PMEG4005EGW - Nexperia · Short data sheet — A short data sheet is an extract from a full data...

PMEG4005EGW40 V, 0.5 A low VF MEGA Schottky barrier rectifier5 December 2016 Product data sheet

1. General descriptionPlanar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection encapsulated in small SOD123 Surface-Mounted Device(SMD) plastic package.

2. Features and benefits• Forward current: IF ≤ 0.5 A• Reverse voltage: VR ≤ 40 V• Low forward voltage typ. VF = 420 mV• Low reverse current typ. IR = 30 µA• Small SMD plastic package• AEC-Q101 qualified

3. Applications• Low voltage rectification• High efficiency DC-to-DC conversion• Switch mode power supply• Reverse polarity protection• Low power consumption applications• Automotive applications

4. Quick reference data

Table 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

IF forward current Tsp ≤ 55 °C - - 0.5 A

VR reverse voltage Tj = 25 °C - - 40 V

VF forward voltage IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 420 470 mV

IR reverse current VR = 40 V; pulsed; Tj = 25 °C [1] - 30 100 µA

[1] Very short test pulse to prevent junction self-heating.

© Nexperia B.V. 2017. All rights reserved

Nexperia PMEG4005EGW40 V, 0.5 A low VF MEGA Schottky barrier rectifier

PMEG4005EGW All information provided in this document is subject to legal disclaimers.

Product data sheet 5 December 2016 2 / 12

5. Pinning information

Table 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode21

SOD123 sym001

1 2

[1] The marking bar indicates the cathode.

6. Ordering information

Table 3. Ordering informationPackageType number

Name Description Version

PMEG4005EGW SOD123 Plastic surface-mounted package; 2 leads SOD123

7. Marking

Table 4. Marking codesType number Marking code

PMEG4005EGW G4





8. Limiting values

Table 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

VR reverse voltage Tj = 25 °C - 40 V

IF forward current Tsp ≤ 55 °C - 0.5 A

δ = 0.5 ; f = 20 kHz; Tamb ≤ 120 °C;square wave

[1] - 0.5 AIF(AV) average forward current

δ = 0.5 ; f = 20 kHz; Tsp ≤ 145 °C; squarewave

- 0.5 A

IFRM repetitive peak forwardcurrent

tp ≤ 1 ms; δ ≤ 0.25 - 7 A

IFSM non-repetitive peakforward current

tp = 8 ms; Tj(init) = 25 °C; square wave - 10 A

[2] - 400 mWPtot total power dissipation Tamb ≤ 25 °C[1] - 660 mW

Tj junction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

9. Thermal characteristics

Table 6. Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit

[1] [2] - - 310 K/WRth(j-a) thermal resistancefrom junction toambient

in free air[1] [3] - - 190 K/W

Rth(j-sp) thermal resistancefrom junction to solderpoint

[4] - - 29 K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are asignificant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.[4] Soldering point of cathode tab.





aaa-024913

tp (s)10-3 102 10310110-2 10-1

102

10

103

Rth(j-a)(K/W

1

duty cycle = 1

0.01

0.250.33

0.75

0.05

0

0.02

0.20

0.10

0.50

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical valuesaaa-024914

tp (s)10-3 102 10310110-2 10-1

102

10

103

Rth(j-a)(K/W

1

duty cycle = 1

0.010

0.02

0.050.10

0.200.25

0.500.75

0.33

FR4 PCB, mounting pad for cathode 1 cm2

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values





10. Characteristics

Table 7. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

V(BR)R reverse breakdownvoltage

IR = 1 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

40 - - V

IF = 0.1 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 95 130 mV

IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 155 210 mV

IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 220 270 mV

IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 295 350 mV

VF forward voltage

IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02 ;Tj = 25 °C

- 420 470 mV

VR = 10 V; pulsed; Tj = 25 °C [1] - 7 20 µAIR reverse current

VR = 40 V; pulsed; Tj = 25 °C [1] - 30 100 µA

Cd diode capacitance VR = 1 V; f = 1 MHz; Tj = 25 °C - 43 50 pF

[1] Very short test pulse to prevent junction self-heating.

aaa-025019

VF (V)0 0.60.40.2 0.50.30.1

1

10-1

102

10

103

IF(mA)

10-2

(1) (2) (3) (4) (5)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 25 °C(5) Tj = -40 °C

Fig. 3. Forward current as a function of forwardvoltage; typical values

aaa-025020

VR (V)0 40302010

IR(µA)

1

10-2

10-1

104

103

102

10

105

10-3

(1)

(2)

(3)

(4)

(5)

pulsed condition(1) Tj = 150 °C(2) Tj = 125 °C(3) Tj = 85 °C(4) Tj = 25 °C(5) Tj = −40 °C

Fig. 4. Reverse current as a function of reversevoltage; typical values





VR (V)0 403010 20

aaa-025021

40

60

20

80

100Cd

(pF)

0

f = 1 MHz; Tamb = 25 °C

Fig. 5. Diode capacitance as a function of reverse voltage; typical values

11. Test information

tptcy

P

t006aac658

duty cycle δ =

tp

tcy

Fig. 6. Duty cycle definition

The current ratings for the typical waveforms are calculated according to the equations:IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMSdefined as RMS current.

Quality informationThis product has been qualified in accordance with the Automotive Electronics Council (AEC)standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use inautomotive applications.





12. Package outline

16-10-13Dimensions in mm

21

3.753.45

2.802.55

1.71.5

1.31.0

Fig. 7. Package outline SOD123

13. Soldering

SOD123

sod123_fr

occupied area

solder paste

solder resist

Cu pad

Dimensions in mm16-05-1016-08-31

0.81

0.91 2.36

1.11

0.81

4.18

0.91

1.11

3.27

4.58

3.1

1.421.12 1.222.1 1.62

Fig. 8. Reflow soldering footprint for SOD123





SOD123

sod123_fw

occupied area

glue dot

solder resist

solder land

Dimensions in mm16-09-0216-09-06

1.2

0.331.2

2.5 2

2.65

7.5

4.5

2.55 2.43.5

Fig. 9. Wave soldering footprint for SOD123





14. Revision history

Table 8. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

PMEG4005EGW v.2 20161205 Product data sheet - PMEG4005EGW v.1

Modifications: • Product status changed

PMEG4005EGW v.1 20161123 Preliminary data sheet - -





15. Legal information

Data sheet status

Documentstatus [1] [2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

DefinitionsPreview — The document is a preview version only. The document is stillsubject to formal approval, which may result in modifications or additions.Nexperia does not give any representations or warranties as tothe accuracy or completeness of information included herein and shall haveno liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequencesof use of such information.

Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local Nexperiasales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.

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Notwithstanding any damages that customer might incur for any reasonwhatsoever, Nexperia’s aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of Nexperia.

Right to make changes — Nexperia reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

Suitability for use in automotive applications — This Nexperiaproduct has been qualified for use in automotiveapplications. Unless otherwise agreed in writing, the product is not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure ormalfunction of a Nexperia product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. Nexperia and its suppliers accept no liability forinclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer's ownrisk.

Quick reference data — The Quick reference data is an extract of theproduct data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makesno representation or warranty that such applications will be suitable for thespecified use without further testing or modification.

Customers are responsible for the design and operation of theirapplications and products using Nexperia products, and Nexperiaaccepts no liability for any assistance with applications orcustomer product design. It is customer’s sole responsibility to determinewhether the Nexperia product is suitable and fit for thecustomer’s applications and products planned, as well as for the plannedapplication and use of customer’s third party customer(s). Customers shouldprovide appropriate design and operating safeguards to minimize the risksassociated with their applications and products.

Nexperia does not accept any liability related to any default,damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use bycustomer’s third party customer(s). Customer is responsible for doing allnecessary testing for the customer’s applications and products using Nexperiaproducts in order to avoid a default of the applicationsand the products or of the application or use by customer’s third partycustomer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

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16. Contents

1. General description......................................................12. Features and benefits.................................................. 13. Applications.................................................................. 14. Quick reference data....................................................15. Pinning information......................................................26. Ordering information....................................................27. Marking..........................................................................28. Limiting values............................................................. 39. Thermal characteristics............................................... 310. Characteristics............................................................511. Test information......................................................... 612. Package outline.......................................................... 713. Soldering..................................................................... 714. Revision history..........................................................915. Legal information..................................................... 10

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] Date of release: 05 December 2016

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