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ASX Code : SOR Cash : Approx. $7MDebts : Nil

Pooled Development Fund funding Australian SME owned projects in technology and resources….

Specialty focus on backing projects with large scale upside potential.

Maintain significant control over direction of projects.

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+pooled development fund

§ SORoperatesunderthePooledDevelopmentFundprogram,anAustralianFederalGovernmentprogramdesignedtoincreaseinvestmentinAustralian SME’s.

§ DesignedbyFederalGovernmenttoinpartdriveinvestmentintoAustralianinnovation.

§ UnderthisAusindustryVentureCapitalProgrammostshareholderspaynocapitalgainstaxonthesaleoftheirASXlistedSORshares.

§ Otherpotentialbenefitsforshareholdersincludepayingnotaxondividendsreceived.

§ SORasaCompanyalsopaysjust15%corporatetaxrateonreturnsfrombackingAustralianSME’s.

§ Over$1bninvestedinAustralian CompaniesbythePDFprogram.

Australian Entrepreneurs Innovators and Geologists

*Shareholdersshouldseektheirownindependenttaxadvice.

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+technology focus on printed electronics

§ PEcancreateprintableelectronicsonmaterialsthatcurrentsemiconductorscannot.

§ PEcanalsobemanufacturedusingcheapprintingmethodsunlikecurrentelectronicsmadeinexpensivefabricationplants.

Printedelectronicsmanufacturingfacilitiescost1/100thoftraditionalsemiconductorfabricationplants.

n Innovationonprintingtechniquesandconductivematerialsmakeshighthroughputandvolumeproductionofelectronicspossibleatlowcostonplastic,glassandeventextiles.

n Thisenablesintegrationofprintedandflexibleelectronicsintoeverydayitemsandplaceswehadonlydreamedofbefore.

This allows device manufacturers to place electronics in places and on products that have never been able to use electronics before.

ORGANIC AND PRINTED ELECTRONICS 29

The wafer level technology includes batch pro-cessing, typically film substrates on a carrier. An adapted semiconductor line is used for process-ing. High resolution can be achieved by vacuum deposition and/or spin coating followed by pho-tolithography and wet or dry etching. The pro-duction cost is relatively high and the process is not compatible for conversion to in-line sheet to sheet or reel-to-reel processes.

Under hybrid technologies, we summarize com-binations of processes including large area pho-tolithography, screen printing or printed circuit board (PCB) technologies that make use of flexi-ble substrates (e.g. polymer films or paper). Depo-sition of materials happens by spin coating, blade coating or large area vacuum deposition, in some cases also partly by printing. Ink-jet print-ing and laser patterning are further technologies that are grouped in the hybrids and enable pro-duction at a medium cost level. At the moment hybrid appears to be possibly the most promising technology for further market penetration in the next few years, and it could also be combined with some amount of silicon for specific func-tions in hybrid systems.

Fully printed means continuous, automated mass-production compatible printing and coat-ing techniques (flexo, gravure, offset, slot-die,

from a large area unpatterned film, while others are additive, i. e. they only deposit material where it is wanted, e.g. by fusing a shadow mask.

There are no single standard processes in exist-ence today. Deciding which printing or other pat-terning process is used depends on the specific requirements of a particular device. In general, different processes have to be used for subse-quent steps of a multilayer device in order to optimize each process step. In an integrated product there may also be some steps in which printing processes are used at standard levels, e.g. for graphics or adhesives, and other critical ones where the highest quality standards need to be applied, e.g. for functional layers and small features. The above mentioned processes differ strongly with regard to, e.g., resolution and throughput and the feature size and throughput for some important processes at the highest quality level are shown in Figure 20.

Process Technology LevelsThe technologies that are used in organic elec-tronics range from batch, clean-room, etching based processes to mass printing processes that are capable of deposition of square meters of substrates per second. Here is a rough classifica-tion of the technologies in three different tech-nology levels:

Figure 21: Reel-to-reel printing of electronic devices. (Source: OE-A)

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+technology sector activities

ORGANIC AND PRINTED ELECTRONICS 21

regard to the trend from health care at clinics and hospitals to health care at home. To some extent, the future is already here, since organic and printed electronics already enables products on the health care market, such as glucose test strips, lab-on-chip products and smart blister package for pharmaceuticals.

While we focus on clusters of applications based on functions, organic electronics contributes to innovation in different industrial sectors such as automotive or health care, with products cover-ing a range of functions. For this reason, OE-A has also begun to look at these market segments, and there have already been intensive discus-sions about how organic electronics may contrib-ute to the future of health care, especially with

Primary batteries, memory for brand protection,ITO-free transparent conductive films and touch sensors

Garments with integrated sensors,anti-theft/forgery labels, temperature sensor smart labels, printed sensors and test strips

Rechargeable batteries, transparent touch sensors, reflective display elements,flexible & large area ITO-free touch sensors

NFC enabled sensor labels, intelligent packaging, integrated systems on garment

Multi-cell batteries, wireless readable memory, printed logic chips, bendable ITO-free touch & gesture sensors

Directly printed batteries, smart objects integrating actives and passive devices, fully integrated touch & gesture sensors

Multi-cell batteries, wireless readable memory, printed logic chips, bendable ITO-free touch & gesture sensors

OLED on textile, disposable health monitoring systems, wireless sensors for smart buildings

OE-A Roadmap for Organic and Printed Electronics Applications 2015

Electronics & Components

Integrated Smart

Systems

Existing until 2015

Short term 2016–2018

Medium term 2019–2022

Longer term 2023+© OE-A 2015

▲ ▲ ▲

Rigid modules for design driven luminaires B2B and B2C

Flexible lighting for design driven applications

Mass-produced flexible lighting

General lighting

Curved OLED TVs, flexible OLED displays, mobile OLED displays, e-reader, wearables

In-moulded displays, (semi-) transparent bendable display, OLED monitors and TVs

Portable foldableOLED displays, (semi-) transparent rollable display

Stretchable display, rollable OLED TV, rollable consumer electronics

Consumer electronic chargers, solar lamps, architectual installations

Consumer electronics, mobile power, energy harvesting, specialized BIPV and BAPV

Mobile power, Internet of Everything energy harvesting, building integration, medium size off-grid

Large volume BIPV integration, large and industrial off-grid, grid-connected PV

Organic Photovoltaics

Flexible andOLED Display

ELO DLighting

Figure 13: 6th Edition of the OE-A Roadmap for organic and printed electronics, with forecast for the market entry in large volumes (general availability) for the different applications. The table is a further development of and update to the fifth version of the OE-A roadmap presented in 2013.

InthetechnologysectorSORisassessingAustralianPrintedElectronicstechnologiesandCompaniesforpotentiallicensingandacquisition

AccordingtoresearchfirmIDTechEx,theglobalmarketforprintedandpotentiallyprintableelectronics,willrisefromaboutUSD24billionin2014to$70.4billionin2024,withacompoundannualgrowthrateof40percent.

Thoseamountsjumpdramaticallywhenyouincludethetotalmarketvalueoftheproductsthatdo,andcould,incorporatePEcomponents.

This is only the beginning.. the global market could reach $340 Billion by 2030.

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+100% owned Nanocube Memory Technology

§ Ok…. whathasbeenachievedsinceourlastAGM?

.. however the team is currently working on something that could open up an even bigger potential opportunity.

Memoryisattheheartofelectronics…….howevercurrentmemorycapacityofprintedelectronicsandsmartsystemsislimited.- IDC

§ Wehaveshownthroughproofofconceptprototypesthatwecanmakeamemoryinkcontainingthenanocubetechnology:

- itcanbecoatedandinkjetprinted- thememorycellsarereliable- withgoodspeed- aretransparentand- functiononsurfacesotherthansiliconsuch

asplasticandglassmaterials.

§ Alloutstandingachievementsinsuchashorttimeframe…

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+current Nanocube Technology focus

Billion dollar German Company announced robust and flexible 25-micrometer thick flexible glass (almost 4 times thinner than a human hair), for use in all sorts of flexible devices.

Flexible and yet robust: ultra-thin glass bends to a radius of a few mm.

Applications in the electronics and semiconductor industries.

§ Enablingmemorytoalsobebentorflexedwouldopenupahuge additionalpotentialmarketsinflexibleproductapplications

“This will allow for pioneering innovations in various industries.. the areas of consumer electronics, packaging, white goods, and automotive, for example” Schott

§ TheCompanyandtheteamattheUniversityofNewSouthWalesarecurrentlyfocusedondevelopmentandtestingoftheabilitytobend/flextheNanocubememoryink..

§ We arealsocurrentlyindiscussionswithpotentialcollaborationanddevelopmentpartners....

Tough, ultra-thin glass is scratch-resistant and bendable with a radius of a few millimeters, showing no signs of fatigue.

§ Largeglobalcompaniesareinvestinghugeamountsandmakingbreakthroughsindevelopingnewflexiblematerialsforelectronics.Letslookatoneexample...

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+nanocube commercialisation strategy

The secret to Printed Electronics growth is collaboration - Dupont

§ IdentifypotentialpartnersfromIndustrialInnovationCentres,InnovationClustersandCompaniesacrossthePrintedElectronicssupplychain.

§ Leveragepartnersglobalnetworkandexpertiseinmanyareas.§ Developproductsfasterandlaunchingthemearlier.§ Gainbetteraccesstothetargetmarket.

Ourstrategyistospecificallyfocustechnicaldevelopmentonthosetasksthatenablepartnerships tobeformed.Wearecurrentlyindiscussionswithpotentialpartners.

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+what do others think of printed electronics?

“Theseprinting,materials,paperandchemicalcompaniesoftodaywillbethenewelectronicgiantstomorrow”– IDTechEx

“Thedemandforlow-cost,nonconventionalelectronicsolutionsisrealanditsgrowing”– Xerox

“Investorsareincreasinglydrawntotheprintedelectronicsmarketduetoitslowcostofentryandtechnologicalknowhowofconventionalprinting.Theconventionalprintingmethodsarealreadymasteredandthisreducesthechancesofanyanomalywiththeprocess”– FrostandSullivan

“Technologiesforflexibleelectronicsmanufacturingwillbemajordifferentiatorsinthenextgenerationofconsumerandcomputingdevices”– President’sCouncilofAdvisorsonScienceandTechnology

“FlexibleHybridElectronicshasthepotentialtore-shapeentireindustries,fromtheelectronicwearabledevicesmarket,tomedicalhealthmonitoringsystems,totheubiquitoussensingoftheworldaroundus– alsoknownastheInternetofThings”-USDepartmentofDefense

“PrintedElectronics..theHolyGrailoflowcost,highvolumemanufacturing.Followthemoney”- DuPont

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+Golden Blocks – Historic High Grade Goldfield

§ Aorangiclosedduetowaterandlabour issuesandhasneverbeendrilled.ThedeeperpotentialoftheAorangimineprovidesapromisingexplorationtarget.

§ TheCompanywillfollowupassaysfromhistoricalundergroundexplorationofaveingrading663.8g/tover0.75macrossthefullwidthofthequartz,includingaselectsampleof5324.5g/tover0.25m.

§ ThehistoricveryhighgradeAorangiGoldminewasstillopentothesouthwhenminingstoppedin1914andanumberofothermineswithintheprojectwereonlyworkedtoveryshallowlevels.

WORKINGTOREOPENA100YEAROLDHIGHGRADEGOLDFIELD

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+Officer Project - Unexplored WA Deserts

The700km2 OfficerProjectisincollaborationwithworldleadinggeologistDrFrancoPirajno,whowasformerlywiththeGeologicalSurveyofWesternAustraliafor21years,previouslyanExplorationManagerforAngloAmericanCorporation(NZ,SWPacific)andhasbeeninvolvedwithseveralcopperdiscoveries.

§ ThegeneralconsensustodatehasbeenthatPermianagecoverrocksinWAareeconomicallyuninterestingformetaldepositsandhenceisolateddesertregionsintheOfficerBasinhaveremainedoverlookedandvirtuallycompletley unexplored.

§ However,incollaborationwithDrFrancoPirajno,anoverseasmetalsdepositmodel(PermianKupfersheifer)unfamiliartoAustraliawasappliedtothegeologyoftheOfficerBasinandthepreviouslyunrecognisedpotentialforcopper+silver+cobalt becameclear.

§ ThisdepositstyleismorecommonlyknowninEuropewheretheyarethe2nd mostimportantcopperdepositswithanaverageof44mt@1.8%Cu.

• RecognisingthatthePermianrockslongthoughtofasjust‘cover’wereactuallyatargetintheirownrightledtheCompanytoapplyforapprox.700km2 ofthemostattractiveground,toprovideadominantholdingforthisstyleofmineralisationintheOfficerBasin.

• Historyshowsthatinanymineraldistrict,thelargestdepositsareusuallyfoundfirst.Gainingfirstbootsonfrontierground foranewmodelisasignificantmotivationtotheprojectteam.

The54,000km2 ofdesertsurroundingtheOfficerProjectisvirtuallyunexploredwithonlyfourcompanieseverhavingbeenactiveinthearea.

• Therehaveonlybeentwentymineralexplorationholes,insurrounding54,000km2-primarilyfordiamonds.

• Significantlyhowever,twooftheseholes8kmapartbothcontainedhighlyanomalouscopperwithallthehallmarksofthisstyleofmineralisation.

FirstBootsonFrontierGround

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Who ?ASX: SOR Summary

• StrategicElementsisregisteredbytheAustralianFederalGovernmentunderaspecialprogramtoencourageinvestmentintoAustralianSME’s enablingmostinvestorstopaynocapitalgainstaxwhentheyselltheirshares.

•Weseektoworkwithworldleadingexpertsandfocusonprojectswithlargescalepotentialupside.Weback‘higherrisk- higherreward’opportunities.

• TheCompanyisauniquevehiclelistedonASXunderthecode“SOR”andhasadualresourcesandtechnologyexposure.$7Mcashanddebtfree.

• CurrentlyworkingwithworldleadinggeologistDrFrancoPirajno fora‘discoveryfromoverseasmodelsinWAfrontiers’.

• TheOfficerProjectincludes700km2 ofunexploredgroundinWAdeserts.

• Currentlypreparingfirstexplorationprogramtooccurwithinnextfewmonths.

•Workingtore-open100yearoldhighgradeNZgoldfield.

•DrillingisbeingplannedtotargetthePioneerShootwherelastexplorationassaysreturned663.9g/tgoldover0.75mincluding5342.5g/tgoldover0.25m.

• ExplorationPermitprogressandconceptualdrillingtobeannouncedshortly.

• CurrentlyfocusingondevelopingNanocubeMemorytechnologyforpotentialuseinbendable/flexibleelectronicdevices.

• Currentlyindiscussionswithpotentialdevelopmentpartners.

• CurrentlyconductingduediligenceonfurtherPrintedElectronicstechnologies.

100% Owned

100% Owned

100% Owned

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