power integrity tests on the panel system
Performing pixel performance measurements Characterizing the DC-DC converter and serial
powering schemes and their efficiencies Next Steps:
Continue with performance measurement studies for DC-DC powering scheme.
Complete test stand setup using: CAEN power supply, magnet, cooler temps.
Testing of serial powering scheme Efficiency comparisons between two schemes.
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